CN213878104U

CN213878104U - VDMOS device containing ESD protection structure

Info

Publication number: CN213878104U
Application number: CN202120066830.XU
Authority: CN
Inventors: 王新强; 王丕龙; 秦鹏海; 张永利; 刘�文
Original assignee: Shenzhen Jiaen Power Semiconductor Co ltd
Current assignee: Shenzhen Jiaen Power Semiconductor Co ltd
Priority date: 2021-01-12
Filing date: 2021-01-12
Publication date: 2021-08-03
Anticipated expiration: 2031-01-12

Abstract

The utility model provides a VDMOS device that contains ESD protection architecture belongs to VDMOS device technical field. The VDMOS device with the ESD protection structure comprises a base component and a heat dissipation component. The base subassembly includes VDMOS device body, ESD device body and pin, the ESD device body with the pin is all established on the VDMOS device body, the ESD device body with the pin all with VDMOS device body electric connection is in the same place, radiator unit includes heat conduction shell, thermal-insulated shell, trachea, protective housing, the connector of admitting air and exhaust connector, and during the use, the gas after the absorption heat is discharged through the exhaust connector, and the gaseous rethread refrigeration plant behind the absorption heat is discharged, and the heat dispersion of this VDMOS device is good, great improvement the life of VDMOS device body and ESD device body.

Description

VDMOS device containing ESD protection structure

Technical Field

The utility model relates to a VDMOS device field particularly, relates to a VDMOS device that contains ESD protection architecture.

Background

The VDMOS device is a sound effect power crystal device. The VDMOS device has been widely used in various fields including motor speed regulation, inverter, intermittent bright power supply, switching power supply, electronic switch, hi-fi audio, automobile electric appliance, electronic ballast, etc.

At present, in the conventional VDMOS device, the heat dissipation speed of a heat dissipation mechanism on the VDMOS device is too low for heat generated during the operation of the VDMOS device, so that the service life of the VDMOS device is greatly shortened.

SUMMERY OF THE UTILITY MODEL

In order to compensate above not enough, the utility model provides a VDMOS device that contains ESD protection architecture aims at improving the heat dissipation speed too slow problem that the heat dissipation mechanism on the VDMOS device produced to its during operation.

The utility model discloses a realize like this:

the utility model provides a VDMOS device that contains ESD protection architecture, including basic module and radiator unit.

The base component comprises a VDMOS device body, an ESD device body and pins, wherein the ESD device body and the pins are arranged on the VDMOS device body, and the ESD device body and the pins are electrically connected with the VDMOS device body.

The heat dissipation assembly comprises a heat conduction shell, a heat insulation shell, a gas pipe, a protective shell, a gas inlet connector and an exhaust connector, wherein the heat conduction shell is fixed on the VDMOS device body and the outer wall of the ESD device body, the gas pipe is fixed on the outer surface of the heat conduction shell, the heat insulation shell is fixed on the outer surface of the gas pipe, the protective shell is fixed on the outer wall of the heat insulation shell, the gas inlet connector and the exhaust connector are fixed on the protective shell, and two end parts of the gas pipe are respectively arranged at the end part of the gas inlet connector and the end part of the exhaust connector.

The utility model discloses an in one embodiment, radiator unit still includes the thermal insulation layer, the thermal insulation layer is fixed thermal insulation shell with between the protective housing.

In an embodiment of the present invention, the heat dissipation assembly further includes a connecting rod, the connecting rod is fixed between the outer surface of the heat insulation housing and the inner wall of the protective housing.

The utility model discloses an in one embodiment, radiator unit still includes first seal cover, first seal cover is fixed heat conduction shell with protective housing is last, first seal cover is established on the pin.

The utility model discloses an in one embodiment, radiator unit still includes the end cap, the end cap is stifled to be established respectively in the connector of admitting air with in the connector of exhausting.

In an embodiment of the present invention, the heat dissipation assembly further includes an elastic band, and the elastic band is fixed between the lower surface of the plug and the outer wall of the protective housing.

In an embodiment of the present invention, the elastic band includes an elastic band body and a connection ear plate, one end of the elastic band body is fixed on the outer wall of the connection ear plate, and the connection ear plate is fixed on the outer wall of the protective housing.

The utility model discloses an in an embodiment, the connector of admitting air includes connector body and the fixture block of admitting air, the fixed cover of fixture block is established on the connector body of admitting air, the fixture block is fixed on protective housing's the outer wall.

The utility model discloses an in one embodiment, radiator unit still includes the second seal cover, the second seal cover is fixed in the protective housing, the second seal cover is established respectively the cover is established on the connector admits air with on the exhaust connector.

In an embodiment of the present invention, the heat insulating layer is a foam layer.

The utility model has the advantages that: the utility model discloses a VDMOS device that contains ESD protection architecture that above-mentioned design obtained, during the use, the connector on the refrigeration plant links together with the connector that admits air and exhaust connector respectively, this VDMOS device is at the in-process of work, refrigeration plant injects air conditioning into the trachea through the connector that admits air, the heat that VDMOS device body and ESD device body during operation produced is derived through the heat conduction shell is quick, air conditioning takes away the heat on the heat conduction shell fast, make VDMOS device body and ESD device body be in best operating condition, gas after the absorption heat is discharged through the exhaust connector, gas rethread refrigeration plant after the absorption heat is discharged, the heat dispersion of this VDMOS device is good, great improvement the life of VDMOS device body and ESD device body.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a VDMOS device including an ESD protection structure according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional structure diagram of a VDMOS device including an ESD protection structure according to an embodiment of the present invention;

fig. 3 is a schematic cross-sectional structure diagram of a foundation assembly according to an embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of a heat dissipation assembly according to an embodiment of the present invention;

fig. 5 is an enlarged view of a region a in fig. 4 according to an embodiment of the present invention.

In the figure: 100-a base component; 110-VDMOS device body; 120-an ESD device body; 130-pin; 200-a heat dissipation assembly; 210-a thermally conductive housing; 220-a thermally insulated enclosure; 230-trachea; 240-heat preservation and insulation layer; 250-a protective housing; 260-connecting rod; 270-a first gland; 280-an elastic band; 281-elastic band body; 282-connecting ear panels; 290-plug; 291-air inlet connector; 2911-inlet connector body; 2912-a fixture block; 292-exhaust connector; 293-second gland.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1-5, the present invention provides a technical solution: a VDMOS device containing an ESD protection structure includes a base assembly 100 and a heat dissipation assembly 200. The heat dissipation assembly 200 is fixed on the base assembly 100, so that the service lives of the VDMOS device body 110 and the ESD device body 120 are greatly prolonged.

Referring to fig. 1-3, the base assembly 100 includes a VDMOS device body 110, an ESD device body 120, and a lead 130, wherein the ESD device body 120 and the lead 130 are disposed on the VDMOS device body 110, and the ESD device body 120 and the lead 130 are electrically connected to the VDMOS device body 110.

Referring to fig. 2, 4 and 5, the heat dissipation assembly 200 includes a heat conductive housing 210, a heat insulating housing 220, an air pipe 230, and a protective housing 250, air inlet connector 291 and exhaust connector 292, heat conduction shell 210 is fixed on the outer wall of VDMOS device body 110 and ESD device body 120, trachea 230 is fixed on the outer surface of heat conduction shell 210, heat insulation shell 220 is fixed on the outer surface of trachea 230, protective casing 250 is fixed on the outer wall of heat insulation shell 220, heat dissipation assembly 200 still includes thermal insulation layer 240, thermal insulation layer 240 is fixed between heat insulation shell 220 and protective casing 250, thermal insulation layer 240 prevents that external heat from causing influence to VDMOS device body 110 or ESD device body 120, thermal insulation layer 240 is a foam plastic layer, the foam plastic layer has the advantages of low thermal conductivity coefficient, good thermal insulation effect, light dead weight, low water absorption, good chemical stability, construction convenience, and the like.

The heat dissipating assembly 200 further includes a connecting rod 260, the connecting rod 260 is fixed between the outer surface of the heat insulating housing 220 and the inner wall of the protective housing 250, the connecting rod 260 enables the heat insulating housing 220 and the protective housing 250 to be more firmly fixed together, the air inlet connector 291 and the air outlet connector 292 are both fixed on the protective housing 250, the heat dissipating assembly 200 further includes a plug 290, the plug 290 is respectively plugged in the air inlet connector 291 and the air outlet connector 292, the plug 290 effectively prevents external dust from entering the air inlet connector 291 or the air outlet connector 292, the heat dissipating assembly 200 further includes an elastic band 280, the elastic band 280 is fixed between the lower surface of the plug 290 and the outer wall of the protective housing 250, the elastic band 280 effectively prevents the plug 290 from being lost, the elastic band 280 includes an elastic band body 281 and a connecting ear plate 282, one end of the elastic band body 281 is fixed on the outer wall of the connecting ear plate 282, the connecting ear plate 282 is fixed on the outer wall of the protective housing 250, the attachment lugs 282 facilitate the mounting and securing of the elastic band body 281 to the protective housing 250.

The air inlet connector 291 comprises an air inlet connector body 2911 and a fixture block 2912, the fixture block 2912 is fixedly sleeved on the air inlet connector body 2911, the fixture block 2912 is fixed on the outer wall of the protective shell 250, the fixture block 2912 enables the air inlet connector body 2911 to be more stably fixed on the protective shell 250, two ends of the air pipe 230 are respectively arranged at the end of the air inlet connector 291 and the end of the exhaust connector 292, the heat dissipation assembly 200 further comprises a first sealing sleeve 270, the first sealing sleeve 270 is fixed on the heat conduction shell 210 and the protective shell 250, the first sealing sleeve 270 is sleeved on the pin 130, the first sealing sleeve 270 enables the sealing performance between the pin 130 and the protective shell 250 to be better, the heat dissipation assembly 200 further comprises a second sealing sleeve 293, the second sealing sleeve 293 is fixed in the protective shell 250, the second sealing sleeve 293 is respectively sleeved on the air inlet connector 291 and the exhaust connector 292, and the second sealing sleeve 293 enables the sealing performance between the air inlet connector 291 or the exhaust connector 292 and the protective shell 250 to be better.

Specifically, the operation principle of the VDMOS device including the ESD protection structure is as follows: when the VDMOS device is used, the connectors on the refrigeration equipment are respectively connected with the air inlet connector 291 and the air exhaust connector 292, the VDMOS device is in the working process, the refrigeration equipment injects cold air into the air pipe 230 through the air inlet connector 291, heat generated when the VDMOS device body 110 and the ESD device body 120 work is rapidly led out through the heat conducting shell 210, the cold air rapidly takes away the heat on the heat conducting shell 210, the VDMOS device body 110 and the ESD device body 120 are in the optimal working state, gas absorbing the heat is discharged through the air exhaust connector 292, and the gas absorbing the heat is discharged through the refrigeration equipment.

It should be noted that the specific model specifications of the VDMOS device body 110 and the ESD device body 120 need to be determined by type selection according to the actual specification of the apparatus, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.

The power supply of the VDMOS device body 110 and the ESD device body 120 and the principle thereof will be apparent to those skilled in the art and will not be described in detail herein.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A VDMOS device having an ESD protection structure, comprising

The base assembly (100), the base assembly (100) comprises a VDMOS device body (110), an ESD device body (120) and a pin (130), the ESD device body (120) and the pin (130) are both arranged on the VDMOS device body (110), and the ESD device body (120) and the pin (130) are both electrically connected with the VDMOS device body (110);

the heat dissipation assembly (200), the heat dissipation assembly (200) includes a heat conduction shell (210), a heat insulation shell (220), an air pipe (230), a protective shell (250), an air inlet connector (291) and an air exhaust connector (292), the thermally conductive housing (210) is secured to an outer wall of the VDMOS device body (110) and the ESD device body (120), the air tube (230) is fixed on the outer surface of the heat-conducting shell (210), the heat insulation shell (220) is fixed on the outer surface of the air pipe (230), the protective casing (250) is fixed on the outer wall of the heat insulation casing (220), the air inlet connector (291) and the air outlet connector (292) are both fixed on the protective shell (250), two ends of the air pipe (230) are respectively arranged at the end part of the air inlet connector (291) and the end part of the air outlet connector (292).

2. A VDMOS device including an ESD protection structure according to claim 1, wherein the heat sink assembly (200) further comprises a thermal insulation layer (240), and the thermal insulation layer (240) is fixed between the thermal insulation housing (220) and the protective housing (250).

3. A VDMOS device including an ESD protection structure according to claim 1, wherein the heat sink assembly (200) further comprises a connection bar (260), the connection bar (260) being fixed between an outer surface of the thermal insulating enclosure (220) and an inner wall of the protective enclosure (250).

4. The VDMOS device with the ESD protection structure according to claim 1, wherein the heat dissipation assembly (200) further comprises a first sealing boot (270), the first sealing boot (270) is fixed to the heat conductive housing (210) and the protection housing (250), and the first sealing boot (270) is sleeved on the pins (130).

5. A VDMOS device including an ESD protection structure according to claim 1, wherein the heat dissipation assembly (200) further comprises a plug (290), and the plug (290) is respectively plugged in the air inlet connector (291) and the air outlet connector (292).

6. A VDMOS device with ESD protection structure according to claim 5, wherein the heat sink assembly (200) further comprises an elastic band (280), the elastic band (280) is fixed between the lower surface of the stopper (290) and the outer wall of the protective housing (250).

7. A VDMOS device having an ESD protection structure according to claim 6, wherein the elastic band (280) comprises an elastic band body (281) and a connection ear plate (282), one end of the elastic band body (281) is fixed on the outer wall of the connection ear plate (282), and the connection ear plate (282) is fixed on the outer wall of the protection housing (250).

8. The VDMOS device with ESD protection structure as claimed in claim 1, wherein the air inlet connector (291) comprises an air inlet connector body (2911) and a clamping block (2912), the clamping block (2912) is fixedly sleeved on the air inlet connector body (2911), and the clamping block (2912) is fixed on the outer wall of the protective housing (250).

9. The VDMOS device with the ESD protection structure according to claim 1, wherein the heat dissipation assembly (200) further comprises a second sealing sleeve (293), the second sealing sleeve (293) is fixed in the protective housing (250), and the second sealing sleeve (293) is respectively sleeved on the air inlet connector (291) and the air exhaust connector (292).

10. A VDMOS device comprising an ESD protection structure according to claim 2, wherein the thermal insulating layer (240) is a foam layer.