CN213841499U

CN213841499U - Light water circulation system capable of heating and refrigerating water

Info

Publication number: CN213841499U
Application number: CN202022388532.0U
Authority: CN
Inventors: 周小波
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-10-24
Filing date: 2020-10-24
Publication date: 2021-07-30
Anticipated expiration: 2030-10-24
Also published as: JP3234812U

Abstract

The utility model discloses a light water circulation system capable of heating and refrigerating water, which belongs to the technical field of water heating and refrigerating, and particularly relates to a light water circulation system capable of heating and refrigerating water, which comprises a semiconductor wafer, a first heat conduction module, a second heat conduction module and a solenoid valve, wherein the first heat conduction module corresponds to the second heat conduction module in position from left to right, the semiconductor wafer is arranged between the first heat conduction module and the second heat conduction module, the first heat conduction module is provided with a first water channel, the upper part of the left side of the first heat conduction module is fixedly connected with a first water inlet, the lower part of the left side of the first heat conduction module is fixedly connected with a first water outlet, the second heat conduction module is provided with a second water channel, the upper part of the right side of the second heat conduction module is fixedly connected with a second water inlet, the invention combines heating and refrigerating functions into a whole, the heating and refrigerating are controlled by the same system unit, and also is the same heating and refrigerating unit, therefore, the product performance is more reliable, the size is smaller, and the energy consumption is more saved.

Description

Light water circulation system capable of heating and refrigerating water

Technical Field

The utility model relates to a water heating and refrigeration technology field specifically are a enable water heating and refrigerated light-duty water circulating system.

Background

The existing light water circulation product has no heating or refrigerating function, and other products of different types have independent heating or independent refrigerating effects, so that the product has unreliable performance, larger volume and higher energy consumption.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an enable water heating and refrigerated light-duty water circulating system to solve the current light-duty water circulating product that proposes in the above-mentioned background art and do not have heating or refrigerated function, the product of other different grade types is solitary heating or solitary refrigeration effect, leads to the performance of product reliable inadequately, and is bulky, the higher problem of energy consumption.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an enable water heating and refrigerated light-duty water circulating system, includes semiconductor wafer, first heat conduction module, second heat conduction module and solenoid valve, first heat conduction module and second heat conduction module position correspond from left to right, be provided with the semiconductor wafer between first heat conduction module and the second heat conduction module, first water course has been seted up to first heat conduction module, the first water inlet of first heat conduction module left side top fixedly connected with, first delivery port is connected with the solenoid valve, the first delivery port of first heat conduction module left side below fixedly connected with, the second water course has been seted up to second heat conduction module, second heat conduction module right side top fixedly connected with second water inlet, second heat conduction module right side below fixedly connected with second delivery port.

Preferably, a connecting block is fixedly connected between the first heat conduction module and the second heat conduction module.

Preferably, heat-conducting silicone grease is coated between the semiconductor wafer and the first heat-conducting module and between the semiconductor wafer and the second heat-conducting module.

Preferably, the outer wall of the second heat conduction module is fixedly connected with a heat recovery conductor.

Preferably, the outer wall of the first heat conduction module is bonded with a heat insulation layer.

Compared with the prior art, the beneficial effects of the utility model are that:

1) the invention combines the heating and refrigerating functions into a whole, the heating and refrigerating are controlled by the same system unit and are also the same heating and refrigerating unit instead of independent heating and independent refrigerating, so that the product performance is more reliable, the volume is smaller, and the energy consumption is more saved;

2) the left side of the semiconductor wafer is a refrigerating surface, and the right side of the semiconductor wafer is a radiating (heating) surface. When the semiconductor wafer works, the refrigerating temperature of the left side surface (refrigerating surface) of the semiconductor wafer is reduced, the temperature of the first heat conduction module is reduced through temperature conduction, so that water in the first water channel is changed into cold water, meanwhile, the closing and opening time of the electromagnetic valve is set to enable the water to be fully refrigerated in the first heat conduction module, and the refrigerating effect of the water is better; the right side of the semiconductor wafer is a heat dissipating (heating) surface while the left side of the semiconductor wafer is refrigerating; according to the water circulation system, through water circulation, cold water of the first heat conduction module circulates to the second heat conduction module to carry out water circulation heat dissipation, so that the refrigeration continuity of the semiconductor and the heat dissipation effect of the heat dissipation surface are better;

3) by changing the directions of the voltage anode and the voltage cathode of the semiconductor wafer, the left side surface of the semiconductor wafer can be changed into a radiating (heating) surface, and the right side surface of the semiconductor wafer can be changed into a refrigerating surface. When the semiconductor wafer works, the right side surface (refrigeration surface) of the semiconductor wafer is refrigerated, and the left side surface of the semiconductor wafer is a heat dissipation surface while the right side surface of the semiconductor wafer is refrigerated; the left side face radiates heat to enable the temperature of the first heat conduction module to rise through temperature conduction, so that water in the first water channel is changed into hot water, meanwhile, the closing time and the opening time of the electromagnetic valve are set to enable the water to be fully heated in the first heat conduction module, and the heating effect of the water is better; the right side face of the semiconductor continuously refrigerates, so that the left side face of the semiconductor continuously radiates heat, and water in the first water channel is continuously heated to generate hot water.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a view of the structure of the present invention;

fig. 3 is a circuit diagram of the semiconductor wafer heating and cooling circuit of the present invention;

FIG. 4 is a circuit diagram of the water pump of the present invention;

fig. 5 is a circuit diagram of the electromagnetic valve of the present invention.

In the figure: the heat recovery device comprises a semiconductor wafer 1, a first heat conduction module 2, a second heat conduction module 3, a first water channel 4, a first water inlet 5, a first water outlet 6, a second water channel 7, a second water inlet 8, a second water outlet 9, a connecting block 10, a heat recovery conductor 11 and an electromagnetic valve 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "left", "right", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b):

referring to fig. 1-5, the present invention provides a technical solution: a light water circulation system capable of heating and refrigerating water comprises a semiconductor wafer 1, a first heat conduction module 2, a second heat conduction module 3 and an electromagnetic valve 12, wherein the first heat conduction module 2 corresponds to the second heat conduction module 3 in a left-right mode, the semiconductor wafer 1 is arranged between the first heat conduction module 2 and the second heat conduction module 3, the left side of the semiconductor wafer 1 is a refrigerating surface, the right side of the semiconductor wafer 1 is a heating surface, the left side of the semiconductor wafer 1 can be changed into the heating surface and the right side of the semiconductor wafer can be changed into the refrigerating surface by changing the directions of the voltage positive and negative poles of the semiconductor wafer 1, a working circuit diagram of the semiconductor wafer 1 is shown in figure 3, a circuit control structure of the utility model is shown in figure 2, a U1 main control MCU is used for changing the refrigeration or heating of the semiconductor wafer 1 by changing the high and low voltages of IO-HOT1 and IO-HOT2 so that HOT + and HOT-exchange output voltages, IO-NTC1 and IO-NTC2 respectively detect the real-time temperature of the semiconductor wafer 1 and transmit the MCU, the MCU is used for controlling the heating and refrigerating capacity of the semiconductor chip 1, the first heat conduction module 2 is provided with a first water channel 4, the upper part of the left side of the first heat conduction module 2 is fixedly connected with a first water inlet 5, the first water inlet 5 is used for connecting a water pipe, the lower part of the left side of the first heat conduction module 2 is fixedly connected with a first water outlet 6, the first water outlet 6 is connected with an electromagnetic valve 12A interface through a water pipe, the electromagnetic valve 12B interface is a water outlet, as shown in figure 1, normal temperature water enters the first water channel 4 from the first water inlet 5, is refrigerated by the semiconductor chip 1 and is changed into cold water, the cold water is discharged from the first water outlet 6, the second heat conduction module 3 is provided with a second water channel 7, the upper part of the right side of the second heat conduction module 3 is fixedly connected with a second water inlet 8, the lower part of the right side of the second heat conduction module 3 is fixedly connected with a second water outlet 9, the second water inlet 8 and the second water outlet 9 are used for being connected with an external water pipe, the normal temperature water enters the second water channel 7 from the second water inlet 8, is heated by the semiconductor wafer 1 and becomes hot water, and is discharged from the second water outlet 9, so that the heat dissipation effect of the second heat conduction module 3 is better, the water in the first water channel 4 is clear water, the clear water is heated or refrigerated by the semiconductor wafer 1 and then is used, when the left side of the semiconductor wafer 1 is refrigerated for a refrigerating surface, the heating surface on the right side generates heat and conducts the heat to the water in the second water channel 7 through the second heat conduction module 3, the second water channel 7 is introduced with circulating water for dissipating the heat of the semiconductor wafer 1, meanwhile, the ice-cold water in the first heat conduction module 2 also plays a role in cooling and heat dissipation through a loop, the water circulation of the circulating water is made to flow through the negative pressure generated by the water suction pump, and the water suction pump is connected with the utility model, the working circuit diagram of the water pump is shown in fig. 4, the utility model discloses a 12 control water yield of solenoid valve, its purpose can guarantee the water yield size, sets for solenoid valve 12 closure and open time for hydroenergy in the first water course 4 of first heat conduction module 2 can fully refrigerate or heat, and it is better to finally produce cold ice water or hydrothermal effect, and solenoid valve 12 control circuit diagram is shown in fig. 5.

Fixedly connected with connecting block 10 between first heat conduction module 2 and the second heat conduction module 3, connecting block 10 is the plastic body of high temperature insulation.

And heat-conducting silicone grease is coated between the semiconductor wafer 1 and the first heat-conducting module 2 and between the semiconductor wafer and the second heat-conducting module 3.

And a heat recovery conductor 11 is fixedly connected to the outer wall of the second heat conduction module 3.

And the outer wall of the first heat conduction module 2 is bonded with a heat insulation layer.

The working principle is as follows: the heating and refrigerating functions are combined into one, the heating and refrigerating are controlled by the same system unit and are also the same heating and refrigerating unit instead of independent heating and independent refrigerating, so that the product performance is more reliable, the size is smaller, the energy consumption is more saved, when the refrigerating surface of the semiconductor chip 1 is refrigerated, the heating surface generates heat, the heat is conducted out through the second heat conduction module 3 to play a role in heat dissipation, and meanwhile, the ice-cold water in the first heat conduction module 2 also plays a role in cooling and heat dissipation through a loop.

Having shown and described the basic principles and principal features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an ability water heating and refrigerated light-duty water circulating system, includes semiconductor wafer (1), first heat conduction module (2), second heat conduction module (3) and solenoid valve (12), its characterized in that: correspond about first heat conduction module (2) and second heat conduction module (3) position, be provided with semiconductor wafer (1) between first heat conduction module (2) and second heat conduction module (3), first water course (4) have been seted up in first heat conduction module (2), first heat conduction module (2) left side top fixedly connected with first water inlet (5), first heat conduction module (2) left side below fixedly connected with first delivery port (6), first delivery port (6) are connected with solenoid valve (12), second water course (7) have been seted up in second heat conduction module (3), second heat conduction module (3) right side top fixedly connected with second water inlet (8), second heat conduction module (3) right side below fixedly connected with second delivery port (9).

2. A lightweight water circulation system for heating and cooling water as claimed in claim 1, wherein: and a connecting block (10) is fixedly connected between the first heat conduction module (2) and the second heat conduction module (3).

3. A lightweight water circulation system for heating and cooling water as claimed in claim 1, wherein: and heat-conducting silicone grease is smeared among the semiconductor wafer (1), the first heat-conducting module (2) and the second heat-conducting module (3).

4. A lightweight water circulation system for heating and cooling water as claimed in claim 1, wherein: and the outer wall of the second heat conduction module (3) is fixedly connected with a heat recovery conductor (11).

5. A lightweight water circulation system for heating and cooling water as claimed in claim 1, wherein: and the outer wall of the first heat conduction module (2) is bonded with a heat insulation layer.