CN213586782U - High-power communication equipment beneficial to heat dissipation - Google Patents
High-power communication equipment beneficial to heat dissipation Download PDFInfo
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- CN213586782U CN213586782U CN202022913320.XU CN202022913320U CN213586782U CN 213586782 U CN213586782 U CN 213586782U CN 202022913320 U CN202022913320 U CN 202022913320U CN 213586782 U CN213586782 U CN 213586782U
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- heat
- heat dissipation
- radiator
- box body
- power communication
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- 238000004891 communication Methods 0.000 title claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 title claims description 34
- 230000009286 beneficial effect Effects 0.000 title claims description 9
- 238000001816 cooling Methods 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000741 silica gel Substances 0.000 claims abstract description 4
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 4
- 230000007704 transition Effects 0.000 claims description 6
- 230000008901 benefit Effects 0.000 abstract description 12
- 238000012423 maintenance Methods 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract 1
- 230000009471 action Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model relates to a communication equipment technical field, in particular to do benefit to radiating high-power communication equipment, the outside surface of box is provided with many heat pipes, the bottom half is fixed with the radiator, many heat pipes communicate in the radiator, the heat conduction that the heat pipe produced the box inside dispels the heat to the radiator, the inside high-power amplifier module that is provided with of box, box lateral wall inboard is hugged closely to high-power amplifier module, many parallel radiating grooves have been seted up to the outside surface of box, many heat pipes cold pressure respectively one by one connect in the radiating groove and through the waterproof silica gel encapsulation of heat conduction. Compared with the prior art, the utility model discloses a do benefit to radiating high-power communication equipment has solved the problem that heat radiation structure's overall arrangement received equipment size restriction among the prior art, realizes nimble configuration through the cooperation of radiating groove, heat pipe, cooling tube, does not receive equipment size restriction to easy dismounting does benefit to the maintenance, can not influence that equipment is pleasing to the eye.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a communication equipment technical field, in particular to do benefit to radiating high-power communication equipment.
[ background of the invention ]
Communication equipment in the prior art generally plays a role in heat dissipation by additionally arranging a heat dissipation structure near a heat source, the heat dissipation mode is often limited due to the size of the equipment, the heat dissipation structure cannot be additionally arranged at a position far away from the heat source, the layout of heat dissipation fins is limited, and the heat dissipation efficiency is not high.
[ Utility model ] content
In order to overcome the above problems, the utility model provides a can effectively solve the radiating high-power communication equipment that does benefit to of above-mentioned problem.
The utility model provides a technical scheme who above-mentioned technical problem provided is: the high-power communication equipment beneficial to heat dissipation comprises a box body, wherein a plurality of heat conduction pipes are arranged on the outer side surface of the box body, a radiator is fixed at the bottom of the box body, the heat conduction pipes are communicated with the radiator, and the heat conduction pipes conduct heat generated in the box body to the radiator for heat dissipation; a high-power amplifier module is arranged in the box body and clings to the inner side of the side wall of the box body; the outer side surface of the box body is provided with a plurality of parallel radiating grooves, and the plurality of heat conduction pipes are respectively cold-pressed in the radiating grooves one by one and are packaged by heat conduction waterproof silica gel; one end of the radiator is provided with an air inlet, the other end opposite to the air inlet is provided with an air outlet, at least two fans are arranged in the radiator, and the positions of the fans correspond to the positions of the air inlet.
Preferably, the opening of the heat dissipation groove is flush with the outer side surface of the box body.
Preferably, an arc transition portion is arranged at an end of the heat dissipation groove, and the heat conduction pipe is communicated with the heat sink after being bent at the arc transition portion.
Preferably, a plurality of radiating fins are uniformly arranged in the radiator, a plurality of cooling pipes are welded and fixed on the radiating fins, and the plurality of cooling pipes are respectively communicated with the plurality of heat conduction pipes one by one.
Preferably, one side of the radiating fin corresponds to the air outlet.
Preferably, the upper end of radiator is provided with first connecting plate, second connecting plate, third connecting plate respectively, be provided with a plurality of screw holes on first connecting plate, second connecting plate, the third connecting plate respectively for fixed connection is in the bottom half.
Compared with the prior art, the utility model discloses a do benefit to radiating high-power communication equipment passes through the radiating mode of heat pipe cooperation radiator, has solved the problem that heat radiation structure's overall arrangement received equipment size restriction among the prior art, realizes nimble configuration through the cooperation of radiating groove, heat pipe, cooling tube, does not receive equipment size restriction to easy dismounting does benefit to the maintenance, can not influence that equipment is pleasing to the eye.
[ description of the drawings ]
Fig. 1 is a perspective view of the whole structure of the high-power communication device beneficial to heat dissipation of the present invention;
fig. 2 is a schematic diagram of the internal structure of the high-power communication device beneficial to heat dissipation of the present invention;
FIG. 3 is a perspective view of the box structure of the high-power communication device facilitating heat dissipation of the present invention;
fig. 4 is a front view of the box structure of the high-power communication device beneficial to heat dissipation of the present invention;
fig. 5 is a perspective view of the heat sink structure of the high-power communication device facilitating heat dissipation of the present invention;
fig. 6 is a side view of the heat sink structure of the high-power communication device beneficial to heat dissipation of the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It should be noted that all directional indications (such as up, down, left, right, front, and back … …) in the embodiments of the present invention are limited to relative positions on a given view, not absolute positions.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Referring to fig. 1 to 6, the high-power communication device beneficial to heat dissipation of the present invention includes a box 10, a plurality of heat pipes 20 are disposed on an outer surface of the box 10, a heat sink 30 is fixed at a bottom of the box 10, the plurality of heat pipes 20 are connected to the heat sink 30, and the heat pipes 20 conduct heat generated inside the box 10 to the heat sink 30 for heat dissipation. The high-power amplifier module 40 is arranged in the box body 10, and the high-power amplifier module 40 is tightly attached to the inner side of the side wall of the box body 10, so that the generated heat can be conducted to the heat conduction pipe 20 through the side wall of the box body 10. The high-power amplifier module 40 includes a PCB board, and a high-power amplifier tube or a CPU is disposed on the PCB board, and generates heat, which needs to be evacuated.
Specifically, the outer side surface of the box 10 is provided with a plurality of parallel heat dissipation grooves 11, the plurality of heat conduction pipes 20 are respectively cold-pressed in the heat dissipation grooves 11 one by one and are packaged by heat conduction waterproof silica gel, and the heat conduction pipes 20 can be fully and uniformly contacted with the outer side wall of the box 10 by adopting a cold-pressing process, so that the heat conduction performance is improved, and the maintenance is facilitated. An air inlet 37 is formed in one end of the heat sink 30, an air outlet 38 is formed in the other end, opposite to the air inlet 37, of the heat sink 30, at least two fans 33 are arranged inside the heat sink 30, and the positions of the fans 33 correspond to the positions of the air inlet 37, so that the heat sink is used for accelerating air circulation and dissipating heat quickly.
The opening of radiating groove 11 and box 10 outside surface parallel and level do benefit to and keep box 10 surface smoothness, can not produce unsmooth sense and influence the outward appearance. The end of the heat sink 11 is provided with an arc transition portion 12, and the heat pipe 20 is bent at the arc transition portion 12 and then communicated with the heat sink 30. The heat radiator 30 is uniformly provided with a plurality of radiating fins 31 inside, a plurality of cooling pipes 32 are welded and fixed on the plurality of radiating fins 31, the plurality of cooling pipes 32 are respectively communicated with the plurality of heat conducting pipes 20 one by one, heat transferred from the heat conducting pipes 20 is quickly radiated through the plurality of radiating fins 31 under the action of the fan 33 through the cooling pipes 32, and the heat radiating performance is good. One side of the heat sink 31 corresponds to the position of the air outlet 38.
The heat conducting pipe 20 and the cooling pipe 32 are made of metal materials with good heat conducting performance, and can fully exert heat dissipation performance.
Compared with the prior art, the utility model discloses a do benefit to radiating high-power communication equipment passes through the radiating mode that heat pipe 20 cooperates radiator 30, has solved the problem that heat radiation structure's overall arrangement received equipment size restriction among the prior art, realizes nimble configuration through the cooperation of radiating groove 11, heat pipe 20, cooling tube 32, does not receive equipment size restriction to easy dismounting does benefit to the maintenance, can not influence that equipment is pleasing to the eye.
The above description is only for the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications made within the spirit of the present invention, equivalent replacements and improvements should be included in the scope of the present invention.
Claims (6)
1. The high-power communication equipment beneficial to heat dissipation is characterized by comprising a box body, wherein a plurality of heat conduction pipes are arranged on the outer side surface of the box body, a radiator is fixed at the bottom of the box body, the heat conduction pipes are communicated with the radiator, and the heat generated in the box body is conducted to the radiator by the heat conduction pipes for heat dissipation;
a high-power amplifier module is arranged in the box body and clings to the inner side of the side wall of the box body;
the outer side surface of the box body is provided with a plurality of parallel radiating grooves, and the plurality of heat conduction pipes are respectively cold-pressed in the radiating grooves one by one and are packaged by heat conduction waterproof silica gel;
one end of the radiator is provided with an air inlet, the other end opposite to the air inlet is provided with an air outlet, at least two fans are arranged in the radiator, and the positions of the fans correspond to the positions of the air inlet.
2. The high power communication device for facilitating heat dissipation of claim 1, wherein the opening of the heat dissipation groove is flush with the outer side surface of the case.
3. The high power communication equipment facilitating heat dissipation according to claim 1, wherein the end of the heat dissipation groove is provided with an arc transition portion, and the heat pipe is connected to the heat sink after the arc transition portion is bent.
4. The high-power communication equipment facilitating heat dissipation according to claim 1, wherein a plurality of heat dissipation fins are uniformly arranged inside the heat sink, a plurality of cooling pipes are welded and fixed on the plurality of heat dissipation fins, and the plurality of cooling pipes are respectively communicated with the plurality of heat conduction pipes one by one.
5. The high power communication device facilitating heat dissipation of claim 4, wherein one side of the heat sink corresponds to the air outlet.
6. The high-power communication equipment facilitating heat dissipation according to claim 1, wherein the upper end of the heat sink is respectively provided with a first connecting plate, a second connecting plate and a third connecting plate, and the first connecting plate, the second connecting plate and the third connecting plate are respectively provided with a plurality of screw holes for fixedly connecting to the bottom of the box body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022913320.XU CN213586782U (en) | 2020-12-07 | 2020-12-07 | High-power communication equipment beneficial to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022913320.XU CN213586782U (en) | 2020-12-07 | 2020-12-07 | High-power communication equipment beneficial to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213586782U true CN213586782U (en) | 2021-06-29 |
Family
ID=76548788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022913320.XU Active CN213586782U (en) | 2020-12-07 | 2020-12-07 | High-power communication equipment beneficial to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213586782U (en) |
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2020
- 2020-12-07 CN CN202022913320.XU patent/CN213586782U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000, Building 1, Block C, Section 1, Chuangzhi Cloud City, Liuxian Avenue, Xili Community, Xili Street, Nanshan District, Shenzhen City, Guangdong Province, China, 3701 Patentee after: Jiwei Communication Technology (Shenzhen) Co.,Ltd. Country or region after: China Address before: 518000 5D, building 3, Tingwei Industrial Park, No.6 Liufang Road, Xingdong community, Xin'an street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Kewei communication technology (Shenzhen) Co.,Ltd. Country or region before: China |
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| CP03 | Change of name, title or address |