CN213498152U

CN213498152U - Semiconductor silicon wafer grinding device

Info

Publication number: CN213498152U
Application number: CN202022244955.5U
Authority: CN
Inventors: 王海霖
Original assignee: Xi'an Multipole Electromagnetic Technology Co ltd
Current assignee: Xi'an Multipole Electromagnetic Technology Co ltd
Priority date: 2020-10-11
Filing date: 2020-10-11
Publication date: 2021-06-22
Anticipated expiration: 2030-10-11

Abstract

The utility model discloses a semiconductor silicon chip grinder, the on-line screen storage device comprises a base, two backup pads of lateral wall fixedly connected with on the base, two the common fixedly connected with roof of the relative lateral wall of backup pad, the last lateral wall fixedly connected with motor of roof, the first bull stick of output shaft fixedly connected with of motor, the lower extreme fixedly connected with of first bull stick grinds the stone, two the relative lateral wall of backup pad is equipped with fixed establishment, fixed establishment is including placing the board, the base upper wall is equipped with the mounting panel, the lateral wall is equipped with the spacing groove on the mounting panel. The utility model discloses guaranteed the stability of silicon chip when grinding, made the silicon chip can not take place the skew at the grinding in-process, guaranteed the even and silicon chip product's of thickness after the silicon chip grinds quality, can also carry out altitude mixture control according to the thickness of silicon chip, can grind the silicon chip of different thickness as required, enlarged the application scope of device.

Description

Semiconductor silicon wafer grinding device

Technical Field

The utility model relates to a silicon chip grinder technical field especially relates to a semiconductor silicon chip grinder.

Background

The development of science and technology is continuously pushing the development of semiconductors, automation, computers and the like, so that the manufacturing cost of the high-technology product silicon chip is reduced to a very low degree, the silicon chip is a fragile crystal, and meanwhile, in the application process, the thinner the silicon chip is, the better the quality of the chip is, and for communication equipment, the faster the processing speed is, and the more practical the processing speed is.

Although mostly machine grinding to the grinding of silicon chip at present stage, but not carry out good fixed to the silicon chip, can make the silicon chip among the grinding process take place the skew because of the vibration of machine, thereby make the silicon chip thickness of grinding out inhomogeneous, make the quality of semiconductor silicon chip not good, moreover, current silicon chip grinder can not be according to the thickness of silicon chip yet, adjust the distance between silicon chip and the grinder, make the device can't grind the silicon chip of multiple thickness, application scope is less, in order to solve above-mentioned problem, need design a semiconductor silicon chip grinder.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a semiconductor silicon wafer grinding device.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a semiconductor silicon wafer grinding device comprises a base, wherein two support plates are fixedly connected to the upper side wall of the base, opposite side walls of the two support plates are fixedly connected with a top plate together, a motor is fixedly connected to the upper side wall of the top plate, an output shaft of the motor is fixedly connected with a first rotating rod, the lower end of the first rotating rod is fixedly connected with a grinding stone, fixing mechanisms are arranged on the opposite side walls of the two support plates, each fixing mechanism comprises a placing plate, a mounting plate is arranged on the upper wall of the base, a limiting groove is formed in the upper side wall of the mounting plate, the bottom of the limiting groove is elastically connected with the placing plate through two springs, a blocking block and a long plate are fixedly connected to the upper side wall of the placing plate, two first electric telescopic rods are fixedly connected to the side wall of the long plate, a serrated plate is fixedly connected to the telescopic ends of the, the lateral wall of the moving block is rotatably connected with a threaded rod through a bearing, the threaded rod penetrates through the long plate and the serrated plate, the lateral wall, far away from the moving block, of the threaded rod is fixedly connected with a turntable, and the lateral wall, located on the right side, of the supporting plate is provided with a lifting mechanism.

Preferably, elevating system is including setting up two spouts at two backup pad lateral walls, two equal sliding connection has the slider on the spout, the right side backup pad lateral wall fixedly connected with second electric telescopic handle and limiting plate, the flexible end of second electric telescopic handle rotates through the bearing and is connected with the second bull stick, the left end of second bull stick and the equal fixedly connected with bevel gear of lateral wall of first bull stick, the fixed winding of second bull stick lateral wall has the rope, the one end and the mounting panel fixed connection of second bull stick are kept away from to the rope, second bull stick lateral wall fixedly connected with fixed plate, the fixed plate lateral wall is equipped with a plurality of openings.

Preferably, the left side wall of carousel is equipped with a plurality of sawtooth, and a plurality of sawtooth matches with the serration board.

Preferably, the moving block is in contact with the upper side wall of the placing plate, and a sponge is arranged on the left side wall of the moving block.

Preferably, the apertures of the plurality of openings are all larger than the diameter of the limiting plate, and the plurality of openings are distributed at equal intervals in the circumferential direction.

Preferably, the long plate is in threaded connection with the threaded rod, and the side wall of the serrated plate is in sliding connection with the side wall of the threaded rod.

The utility model discloses in following beneficial achievement:

1. the device enables the moving block to move by rotating the threaded rod, can tightly clamp the semiconductor silicon wafer between the blocking block and the moving block, and can prevent the rotating disc from rotating without human operation by meshing the sawteeth on the rotating disc with the serrated plate, thereby ensuring the stability of the silicon wafer during grinding, preventing the silicon wafer from deviating during grinding, further ensuring the uniform thickness of the ground silicon wafer and ensuring the quality of silicon wafer products;

2. this device drives bevel gear through first bull stick and rotates to drive the second bull stick and rotate, thereby make the rope winding at second bull stick lateral wall, the pulling mounting panel removes, can carry out altitude mixture control according to the thickness of silicon chip, can grind the silicon chip of different thickness as required, enlarged the application scope of device.

Drawings

Fig. 1 is a schematic structural view of a semiconductor silicon wafer grinding apparatus according to the present invention;

fig. 2 is an enlarged schematic view of a point a of the semiconductor silicon wafer polishing apparatus provided by the present invention.

In the figure: the device comprises a base 1, a supporting plate 2, a sliding groove 3, a sliding block 4, a mounting plate 5, a limiting groove 6, a placing plate 7, a blocking block 8, a moving block 9, a threaded rod 10, a long plate 11, a first electric telescopic rod 12, a serrated plate 13, a rotating disc 14, a rope 15, a top plate 16, a motor 17, a first rotating rod 18, a bevel gear 19, a polishing stone 20, a second rotating rod 21, a fixing plate 22, a limiting plate 23, a second electric telescopic rod 24 and an opening 25.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-2, a semiconductor silicon wafer grinding device comprises a base 1, wherein two support plates 2 are fixedly connected to the side wall of the base 1, the opposite side walls of the two support plates 2 are jointly and fixedly connected with a top plate 16, the upper side wall of the top plate 16 is fixedly connected with a motor 17, an output shaft of the motor 17 is fixedly connected with a first rotating rod 18, the lower end of the first rotating rod 18 is fixedly connected with a grinding stone 20, the opposite side walls of the two support plates 2 are provided with fixing mechanisms, each fixing mechanism comprises a placing plate 7, the upper wall of the base 1 is provided with a mounting plate 5, the upper side wall of the mounting plate 5 is provided with a limiting groove 6, the bottom in the limiting groove 6 is elastically connected with the placing plate 7 through two springs, each spring can play a certain buffering role when a silicon wafer is contacted with the grinding stone 20, the upper side wall of the placing plate 7 is, the equal fixedly connected with serration plate 13 in flexible end of two first electric telescopic handle 12, it is equipped with movable block 9 to place the side wall on the board 7, movable block 9 with place the side wall contact on the board 7, movable block 9 left side wall is equipped with the sponge, the sponge makes the silicon chip broken when preventing to centre gripping silicon chip, movable block 9 side wall rotates through the bearing and is connected with threaded rod 10, threaded rod 10 runs through long board 11 and serration plate 13, long board 11 and threaded rod 10 threaded connection, serration plate 13 side wall and threaded rod 10 side wall sliding connection, the threaded rod 10 is kept away from the lateral wall fixedly connected with carousel 14 of movable block 9, the left side wall of carousel 14 is equipped with a plurality of zigzags, a plurality of.

The side wall of the supporting plate 2 positioned on the right side is provided with a lifting mechanism, the lifting mechanism comprises two sliding grooves 3 arranged on the side walls of the two supporting plates 2, the two sliding grooves 3 are both connected with a sliding block 4 in a sliding way, the mounting plate 5 can not shake randomly in the moving process due to the movement of the sliding block 4 on the sliding grooves 3, the side wall of the supporting plate 2 on the right side is fixedly connected with a second electric telescopic rod 24 and a limiting plate 23, the telescopic end of the second electric telescopic rod 24 is rotatably connected with a second rotating rod 21 through a bearing, the left end of the second rotating rod 21 and the side wall of the first rotating rod 18 are both fixedly connected with a bevel gear 19, the side wall of the second rotating rod 21 is fixedly wound with a rope 15, one end of the rope 15 far away from the second rotating rod 21 is fixedly connected with the mounting plate 5, the side wall of the second rotating rod 21 is fixedly connected with, the plurality of openings 25 are circumferentially equally spaced.

The utility model discloses in, when grinding the silicon chip, place the silicon chip on placing board 7, rotate carousel 14, carousel 14 drives threaded rod 10 and rotates, and threaded rod 10 drives movable block 9 and removes, when movable block 9 with block 8 and fix the silicon chip, starts first electric telescopic handle 12, makes the sawtooth plate 13 and the sawtooth meshing of carousel 14 lateral walls, can prevent carousel 14 and rotate, and then fixes the silicon chip.

And then according to the thickness of the silicon chip, adjust the distance between stone 20 of polishing and the silicon chip, the concrete operation is as follows: when the second electric telescopic rod 24 is started, the telescopic end of the second electric telescopic rod 24 extends, and when the first rotating rod 18 is engaged with the bevel gear 19 on the second rotating rod 21, the second electric telescopic rod 24 is closed, the motor 17 is started, the first rotating rod 18 rotates to drive the two bevel gears 19 to rotate, thereby driving the second rotating rod 21 to rotate, winding the rope 15 on the side wall of the second rotating rod 21, further pulling the mounting plate 5 to rise, when the silicon wafer is contacted with the grinding stone 20, turning off the motor 17, starting the second electric telescopic rod 24, retracting the telescopic end of the second electric telescopic rod 24 to separate the two bevel gears 19, when the limiting plate 23 extends into the opening 25 on the fixing plate 22, the second electric telescopic rod 24 is closed, the second rotating rod 21 is prevented from pulling the rope 15 to move downwards under the action of the gravity of the mounting plate 5, the motor 17 is started again, and the motor 17 drives the grinding stone 20 to rotate to grind the silicon wafer.

And when the grinding is finished, the motor 17 is turned off, the second electric telescopic rod 24 is started, the two bevel gears 19 are meshed again, the motor 17 is started to rotate reversely, the rope 15 is released, the mounting plate 5 is lowered, the first electric telescopic rod 12 is contracted, the serrated plate 13 is separated from the rotary plate 14, the rotary plate 14 is rotated reversely, the threaded rod 10 pulls the moving block 9 to move, and then the silicon wafer can be taken out.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The semiconductor silicon wafer grinding device comprises a base (1) and is characterized in that two supporting plates (2) are fixedly connected to the side wall of the base (1), a top plate (16) is fixedly connected to the opposite side walls of the two supporting plates (2) jointly, a motor (17) is fixedly connected to the side wall of the top plate (16), a first rotating rod (18) is fixedly connected to an output shaft of the motor (17), a grinding stone (20) is fixedly connected to the lower end of the first rotating rod (18), a fixing mechanism is arranged on the opposite side walls of the two supporting plates (2), the fixing mechanism comprises a placing plate (7), a mounting plate (5) is arranged on the upper wall of the base (1), a limiting groove (6) is arranged on the upper side wall of the mounting plate (5), the bottom in the limiting groove (6) is elastically connected with the placing plate (7) through two springs, a blocking block (8) and a long plate (11) are fixedly connected to the side wall of, the utility model discloses a supporting plate, including long board (11) lateral wall fixedly connected with two electric telescopic handle (12), two the equal fixedly connected with serration plate (13) in flexible end of first electric telescopic handle (12), place board (7) side wall and be equipped with movable block (9), movable block (9) lateral wall rotates through the bearing and is connected with threaded rod (10), threaded rod (10) run through long board (11) and serration plate (13), lateral wall fixedly connected with carousel (14) of movable block (9) are kept away from in threaded rod (10), are located the right side backup pad (2) lateral wall is equipped with elevating system.

2. The semiconductor silicon wafer grinding device according to claim 1, wherein the lifting mechanism comprises two sliding grooves (3) formed in the side walls of two supporting plates (2), a sliding block (4) is slidably connected to each of the two sliding grooves (3), a second electric telescopic rod (24) and a limiting plate (23) are fixedly connected to the side wall of the supporting plate (2) on the right side, a second rotating rod (21) is rotatably connected to the telescopic end of the second electric telescopic rod (24) through a bearing, bevel gears (19) are fixedly connected to the left end of the second rotating rod (21) and the side wall of the first rotating rod (18), a rope (15) is fixedly wound on the side wall of the second rotating rod (21), one end of the rope (15) far away from the second rotating rod (21) is fixedly connected with the mounting plate (5), and a fixing plate (22) is fixedly connected to the side wall of the second rotating rod (21), the side wall of the fixing plate (22) is provided with a plurality of openings (25).

3. The semiconductor silicon wafer grinding device as claimed in claim 1, characterized in that the left side wall of the turntable (14) is provided with a plurality of saw teeth, and the plurality of saw teeth are matched with the saw-toothed plate (13).

4. The semiconductor silicon wafer grinding device as claimed in claim 1, wherein the moving block (9) is in contact with the upper side wall of the placing plate (7), and the left side wall of the moving block (9) is provided with a sponge.

5. The semiconductor silicon wafer grinding device as claimed in claim 2, wherein the apertures of the plurality of openings (25) are larger than the diameter of the limiting plate (23), and the plurality of openings (25) are distributed at equal intervals in the circumferential direction.

6. The semiconductor silicon wafer grinding device as claimed in claim 3, characterized in that the long plate (11) is in threaded connection with the threaded rod (10), and the side wall of the serrated plate (13) is in sliding connection with the side wall of the threaded rod (10).