CN111465219A - Circuit board processing method - Google Patents
Circuit board processing method Download PDFInfo
- Publication number
- CN111465219A CN111465219A CN202010295766.2A CN202010295766A CN111465219A CN 111465219 A CN111465219 A CN 111465219A CN 202010295766 A CN202010295766 A CN 202010295766A CN 111465219 A CN111465219 A CN 111465219A
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- Prior art keywords
- positioning hole
- layer
- carbon dioxide
- processing method
- dioxide laser
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a circuit board processing method, which comprises the following steps of S1, manufacturing a first positioning hole on a conducting layer of a single-layer board; s2, performing carbon dioxide laser on the conducting layer of the single-layer plate, wherein the carbon dioxide laser position is the position of the first positioning hole, and the carbon dioxide laser area completely covers the first positioning hole so as to form a second positioning hole which has the same aperture as the first positioning hole and is coaxial with the first positioning hole on the base material layer of the single-layer plate; and S3, positioning by using the second positioning hole, and manufacturing blind holes on the base material layer of the single-layer plate. Utilize the radium-shine characteristic that can not puncture the copper foil of carbon dioxide, realize shooing out the same and coaxial second locating hole with first locating hole aperture at the substrate layer radium, this technical scheme compares in prior art and has reduced the tolerance accumulation one time, has improved the machining precision of single-layer board effectively for the interlayer counterpoint precision of the multiply wood that follow-up lamination was made promotes by a wide margin.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a circuit board processing method.
Background
With the development of the 5G technology, the demand of high-frequency and high-speed circuit boards is continuously increased, and the requirement of the processing precision of the circuit boards is higher and higher due to the development trend of miniaturization and multilayering of the high-frequency circuit boards.
The existing multilayer circuit board is formed by laminating and conducting a plurality of single-layer boards, each single-layer board comprises a base material layer and a conducting layer (usually copper foil) arranged on one side of the base material layer, the conducting layer of each single-layer board needs to be etched with a circuit, and the base material layer of each single-layer board needs to be provided with a laser blind hole (the subsequent blind hole can be filled with conducting materials so as to conduct the conducting layers of two adjacent single-layer boards).
In the face of the rapid development of the 5G technology, the improvement of the processing precision of the circuit board is urgent.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: provided is a processing method capable of improving the processing precision of a circuit board.
In order to solve the technical problems, the invention adopts the technical scheme that: a processing method of a circuit board comprises the following steps,
s1, manufacturing a first positioning hole in the conducting layer of the single-layer plate;
s2, performing carbon dioxide laser on the conducting layer of the single-layer plate, wherein the carbon dioxide laser position is the position of the first positioning hole, and the carbon dioxide laser area completely covers the first positioning hole so as to form a second positioning hole which has the same aperture as the first positioning hole and is coaxial with the first positioning hole on the base material layer of the single-layer plate;
and S3, positioning by using the second positioning hole, and manufacturing blind holes on the base material layer of the single-layer plate.
The invention has the beneficial effects that: utilize the radium-shine characteristic that can not puncture the copper foil of carbon dioxide, realize penetrating the same and coaxial second locating hole with first locating hole aperture at the substrate layer radium, then utilize the second locating hole location to carry out the preparation of blind hole, compare in prior art, any tolerance can not appear when preparation second locating hole in this technical scheme, in other words, this technical scheme compares and has reduced the tolerance accumulation in prior art, has improved the machining precision of single-layer board effectively, make the interlayer counterpoint precision of the multiply wood that follow-up lamination was made promote by a wide margin.
Drawings
Fig. 1 is a cross-sectional view of the circuit board after step S1 in the first embodiment of the present invention;
fig. 2 is a cross-sectional view of the circuit board before step S2 according to the first embodiment of the present invention;
fig. 3 is a cross-sectional view of the circuit board after step S2 according to the first embodiment of the present invention;
fig. 4 is a cross-sectional view of the circuit board after step S3 in the first embodiment of the present invention.
Description of reference numerals:
1. a conductive layer;
2. a substrate layer;
3. a first positioning hole;
4. a second positioning hole;
5. a carbon dioxide laser area;
6. and (4) blind holes.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The most key concept of the invention is as follows: by utilizing the characteristic that the copper foil cannot be broken down by carbon dioxide laser, the second positioning hole which has the same aperture as the first positioning hole and is coaxial with the first positioning hole is formed in the substrate layer by laser, and the tolerance accumulation in the process of manufacturing the second positioning hole in the prior art is completely eliminated.
Referring to fig. 1 to 4, a method for processing a circuit board includes the following steps,
s1, manufacturing a first positioning hole 3 in the conducting layer 1 of the single-layer plate;
s2, performing carbon dioxide laser on the conducting layer 1 of the single-layer plate, wherein the carbon dioxide laser position is the position of the first positioning hole 3, and the carbon dioxide laser area 5 completely covers the first positioning hole 3 so as to form a second positioning hole 4 which has the same aperture as that of the first positioning hole 3 and is coaxial with the first positioning hole 3 on the base material layer 2 of the single-layer plate;
and S3, positioning by using the second positioning hole 4, and manufacturing the blind hole 6 on the base material layer 2 of the single-layer plate.
From the above description, the beneficial effects of the present invention are: compared with the prior art, any tolerance can not appear when making second locating hole 4 in this technical scheme, in other words, this technical scheme compares and has reduced a tolerance accumulation in prior art, has improved the machining precision of single-layer board effectively for the interlayer counterpoint precision of the multiply wood that follow-up lamination was made promotes by a wide margin.
Further, in step S1, the first positioning holes 3 are formed by etching.
As can be seen from the above description, the etching formation of the first positioning hole 3 can ensure the machining accuracy of the first positioning hole 3.
Further, the first positioning holes 3 and the circuit on the conductive layer 1 are etched and formed simultaneously.
As can be seen from the above description, the first positioning holes 3 are formed in the same process step as the circuit of the conductive layer 1, which effectively improves the processing efficiency of the circuit board.
Further, in step S2, the area of the carbon dioxide laser area 5 is larger than the area of the first positioning hole 3.
Further, the first positioning hole 3 is located in the carbon dioxide laser area 5, and a gap is formed between an edge of the first positioning hole 3 and an edge of the carbon dioxide laser area 5.
As can be seen from the above description, the above arrangement can ensure that the diameter of the second positioning hole 4 and the diameter of the first positioning hole 3 are the same and coaxial.
Further, step S3 is preceded by step S03 of turning over the single-layer board.
Further, the blind holes 6 are formed through carbon dioxide laser forming.
According to the description, the UV laser blind holes 6 can generate high heat to cause the hole walls to be blackened, the alignment of the subsequent process is influenced, cleaning actions need to be added, and cleaning is not needed after the carbon dioxide laser blind holes 6 are adopted, so that the processing efficiency is improved.
Further, step S4 is included after step S3, and a conductive material is disposed in the blind hole 6.
Further, step S4 is to print conductive paste in the blind via 6.
Further, step S4 is followed by step S5 of laminating a plurality of single-layer boards, so that the adjacent single-layer boards are electrically connected through the conductive material in the blind holes 6.
Example one
Referring to fig. 1 to 4, a first embodiment of the present invention is: a processing method of a circuit board comprises the following steps,
s1, forming a first positioning hole 3 in the conductive layer 1 of the single-layer board, as shown in fig. 1. Preferably, the first positioning hole 3 is formed by etching, and further preferably, the first positioning hole 3 is formed at the time of etching a circuit on the conductive layer 1 of the single-layer board, that is, the first positioning hole 3 and the circuit on the conductive layer 1 are simultaneously formed by etching; the conductive layer 1 is usually made of copper foil. The single layer board can be a flexible copper clad board.
S2, performing carbon dioxide laser on the conductive layer 1 of the single-layer plate, wherein the carbon dioxide laser position is the position of the first positioning hole 3, and the carbon dioxide laser area 5 completely covers the first positioning hole 3 so as to form a second positioning hole 4 which has the same aperture as that of the first positioning hole 3 and is coaxial with the first positioning hole 3 on the base material layer 2 of the single-layer plate, please combine the figures 2 and 3, and the base material layer 2 can be L CP.
S3, positioning the substrate layer 2 of the single-layer board by the second positioning holes 4, and forming blind holes 6, see fig. 4. Preferably, the blind holes 6 are formed by carbon dioxide laser;
step S4, arranging a conductive material in the blind hole 6, specifically, printing conductive slurry in the blind hole 6;
and step S5, laminating a plurality of single-layer plates to enable adjacent single-layer plates to be conducted through the conductive materials in the blind holes 6.
In order to reduce the processing difficulty, in step S2, the area of the carbon dioxide laser area 5 is larger than the area of the first positioning hole 3. Specifically, the first positioning hole 3 is located in the carbon dioxide laser area 5, and a gap is formed between the edge of the first positioning hole 3 and the edge of the carbon dioxide laser area 5.
Step S03, turning the single-layer board is further included before step S3.
The processing method of the circuit board is particularly suitable for manufacturing soft boards, especially high-frequency and high-speed soft boards.
In the 5G technology, the number of stacked layers of the multilayer circuit board is large, and if the machining accumulated tolerance of the single board is large, the total accumulated tolerance of the multilayer circuit board is directly large, while the 5G communication line has a severe shielding requirement, and the large total accumulated tolerance may cause the shielding effect of the multilayer circuit board to be poor, so that the multilayer circuit board does not meet the requirement of 5G communication. The circuit board processing method effectively reduces the accumulated tolerance of the single board, so the circuit board processing method is particularly suitable for preparing the circuit board for 5G communication.
In conclusion, the circuit board processing method provided by the invention creatively uses the disadvantages of carbon dioxide laser as advantages, compared with the prior art, the technical scheme has the advantages that no tolerance is generated when the second positioning hole is manufactured, the tolerance accumulation at one time is reduced, the processing precision of a single-layer board is effectively improved, and the interlayer alignment precision of a multi-layer board manufactured by subsequent lamination is greatly improved; the processing method of the circuit board is particularly suitable for preparing the flexible copper clad laminate for 5G communication.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (10)
1. A circuit board processing method is characterized in that: comprises the following steps of (a) carrying out,
s1, manufacturing a first positioning hole in the conducting layer of the single-layer plate;
s2, performing carbon dioxide laser on the conducting layer of the single-layer plate, wherein the carbon dioxide laser position is the position of the first positioning hole, and the carbon dioxide laser area completely covers the first positioning hole so as to form a second positioning hole which has the same aperture as the first positioning hole and is coaxial with the first positioning hole on the base material layer of the single-layer plate;
and S3, positioning by using the second positioning hole, and manufacturing blind holes on the base material layer of the single-layer plate.
2. The wiring board processing method according to claim 1, characterized in that: in step S1, the first positioning hole is formed by etching.
3. The wiring board processing method according to claim 2, characterized in that: the first positioning hole and the circuit on the conductive layer are etched and formed at the same time.
4. The wiring board processing method according to claim 1, characterized in that: in step S2, the area of the carbon dioxide laser area is larger than the area of the first positioning hole.
5. The wiring board processing method according to claim 4, characterized in that: the first positioning hole is located in the carbon dioxide laser area, and a gap is formed between the edge of the first positioning hole and the edge of the carbon dioxide laser area.
6. The wiring board processing method according to claim 1, characterized in that: step S03, turning the single-layer board is further included before step S3.
7. The wiring board processing method according to claim 1, characterized in that: the blind holes are formed through carbon dioxide laser.
8. The wiring board processing method according to claim 1, characterized in that: step S4 is further included after step S3, and a conductive material is disposed in the blind hole.
9. The wiring board processing method according to claim 8, characterized in that: step S4 is specifically to print conductive paste in the blind via.
10. The wiring board processing method according to claim 8, characterized in that: step S5 is further included after step S4, the multiple single-layer boards are stacked, and the adjacent single-layer boards are conducted through the conductive material in the blind holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010295766.2A CN111465219B (en) | 2020-04-15 | 2020-04-15 | Circuit board processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010295766.2A CN111465219B (en) | 2020-04-15 | 2020-04-15 | Circuit board processing method |
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| Publication Number | Publication Date |
|---|---|
| CN111465219A true CN111465219A (en) | 2020-07-28 |
| CN111465219B CN111465219B (en) | 2022-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010295766.2A Active CN111465219B (en) | 2020-04-15 | 2020-04-15 | Circuit board processing method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113141709A (en) * | 2021-02-26 | 2021-07-20 | 江苏博敏电子有限公司 | Equipment self-checking method for blind hole position offset of circuit board |
| CN113191037A (en) * | 2021-03-23 | 2021-07-30 | 深圳市信维通信股份有限公司 | Insertion loss prediction method based on form and position tolerance and terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08274466A (en) * | 1995-03-31 | 1996-10-18 | Nec Corp | Manufacturing method of multilayer printed interconnection board |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| CN102413646A (en) * | 2010-09-21 | 2012-04-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board |
| CN105530767A (en) * | 2016-01-26 | 2016-04-27 | 江苏博敏电子有限公司 | Streamline production process for HDI board |
-
2020
- 2020-04-15 CN CN202010295766.2A patent/CN111465219B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08274466A (en) * | 1995-03-31 | 1996-10-18 | Nec Corp | Manufacturing method of multilayer printed interconnection board |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| CN102413646A (en) * | 2010-09-21 | 2012-04-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board |
| CN105530767A (en) * | 2016-01-26 | 2016-04-27 | 江苏博敏电子有限公司 | Streamline production process for HDI board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113141709A (en) * | 2021-02-26 | 2021-07-20 | 江苏博敏电子有限公司 | Equipment self-checking method for blind hole position offset of circuit board |
| CN113191037A (en) * | 2021-03-23 | 2021-07-30 | 深圳市信维通信股份有限公司 | Insertion loss prediction method based on form and position tolerance and terminal |
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| Publication number | Publication date |
|---|---|
| CN111465219B (en) | 2022-02-22 |
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