CN213424953U - Wafer carrier signboard replacing device - Google Patents

Wafer carrier signboard replacing device Download PDF

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Publication number
CN213424953U
CN213424953U CN202120570604.5U CN202120570604U CN213424953U CN 213424953 U CN213424953 U CN 213424953U CN 202120570604 U CN202120570604 U CN 202120570604U CN 213424953 U CN213424953 U CN 213424953U
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CN
China
Prior art keywords
signboard
clamping
wafer carrier
clamping piece
assembly
Prior art date
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Active
Application number
CN202120570604.5U
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Chinese (zh)
Inventor
季爱民
张宁娜
孙勤
蒋孝恩
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TSMC China Co Ltd
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Original Assignee
TSMC China Co Ltd
Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Application filed by TSMC China Co Ltd, Taiwan Semiconductor Manufacturing Co TSMC Ltd filed Critical TSMC China Co Ltd
Priority to CN202120570604.5U priority Critical patent/CN213424953U/en
Priority to PCT/CN2021/082312 priority patent/WO2022193336A1/en
Application granted granted Critical
Publication of CN213424953U publication Critical patent/CN213424953U/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application provides a device is changed to wafer carrier signboard includes support, centre gripping subassembly, first detection element and second detection element. The bracket extends along the longitudinal direction. The clamping assembly is arranged on the support and comprises a first clamping piece and a second clamping piece which are matched for use, and at least one of the first clamping piece and the second clamping piece is arranged in a sliding mode relative to the support along the longitudinal direction. The first detection assembly is arranged between the first clamping piece and the second clamping piece to detect first parameter information of the signboard, and the first parameter information comprises information data of whether the signboard exists between the first clamping piece and the second clamping piece. The second detection assembly is arranged on the support in a longitudinally moving mode and moves to the clamping assembly according to the first parameter information to acquire second parameter information of the signboard. The application provides a wafer carrier signboard changing device not only can replace manual work, reduce cost, has improved the precision that the signboard was by the clamping position moreover, and then has improved the change efficiency of signboard.

Description

Wafer carrier signboard replacing device
Technical Field
The present application relates to the field of semiconductor technology, and more particularly, to a wafer carrier signboard replacing device.
Background
A wafer refers to a substrate (also called a substrate) from which semiconductor transistors or integrated circuits are fabricated. Since it is a crystalline material, it is called a wafer because it is circular in shape. In recent years, the semiconductor industry is being developed greatly in China, and the automation degree of a wafer production line becomes an important influence factor for improving the yield and quality of wafers.
In the current wafer production line, the signboard of the wafer carrier needs to be manually replaced, and an operator needs to pull out the signboard from the previous wafer carrier and then install the signboard into another clean wafer carrier, so that the efficiency is low and the labor cost is high.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a device for replacing a wafer carrier signboard, which at least solves the problems of high cost and low efficiency caused by the fact that the conventional wafer carrier signboard needs to be manually replaced.
The embodiment of the application provides a device is changed to wafer carrier signboard, includes:
the bracket extends along the longitudinal direction;
the clamping assembly is arranged on the bracket and comprises a first clamping piece and a second clamping piece which are matched with each other, and at least one of the first clamping piece and the second clamping piece is arranged in a sliding mode relative to the bracket along the longitudinal direction so as to adjust the distance between the first clamping piece and the second clamping piece;
the first detection assembly is arranged between the first clamping piece and the second clamping piece to detect first parameter information of the signboard, wherein the first parameter information comprises information data of whether the signboard exists between the first clamping piece and the second clamping piece;
the second detection assembly is arranged on the support along the longitudinal movement, moves to the clamping assembly according to the first parameter information to obtain second parameter information of the signboard, and the second parameter information comprises preset position information of the signboard between the first clamping piece and the second clamping piece.
In some embodiments, the second detecting assembly comprises two first pressure-sensitive elements arranged on two sides of the bracket along the transverse direction, and the first pressure-sensitive elements can move to the clamping assembly along the longitudinal direction from an initial position.
In some embodiments, the second detecting assembly further includes a first driving member disposed on the bracket and driving the first pressure-sensitive element to perform a linear reciprocating motion along the longitudinal direction.
In some embodiments, the wafer carrier replacing device further comprises a third detecting component, wherein the third detecting component is positioned on at least one of the first clamping piece and the second clamping piece to detect third parameter information of the signboard, and the third parameter information comprises information data of whether the wafer carrier leaves the replacing device or not; and when the first parameter information indicates that a signboard exists between the first clamping piece and the second clamping piece and the third parameter information indicates that the wafer carrier leaves the replacing device, the second detection assembly moves to the clamping assembly.
In some embodiments, the third detection assembly comprises a photosensitive element disposed on a side of the first clamp facing the wafer carrier and/or a photosensitive element disposed on a side of the second clamp facing the wafer carrier.
In some embodiments, the first detection assembly includes a second pressure sensitive element for detecting the first parameter information of the signboard.
In some embodiments, the first clamping member includes a first clamping portion and a first stopping portion which are connected angularly, the second clamping member includes a second clamping portion and a second stopping portion which are connected angularly, and the first clamping portion and the second clamping portion are arranged oppositely along the longitudinal direction and are used for clamping the signboard.
In some embodiments, the clamping assembly further comprises a driving assembly, the driving assembly comprises a second driving member and a connecting member, the connecting member is connected to the first clamping member, and the second driving member drives the first clamping member to approach or separate from the second clamping member through the connecting member; the second clamping piece is fixedly arranged on the support and is positioned between the first clamping piece and the second detection assembly.
In some embodiments, a side of the bracket facing away from the second clamping member is provided with a groove, and the connecting member is located in the groove and can slide therein.
In some embodiments, the connecting member has an avoiding hole penetrating through the connecting member in a thickness direction, and the first detecting member is located in the avoiding hole.
The wafer carrier signboard changing device provided by the embodiment of the application not only can replace the manual work, realize that the clamp of signboard gets and releases, reduce cost, but also can detect whether the signboard is correctly by centre gripping and clamping position through setting up first determine module and second determine module to improve the accurate degree of signboard by clamping position, and then improved the change efficiency of signboard. And, the improvement of signboard by the centre gripping position precision can promote the success rate that follow-up signboard inserted in clean wafer carrier greatly, has reduced because the friction between signboard and the wafer carrier that the centre gripping offset leads to, provides the assurance for the accurate grafting of signboard and wafer carrier.
Drawings
Features, advantages and technical effects of exemplary embodiments of the present application will be described below by referring to the accompanying drawings.
Fig. 1 is a schematic structural view of a wafer carrier signboard changing apparatus according to an embodiment of the present application;
FIG. 2 is an enlarged schematic view at A in FIG. 1;
FIG. 3 is a rear view of the wafer carrier signboard changer of FIG. 1;
fig. 4 is a schematic structural view of the wafer carrier signboard changer, the wafer carrier and the robot shown in fig. 1 in an operating state.
Reference numerals:
1. replacing the device;
11. a support;
12. a clamping assembly; 121. a first clamping member; 122. a second clamping member; 123. a first clamping portion; 124. a first stopper portion; 125. a second clamping portion; 126. a second stopper portion; 127. a second driving member; 128. a connecting member; 129. avoiding holes;
13. a first detection assembly;
14. a second detection assembly; 141. a first pressure-sensitive element; 142. a first driving member;
15. a photosensitive element;
2. a signboard;
3. a wafer carrier;
4. a manipulator;
x, transverse direction; y, longitudinal direction.
Detailed Description
Embodiments of the present application will be described in further detail below with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the application and are not intended to limit the scope of the application, i.e., the application is not limited to the described embodiments.
In the description of the present application, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like, indicate an orientation or positional relationship that is merely for convenience in describing the application and to simplify the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The following description is given with the directional terms as they are used in the drawings and not intended to limit the specific structure of the present application. In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood as appropriate by one of ordinary skill in the art.
For a better understanding of the present application, embodiments of the present application are described below with reference to fig. 1 to 4.
Fig. 1 is a schematic structural diagram of a device for replacing a signboard of a wafer carrier according to an embodiment of the present application. Referring to fig. 1, the apparatus for replacing a signboard of a wafer carrier according to an embodiment of the present invention includes a support 11, a clamping assembly 12, a first detecting assembly 13 and a second detecting assembly 14. The holder 11 extends in the longitudinal direction Y. The clamping assembly 12 is disposed on the bracket 11, the clamping assembly 12 includes a first clamping member 121 and a second clamping member 122, and at least one of the first clamping member 121 and the second clamping member 122 is slidably disposed along the longitudinal direction Y relative to the bracket 11, so as to adjust a distance between the first clamping member 121 and the second clamping member 122. The first detecting component 13 is disposed between the first clamping member 121 and the second clamping member 122 to detect first parameter information of the signboard, where the first parameter information includes information data of whether the signboard exists between the first clamping member 121 and the second clamping member 122. The second detecting component 14 is disposed on the support 11 along the longitudinal direction Y, and the second detecting component 14 moves to the holding component 12 according to the first parameter information to obtain the second parameter information of the signboard, where the second parameter information includes the preset position information of the signboard between the first holding component 121 and the second holding component 122.
The wafer carrier signboard changing device of the embodiment of the application not only can replace the manual work, realize that the clamp of signboard gets and releases, reduce cost, but also can detect whether the signboard is held and whether the clamping position is correct or not by setting up the first detection component 13 and the second detection component 14, thereby improving the precision of the signboard by the clamping position and further improving the changing efficiency of the signboard. And, the improvement of signboard by the centre gripping position precision can promote the success rate that follow-up signboard inserted in clean wafer carrier greatly, has reduced because the friction between signboard and the wafer carrier that the centre gripping offset leads to, provides the assurance for the accurate grafting of signboard and wafer carrier.
In some alternative embodiments, the first sensing assembly 13 includes a second pressure sensitive element for sensing the first parameter information of the signboard. Wherein the second pressure sensitive element is a pressure sensor. The second pressure sensitive element is disposed on the bracket 11 between the first clamping member 121 and the second clamping member 122, and the second pressure sensitive element can protrude out of the surface of the bracket 11. Of course, the second pressure sensitive element may be disposed on other structures as long as it can detect whether the information data of the signboard exists between the first clamping member 121 and the second clamping member 122. When the signboard is clamped, the second pressure sensitive element which is protruded is pressed, and the second pressure sensitive element sends out information data that the signboard is clamped.
In further alternative embodiments, the first detection assembly 13 includes a ranging sensor that detects the first parameter information of the signboard. When the distance measuring sensor detects that the distance from the signboard is within a certain range, the information data that the signboard is clamped is sent out, for example, the information data is within the range of 0-5mm, and the clamping of the signboard is indicated. Of course, the first detecting component 13 may also include other types of detecting elements, and it is sufficient that the information data of the signboard can be detected between the first clamping member 121 and the second clamping member 122.
In some alternative embodiments, the second detecting assembly 14 includes two first pressure-sensitive elements 141 disposed on both sides of the bracket 11 along the transverse direction X, and the first pressure-sensitive elements 141 can move to the clamping assembly 12 along the longitudinal direction Y from the initial position. The initial position of the first pressure sensitive element 141 is located in the middle or lower portion of the bracket 11, the clamping assembly 12 is located in the upper portion of the bracket 11, the first pressure sensitive element 141 moves upward from the initial position to the two sides of the clamping assembly 12, and then information of whether the signboard is located at a preset position between the first clamping member 121 and the second clamping member 122 is obtained, that is, whether the signboard is located between the two first pressure sensitive elements 141 is obtained, if the signboard is skewed, one of the first pressure sensitive elements 141 touches the signboard when rising to the clamping assembly 12, that is, the first pressure sensitive element 141 touches the signboard when rising to the second clamping member 122, and the first pressure sensitive element 141 senses the signboard skewed signal. Of course, the second detecting component 14 may also include other types of detecting elements capable of detecting whether the signboard is at the preset position. The preset position refers to a set area where the signboard is located, and can be determined according to actual needs, and the preset position refers to an area between the two first pressure-sensitive elements 141 in this embodiment.
In other alternative embodiments, the second detecting unit 14 includes a distance measuring sensor, and detects the distance from the distance sensor to the left or right side of the signboard when the signboard ascends to the holding unit 12, and obtains information data on whether the signboard is at a predetermined position between the first holding member 121 and the second holding member 122.
In some optional embodiments, the second detecting assembly 14 further includes a first driving member 142, and the first driving member 142 is fixedly disposed on the bracket 11 and drives the first pressure sensitive element 141 to perform a linear reciprocating motion along the longitudinal direction Y. The first driving member 142 is an electric cylinder, but may be other members capable of driving the first pressure sensitive element 141 to ascend or descend, such as a hydraulic cylinder. The first driving member 142 is arranged to drive the first pressure sensitive element 141 to ascend or descend, so that the first pressure sensitive element 141 is located at a position where the movement of the manipulator and the wafer carrier is not affected when the first pressure sensitive element is not used, and the interference is avoided.
In some optional embodiments, the wafer carrier signboard changer further includes a third detecting element disposed on at least one of the first gripper 121 and the second gripper 122 to detect third parameter information of the signboard, wherein the third parameter information includes information about whether the wafer carrier is removed from the changer. When the first parameter information indicates that the signboard exists between the first clamping member 121 and the second clamping member 122, and the third parameter information indicates that the wafer carrier leaves the replacement device, the second detecting assembly 14 moves to the clamping assembly 12 to obtain the second parameter information of the signboard. Whether the wafer carrier leaves the replacing device or not is detected by arranging the third detection component, if the wafer carrier leaves the replacing device and the first parameter information indicates that the signboard exists between the first clamping piece 121 and the second clamping piece 122, the signboard is just detached and is positioned on the replacing device at the moment, whether the signboard is inclined or not needs to be detected, and at the moment, the second detection component 14 rises to detect and cannot interfere with the wafer carrier.
In some alternative embodiments, the third detecting element comprises a photosensitive element 15, and the photosensitive element 15 is fixedly disposed on a side of the second clamping member 122 facing the wafer carrier. Of course, the photosensitive element 15 may be disposed on the side of the first gripper 121 facing the wafer carrier, or one each of the first gripper 121 and the second gripper 122. Because the wafer carrier is close to the clamping component 12 in the process of detaching or installing the signboard, and the volume of the wafer carrier is far larger than that of the clamping component 12, most of the irradiating light is shielded by the clamping component 12, the intensity of the irradiating light received by the clamping component 12 can be weakened, and the change of the irradiating light of the clamping component 12 can be clearly sensed by arranging the photosensitive element 15, so that whether the wafer carrier leaves the replacing device or not can be accurately judged. Since the second clamping member 122 is located below the first clamping member 121, the shielded area is larger, and the photosensitive element 15 can be more clearly perceived by being disposed thereon. Of course, the third detecting component may also include other detecting elements capable of detecting whether the wafer carrier is away from the replacing device.
Referring to fig. 2, fig. 2 is an enlarged view of a point a in fig. 1, in some alternative embodiments, the first clamping member 121 includes a first clamping portion 123 and a first stopping portion 124 connected at an angle, the second clamping member 122 includes a second clamping portion 125 and a second stopping portion 126 connected at an angle, and the first clamping portion 123 and the second clamping portion 125 are disposed opposite to each other along the longitudinal direction Y for clamping the signboard. By providing the first stopper 124 and the second stopper 126, the signboard is prevented from slipping out. Alternatively, the first clamping portion 123 and the first stopping portion 124 are connected at a right angle, and the second clamping portion 125 and the second stopping portion 126 are connected at a right angle. Of course, the first clamping portion 123 and the first stopping portion 124, and the second clamping portion 125 and the second stopping portion 126 may be connected at other angles, and only the stopping function of the first stopping portion 124 and the second stopping portion 126 is required to be satisfied.
In some alternative embodiments, the first stopping portion 124 and the first clamping portion 123 are integrally formed, and the second stopping portion 126 and the second clamping portion 125 are integrally formed. Of course, the first stopping portion 124 and the first clamping portion 123, and the second stopping portion 126 and the second clamping portion 125 may also be connected by other methods, such as adhesion.
Referring now to fig. 3, fig. 3 is a rear view of the wafer carrier signboard changer of fig. 1. In some alternative embodiments, the clamping assembly 12 further comprises a driving assembly, the driving assembly comprises a second driving member 127 and a connecting member 128, the second driving member 127 is fixedly disposed on the bracket 11, and the connecting member 128 is connected to an output end of the second driving member 127 and is fixedly connected to the first clamping member 121. The second clamping member 122 is fixedly disposed on the bracket 11 and located between the first clamping member 121 and the second detecting component 14, and the first clamping member 121 is located above the bracket 11. The second driving member 127 drives the first clamping member 121 to move closer to or away from the second clamping member 122 via the connecting member 128. The position of the second clamping piece 122 is fixed, the first clamping piece 121 is close to or far away from the second clamping piece 122 to clamp the signboard 2, and the signboard clamping device is more compact and reasonable in structure and is more convenient to use.
In some alternative embodiments, the second driver 127 is an electric cylinder. Of course, the second driving member 127 may also be other members capable of driving the first clamping member 121 to move linearly, such as an electric telescopic rod, a pneumatic cylinder, a hydraulic cylinder, etc.
In some alternative embodiments, the second clamping portion 125 is threadedly coupled to the bracket 11. The two adopts detachable connected mode, conveniently adjusts the position of second clamping part 125, and then can adjust the centre gripping distance of first clamping part 123 and second clamping part 125 according to the 2 sizes of signboard of difference, improves the suitability of changing the device.
In other alternative embodiments, the connecting member 128 is connected to the second clamping member 122 located at the lower portion, the first clamping member 121 located at the upper portion is fixedly disposed, and the second driving member 127 drives the second clamping member 122 to move closer to or away from the first clamping member 121.
In some alternative embodiments, the side of the bracket 11 facing away from the second clamping member 122 is provided with a groove, the connecting member 128 is located in the groove and slides therein, and the upper end of the connecting member 128 is fixedly connected with the first clamping portion 123. Through setting up the recess on support 11 for connecting piece 128 slides and sets up in wherein, can not only provide the direction for the up-and-down motion of connecting piece 128, promotes the stability of motion, but also can reduce the width of first clamping part 123, avoids the extravagant material because of the first clamping part 123 width that support 11 thickness leads to is great.
Further, the connecting member 128 is provided with an avoiding hole 129 penetrating through the connecting member in the thickness direction, and the first detecting element 13 is located in the avoiding hole 129. The connecting member 128 is a plate-shaped member, but may be a block or a bar.
The signboard changing device comprises a control device, wherein the control device is connected with the first detection assembly 13, the second detection assembly 14, the third detection assembly and the driving assembly so as to control the time of corresponding actions of the components, receive corresponding information data and process the information data. The control device may be located on the support 11 or integrated into a control system of the wafer production line.
Next, an operation process of the wafer carrier signboard changing apparatus according to the embodiment of the present application will be described with reference to fig. 4, where fig. 4 is a schematic structural diagram of the wafer carrier signboard changing apparatus, the wafer carrier and the robot shown in fig. 1 in an operating state.
The mechanical arm 4 clamps the wafer carrier 3 of the signboard 2 to be replaced to the front of the clamping assembly 12 and enables the signboard 2 to be inserted between the first clamping portion 123 and the second clamping portion 125, the mechanical arm 4 drives the wafer carrier 3 to move downwards and to be inserted into a clamping groove formed by the second stopping portion 126, the second clamping portion 125 and the support 11 in an enclosing mode, then the second driving piece 127 drives the first clamping piece 121 to move downwards through the connecting piece 128, the signboard 2 is clamped by the first clamping portion 123 and the second clamping portion 125, the mechanical arm 4 drives the wafer carrier 3 to move downwards, the accommodating groove in the wafer carrier 3 is enabled to be separated from the signboard 2, and the mechanical arm 4 drives the wafer carrier 3 to be replaced to be separated; at this time, the first detecting component 13 detects whether the signboard 2 is clamped, after the signboard is clamped, the third detecting component detects whether the wafer carrier 3 leaves the replacing device 1, if the wafer carrier leaves, the control device controls the first driving component 142 to drive the first pressure sensitive element 141 to ascend to the clamping component 12, the preset position information of the signboard 2 between the first clamping component 121 and the second clamping component 122 is detected, and if the position of the signboard 2 is correct, the first pressure sensitive element 141 descends to the initial position.
The manipulator 4 brings a clean wafer carrier 3 to the replacement device 1 again, and drives the wafer carrier 3 to move from bottom to top, so that the holding tank is sleeved into the two sides of the signboard 2 from bottom to top, after the signboard is completely sleeved in, the second driving piece 127 drives the first clamping piece 121 to rise and loosen the signboard 2, the manipulator 4 drives the wafer carrier 3 to rise for a certain distance, so that the signboard 2 is separated from the second clamping piece 122, then the manipulator 4 leads the clean wafer carrier 3 with the signboard 2 to retreat and leave, and the replacement of the signboard 2 is completed.
While the present application has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the present application, and in particular, features shown in the various embodiments may be combined in any manner as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.

Claims (10)

1. A wafer carrier signboard changing device is characterized by comprising:
the bracket extends along the longitudinal direction;
the clamping assembly is arranged on the bracket and comprises a first clamping piece and a second clamping piece which are matched with each other, and at least one of the first clamping piece and the second clamping piece is arranged in a sliding mode relative to the bracket along the longitudinal direction so as to adjust the distance between the first clamping piece and the second clamping piece;
the first detection assembly is arranged between the first clamping piece and the second clamping piece and used for detecting information data of the signboard existing between the first clamping piece and the second clamping piece;
the second detection assembly is arranged on the support in a longitudinally moving mode, and when the signboard exists between the first clamping piece and the second clamping piece, the second detection assembly can move to the clamping assembly to detect the preset position information of the signboard between the first clamping piece and the second clamping piece.
2. The wafer carrier signboard changing device of claim 1, wherein the second detecting assembly comprises two first pressure sensitive elements disposed on two sides of the bracket along a transverse direction, and the first pressure sensitive elements can move from an initial position to the clamping assembly along the longitudinal direction.
3. The wafer carrier signboard changing apparatus as claimed in claim 2, wherein the second detecting component further comprises a first driving component disposed on the bracket and driving the first pressure sensitive element to reciprocate linearly along the longitudinal direction.
4. The wafer carrier signboard changing device of claim 1, further comprising a third detection assembly, the third detection assembly being located on the first holder and/or the second holder, the third detection assembly being configured to detect data information of the wafer carrier leaving the changing device;
when the signboard exists between the first clamping piece and the second clamping piece and the wafer carrier leaves the replacing device, the second detection assembly moves to the clamping assembly.
5. The wafer carrier signboard changing device of claim 4, wherein the third detecting element comprises a photosensitive element disposed on a side of the first clamp facing the wafer carrier and/or a side of the second clamp facing the wafer carrier.
6. The wafer carrier signboard changing apparatus of claim 1, wherein the first detecting component comprises a second pressure sensitive element for detecting information data of the signboard existing between the first holder and the second holder.
7. The wafer carrier signboard changing device of claim 1, wherein the first clamping member comprises a first clamping portion and a first stopping portion which are connected in an angle, the second clamping member comprises a second clamping portion and a second stopping portion which are connected in an angle, and the first clamping portion and the second clamping portion are arranged oppositely along the longitudinal direction and are used for clamping the signboard.
8. The wafer carrier signboard changing apparatus of claim 7, wherein the clamping assembly further comprises a driving assembly, the driving assembly comprises a second driving member and a connecting member, the connecting member is connected to the first clamping member, and the second driving member drives the first clamping member to approach or move away from the second clamping member through the connecting member;
the second clamping piece is fixedly arranged on the support and is positioned between the first clamping piece and the second detection assembly.
9. The wafer carrier sign changing device of claim 8, wherein a side of the bracket facing away from the second retaining member is provided with a groove, and the connector is located in the groove and is slidable therein.
10. The wafer carrier signboard changing device of claim 8, wherein the connecting member has an avoiding hole penetrating therethrough in a thickness direction, and the first detecting element is located in the avoiding hole.
CN202120570604.5U 2021-03-19 2021-03-19 Wafer carrier signboard replacing device Active CN213424953U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202120570604.5U CN213424953U (en) 2021-03-19 2021-03-19 Wafer carrier signboard replacing device
PCT/CN2021/082312 WO2022193336A1 (en) 2021-03-19 2021-03-23 Wafer carrier identification card replacement device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120570604.5U CN213424953U (en) 2021-03-19 2021-03-19 Wafer carrier signboard replacing device

Publications (1)

Publication Number Publication Date
CN213424953U true CN213424953U (en) 2021-06-11

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CN202120570604.5U Active CN213424953U (en) 2021-03-19 2021-03-19 Wafer carrier signboard replacing device

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WO (1) WO2022193336A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6745901B2 (en) * 2001-10-12 2004-06-08 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cassette equipped with piezoelectric sensors
CN201163612Y (en) * 2008-01-24 2008-12-10 中芯国际集成电路制造(上海)有限公司 Auxiliary fixing element for electronic label on wafer transmission box
CN105416738B (en) * 2015-12-18 2018-05-01 天弘(东莞)科技有限公司 A kind of control method of material mark equipment and material mark equipment
CN207489826U (en) * 2017-08-03 2018-06-12 渴飞股份有限公司 Wafer carrier system, wafer carrier and electronic module tag
CN211809962U (en) * 2020-03-18 2020-10-30 三门峡珑启物联网科技有限公司 Power transformation operation and maintenance vehicle

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