CN213280226U - Circuit board convenient to nation decides - Google Patents

Abstract

The utility model discloses a circuit board convenient to bind, including circuit board body 100, be provided with the pad, the width of pad is 0.25-0.33mm, in the PCB board, design suitable pad usually, and the pad design in the past is for meticulous circuit and arrange more circuits, set up the width of pad to be more than or equal to 0.13mm and be less than 2.0mm, under this width, it is inconvenient when binding, easily cause the dislocation welding, lead to the pin of chip and the resistance of pad welding department on the large side, easily cause the chip low pressure operation, cause whole PCB to move badly, inside the same PCB board, the pad is too big easily extrudes the circuit, cause the wiring space not enough, influence the production of PCB board; the width of the bonding pad is set to be 0.25-0.33mm, which is equivalent to the increase of the width of the bonding pad, and the limitation of 0.33mm ensures that enough wiring space is reserved on the PCB, the bonding pad with the width is easier to be welded with a pin of a chip when the PCB is bonded, and the width of the bonding pad is relatively large, so that the positioning is more convenient and faster, and the productivity is improved.

Description

Circuit board convenient to nation decides

Technical Field

The utility model relates to a PCB board technical field, in particular to circuit board convenient to nation decides.

Background

Bonding is a wire bonding method in the chip production process, and is generally used for connecting a circuit inside a chip with a pin or a bonding pad on a circuit board by using a gold wire or an aluminum wire before packaging.

The pad is slightly little, and the nation decides inconveniently, and production efficiency step-down if can't nation still can scrap whole PCB board.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a circuit board convenient to nation decides can make things convenient for the PCB board nation to decide.

According to the utility model discloses a circuit board convenient to nation of first aspect embodiment, including the circuit board body, be provided with the pad, the width of pad is 0.25-0.33mm, keeping away from of pad the one side of circuit board body is provided with the tin layer, the pad is provided with a plurality ofly, and is a plurality of the pad sets up side by side, the pad sets up to the square body, the square body perpendicular to the juncture on the adjacent two sides of circuit board body sets up to the chamfer, still includes the external locating piece that links, the external locating piece sets up to the cross.

According to the utility model discloses circuit board convenient to nation decides has following beneficial effect at least: in the PCB, the proper bonding pad is usually designed, and in the past, in order to refine circuits and arrange more circuits, the width of the bonding pad is set to be more than or equal to 0.13mm and less than 2.0mm, under the width, the bonding is inconvenient, the staggered welding is easily caused, the resistance of the pin of a chip and the welding part of the bonding pad is larger, the low-voltage operation of the chip is easily caused, the whole PCB is poor in operation, and the circuit is easily extruded due to the overlarge bonding pad in the same PCB, so that the wiring space is insufficient, and the production of the PCB is influenced; the width of the bonding pad is set to be 0.25-0.33mm, which is equivalent to increase the width of the bonding pad, the limitation of 0.33mm ensures that enough wiring space is reserved on a PCB, the bonding pad with the width is easier to weld with a pin of a chip when the PCB is bonded, the bonding pad is relatively large in width, the positioning is more convenient and quicker, the productivity is improved, the tin layer is used for covering one surface of the bonding pad far away from the circuit board body, the oxidation resistance of the bonding pad is enhanced, the bonding pads arranged side by side can be bonded with the pin of the chip when the bonding is performed, the alignment welding is convenient, the chamfer is used for increasing the interval between two adjacent bonding pads, the two adjacent bonding pads are prevented from being communicated when the welding is performed, the chamfer is also used for conveniently welding the pin of the chip with the bonding pad, and the outer connecting positioning block is convenient for welding gun positioning, make welder can target in place one step at the bonding in-process, the cross connect the crosspoint of locating piece only definite outward, convenient location, and the cross connect the locating piece outward easily by discernment.

According to some embodiments of the utility model, the width of outer locating piece of linking is 0.2mm to 0.25mm, makes things convenient for welder to discern outer locating piece of linking.

According to the utility model discloses a some embodiments still include the protection ring, outer even locating piece sets up in the protection ring, when the protection ring is used for preventing the etching the pad is little, can also with outer even locating piece with the pad is kept apart, prevents outer even locating piece with both are by mistake welding together the pad.

According to some embodiments of the present invention, the protection ring encloses a rectangle, the ring width of the protection ring is 0.25mm to 0.3mm, the protection ring is convenient to identify.

According to the utility model discloses a some embodiments, be provided with green oil layer on the protection ring, green oil layer reduces the influence of protection ring to nation.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a circuit board convenient for bonding according to an embodiment of the present invention;

fig. 2 is a side view of the wiring board shown in fig. 1 for ease of bonding.

The circuit board comprises a circuit board body 100, a solder pad 110, a tin layer 130, a chamfer 120, an external connection positioning block 200, a protection ring 300 and a green oil layer 310.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality is two or more, and the terms greater than, less than, exceeding, etc. are understood not to include the number, and the terms greater than, less than, within, etc. are understood to include the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Referring to fig. 1 and 2, a circuit board convenient for bonding includes a circuit board body 100 provided with a pad 110, and the width of the pad 110 is 0.25-0.33 mm. In a PCB, a proper bonding pad 110 is usually designed, and in the past, the bonding pad 110 is designed for fine circuits and arrangement of more circuits, the width of the bonding pad 110 is set to be more than or equal to 0.13mm and less than 2.0mm, under the width, bonding is inconvenient, staggered welding is easily caused, the resistance of the welding part of a pin of a chip and the bonding pad 110 is larger, low-voltage operation of the chip is easily caused, the whole PCB is poor in operation, and the excessive bonding pad 110 easily extrudes the circuits to cause insufficient wiring space in the same PCB, so that the production of the PCB is influenced; the width of the bonding pad 110 is set to be 0.25-0.33mm, which is equivalent to increasing the width of the bonding pad 110, and the limitation of 0.33mm allows enough wiring space on a PCB board, the bonding pad 110 with such width is easier to be welded with a pin of a chip when the PCB is bonded, and because the width of the bonding pad 110 is relatively large, the positioning is more convenient and faster, and the productivity is improved. It should be noted that bonding is to solder the pins of the chip and the corresponding pads, and fix the chip on the PCB and connect the chip to the circuit on the PCB.

In some embodiments, a tin layer 130 is disposed on a side of the bonding pad 110 away from the circuit board body 100, and the tin layer 130 is used to cover the side of the bonding pad 110 away from the circuit board body 100, so that the oxidation resistance of the bonding pad 110 is enhanced. It is understood that the surface of the pad 110 away from the circuit board body 100, i.e. the bonding surface of the pad 110, is used for attaching to the surface of the chip pin. It is understood that, in order to prevent the exposed portion of the pad 110 from being oxidized and corroded, the tin layer 130 may cover the exposed portion of the pad 110; note that, a silver layer or an aluminum layer may be provided on the surface of the pad 110 away from the circuit board body 100.

In some embodiments, the bonding pads 110 are provided in a plurality, the bonding pads 110 are arranged side by side, and the bonding pads 110 arranged side by side enable the bonding to fit the pins of the chip, so as to facilitate the alignment welding.

In some embodiments, the bonding pad 110 is a square body, the junction of the two adjacent surfaces of the square body perpendicular to the circuit board body 100 is provided with a chamfer 120, the chamfer 120 is used for increasing the interval between the two adjacent bonding pads 110 and preventing the two adjacent bonding pads 110 from being communicated during welding, the chamfer 120 is also provided for conveniently welding the chip pin and the bonding pad 110, it is to be noted that the bonding pad 110 itself is a square body, because the bonding pad 110 is thin, a relatively large plane on the bonding pad 110 is a part for contacting the chip pin, i.e. a welding surface, the welding surface is rectangular in shape, chamfers are provided at four corners of the rectangle, correspondingly, the bonding pad of the square body is also provided with chamfers 120 at four corners of the rectangle, for the square body, the chamfer 120 is formed after the material is removed at the edge of the square body, i.e. the intersection line of the two adjacent surfaces of the square body perpendicular to the circuit board body 100 is the edge of, at this edge, a square chamfer 120 is formed by removing material.

In some embodiments, the external positioning block 200 is further included, the external positioning block 200 facilitates positioning of a welding gun, so that the welding gun can be positioned in one step in a bonding process, it can be understood that the external positioning block 200 is a positioning cursor on a PCB, the external positioning block 200 is composed of a copper layer and a second tin layer arranged on the copper layer, it is to be noted that the welding gun is needed during bonding, and the welding gun is provided with a CCD camera which identifies the external positioning block 200 on the PCB, so as to achieve a positioning effect, wherein the CCD camera is an industrial camera, and is often used in the PCB field, and the second tin layer is etched for preventing the copper layer.

In some embodiments, the outer connection positioning block 200 is configured as a cross shape, the intersection point of the cross-shaped outer connection positioning block 200 is uniquely determined, which facilitates positioning, and the cross-shaped outer connection positioning block 200 is easily recognized, it is understood that the cross-shaped outer connection positioning block 200 has a simple shape and is easily recognized, and the shape of the outer connection positioning block 200 may also be configured as a trident shape or a circle.

In some embodiments, the width of the outer positioning block 200 is 0.2mm to 0.25mm, which facilitates the recognition of the outer positioning block 200 by the welding gun, it should be noted that the outer positioning block 200 is composed of a strip-shaped portion, and the width of the outer positioning block 200 refers to the width of the strip-shaped portion composing the outer positioning block 200, and the width of the outer positioning block 200 is easier to recognize in the range of 0.2mm to 0.25mm than below 0.2 mm.

In some embodiments, a protection ring 300 is further included, and the external connection positioning block 200 is disposed in the protection ring 300, and the protection ring 300 is used to prevent the pad 110 from being too small during etching, and also can isolate the external connection positioning block 200 from the pad 110, thereby preventing both the external connection positioning block 200 and the pad 110 from being erroneously soldered together.

It can be understood that the external connection positioning block 200 is a target for being recognized by a welding gun, and the independent external connection positioning block 200 is prone to generate a tin-thin phenomenon in an electroplating tin process, that is, the second tin layer is too thin or has a through hole, and the tin-thin phenomenon may cause a problem that the second tin layer has poor protection performance on a copper layer, so that a copper foil is etched in an etching process, thereby causing the external connection positioning block 200 to be incomplete or have a size exceeding a predetermined specification, and finally causing inaccurate bonding and scrapping of a PCB.

In some embodiments, the protective ring 300 surrounds a rectangle, the protective ring 300 has a ring width of 0.25mm to 0.3mm, the protective ring 300 is easy to identify, and the protective ring 300 has a width of 0.25mm to 0.3mm, which is easier to identify than a width of 0.25mm or less.

In some embodiments, a layer of green oil 310 is disposed on the protective ring 300, the layer of green oil 310 reducing the impact of the protective ring 300 on bonding. It is understood that the green oil layer 310, i.e., the solder mask, serves to reduce the effect of etching on the guard ring 300.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims (5)

1. A circuit board convenient to bond, comprising:

circuit board body (100) is provided with pad (110), the width of pad (110) is 0.25-0.33mm, keeping away from of pad (110) the one side of circuit board body (100) is provided with tin layer (130), pad (110) are provided with a plurality ofly, and are a plurality of pad (110) set up side by side, pad (110) set up to the square body, the square body perpendicular to the juncture of the adjacent two sides of circuit board body (100) sets up to chamfer (120), still includes outer locating piece (200) even, outer locating piece (200) set up to the cross.

2. A wiring board for facilitating bonding according to claim 1, wherein: the width of the external connection positioning block (200) is 0.2mm to 0.25 mm.

3. A wiring board for facilitating bonding according to claim 1 or 2, characterized in that: the protection ring (300) is further included, and the external connection positioning block (200) is arranged in the protection ring (300).

4. A wire board for facilitating bonding according to claim 3, wherein: the protection ring (300) is surrounded into a rectangle, and the ring width of the protection ring (300) is 0.25mm to 0.3 mm.

5. A wire board for facilitating bonding according to claim 3, wherein: and a green oil layer (310) is arranged on the protection ring (300).

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