CN213278095U - Full-color display module - Google Patents

Abstract

The utility model discloses a full-color display module, which comprises a plurality of pixel points, wherein any pixel point of the plurality of pixel points comprises at least three light-emitting units, the light-emitting colors of at least three light-emitting units are different from each other, and any light-emitting unit comprises a light-emitting chip and a color processing layer arranged above the light-emitting chip; the full-color display module comprises a substrate and a cover plate, wherein the cover plate is packaged on the substrate; the light-emitting chip of any light-emitting unit is arranged on the substrate in a bonding mode, and the cover plate is provided with a groove at the position corresponding to the light-emitting chip; the lateral wall of recess is provided with the barrier layer, and the color processing layer that corresponds with luminous chip sets up in the recess and is located the encirclement region of barrier layer. This full-color display module is through handling the layer with luminous chip and colour and establish on base plate and apron, can guarantee full-color display module's display effect, and overcome the restriction of traditional handicraft, improves the production yield of product.

Description

Full-color display module

Technical Field

The utility model relates to the demonstration field, concretely relates to full-color display module.

Background

Fig. 1 is a partially enlarged schematic view illustrating a structure of a full-color display module in the prior art, in which a structure of one pixel point is shown.

Generally, a pixel of a full-color display module is composed of at least three light-emitting units with different light-emitting colors, and the display colors of the three light-emitting units with different light-emitting colors are red, green and blue. If the chips of the corresponding colors are directly used as the light emitting units, the chips of each color need to be transferred in sequence when the chips are transferred from the temporary substrate to the substrate. The method is limited by the process, and when the micro LED is adopted as the chip, the transfer quantity is large, the chip size is small, the distance between adjacent chips is small, and the production of the full-color display module with high yield is difficult to realize. Therefore, when the Micro LED is adopted as the light emitting chip in the full-color display module, the light emitting unit generally adopts a mode of using a blue light chip and a quantum dot material (QD material) in a combined manner, so that the transfer difficulty of the chip is simplified, and the requirements of the light emitting units with different colors are met.

Referring to fig. 1 of the drawings, when the structure of the light emitting unit adopts a combined structure of a blue light chip and a QD material, for each light emitting unit, a blue light chip 11 is transfer-bonded on a substrate 10, a barrier layer 12 is formed around the blue light chip 11 from the surface of the substrate 10, and then a quantum dot layer 13 is formed on the top surface of the blue light chip 11 in the surrounding area of the barrier layer 12.

Specifically, the barrier layer 12 is used to prevent light leakage from the side of the blue chip 11, and the barrier layer 12 is generally implemented by a photolithography process, in which the photoresist forming height achieved by the photolithography process is limited due to the limitation of the material (photoresist material) of the barrier layer 12, and correspondingly, the thickness of the quantum dot layer 13 is limited due to the limitation of the top height of the quantum dot layer 13 by the height of the barrier layer 12. In the specific implementation, it is found that if the thickness of the quantum dot layer 13 is insufficient, for the light emitting unit, a certain blue leakage phenomenon exists (the quantum dot layer 13 cannot completely process the light of the blue light chip 11, so that the blue light directly penetrates through the quantum dot layer 13 to be emitted), so that the final color presented by the pixel point is distorted.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defect of current full colouration display module, the utility model provides a full colouration display module, the institutional advancement through full colouration display module is favorable to producing on a large scale in order to improve product quality and product production yield.

Correspondingly, the utility model provides a full-color display module, including a plurality of pixel, any pixel in a plurality of pixel includes at least three luminescence unit and in at least three luminescence unit, the luminous colour of at least three luminescence unit is mutually different, arbitrary luminescence unit includes luminescence chip and sets up the colour processing layer above the luminescence chip;

the full-color display module comprises a substrate and a cover plate, wherein the cover plate is packaged on the substrate;

the light-emitting chip of any one light-emitting unit is arranged on the substrate in a bonding mode, and the cover plate is provided with a groove at a position corresponding to the light-emitting chip;

the lateral wall of recess is provided with the barrier layer, with the corresponding color processing layer setting of luminous chip is in the recess and be located the surrounding area of barrier layer is intra-topically.

In an optional embodiment, when the type of the light emitting chip is a blue light emitting chip, the type of the color processing layer of the corresponding light emitting unit is one of a red light conversion layer, a green light conversion layer and a transparent layer;

and when the type of the light emitting chip is an ultraviolet light emitting chip, the type of the color processing layer of the corresponding light emitting unit is one of a red light conversion layer, a green light conversion layer and a blue light conversion layer.

In an alternative embodiment, the transparent layer is uniformly doped with light absorbing particles.

In an alternative embodiment, the inner wall of the recess is roughened.

In an alternative embodiment, the barrier layer is attached to the sidewalls of the recess, and the inner wall of the barrier layer is rough.

In an optional embodiment, a water and oxygen blocking layer is disposed between the color treatment layer and the corresponding notch of the groove.

In an alternative embodiment, the light emitting chip of any one of the light emitting units is located in the corresponding recess.

In an optional embodiment, the method further comprises filling the groove;

an enclosing structure with an open top surface is arranged on the cover plate or the substrate;

when the cover plate is packaged on the substrate, the top surface of the surrounding structure is sealed by the cover plate or the substrate opposite to the top surface, the filling groove is formed inside the surrounding structure, all the light-emitting chips are located in the filling groove, and the light-emitting chip of any light-emitting unit is opposite to the notch of the corresponding groove;

and the filling groove is filled with a buffer material.

In an alternative embodiment, the cover plate is provided with a light absorbing layer on a surface between the notches of any two adjacent grooves.

In an optional embodiment, a connecting wall is disposed on one side of the cover plate facing the base plate, and a connecting groove is disposed on the base plate at a position corresponding to the connecting wall;

the tank bottom of spread groove is provided with viscous material, the connecting wall is fixed based on viscous material in the spread groove.

In an optional implementation manner, a buffering protrusion is further disposed on one side of the cover plate facing the substrate, a buffering groove is disposed on the substrate at a position corresponding to the buffering protrusion, and an elastic member is disposed at the bottom of the buffering groove;

the distance between the top surface of the buffering bulge and the top surface of the corresponding elastic piece is smaller than the distance between the top surface of the connecting wall and the bottom of the connecting groove.

The utility model provides a full-color display module through with luminous chip and colour processing layer branch establish on base plate and apron, can guarantee full-color display module's display effect, and overcome the restriction of traditional technology, improves the production yield of product, has good practical meaning.

Drawings

Fig. 1 is a partially enlarged schematic view showing a structure of a full-color display module in the prior art;

fig. 2 is a schematic structural diagram of a full-color display module according to a first embodiment of the present invention;

fig. 3 is a schematic structural diagram of a full-color display module according to a second embodiment of the present invention;

fig. 4 shows a schematic structural diagram of a full-color display module according to a third embodiment of the present invention;

fig. 5 is a partially enlarged schematic view of a full-color display module structure according to a fourth embodiment of the present invention;

fig. 6 shows a schematic diagram of a partial enlarged full-color display module structure according to the fifth embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Basically, a full-color display module includes a plurality of pixel, and any pixel in a plurality of pixel includes the different luminescence unit of at least three luminescent color. Specifically, a plurality of pixel points are arranged in an array mode in the full-color display module, and any one of the first light-emitting units comprises a light-emitting chip and a color processing layer arranged above the light-emitting chip.

Optionally, in order to facilitate transfer of light emitting chips, the type of the light emitting chip of any one of the light emitting units is one of a blue light emitting chip and an ultraviolet light emitting chip.

Specifically, when the type of the light emitting chip is a blue light emitting chip, the type of the color processing layer of the corresponding light emitting unit is one of a red light conversion layer, a green light conversion layer and a transparent layer; and when the type of the light emitting chip is an ultraviolet light emitting chip, the type of the color processing layer of the corresponding light emitting unit is one of a red light conversion layer, a green light conversion layer and a blue light conversion layer.

Specifically, when the type of the light emitting chip is a blue light emitting chip, the red light conversion layer is used for converting light emitted by the blue light emitting chip into red light and then emitting the red light, the green light conversion layer is used for converting light emitted by the blue light emitting chip into green light and then emitting the green light, and the transparent layer is used for directly emitting the light emitted by the blue light emitting chip; when the type of the light emitting chip is an ultraviolet light emitting chip, the red light conversion layer is used for converting light emitted by the ultraviolet light emitting chip into red light and then emitting the red light, the green light conversion layer is used for converting light emitted by the ultraviolet light emitting chip into green light and then emitting the green light, and the blue light conversion layer is used for converting light emitted by the ultraviolet light emitting chip into blue light and then emitting the blue light.

For a specific pixel point, the pixel point presents a specific color through the mixing of emergent rays of a plurality of light-emitting units in the pixel point, and in the specific implementation, the light-emitting unit structures (the arrangement mode of the light-emitting units, the number of various light-emitting units and the like) in the pixel point are reasonably set according to the setting requirements of the pixel point, so that each pixel point can realize full-color display.

It should be noted that, in the following embodiments, the light emitting chip is taken as an example of an ultraviolet light emitting chip, and as can be seen from the above description, for the light emitting unit, the structure difference of the light emitting chip being a blue light emitting chip or an ultraviolet light emitting chip is the replacement application of the transparent layer and the blue light conversion layer, therefore, in the following embodiments, if the light emitting chip is a blue light emitting chip, only the blue light conversion layer needs to be replaced by the transparent layer, and no additional description is subsequently made.

In specific implementation, because the light emitting chips of different light emitting units are the same type of chip, the red light conversion layer and the green light conversion layer can absorb light to a certain extent when processing the light of the light emitting chips, and the transparent layer has a small influence degree on the light intensity of the light emitting chips, in order to ensure that the light intensities of various colors of the light emitting units in the same pixel point are close to each other, so as to meet design requirements, light absorbing particles (such as carbon black particles) can be uniformly doped in the transparent layer in specific implementation, and the doping density of the light absorbing particles is determined according to specific implementation conditions.

Specifically, the conversion layer can realize a corresponding light color conversion function based on the phosphor material or the quantum dot material, and the conversion layer with a specific color can realize a required light color conversion effect based on the phosphor material or the quantum dot material with a corresponding color.

Further, the present invention is conceived in a configuration of the light emitting chip and the color processing layer and a structure improvement of the related components, and is subsequently described with respect to different embodiments, respectively.

The first embodiment is as follows:

fig. 2 is a schematic diagram illustrating a full-color display module according to an embodiment of the present invention, in order to distinguish between components of different embodiments, a prefix "first" is added before naming a part of the components in the embodiment of the present invention.

The full-color display module provided by the embodiment of the utility model comprises a first substrate 20 and a first cover plate 21; optionally, the first substrate 20 may be a glass substrate, and a circuit structure is distributed on the glass substrate for bonding the first light emitting chip; the first cover plate 21 may be a glass cover plate having a certain hardness and a high transparency so as to prevent light from being transmitted therethrough.

The first cover plate 21 is encapsulated on the first substrate 20; since the first cover plate 21 is used for protecting the light emitting chip and correspondingly handling the light of the light emitting chip, the packaging concept described herein refers to the packaging of the first cover plate 21 to the first substrate 20, which is substantially the interconnecting fixed relationship between the first cover plate 21 and the first substrate 20, in the embodiment of the present invention, the first cover plate 21 is packaged on the first substrate 20 based on the adhesive material 27.

A first light emitting chip 22 of any one of the light emitting units is arranged on the first substrate 20 in a bonding manner, and a first groove 23 is arranged on the first cover plate 21 at a position corresponding to the first light emitting chip 22; in the embodiment of the present invention, since the first light emitting chip 22 is enclosed in the first groove 23, therefore, the size of the first groove 23 needs to be determined according to the first light emitting chip 22, optionally, the cross-sectional profile of the first groove 23 may be the same as the cross-sectional profile of the first light emitting chip 22, that is, if the cross-sectional shape of the first light emitting chip 22 is rectangular, the cross-sectional shape of the first groove 23 may be rectangular, and if the cross-sectional shape of the first light emitting chip 22 is circular, the cross-sectional shape of the first groove 23 may be circular.

A first barrier layer 24 is disposed on a sidewall of the first groove 23, and a first color processing layer 25 corresponding to the first light emitting chip 22 is disposed in the first groove 23 and located in an enclosed region of the first barrier layer 24. Alternatively, the first barrier layer 24 may be made of a light absorbing material or a light reflecting material.

Optionally, when the first color processing layer 25 is made of a quantum dot material, in order to protect the quantum dot material, a protection layer 26 is generally disposed on a surface of the first color processing layer 25 facing the notch direction of the corresponding first groove 23 to protect the quantum dot material.

For the above full-color display module implementation structure, in a specific implementation, the first light emitting chips 22 are first transferred and bonded to the first substrate 20, and a plurality of first grooves 23 are correspondingly processed (etching process) on the first cover plate 21 in a synchronous manner, optionally, the depth of the first grooves 23 is 10 micrometers; then, a first barrier layer 24 is processed (sputtering process) on the inner wall of the first groove 23; next, for a preset structure, a first color treatment layer 25 (quantum dot material) is processed (inkjet printing process) in a different first groove 23; finally, the first cover plate 21 is encapsulated on the first substrate 20 by an adhesive material (bonding process).

Through the implementation structure and the processing technology, the light-emitting chips of the same type can be integrally transferred on the first substrate 20, so that the yield is high; the first color processing layer 25 is arranged in the first groove 23 of the first cover plate 21, and can be formed by the first groove 23 in an auxiliary manner, so that the defect that the height of a barrier layer is insufficient due to the formation of the barrier layer in the traditional process is avoided; the first barrier layer 24 is correspondingly disposed on the inner wall of the first groove 23 to achieve the function of light cross-talk prevention.

Alternatively, the inner wall of the first groove 23 is rough (including the side wall and/or the bottom surface, in fig. 2, the rough surface of the side wall is illustrated for clarity, and the size of the uneven microstructure of the side wall is enlarged as appropriate). Specifically, the embodiment of the utility model provides a to the definition of mat surface for non-smooth, in the concrete implementation, according to processing technology and machining precision's difference, modes such as accessible are polished, manual work process and are processed out unevenness's micro-structure on the inner wall of first recess 23. Specifically, the sidewall of the first groove 23 is processed into a rough surface, so that the adhesion of the first barrier layer 24 and the first color treatment layer 25 is improved, the falling difficulty of the first barrier layer 24 is increased, and the yield of the product is improved.

Further, since the first barrier layer 24 is generally formed by a sputtering process, under the condition that the side wall of the first groove 23 is a rough surface, the first barrier layer 24 is attached to the side wall of the first groove 23, and correspondingly, the inner wall of the first barrier layer 24 is also a rough surface. The sputtering process can be understood as that a material with a certain thickness is uniformly adhered on the adhering surface, and the adhered material also presents a corresponding concave-convex state according to the concave-convex condition of the adhering surface. The inner wall of the first barrier layer 24 is a rough surface, so that the adhesion of the first color treatment layer 25 can be improved, the falling difficulty of the first color treatment layer 25 is increased, and the yield of products is improved. In a specific implementation, if other processes are used to form the first barrier layer 24, the inner wall of the first barrier layer 24 may be processed into a rough surface through related processes, so as to achieve the above-mentioned effect.

Example two:

in the first embodiment, although there is a certain gap between the top surface of the first light emitting chip 22 and the first color treatment layer 25 (protection layer 26) in the structure shown in fig. 2, in actual construction, due to processing errors, when the first substrate 20 and the first cover plate 21 are packaged, a rigid collision may occur between the first light emitting chip 22 and the first color treatment layer 25, which may cause a failure or a breakage, and thus a defective product may be easily generated.

Therefore, the embodiment of the present invention improves the structure of the first cover plate 21 on the basis of the first embodiment, and specifically, in order to distinguish the components of different embodiments, the embodiment of the present invention adds the prefix of "second" before naming the partial components.

Fig. 3 shows a schematic structural diagram of a full-color display module according to an embodiment of the present invention. Specifically, on the basis of embodiment one, the embodiment of the utility model provides a layer 35 is handled to the second colour and is provided with the second oxygen layer 38 that blocks water towards the notch direction of the second recess 33 that corresponds, and the second oxygen layer 38 that blocks water is located the second colour and handles between the notch of layer 35 and the second recess 33 that corresponds.

Through this mode of setting, when second apron 31 encapsulation was on second base plate 30, the second oxygen layer 38 that blocks water can play certain cushioning effect, and simultaneously, the second oxygen layer 38 that blocks water can also replace the protective layer in order to realize the protection to second colour processing layer 35, prevents that second colour processing layer 35 from oxidizing and becoming invalid.

Example three:

in embodiment one and embodiment two, the luminescence chip all sets up in the recess that corresponds, and is concrete, the embodiment of the utility model provides another feasible implementation. In order to distinguish between components of different embodiments, a "third" prefix is added before naming a part of the components in the embodiments of the present invention.

The embodiment of the utility model provides a full-color display module the apron or corresponding formation surrounds the surrounding structure in all luminescence unit peripheries on the base plate the apron with the base plate encapsulation is accomplished the back, and the top surface of surrounding structure is sealed, and the inboard forms required packing groove structure. The filling groove surrounds all the light-emitting chips, and is filled with a buffer material; the notches of the grooves of the cover plate face the filling grooves, and the light-emitting chips of any one of the light-emitting units are opposite to the notches of the corresponding grooves. The filling groove is used for containing a buffer material, on one hand, the buffer material can wrap the light-emitting chip to protect the light-emitting chip, and on the other hand, the buffer material can be used for buffering when the cover plate and the substrate are packaged.

Fig. 4 shows a schematic structural diagram of a full-color display module according to an embodiment of the present invention. Specifically, the embodiment of the present invention is described by taking the example that the surrounding structure is disposed on the cover plate, and the embodiment that the surrounding structure is disposed on the base plate can be implemented by referring to the idea of the embodiment of the present invention.

The embodiment of the utility model provides a full-color display module, on the structure basis of preceding embodiment, third apron 41 still is provided with enclosure structure 490, because the position that sets up of third recess is corresponding with the third luminescence chip, consequently, enclosure structure 490 surrounds outside all third recesses. Specifically, after the third cover plate 41 and the third substrate 40 are packaged, the surrounding structure 490 surrounds the outer sides of all the third light emitting chips, a filling groove is formed between the third substrate 40 and the third cover plate 41, and the third light emitting chip 42 of any one of the light emitting units is opposite to the notch of the corresponding third groove. Accordingly, the highly filled volume of the third water and oxygen blocking layer 48 may be appropriately increased, and the maximum volume may completely fill the corresponding third groove. With this embodiment, the third light emitting chip 42 can be prevented from contacting the structure in the corresponding third recess.

Further, the filling grooves are filled with a buffer material 491. Specifically, the buffer material 491 functions as a buffer for the third cover plate 41 when it is packaged on the third substrate 40. Specifically, before the encapsulation, according to the size of the filling groove 490, the surrounding wall 492 is formed on the third substrate 40 by using the sealant material, then the buffer material 491 is processed in the surrounding wall 492 by a spraying process, and finally, the encapsulation operation of the third cover plate 41 is performed.

Further, in consideration of the fact that the third light emitting chips 42 have a certain distance from the corresponding third grooves, in order to prevent crosstalk and light leakage (light of the light emitting chips is directly emitted without being processed by a conversion layer or a transparent layer), the third cover plate 41 is optionally provided with a light absorbing layer 493 on a surface between the notches of any two adjacent third grooves for reducing crosstalk. Further, the surface of the third cover plate 41 opposite to the third light emitting chip 42, where there is a possibility of light leakage, may be covered with the light absorbing layer 493. Specifically, referring to fig. 4, the circled areas are all possible locations where light leakage may occur, and it can be seen that light leakage may also occur on the surface of the third cover plate 41 between the third groove and the surrounding structure 490, and therefore in an implementation, the light absorbing layer 493 may also be used to cover the surface to avoid light leakage.

Example four:

the first to third embodiments are mainly described with respect to the matching structure of the cover plate and the base plate in the light-emitting area, and the embodiments of the present invention are described with respect to the connection and fixation manner of the cover plate and the base plate.

In the first to third embodiments, as can be seen from the structures shown in the drawings, the cover plate and the substrate are directly bonded by the adhesive material, and in the specific implementation, considering that the requirement on compactness of the adhesive material is high, and a certain pressure exists in the attaching process, the substrate is easily damaged, so the embodiment of the present invention further explains the connection and fixation manner of the cover plate and the substrate.

Fig. 5 is a schematic diagram showing a partial enlarged structure of a full-color display module according to an embodiment of the present invention, the enlarged portion is a connection structure region between a fourth cover plate and a fourth substrate, and the structure of the remaining regions is implemented with reference to the first to third embodiments.

Specifically, in the full-color display module provided in the embodiment of the present invention, the fourth cover plate 51 is provided with a convex connecting wall 560 toward the fourth substrate 50, and the fourth substrate 50 is provided with a connecting groove 561 at a position corresponding to the connecting wall 560; the groove bottom of the connecting groove 561 is provided with an adhesive material 562, and the connecting wall 560 is fixed in the connecting groove 561 based on the adhesive material 562.

Specifically, the connecting wall 560 and the connecting groove 561 are cooperatively arranged, and on one hand, the connecting groove 561 has a guiding and positioning function on the connecting wall 560, so that the relative position between the fourth cover plate 51 and the fourth substrate 50 can be ensured to be fixed; on the other hand, compared with the first to third embodiments, the distance from the external water oxygen to the inside is longer, which is beneficial to improving the waterproof and oxygen-proof effect of the full-color display module, and meanwhile, the adhesive material can play a certain role in buffering the fourth cover plate 51 and the fourth substrate 50 during the packaging operation, so as to prevent the fourth substrate 50 from being damaged.

Furthermore, the fourth cover plate 51 is further provided with a buffering protrusion 550 towards the side of the fourth substrate 50, the buffering protrusion 550 is adjacent to the connecting wall 560, in the embodiment of the present invention, the buffering protrusion 550 and the connecting wall 560 are an integral structure, and the buffering protrusion 550 is in a step structure; the fourth substrate 50 is provided with a buffer groove 551 at a position corresponding to the buffer protrusion 550, and an elastic member 552 is disposed at the bottom of the buffer groove 551; the distance between the top surface of the buffering projection 550 and the top surface of the corresponding elastic member 552 is smaller than the distance between the top surface of the connection wall 560 and the bottom surface of the connection groove 561. Through this arrangement, the elastic element 552 can better buffer the fourth cover plate 51 and the fourth substrate 50 during the packaging operation, thereby preventing the fourth substrate 50 from being damaged.

Example five:

fig. 6 shows a schematic diagram of a partial enlargement of a full-color display module structure according to an embodiment of the present invention. On the basis of the fourth embodiment, the second surrounding wall 660 of the present invention needs to be fitted in the second connecting groove 661 and fixed by adhering with the second adhesive material 662.

Specifically, the embodiment of the utility model provides a bottom structure to two 661 of spread groove improves, and is specific, two 661 tank bottoms of spread groove expand out the flank structure towards the outside, and on the one hand, the flank structure can supply two 662 of viscous material to carry out the space flow when receiving two 660 extrusion of enclosure walls in order to provide the buffering, and on the other hand, after two 662 solidification of viscous material, can form buckle structure to better prevent that two 660 of enclosure walls deviate from, improve the connection reliability between apron and the base plate.

To sum up, the utility model provides a full-color display module through to send out optical chip and colour processing layer and establish on base plate and apron, can guarantee full-color display module's display effect, and overcome the restriction of traditional handicraft, improves the production yield of product.

The above detailed description is made on a full-color display module provided by the embodiments of the present invention, and the detailed examples are applied herein to explain the principles and embodiments of the present invention, and the description of the above embodiments is only used to help understand the method and core ideas of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.

Claims (11)

1. A full-color display module comprises a plurality of pixel points, wherein any pixel point of the plurality of pixel points comprises at least three light-emitting units, the light-emitting colors of at least three light-emitting units are different from each other, and any light-emitting unit comprises a light-emitting chip and a color processing layer arranged above the light-emitting chip;

the full-color display module is characterized by comprising a substrate and a cover plate, wherein the cover plate is packaged on the substrate;

the light-emitting chip of any one light-emitting unit is arranged on the substrate in a bonding mode, and the cover plate is provided with a groove at a position corresponding to the light-emitting chip;

the lateral wall of recess is provided with the barrier layer, with the corresponding color processing layer setting of luminous chip is in the recess and be located the surrounding area of barrier layer is intra-topically.

2. The full-color display module according to claim 1, wherein when the type of the light emitting chip is a blue light emitting chip, the type of the color processing layer of the corresponding light emitting unit is one of a red light conversion layer, a green light conversion layer, and a transparent layer;

and when the type of the light emitting chip is an ultraviolet light emitting chip, the type of the color processing layer of the corresponding light emitting unit is one of a red light conversion layer, a green light conversion layer and a blue light conversion layer.

3. The full-color display module according to claim 2, wherein the transparent layer is uniformly doped with light-absorbing particles.

4. The full-color display module according to claim 1, wherein the inner wall of the groove is roughened.

5. The full-color display module according to claim 4, wherein the barrier layer is attached to the side wall of the groove, and the inner wall of the barrier layer is rough.

6. The full-color display module according to claim 1, wherein a water-blocking oxygen layer is disposed between the color treatment layer and the notch of the corresponding groove.

7. The full-color display module according to claim 1, wherein the light emitting chip of any one of the light emitting units is located in the corresponding groove.

8. The full-color display module according to claim 1, further comprising a fill slot;

an enclosing structure with an open top surface is arranged on the cover plate or the substrate;

when the cover plate is packaged on the substrate, the top surface of the surrounding structure is sealed by the cover plate or the substrate opposite to the top surface, the filling groove is formed inside the surrounding structure, all the light-emitting chips are located in the filling groove, and the light-emitting chip of any light-emitting unit is opposite to the notch of the corresponding groove;

and the filling groove is filled with a buffer material.

9. The full-color display module according to claim 8, wherein the cover plate is provided with a light absorbing layer on a surface between the notches of any two adjacent grooves.

10. The full-color display module according to any one of claims 1 to 9, wherein the cover plate is provided with a connecting wall on a side facing the substrate, and the substrate is provided with a connecting groove at a position corresponding to the connecting wall;

the tank bottom of spread groove is provided with viscous material, the connecting wall is fixed based on viscous material in the spread groove.

11. The full-color display module according to claim 10, wherein the cover plate is further provided with a buffer protrusion on a side facing the substrate, the substrate is provided with a buffer groove at a position corresponding to the buffer protrusion, and an elastic member is provided at a bottom of the buffer groove;

the distance between the top surface of the buffering bulge and the top surface of the corresponding elastic piece is smaller than the distance between the top surface of the connecting wall and the bottom of the connecting groove.

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