CN214253721U - Display module - Google Patents
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- CN214253721U CN214253721U CN202120342289.0U CN202120342289U CN214253721U CN 214253721 U CN214253721 U CN 214253721U CN 202120342289 U CN202120342289 U CN 202120342289U CN 214253721 U CN214253721 U CN 214253721U
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Abstract
The application discloses a display module, which comprises an array substrate, a plurality of light-emitting units, a lens unit and a color film substrate, wherein the plurality of light-emitting units are arranged on one side of the array substrate; the lens unit is arranged on the light emitting side of the light emitting unit; the color film substrate is arranged on the light emitting side of the lens unit, a plurality of light conversion units are arranged on one side of the color film substrate facing the array substrate, the light conversion units are arranged corresponding to the light emitting units, and a light blocking structure is arranged between every two adjacent light conversion units. When the display module disclosed by the application works, light rays emitted by the light emitting unit are adjusted by the lens unit and then emitted to the light conversion unit for color development, and finally emitted from the color film substrate for display, so that the side light with a large visual angle is reduced, and the display brightness is improved.
Description
Technical Field
The application relates to the technical field of semiconductor display screens, in particular to a display module.
Background
With the continuous development of Micro-LED display technology in the semiconductor industry, Micro-LED display screen products gradually enter various fields of society and life. At present, in the manufacturing process of Micro-LED display screens, Light Emitting Diode (LED) chips need to be transferred to a back panel by bulk transfer; a color resist layer R, G, B is then provided over the LED chips so that various colors can be displayed on the display screen.
However, light of the LED chip in the existing LED display module is emitted in all directions, and not only the light emitted in the forward direction can be emitted to the color resist layer, but also the lateral light of the LED chip can penetrate through the packaging layer to emit to the adjacent color group layer, which causes the color crosstalk problem of the display module and affects the display effect of the display module.
Accordingly, the prior art is yet to be improved and developed.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings of the prior art, the present application is directed to a display module, which is aimed at solving the problem of color cross-talk occurring on the display module.
The technical scheme of the application is as follows:
a display module comprises an array substrate, a plurality of light-emitting units, a lens unit and a color film substrate, wherein the plurality of light-emitting units are arranged on one side of the array substrate; the lens unit is arranged on the light emitting side of the light emitting unit; the color film substrate is arranged on the light emitting side of the lens unit, a plurality of light conversion units are arranged on one side of the color film substrate facing the array substrate, the light conversion units are arranged corresponding to the light emitting units, and a light blocking structure is arranged between every two adjacent light conversion units.
The display module, wherein, the display module still includes locates the encapsulation layer on the array substrate, the encapsulation layer surrounds the setting all around of luminescence unit, and the top surface of encapsulation layer with the top surface coplane of luminescence unit, the lens unit set up in the top surface of encapsulation layer with on the top surface of luminescence unit.
The display module, wherein the encapsulation layer comprises a first adhesive layer and a second adhesive layer which are sequentially stacked on the array substrate, and the first adhesive layer is used for fixing the welding feet of the light-emitting units; the second adhesive layer is used for fixing the epitaxial layer of the light-emitting unit.
The display module, wherein, the second glue film is a light-tight glue film.
The display module, wherein the lens unit includes a plurality of micro lenses arranged in parallel, and the projection area of the micro lenses on the light-emitting unit is smaller than the top surface area of the light-emitting unit.
The display module further comprises a light-blocking film layer arranged on the array substrate, and the light-blocking film layer is positioned on one side, deviating from the light-emitting unit, of the array substrate.
The display module is characterized in that one side of the lens unit, which is far away from the light-emitting unit, is provided with a bonding glue layer, and the light blocking structure is arranged on the bonding glue layer; the cross section of the light blocking structure is trapezoidal, and the width of the light blocking structure is gradually increased along the light emitting direction of the light emitting unit.
The display module is characterized in that the adhesive layer is also provided with a light-transmitting interlayer, and the light-transmitting interlayer is arranged around the light-blocking structure; the light conversion unit is arranged on the light-transmitting interlayer, the projection position of the light-emitting unit on the light-transmitting interlayer is overlapped with the position of the light conversion unit, and the color film substrate is arranged on one side, away from the light-transmitting interlayer, of the light conversion unit.
In the display module, a first light-tight retaining wall and a second light-tight retaining wall are further arranged on one side, provided with the light conversion unit, of the light-transmitting interlayer; the light conversion unit comprises a quantum dot color conversion layer and a color filter film layer, and the first light-tight retaining wall is arranged around the quantum dot color conversion layer; the second light-tight retaining wall surrounds the color filter film layer.
The display module, wherein, the luminescence unit is blue light LED chip.
The utility model discloses a display module during operation spreads the signal of telecommunication on the array substrate and makes luminescence unit luminous, luminescence unit jets out light to all sides, the light of forward shooting lens unit directly pierces through lens unit and jets out, and the light that the side direction jetted in the lens unit then can be adjusted the direction of propagation by lens unit, the side direction light-emitting through lens unit collimation luminescence unit, reduce the light at the big visual angle of side direction, avoid adjacent luminescence unit to influence each other and cause crosstalk, increase the forward light yield of luminescence unit simultaneously, improve display brightness, improve display module's display effect in some implementation modes.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a middle display module according to the present invention.
10, an array substrate; 20. a light emitting unit; 30. a lens unit; 31. a micro lens; 40. a color film substrate; 50. a light conversion unit; 51. a quantum dot color conversion layer; 52. a color filter film layer; 60. a light blocking structure; 70. a packaging layer; 71. a first glue layer; 72. a second adhesive layer; 80. a light blocking film layer; 90. gluing a glue layer; 100. a light-transmitting interlayer; 110. a first light-tight retaining wall; 120. the second light-tight retaining wall.
Detailed Description
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The continuous development of the society and the vigorous advocation of the country make the semiconductor industry become one of the most active industries at present, along with the innovation and development of the technology of the LED display screen, the mini LED display screen and the Micro-LED display screen with high resolution per unit area have become the mainstream products of the LED display screen, and the mini LED and the Micro-LED are new generation display technologies, and have higher technical brightness, better luminous efficiency and lower power consumption than the existing Organic Light-Emitting Diode (OLED for short).
In the prior art, the Micro-LED display technology can solve the technical bottlenecks of huge transfer and low efficiency and yield of red LED chips in the mass production of Micro-LEDs by means of a quantum dot color conversion technology. However, in the quantum dot color conversion technology, the cross-color problem is an optical defect problem which needs to be overcome and avoided in the industry field, and generally, a chip on a substrate emits light, and the light is emitted upwards to a light resistance layer and also emitted obliquely and reversely, the light emitted reversely to the substrate is easy to leak light after penetrating through the substrate, and the light emitted obliquely to a light resistance layer corresponding to an adjacent chip causes cross-color, so that the final display result has color cast.
At present, the packaging technology is mature for packaging a layer of transparent-like adhesive material, but because the transmittance of the transparent material is high, part of light rays with a large lateral visual angle of a chip can penetrate through a back plate, and pixel crosstalk is also easily caused in Micro-LED products; and because the light emitting angle of the Micro-LED chip faces all directions, light can leak from the side of the back plate, the display effect is influenced, and meanwhile, the brightness loss is caused.
It should be noted that, as shown in fig. 1, the width in the various implementations of the embodiments of the present application refers to the length along the x-axis direction in fig. 1, and the thickness refers to the length along the y-axis direction in fig. 1.
It should be further noted that the light emitting unit 20 referred to in the embodiments of the present application is a blue LED chip. The full-color display of the display module is completed jointly by arranging the blue LED chip, arranging the quantum dot conversion layer for converting red light and the quantum dot conversion layer for converting green light above the blue LED chip, and arranging the scattering (Scatter) layer to be matched with the quantum dot conversion layer for converting red light and the quantum dot conversion layer for converting green light. Of course, in other embodiments of the present application, LED chips of other colors, such as red LED chips, green LED chips, etc., may be used as the light emitting unit 20. The display module disclosed in each embodiment of the application can use the light-emitting unit as an OLED chip, a mini LED chip, a Micro-LED chip, and the like, and is suitable for OLED display technology, mini LED display technology, and Micro-LED display technology.
Referring to fig. 1, in an embodiment of the present application, a display module is disclosed, which includes an array substrate 10, a plurality of light emitting units 20, a lens unit 30, and a color film substrate 40, where the plurality of light emitting units 20 are disposed on one side of the array substrate 10; the lens unit 30 is disposed on the light emitting side of the light emitting unit 20; the color film substrate 40 is disposed on the light exit side of the lens unit 30, a plurality of light conversion units 50 are disposed on one side of the color film substrate 40 facing the array substrate 10, the light conversion units 50 are disposed corresponding to the light emitting units 20, and a light blocking structure 60 is disposed between two adjacent light conversion units 50.
The utility model discloses a display module during operation spreads the signal of telecommunication on array substrate 10 and makes luminescence unit 20 give off light, luminescence unit 20 jets out light to all sides, the direct lens unit 30 that pierces through of forward directive lens unit's light jets out, and the light that the side direction jetted in lens unit 30 then can be adjusted the direction of propagation by lens unit 30, the side direction light-emitting through lens unit 30 collimation luminescence unit 20, reduce the light at the big visual angle of side direction, avoid adjacent luminescence unit 20 to influence each other and cause crosstalk, increase luminescence unit 20 forward light output simultaneously, improve display brightness, improve display module's display effect.
In some embodiments, as an implementation manner of the present embodiment, it is disclosed that the light emitting unit 20 is provided in a plurality, and the plurality of light emitting units 20 are uniformly distributed on the array substrate 10. By arranging the plurality of light-emitting units 20, the light-emitting brightness of each position on the array substrate 10 is more uniform, and the defects of color cast or light and dark stripes and the like are avoided.
Specifically, as an implementation manner of this embodiment, it is disclosed that the display module further includes an encapsulation layer 70 disposed on the array substrate 10, the encapsulation layer 70 is disposed around the periphery of the light emitting unit 20, the top surface of the encapsulation layer 70 is coplanar with the top surface of the light emitting unit 20, and the lens unit 30 is disposed on the top surface of the encapsulation layer 70 and the top surface of the light emitting unit 20. The encapsulation layer 70 is arranged around the light emitting unit 20, so that the light emitting unit 20 can be better fixed on the array substrate 10, the light emitting unit 20 is prevented from being separated from the array substrate 10 due to vibration generated in the transportation and use processes, and the display effect is prevented from being influenced; in particular, in the present embodiment, the encapsulation layer 70 is disposed at the same height as the light emitting unit 20, so that the encapsulation layer 70 and the top surface of the light emitting unit 20 are in the same plane, and when the lens units 30 are disposed above and laterally above the light emitting unit 20, the encapsulation layer 70 can also play a role of support, and if the light of the light emitting unit 20 penetrates the encapsulation layer 70 too strongly, the lens units 30 disposed on the encapsulation layer 70 can play a role of collimation, so that the lateral light becomes more upward to propagate; moreover, if the encapsulation layer 70 is not provided, the lens units 30 need to be manufactured on the top surfaces of the plurality of light emitting units 20 one time and again, in the embodiment, the lens units 30 are all flatly arranged on the same plane, and the whole lens unit 30 can be formed on the plane through only one process during manufacturing, so that the operation steps are saved, the lens units 30 are manufactured more conveniently, the time is saved, and the yield is improved.
Specifically, as an implementation manner of the present embodiment, it is disclosed that the encapsulation layer 70 includes a first adhesive layer 71 and a second adhesive layer 72 sequentially stacked on the array substrate 10, where the first adhesive layer 71 is used to fix the solder tails of the light emitting units 20; the second adhesive layer 72 is used for fixing the epitaxial layer of the light emitting unit 20. In the manufacturing process of the display module, after the light emitting unit 20 is transferred onto the array substrate 10 in a huge amount, the solder feet of the light emitting unit 20 are soldered, and then the lens unit 30 is arranged above the light emitting unit 20, so that the light emitting unit 20 after the huge amount transfer needs to be kept stable in the subsequent manufacturing steps, the first adhesive layer 71 is arranged to surround the solder feet of the light emitting unit 20, the positions of the solder feet are fixed, the stability of the light emitting unit 20 is improved, and the stable connection of the light emitting unit 20 and the array substrate 10 is kept; after the mass transfer is completed, the first adhesive layer 71 can be made by adopting a spin coating mode, the selected material is an epoxy resin transparent material, the optical density value (OD value for short) is 0.3-1.3, the specific mode is not limited, and the height of the first adhesive layer 71 is flush with the solder feet of the light-emitting unit 20; then, a second adhesive layer 72 is formed on the first adhesive layer 71, the epitaxial layer of the light emitting unit 20 can be fixed by the second adhesive layer 72, the stability of the light emitting unit 20 is enhanced together with the first adhesive layer 71, and meanwhile, the top surface of the second adhesive layer 72 is flush with the top surface of the light emitting unit 20, so that the lens unit 30 is conveniently formed; in some embodiments, in another implementation manner of this embodiment, the second adhesive layer 72 may be an opaque adhesive layer. The second adhesive layer 72 is disposed around the side of the light emitting unit 20, and after the light of the light emitting unit 20 is emitted, the lateral light is blocked by the second adhesive layer 72, so that the crosstalk of the lateral light can be reduced, and the light-tight encapsulation layer 70 can further enhance the absorption and reflection of the light, thereby improving the influence on the light emitting effect of the light emitting unit 20.
As shown in fig. 1, as an implementation manner of the present embodiment, it is disclosed that the lens unit 30 includes a plurality of micro lenses 31 arranged in parallel, and a projection area of the micro lenses 31 on the light emitting unit 20 is smaller than an area of a top surface of the light emitting unit 20. In the embodiment, the radius of the micro lens 31 is 5-20 μm, each light emitting unit 20 is correspondingly provided with a plurality of micro lenses 31, and the curvature of each micro lens 31 is determined by the radius, so that the radius of each micro lens 31 directly affects the light collimation effect of the lens unit 30, and the side of the micro lens 31 away from the light emitting unit 20 is a convex curved surface, so that the light equivalently penetrates through one micro convex lens, thereby generating the collimation effect, and changing the propagation direction of the light emitted laterally to propagate above the light emitting unit 20. The size of the light emitting units 20 is relatively small, so that if the radius of the micro lens 31 is too small according to the light emitting range of each light emitting unit 20 and the distance between adjacent light emitting units 20, the light propagation direction of the light emitting units 20 is excessively adjusted, which easily causes blank areas without light between adjacent light emitting units 20, possibly causes dark stripes on the display module, affects the display effect, and the micro lens 31 with small radius has higher requirements on the process, and increases the cost; if the radius of the micro-lens 31 is too large, the light collimating effect of the light emitting unit 20 is insufficient, and there may still be some lateral light emission that may cause crosstalk problems.
In some embodiments, as an implementation manner of this embodiment, it is disclosed that the micro-lens 31 includes one or more of a polymethyl methacrylate micro-lens, a silicon dioxide micro-lens, and a silicon lens. The micro-lenses 31 can be made by nanoimprint, ink-jet printing or spraying.
As shown in fig. 1, as an implementation manner of this embodiment, it is disclosed that the display module further includes a light blocking film layer 80 disposed on the array substrate 10, and the light blocking film layer 80 is located on a side of the array substrate 10 away from the light emitting unit 20. When the light emitting unit 20 emits light, light is emitted from all directions, so that a part of light is emitted to the array substrate 10, even penetrates through the array substrate 10, and back light leakage may be caused, and the light blocking film layer 80 is disposed to block the light penetrating through the array substrate 10, thereby avoiding the light leakage problem.
Specifically, as an implementation manner of this embodiment, it is disclosed that the light blocking film layer 80 includes one or more of a black hot-pressing adhesive film layer, an injection molding adhesive film layer, an inkjet printing film layer, a metal film layer, and a metal oxide film layer. A black hot-pressing adhesive film layer, an injection molding adhesive film layer or an ink printing adhesive film layer can be arranged in a mode of film material application, and light leakage can be avoided by absorbing light through the lightproof black film; in addition, a metal film layer or a metal oxide film layer can be arranged in a metal sputtering or evaporation mode, light leakage can be avoided by arranging high-reflection metal and oxide films, and the brightness of forward light can be increased.
Specifically, as an implementation manner of the present embodiment, it is disclosed that a bonding glue layer 90 is disposed on a side of the lens unit 30 away from the light emitting unit 20, and the light blocking structure 60 is disposed on the bonding glue layer 90; the cross-sectional shape of the light blocking structure 60 is a trapezoid, and the width of the light blocking structure 60 gradually increases along the light emitting direction of the light emitting unit 20. After the first adhesive layer 71 and the second adhesive layer 72 are arranged, in order to stably arrange the encapsulation layer 70 and the light conversion unit 50, the second adhesive layer 72 is coated with glue to form the bonding adhesive layer 90, and in addition, the bonding adhesive layer 90 is arranged to isolate water vapor and oxygen in the outside air, so that the lens unit 30 and the light emitting unit 20 are prevented from being oxidized. And the laminating glue layer 90 can be set to be flat on the top surface, so that the light blocking structures 60 can be conveniently and stably arranged, the light blocking structures 60 gradually widen along the light emitting direction departing from the light emitting unit 20, the light paths formed by the two adjacent light blocking structures 60 form a channel with a wide bottom and a narrow top, when the light of the light emitting unit 20 passes through the channel, the lateral light at two sides can be blocked by the light blocking structures 60, and only the light emitted in the forward direction in the middle is left to pass through the channel and emit to the light conversion unit 50.
Specifically, as an implementation manner of this embodiment, it is disclosed that a light-transmitting interlayer 100 is further disposed on the adhesive layer 90, and the light-transmitting interlayer 100 is disposed around the light-blocking structure 60; the light conversion unit 50 is disposed on the light-transmitting interlayer 100, a projection position of the light emitting unit 20 on the light-transmitting interlayer 100 overlaps with a position of the light conversion unit 50, and the color film substrate 40 is disposed on a side of the light conversion unit 50 away from the light-transmitting interlayer 100. The adhesive layer 90 in this embodiment has a certain viscosity, and can be used to bond and fix the transparent interlayer 100, the transparent interlayer 100 can be set to have the same height as the light blocking structures 60, so as to form a continuous plane, and a supporting platform can be provided when the light conversion units 50 are further arranged above the plurality of light blocking structures 60, so that the whole structure of the display module is stable, and the filling is sufficient and no gap exists. Since the light conversion unit 50 is offset from the light blocking structure 60, the light transmissive interlayer 100 may support the light conversion unit 50, and the light of the light emitting element passes through the channel formed by the light blocking structure 60, then continues to penetrate through the light transmissive interlayer 100, and then enters the light conversion unit 50.
Specifically, as an implementation manner of this embodiment, it is disclosed that a first light-tight retaining wall 110 and a second light-tight retaining wall 120 are further disposed on one side of the light-transmitting interlayer 100 where the light conversion unit 50 is disposed; the light conversion unit 50 includes a quantum dot color conversion layer 51 and a color filter film layer 52, and the first light-tight retaining wall 110 is disposed around the quantum dot color conversion layer 51; the second opaque retaining wall 120 is disposed around the color filter film layer 52. The quantum dot color conversion layer 51 can convert the light of the light emitting unit 20 into corresponding colors, and when a blue LED chip is used as the light emitting unit 20, the quantum dot color conversion layer 51 can adopt a quantum dot conversion layer for converting red light, a quantum dot conversion layer for converting green light, and a diffusion layer to cooperate to form a color light emitting effect of the display module. The color filter layer 52 can prevent external light from irradiating the quantum dot color conversion layer 51, and thus, the influence of the external light on the quantum dot color conversion layer 51 can be avoided.
As another embodiment of the present application, a structure of a display module is disclosed, specifically as shown in fig. 1, including: a plurality of light-emitting units 20 are arranged on one TFT array substrate 10 at intervals by a mass transfer technology, in the embodiment, the light-emitting units 20 are Micro-LED chips 20, the first adhesive layer 71 is arranged around the Micro-LED chips 20 to wrap welding pins of the Micro-LED chips 20, and the second adhesive layer 72 is arranged to wrap the light-emitting structures of the Micro-LED chips 20; then, lens units 30 are arranged above the second adhesive layer 72 and above the Micro-LED chips 20 to collimate the light emitted from the Micro-LED chips 20, and the lens units 30 are fully paved on the top surfaces of the second adhesive layer 72 and the Micro-LED chips 20, so that the side light emitted to the upper side at any position can be collimated by the lens units 30, and the transmission angle is changed; moreover, the bonding glue layer 90 is formed to wrap the lens unit 30, then the light-transmitting interlayer 100 is arranged, and the light-transmitting interlayer 100 is used for blocking water and oxygen; the light-tight light blocking structures 60 are arranged on the light-transmitting interlayer 100 at positions corresponding to the intervals between two adjacent Micro-LED chips 20, so that light rays emitted by the Micro-LED chips 20 in the forward direction can only be continuously transmitted upwards after being transmitted to the light-transmitting interlayer 100, and cannot be transmitted laterally; in order to enable the display module to emit light of various colors, a quantum dot color conversion layer 51 is further arranged above the light-transmitting interlayer 100, the quantum dot color conversion layer 51 comprises a quantum dot conversion layer for converting red light, a quantum dot conversion layer for converting green light and a scattering layer, wherein the three Micro-LED chips 20 form a pixel unit, light rays of the three Micro-LED chips 20 respectively emit red light, green light and blue light after passing through the quantum dot color conversion layer 51, and the display effect of the display module can be more diversified by adjusting the brightness proportion of the light rays of the three colors; in addition, a first light-tight retaining wall 110 is also arranged around the quantum dot color conversion layer 51 to prevent light rays in the quantum dot color conversion layer 51 from being transmitted laterally, so that crosstalk interference is avoided, and meanwhile, in order to prevent disordered light rays of the external environment from influencing the quantum dot color conversion layer 51, a color filter film layer 52 is arranged on a light emitting surface of the display module and comprises a red filter film layer, a green filter film layer, a blue filter film layer and second light-tight retaining walls 120 among the color filter film layers 52, so that the normal operation of the display module can be ensured, the self crosstalk is reduced, and the influence of environmental factors is also reduced; finally, the color film substrate 40 is covered on the color filter film layer 52 and the second opaque barriers 120 to isolate and protect the structures in the display module. The thicknesses of the color film substrate 40 and the TFT array substrate 10 are 0.5-0.7mm, the thicknesses of the color filter film layers 52 are 1-2 μm, the thickness of the quantum dot color conversion layer 51 is 5-15 μm, the thickness of the first light-tight retaining wall 110 is 5-15 μm, and the thickness of the light-blocking structure 60 is 5-10 μm; the widths of the color filter film layer 52 and the quantum dot color conversion layer 51 depend on the size of the Micro-LED chip 20, and are typically 4-10 μm larger than the size of the Micro-LED chip 20. The width of second opaque walls 120 is equivalent to the interval between two adjacent Micro-LED chips 20, the width of first opaque walls 110 is 2-6 μm less than the width of second opaque walls 120, and the width of light blocking structure 60 is 2-6 μm less than the width of first opaque walls 110.
In addition, it should be noted that the light blocking structure 60, the first opaque wall 110, the second opaque wall 120, the color filter layer 52, the quantum dot color conversion layer 51, the light-transmitting interlayer 100, and other structures in this embodiment can be manufactured by using a photolithography process, or by using a printing process.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A display module, comprising:
an array substrate;
a plurality of light emitting cells disposed at one side of the array substrate;
a lens unit disposed at a light emitting side of the light emitting unit;
the color film substrate is arranged on the light emitting side of the lens units, a plurality of light conversion units are arranged on one side of the color film substrate facing the array substrate, the light conversion units are arranged corresponding to the light emitting units, and a light blocking structure is arranged between every two adjacent light conversion units.
2. The display module of claim 1, further comprising an encapsulation layer disposed on the array substrate, the encapsulation layer being disposed around the periphery of the light emitting unit and having a top surface coplanar with the top surface of the light emitting unit, the lens unit being disposed on the top surface of the encapsulation layer and the top surface of the light emitting unit.
3. The display module according to claim 2, wherein the encapsulation layer comprises a first adhesive layer and a second adhesive layer sequentially stacked on the array substrate, the first adhesive layer being used for fixing the solder feet of the light emitting unit; the second adhesive layer is used for fixing the epitaxial layer of the light-emitting unit.
4. The display module of claim 3, wherein the second adhesive layer is an opaque adhesive layer.
5. The display module of claim 1, wherein the lens unit comprises a plurality of micro lenses arranged side by side, and a projection area of the micro lenses on the light emitting unit is smaller than a top surface area of the light emitting unit.
6. The display module of claim 1, further comprising a light blocking film layer disposed on the array substrate, wherein the light blocking film layer is disposed on a side of the array substrate facing away from the light emitting unit.
7. The display module according to claim 1, wherein a side of the lens unit facing away from the light emitting unit is provided with a glue layer, and the light blocking structure is disposed on the glue layer; the cross section of the light blocking structure is trapezoidal, and the width of the light blocking structure is gradually increased along the light emitting direction of the light emitting unit.
8. The display module of claim 7, wherein the adhesive layer further comprises a light-transmissive interlayer disposed around the light-blocking structure; the light conversion unit is arranged on the light-transmitting interlayer, the projection position of the light-emitting unit on the light-transmitting interlayer is overlapped with the position of the light conversion unit, and the color film substrate is arranged on one side, away from the light-transmitting interlayer, of the light conversion unit.
9. The display module according to claim 8, wherein a first opaque retaining wall and a second opaque retaining wall are further disposed on one side of the light-transmitting interlayer where the light conversion unit is disposed; the light conversion unit comprises a quantum dot color conversion layer and a color filter film layer, and the first light-tight retaining wall is arranged around the quantum dot color conversion layer; the second light-tight retaining wall surrounds the color filter film layer.
10. The display module of claim 1, wherein the light emitting unit is a blue LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120342289.0U CN214253721U (en) | 2021-02-05 | 2021-02-05 | Display module |
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| CN202120342289.0U CN214253721U (en) | 2021-02-05 | 2021-02-05 | Display module |
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| CN214253721U true CN214253721U (en) | 2021-09-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114035380A (en) * | 2021-11-01 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | Color film substrate, display panel and color film substrate manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114035380A (en) * | 2021-11-01 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | Color film substrate, display panel and color film substrate manufacturing method |
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