CN213124033U - Integrated inductance electronic element - Google Patents

Integrated inductance electronic element Download PDF

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Publication number
CN213124033U
CN213124033U CN202022349763.0U CN202022349763U CN213124033U CN 213124033 U CN213124033 U CN 213124033U CN 202022349763 U CN202022349763 U CN 202022349763U CN 213124033 U CN213124033 U CN 213124033U
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China
Prior art keywords
coil
magnetic core
electronic component
bottom plate
alloy
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CN202022349763.0U
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Chinese (zh)
Inventor
娄海飞
陈胜齐
杜阳忠
卢军伟
王林科
方萌
方军民
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Hengdian Group DMEGC Magnetics Co Ltd
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Hengdian Group DMEGC Magnetics Co Ltd
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Abstract

The utility model discloses an integral type inductance electronic component that belongs to inductance element technical field, including the magnetic core, the inside of magnetic core is equipped with the coil, is equipped with the alloy stopping between magnetic core and the coil, and the outside cladding of magnetic core has insulating housing, and the inside of magnetic core is equipped with U type groove, and the lower extreme in U type groove is equipped with the bottom plate, and the tip of two lead wires of coil is the electrode foot, and two lead wires of coil are bending structure. The utility model discloses bend the back of magnetic core with two lead wires of coil, lateral wall and bottom plate through the magnetic core carry on spacingly to the coil to reduce the intensity requirement to the magnetic core, consequently, the shaping powder adds the reduction that the glue proportion can be appropriate, thereby makes the inductance element performance can be more excellent, the performance of full play material.

Description

Integrated inductance electronic element
Technical Field
The utility model belongs to the technical field of inductance element, concretely relates to integral type inductance electronic component.
Background
As electronic components become smaller and smaller, the lead frame originally occupies a relatively large volume of electronic components, and the coil offset deformation cannot be fundamentally solved, so that the lead frame approach is not suitable for small-sized electronic components. At present, the problem that the inductance element cannot meet the performance requirement due to the fact that a conductor coil is deflected and deformed and the size of an electronic component cannot be fully utilized is basically difficult to solve by a lead frame.
The current manufacturing methods of inductors are mold-pressing inductors and T-core process inductors. The die pressing inductance technology is simple, but the lead frame occupies too much space, the coil cannot be fixed, the product characteristics are poor, and the coil is easy to deform and the quality cannot be guaranteed. Although the T-core process inductor has a certain fixation to the coil, the coil still has an indefinite outward expansion during the secondary pressing, and because the T-core has a very high requirement on the strength, a high proportion of glue needs to be added to ensure the strength, and a part of the electrical performance is sacrificed.
Therefore, an inductance device with better performance is needed.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides an integral type inductance electronic component has the characteristics that make inductance component performance can be more excellent, the performance of full play material.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an integral type inductance electronic component, includes the magnetic core, and the inside of magnetic core is equipped with the coil, is equipped with the alloy stopping between magnetic core and the coil, and the outside cladding of magnetic core has insulating housing, and the inside of magnetic core is equipped with U type groove, and the lower extreme in U type groove is equipped with the bottom plate, and the tip of two lead wires of coil is the electrode foot, and two lead wires of coil are bending structure.
As the preferred technical proposal of the utility model, the alloy filler is alloy powder or an alloy T-shaped block.
As the utility model discloses a preferred technical scheme, the intermediate position that the bottom plate is located U type groove opening one side is connected with the shrouding.
As the preferred technical scheme of the utility model, the below of bottom plate is equipped with bending groove.
As the utility model discloses a preferred technical scheme, the top of bottom plate is equipped with keeps away the dead slot.
As the preferred technical scheme of the utility model, the coil is circular or hollow coil of runway shape.
As the preferred technical scheme of the utility model, the wire rod of coil is flat line, round wire or stranded wire.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses bend the back of magnetic core with two lead wires of coil, lateral wall and bottom plate through the magnetic core carry on spacingly to the coil to reduce the intensity requirement to the magnetic core, consequently, the shaping powder adds the reduction that the glue proportion can be appropriate, thereby makes the inductance element performance can be more excellent, the performance of full play material.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the internal structure of the present invention;
fig. 3 is a schematic structural view of the magnetic core of the present invention;
fig. 4 is a schematic structural diagram of the coil of the present invention;
fig. 5 is a schematic structural view of the coil and the magnetic core of the present invention after being combined;
fig. 6 is a schematic structural view of embodiment 2 of the present invention;
in the figure: 1. an insulating housing; 2. an electrode pin; 3. alloying powder; 4. a coil; 5. a magnetic core; 51. a U-shaped groove; 52. an empty avoiding groove; 53. bending the groove; 54. closing the plate; 55. a base plate; 6. and (5) alloy T-shaped blocks.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1-5, the present invention provides the following technical solutions: the utility model provides an integral type inductance electronic component, including magnetic core 5, magnetic core 5 is with alloy powder, amorphous powder, the mixed powder of one kind or multiple combination such as the brilliant powder of nanometer, add certain proportion glue (epoxy, silicone resin, amino resin etc.) and carry out the cladding granulation, carry out certain mesh number section screening to the granulation powder, then compression moulding, one-time pressing pressure 200 ~ 1000MPa, it carries out the partial solidification to pass the Reflow stove behind the compression moulding, the inside of magnetic core 5 is equipped with coil 4, be equipped with the alloy stopping between magnetic core 5 and the coil 4, the outside cladding of magnetic core 5 has insulating housing 1, the inside of magnetic core 5 is equipped with U type groove 51, the lower extreme in U type groove 51 is equipped with bottom plate 55, the tip of two leads of coil 4 is electrode foot 2, and two leads of coil 4 are bending structure.
Specifically, the alloy filler is alloy powder 3.
Specifically, a sealing plate 54 is connected to the bottom plate 55 at a position in the middle of the opening side of the U-shaped groove 51.
By adopting the technical scheme, the secondary pressing of the alloy filler is facilitated.
Specifically, the bending groove 53 is provided below the bottom plate 55.
By adopting the technical scheme, the two leads of the coil 4 can be flush with the bottom of the magnetic core 5 after being bent.
Specifically, a clearance groove 52 is provided above the bottom plate 55.
Through adopting above-mentioned technical scheme, be convenient for put coil 4 into the inside of magnetic core 5.
Specifically, the coil 4 is a circular or racetrack-shaped air coil, and the circular air coil is preferred in this embodiment.
Example 2
Referring to fig. 6, the present embodiment is different from embodiment 1 in that: specifically, the alloy filler is an alloy T-shaped block 6.
Example 3
The present embodiment is different from embodiment 1 in that: specifically, the wire material of the coil 4 is a flat wire, a round wire or a multi-strand wire, and the present embodiment is preferably a flat wire.
The utility model discloses a production flow does: mixing one or more of alloy powder, amorphous powder, nanocrystalline powder and the like, adding a certain proportion of glue (epoxy resin, silicon resin, amino resin and the like) for coating and granulation, sieving the granulated powder by a certain mesh number, then performing compression molding at a one-time compression pressure of 200-1000 MPa, and performing partial curing in a Reflow furnace after the compression molding; the magnetic core 5 and the coil 4 are combined and bent, then are filled in a die cavity with a certain volume and quantity, and then are filled with alloy powder 3 or alloy T-shaped blocks 6 for secondary pressing to form the magnetic core, and after the secondary pressing, the magnetic core and the coil are baked and cured at 150-180 ℃ fully. Through the rolling spraying process, the surface of the product is coated with insulating paint once to form an insulating shell 1, the laser stripping of the insulating paint is carried out on the copper wires with two electrodes on the bottom surface, and the two copper wires form electrode pins 2 through the electroplating process.
To sum up, the utility model discloses bend two lead wires of coil 4 to the back of magnetic core 5, lateral wall and bottom plate 55 through magnetic core 5 carry on spacingly to the coil to reduce the intensity requirement to magnetic core 5, consequently, the shaping powder adds the reduction that the glue proportion can be appropriate, thereby makes the inductance element performance can be more excellent, the performance of full play material.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. An integrated inductive electronic component comprising a magnetic core (5), characterized in that: the coil (4) is arranged inside the magnetic core (5), the alloy filling material is arranged between the magnetic core (5) and the coil (4), the insulating shell (1) is wrapped outside the magnetic core (5), the U-shaped groove (51) is arranged inside the magnetic core (5), the bottom plate (55) is arranged at the lower end of the U-shaped groove (51), the end portions of the two leads of the coil (4) are electrode pins (2), and the two leads of the coil (4) are of a bending structure.
2. The integrated inductor electronic component of claim 1, wherein: the alloy filler is alloy powder (3) or an alloy T-shaped block (6).
3. The integrated inductor electronic component of claim 1, wherein: the middle position of the bottom plate (55) at the opening side of the U-shaped groove (51) is connected with a sealing plate (54).
4. The integrated inductor electronic component of claim 1, wherein: a bending groove (53) is arranged below the bottom plate (55).
5. The integrated inductor electronic component of claim 1, wherein: an empty avoiding groove (52) is arranged above the bottom plate (55).
6. The integrated inductor electronic component of claim 1, wherein: the coil (4) is a circular or racetrack-shaped hollow coil.
7. The integrated inductor electronic component of claim 1, wherein: the wire of the coil (4) is flat wire, round wire or multi-strand wire.
CN202022349763.0U 2020-10-21 2020-10-21 Integrated inductance electronic element Active CN213124033U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022349763.0U CN213124033U (en) 2020-10-21 2020-10-21 Integrated inductance electronic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022349763.0U CN213124033U (en) 2020-10-21 2020-10-21 Integrated inductance electronic element

Publications (1)

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CN213124033U true CN213124033U (en) 2021-05-04

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114023548A (en) * 2021-11-01 2022-02-08 横店集团东磁股份有限公司 Inductive magnetic element manufacturing method and inductive magnetic element
CN114068152A (en) * 2021-12-14 2022-02-18 苏州邦鼎新材料有限公司 High-performance high-quality integrated inductance element structure and manufacturing method thereof
CN114898998A (en) * 2022-05-27 2022-08-12 横店集团东磁股份有限公司 Cross-shaped magnetic core inductor and preparation method and application thereof
WO2023134436A1 (en) * 2022-01-11 2023-07-20 昆山玛冀电子有限公司 Integrally formed inductor and manufacturing method therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114023548A (en) * 2021-11-01 2022-02-08 横店集团东磁股份有限公司 Inductive magnetic element manufacturing method and inductive magnetic element
CN114068152A (en) * 2021-12-14 2022-02-18 苏州邦鼎新材料有限公司 High-performance high-quality integrated inductance element structure and manufacturing method thereof
WO2023134436A1 (en) * 2022-01-11 2023-07-20 昆山玛冀电子有限公司 Integrally formed inductor and manufacturing method therefor
CN114898998A (en) * 2022-05-27 2022-08-12 横店集团东磁股份有限公司 Cross-shaped magnetic core inductor and preparation method and application thereof

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