CN103714945A - Electronic component and manufacturing method thereof - Google Patents
Electronic component and manufacturing method thereof Download PDFInfo
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- CN103714945A CN103714945A CN201310729544.7A CN201310729544A CN103714945A CN 103714945 A CN103714945 A CN 103714945A CN 201310729544 A CN201310729544 A CN 201310729544A CN 103714945 A CN103714945 A CN 103714945A
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Abstract
The invention discloses an electronic component. The electric component is characterized by comprising an inner core and an outer wrapping layer, wherein the inner core is located in the outer wrapping layer; the inner core comprises a combination of a coil winding and a coil and a combination of print circuits and further comprises a main body and an electrode formed due to the fact that an extending portion from the main body is connected with a terminal through welding or point welding; the outer wrapping layer is formed in the mode that the inner core is compressed to be embedded in a pulpy mixture material in a squeezing forming mode or a casting mode or an embed casting mode so that the pulpy mixture material tightly wraps the inner core and heating curing is carried out, and the surface of the outer wrapping layer is sleeved with a metal shell or a plastic shell. The electronic component and the manufacturing method have the advantages that manufacturability and performance are improved.
Description
Technical field
The present invention relates to a kind of electronic devices and components and manufacture method thereof.
Background technology
Along with electronic technology is to high frequency, miniaturization development, the technological innovation that constantly requires electronic devices and components to match.And the small size chip electronic devices and components of Vehicles Collected from Market mostly exist that inductance value is on the low side, electric current is little, poor reliability and temperature rise higher, and the real drop of anti-EMI weak effect.In conventional shielded electronic-type components and parts or non-screening electron components and parts, all high-power, large electric current, high sense value performance cannot be presented to better effect simultaneously.Had at present the Integral electronic components and parts that adopt powder die-casting, but the Integral electronic components and parts of powder die-casting are because magnetic core powder magnetic permeability used is generally low, cause performance to be still limited by the limitation of large electric current, low sense value.Therefore, need a kind of aforementioned limitations that overcomes, provide improvement inductive means and the manufacture method thereof of the ability, feature and the function that do not have in current manufacturing equipment and method, for the new electronic component of specific application area.
Summary of the invention
The object of this invention is to provide a kind of electronic devices and components and manufacture method thereof that can improve manufacturability and performance.
Object of the present invention is achieved through the following technical solutions.
Electronic devices and components, is characterized in that: described electronic devices and components comprise inner core and external coating, and inner core is positioned at external coating; Described inner core comprises coil windings and coil assembly, printed circuit and printed circuit assembly, and it comprises main body and by welding or spot welding, is connected to terminal, the electrode of formation from extension and the extension of described main body; Described external coating is to take pressuring method that inner core is embedded among paste mixture material in the mode by extrusion modling or casting or embedding casting, the described paste mixture material of order closely envelopes core arrangement body, and the mode being heating and curing, to form the external coating of described electronic devices and components; Metal shell or plastic shell are inserted in the surface of described external coating.
Described coil windings is the loop construction that flat enamelled wire or circular enamelled wire coiling form; Described flat enamelled wire extension is flat, by wicking or plating, directly forms electrode; Described circular enamelled wire can directly be drawn to flatten by wicking or electroplate and directly be formed electrode, or is connected to terminal by welding or spot welding, forms electrode.
In described coil windings, increase magnetic core or non-core material.
Described printed circuit is that conductor fig uses printing means etching or sensitization on an insulated substrate, the printed coil of formation.
In described printed coil, increase magnetic core or non-core material.
Described employing core material or non-core material are made moulding, and wherein core material is the material of MnZn or nickel zinc or alloy powder or amorphous powder or epoxy iron powder; Non-core material is the material of adhering resin; Described magnetic core or non-core material shape comprise " straight clavate ", " I-shaped ", " T shape ", " TT shape ".
Described external coating is that paste mixture material forms;
Described paste mixture material, refers to according to characteristic requirements and chooses corresponding metal dust and corresponding adhering resin, it comprises curing agent, the paste mixture material forming after being fully uniformly mixed; Described adhering resin, the epoxy resin that comprises thermosetting sizing, phenolic resins, novolac epoxy resin, o-cresol formaldehyde epoxy resin and corresponding curing agent.
Described metal shell is the metallic shield that all kinds of and this electronic devices and components profile of copper alloy or aluminium alloy making matches; Described plastic shell is the plastic shielding cover that all kinds of and this electronic devices and components profile of phenolic plastics, LCP plastics, the making of nylon plastic(s) material matches.
The manufacture method of described electronic devices and components comprises the following steps:
(1), employing enamelled wire turns to coil, and in the coil of coiling, adds magnetic core or non-core material; Or the printed circuit that adopts printing technology to be made into, and in printed circuit, add magnetic core or non-core material; Be made into the inner core of coil windings and coil assembly, printed circuit and printed circuit assembly form;
(2), by the inner core of described coil windings and coil assembly, printed circuit and printed circuit assembly form, put among corresponding mould;
(3), the paste mixture material modulating will be inserted in described mould, take pressuring method that inner core is embedded among paste mixture material in the mode by extrusion modling or casting or embedding casting, the described paste mixture material of order closely envelopes core arrangement body, and the mode being heating and curing forms external coating, the extension of described inner core exposes the corresponding end face of described external coating;
(4), described external coating can directly become the skin of these electronic devices and components, or be inserted in metal shell or plastic shell on the surface of its external coating;
(5), in the end of the corresponding described extension of described external coating, by wicking or by the extension of coil, be welded on terminal, form the electrode of these electronic devices and components, produce described new electronic component.
In described step (1), described coil windings is the loop construction that flat enamelled wire or circular enamelled wire coiling form; Described flat enamelled wire extension is flat, by laser or peel manually, after the paint film of exposed part, carries out wicking or plating, directly forms electrode; Described circular enamelled wire can directly be drawn to flatten by wicking or electroplate and directly be formed electrode, or is connected to terminal by welding or spot welding, forms electrode.
In described step (1), on the basis that described coil assembly is described claim 11, in the center of coil windings, increase magnetic core or non-core material.
In described step (1), described printed circuit is that conductor fig is made corresponding printed coil with the etching of printing means or sensitization on an insulated substrate.
In described step (1), on the basis of claim 12, in printed coil, increase magnetic core or non-core material described in described printed circuit assembly.
In described step (1), adopt core material or non-core material to make moulding, wherein core material is the material of MnZn or nickel zinc or alloy powder or amorphous powder or epoxy iron powder; Non-core material is the material of adhering resin; Described magnetic core or non-core material shape comprise " straight clavate ", " I-shaped ", " T font ", " TT shape ".
In described step (3), described external coating is paste mixture material, takes pressuring method to form by the mode of extrusion modling or casting or embedding casting;
In described step (3), described paste mixture material, refers to according to characteristic requirements and choose corresponding metal dust and corresponding adhering resin (containing curing agent), the paste mixture material forming after being fully uniformly mixed; Described adhering resin, the epoxy resin of thermosetting sizing, phenolic resins, novolac epoxy resin, o-cresol formaldehyde epoxy resin and corresponding curing agent.
In described step (4), wherein said metal shell, the metallic shield that all kinds of and this electronic devices and components profile of making for copper alloy or aluminium alloy matches; Wherein said plastic shell, the plastic shielding cover that all kinds of and this electronic devices and components profile of making for phenolic plastics, LCP plastics, nylon plastic(s) material matches.
The present invention compared with prior art has the following advantages.
(1) the prefabricated inner core forming by coil windings and coil assembly, printed circuit and printed circuit assembly, for these electronic devices and components are in same size, provides multiple solution, to cater to client for the design requirement of different levels product;
(2) on prefabricated inner core, take pressuring method that inner core is embedded among paste mixture material in the mode by extrusion modling or casting or embedding casting, the described paste mixture material of order closely envelopes core arrangement body, and the mode being heating and curing, reduce the air gap between interiors of products or coil turn, what increase product effectively utilizes space, improves the performance of product.
Accompanying drawing explanation
Fig. 1 is the structural representation of electronic devices and components execution mode of the present invention ();
Fig. 2 is the structural representation of electronic devices and components execution mode of the present invention () bottom;
Fig. 3 is the structural representation of electronic devices and components execution mode of the present invention () inner core;
Fig. 4 is the structural representation of electronic devices and components execution mode of the present invention () T shape rod;
Fig. 5 is the structural representation of electronic devices and components execution mode of the present invention () coil;
Fig. 6 is the structural representation of electronic devices and components execution mode of the present invention () terminal;
Fig. 7 is the structural representation of electronic devices and components execution mode of the present invention (two);
Fig. 8 is the structural representation of electronic devices and components execution mode of the present invention (two) bottom;
Fig. 9 is the structural representation of electronic devices and components execution mode of the present invention (two) inner core;
Figure 10 is the structural representation of electronic devices and components execution mode of the present invention (two) T shape rod;
Figure 11 is the structural representation of electronic devices and components execution mode of the present invention (two) coil;
Figure 12 is the structural representation of electronic devices and components execution mode of the present invention (three);
Figure 13 is the structural representation of electronic devices and components execution mode of the present invention (three) bottom;
Figure 14 is the structural representation of electronic devices and components execution mode of the present invention (three) inner core;
Figure 15 is the structural representation of electronic devices and components execution mode of the present invention (three) T shape rod;
Figure 16 is the structural representation of electronic devices and components execution mode of the present invention (three) coil;
Figure 17 is the structural representation of electronic devices and components execution mode of the present invention (three) terminal;
Figure 18 is the structural representation of electronic devices and components execution mode of the present invention (four);
Figure 19 is the structural representation of electronic devices and components execution mode of the present invention (four) bottom;
Figure 20 is the structural representation of electronic devices and components execution mode of the present invention (four) inner core;
Figure 21 is the structural representation of electronic devices and components execution mode of the present invention (four) T shape rod;
Figure 22 is the structural representation of electronic devices and components execution mode of the present invention (four) coil;
Figure 23 is the structural representation of electronic devices and components execution mode of the present invention (four) terminal;
Figure 24 is the structural representation of electronic devices and components execution mode of the present invention (five);
Figure 25 is the structural representation of electronic devices and components execution mode of the present invention (five) bottom;
Figure 26 is the structural representation of electronic devices and components execution mode of the present invention (five) inner core;
Figure 27 is the structural representation of electronic devices and components execution mode of the present invention (five) T shape rod;
Figure 28 is the structural representation of electronic devices and components execution mode of the present invention (five) coil;
Figure 29 is the structural representation of electronic devices and components execution mode of the present invention (five) terminal;
Figure 30 is the structural representation of electronic devices and components execution mode of the present invention (six);
Figure 31 is the structural representation of electronic devices and components execution mode of the present invention (six) bottom;
Figure 32 is the structural representation of electronic devices and components execution mode of the present invention (six) inner core;
Figure 33 is the structural representation of electronic devices and components execution mode of the present invention (six) T shape rod;
Figure 34 is the structural representation of electronic devices and components execution mode of the present invention (six) coil;
Figure 35 is the structural representation of electronic devices and components execution mode of the present invention (seven);
Figure 36 is the structural representation of electronic devices and components execution mode of the present invention (seven) bottom;
Figure 37 is the structural representation of electronic devices and components execution mode of the present invention (seven) inner core;
Figure 38 is the structural representation of electronic devices and components execution mode of the present invention (seven) T shape rod;
Figure 39 is the structural representation of electronic devices and components execution mode of the present invention (seven) coil;
Figure 40 is the structural representation of electronic devices and components execution mode of the present invention (seven) terminal.
Embodiment
Below in conjunction with accompanying drawing, electronic devices and components of the present invention and manufacture method thereof are described in further detail.
Shown in 0, the present invention is a kind of electronic devices and components, it is characterized in that as shown in Figure 1 to Figure 4: described electronic devices and components comprise inner core and external coating (3A, 3B, 3C, 3D, 3E, 3F, 3G), and inner core is positioned at external coating; Described inner core comprises coil windings (1A, 1B, 1C, 1D, 1E, 1F, 1G) and coil assembly, printed circuit and printed circuit assembly, it comprise main body and from the extension of described main body (4A, 4B, 4C, 4D, 4E, 4F, 4G, 4H, 4I, 4J, 4L, 4M, 4N) and extension by welding or spot welding be connected to terminal (5A, 5B, 5C, 5D, 5E, 5F, 5G), the electrode of formation; Described external coating is to take pressuring method that inner core is embedded among paste mixture material in the mode by extrusion modling or casting or embedding casting, the described paste mixture material of order closely envelopes core arrangement body, and the mode being heating and curing, to form the external coating of described electronic devices and components; Metal shell or plastic shell are inserted in the surface of described external coating.
Described coil windings is the loop construction that flat enamelled wire or circular enamelled wire coiling form; Described flat enamelled wire extension is flat, by wicking or plating, directly forms electrode; Described circular enamelled wire can directly be drawn to flatten by wicking or electroplate and directly be formed electrode, or is connected to terminal by welding or spot welding, forms electrode.
In described coil windings, increase magnetic core or non-core material (2A, 2B, 2C, 2D, 2E, 2F, 2G).
Described printed circuit is that conductor fig uses printing means etching or sensitization on an insulated substrate, the printed coil of formation.
In described printed coil, increase magnetic core or non-core material.
Described employing core material or non-core material are made moulding, and wherein core material is the material of MnZn or nickel zinc or alloy powder or amorphous powder or epoxy iron powder; Non-core material is the material of adhering resin; Described magnetic core or non-core material shape comprise " straight clavate ", " I-shaped ", " T shape ", " TT shape ".
Described external coating is that paste mixture material forms;
Described paste mixture material, refers to according to characteristic requirements and chooses corresponding adhering resin, or corresponding metal dust and corresponding adhering resin, the paste mixture material forming after being fully uniformly mixed;
Described adhering resin, the epoxy resin of thermosetting sizing, phenolic resins, novolac epoxy resin, o-cresol formaldehyde epoxy resin and corresponding curing agent.
Described metal dust, refers to the material into MnZn or nickel zinc or alloy powder or amorphous powder or epoxy iron powder.
Described metal shell is the metallic shield that all kinds of and this electronic devices and components profile of copper alloy or aluminium alloy making matches; Described plastic shell is the plastic shielding cover that all kinds of and this electronic devices and components profile of phenolic plastics, LCP plastics, the making of nylon plastic(s) material matches.
The manufacture method of described electronic devices and components comprises the following steps:
(1), employing enamelled wire turns to coil, and in the coil of coiling, adds magnetic core or non-core material; Or the printed circuit that adopts printing technology to be made into, and in printed circuit, add magnetic core or non-core material; Be made into the inner core of coil windings and coil assembly, printed circuit and printed circuit assembly form;
(2), by the inner core of described coil windings and coil assembly, printed circuit and printed circuit assembly form, put among corresponding mould;
(3), the paste mixture material modulating will be inserted in described mould, take pressuring method that inner core is embedded among paste mixture material in the mode by extrusion modling or casting or embedding casting, the described paste mixture material of order closely envelopes core arrangement body, and the mode being heating and curing forms external coating, the extension of described inner core exposes the corresponding end face of described external coating;
(4), described external coating can directly become the skin of these electronic devices and components, or be inserted in metal shell or plastic shell on the surface of its external coating;
(5), in the end of the corresponding described extension of described external coating, by wicking or by the extension of coil, be welded on terminal, form the electrode of these electronic devices and components, produce described new electronic component.
(6) coil extension is welded on terminal electrode by the mode of spot welding, and technique is simple, is applicable to batch production, breaks away from traditional inductance and carries out the destruction of high-temperature soldering to coil at tin stove, improves the reliability of product.
(7) adopt flat wire coiling, by coil ennation pin, directly along inner core base plate location, carry out bending forming, as electrode, flat wire has lower DCR, be applicable to very much high-power low-loss circuit design, flat wire can effectively reduce the skin effect of high frequency in addition, makes product have good Q value characteristic.
In described step (1), described coil windings is the loop construction that flat enamelled wire or circular enamelled wire coiling form; Described flat enamelled wire extension is flat, by laser or peel manually, after the paint film of exposed part, carries out wicking or plating, directly forms electrode; Described circular enamelled wire welds by wicking or the mode of spot welding is connected to terminal, forms electrode.
In described step (1), on the basis that described coil assembly is described claim 11, in the center of coil windings, increase magnetic core or non-core material.
In described step (1), described printed circuit is that conductor fig is made corresponding printed coil with the etching of printing means or sensitization on an insulated substrate.
In described step (1), on the basis of claim 12, in printed coil, increase magnetic core or non-core material described in described printed circuit assembly.
In described step (1), adopt core material or non-core material to make moulding, wherein core material is the material of MnZn or nickel zinc or alloy powder or amorphous powder or epoxy iron powder; Non-core material is the material of adhering resin; Described magnetic core or non-core material shape comprise " straight clavate ", " I-shaped ", " T font ", " TT shape ".
In described step (3), described external coating is paste mixture material, takes pressuring method to form by the mode of extrusion modling or casting or embedding casting;
In described step (3), described paste mixture material, refers to according to characteristic requirements and choose corresponding metal dust and corresponding adhering resin (containing curing agent), the paste mixture material forming after being fully uniformly mixed; Described adhering resin, the epoxy resin of thermosetting sizing, phenolic resins, novolac epoxy resin, o-cresol formaldehyde epoxy resin and corresponding curing agent.
In described step (4), wherein said metal shell, the metallic shield that all kinds of and this electronic devices and components profile of making for copper alloy or aluminium alloy matches; Wherein said plastic shell, the plastic shielding cover that all kinds of and this electronic devices and components profile of making for phenolic plastics, LCP plastics, nylon plastic(s) material matches.
The present invention compared with prior art has the following advantages.
(1) the prefabricated inner core forming by coil windings and coil assembly, printed circuit and printed circuit assembly, for these electronic devices and components are in same size, provides multiple solution, to cater to client for the design requirement of different levels product; Break through the technical bottleneck that current inductance is confined to the large electric current of small inductor.
(2) on prefabricated inner core, take pressuring method that inner core is embedded among paste mixture material in the mode by extrusion modling or casting or embedding casting, the described paste mixture material of order closely envelopes core arrangement body, and the mode being heating and curing, reduce the air gap between interiors of products or coil turn, effectively eliminate different sound, what increase product effectively utilizes space, improve product work efficiency, increase the ability of product insulation impedance.
(3) coiler part of interiors of products in the process of moulding without any pressure, and the destructive techniques such as impact of high temperature, effectively avoid product in the distortion of forming process coil or broken skin short-circuit conditions.
Claims (18)
1. electronic devices and components, is characterized in that: described electronic devices and components comprise inner core and external coating, and inner core is positioned at external coating; Described inner core comprises coil windings and coil assembly, printed circuit and printed circuit assembly, and it comprises main body and by welding or spot welding, is connected to terminal, the electrode of formation from extension and the extension of described main body; Described external coating is to take pressuring method that inner core is embedded among paste mixture material in the mode by extrusion modling or casting or embedding casting, the described paste mixture material of order closely envelopes core arrangement body, and the mode being heating and curing, to form the external coating of described electronic devices and components; Metal shell or plastic shell are inserted in the surface of described external coating.
2. electronic devices and components according to claim 1, is characterized in that: described coil windings is the loop construction that flat enamelled wire or circular enamelled wire coiling form; Described flat enamelled wire extension is flat, by wicking or plating, directly forms electrode; Described circular enamelled wire can directly be drawn to flatten by wicking or electroplate and directly be formed electrode, or is connected to terminal by welding or spot welding, forms electrode.
3. electronic devices and components according to claim 2, is characterized in that: in described coil windings, increase magnetic core or non-core material.
4. electronic devices and components according to claim 1, is characterized in that: described printed circuit is that conductor fig uses printing means etching or sensitization on an insulated substrate, the printed coil of formation.
5. electronic devices and components according to claim 4, is characterized in that: in described printed coil, increase magnetic core or non-core material.
6. according to the electronic devices and components described in claim 3 or 5, it is characterized in that: described employing core material or non-core material are made moulding, and wherein core material is the material of MnZn or nickel zinc or alloy powder or amorphous powder or epoxy iron powder; Non-core material is the material of adhering resin; Described magnetic core or non-core material shape comprise " straight clavate ", " I-shaped ", " T shape ", " TT shape ".
7. electronic devices and components according to claim 1, is characterized in that: described external coating is that paste mixture material forms;
8. electronic devices and components according to claim 7, it is characterized in that: described paste mixture material, refer to according to characteristic requirements and choose corresponding adhering resin, or corresponding metal dust and corresponding adhering resin, the paste mixture material forming after being fully uniformly mixed; Described adhering resin, the epoxy resin that comprises thermosetting sizing, phenolic resins, novolac epoxy resin, o-cresol formaldehyde epoxy resin and corresponding curing agent; Described metal dust, refers to the material into MnZn or nickel zinc or alloy powder or amorphous powder or epoxy iron powder.
9. electronic devices and components according to claim 1, is characterized in that: described metal shell is the metallic shield that all kinds of and this electronic devices and components profile of copper alloy or aluminium alloy making matches; Described plastic shell is the plastic shielding cover that all kinds of and this electronic devices and components profile of phenolic plastics, LCP plastics, the making of nylon plastic(s) material matches.
10. the manufacture method of electronic devices and components according to claim 1, is characterized in that: the manufacture method of described electronic devices and components comprises the following steps:
(1), employing enamelled wire turns to coil, and in the coil of coiling, adds magnetic core or non-core material; Or the printed circuit that adopts printing technology to be made into, and in printed circuit, add magnetic core or non-core material; Be made into the inner core of coil windings and coil assembly, printed circuit and printed circuit assembly form;
(2), by the inner core of described coil windings and coil assembly, printed circuit and printed circuit assembly form, put among corresponding mould;
(3), the paste mixture material modulating will be inserted in described mould, take pressuring method that inner core is embedded among paste mixture material in the mode by extrusion modling or casting or embedding casting, the described paste mixture material of order closely envelopes core arrangement body, and the mode being heating and curing forms external coating, the extension of described inner core exposes the corresponding end face of described external coating;
(4), described external coating can directly become the skin of these electronic devices and components, or be inserted in metal shell or plastic shell on the surface of its external coating;
(5), in the end of the corresponding described extension of described external coating, by wicking or by the extension of coil, be welded on terminal, form the electrode of these electronic devices and components, produce described new electronic component.
The manufacture method of 11. electronic devices and components according to claim 10, is characterized in that: in described step (1), described coil windings is the loop construction that flat enamelled wire or circular enamelled wire coiling form; Described flat enamelled wire extension is flat, by laser or peel manually, after the paint film of exposed part, carries out wicking or plating, directly forms electrode; Described circular enamelled wire can directly be drawn to flatten by wicking or electroplate and directly be formed electrode, or is connected to terminal by welding or spot welding, forms electrode.
The manufacture method of 12. electronic devices and components according to claim 10, is characterized in that: in described step (1), on the basis that described coil assembly is described claim 11, in the center of coil windings, increase magnetic core or non-core material.
The manufacture method of 13. electronic devices and components according to claim 10, is characterized in that: in described step (1), described printed circuit is that conductor fig is made corresponding printed coil with the etching of printing means or sensitization on an insulated substrate.
The manufacture method of 14. electronic devices and components according to claim 10, is characterized in that: in described step (1), on the basis of claim 12, increase magnetic core or non-core material in printed coil described in described printed circuit assembly.
The manufacture method of 15. electronic devices and components according to claim 10, it is characterized in that: in described step (1), adopt core material or non-core material to make moulding, wherein core material is the material of MnZn or nickel zinc or alloy powder or amorphous powder or epoxy iron powder; Non-core material is the material of adhering resin; Described magnetic core or non-core material shape comprise " straight clavate ", " I-shaped ", " T font ", " TT shape ".
The manufacture method of 16. electronic devices and components according to claim 10, is characterized in that: in described step (3), described external coating is paste mixture material, takes pressuring method to form by the mode of extrusion modling or casting or embedding casting;
The manufacture method of 17. electronic devices and components according to claim 10, it is characterized in that: in described step (3), described paste mixture material, refer to according to characteristic requirements and choose corresponding metal dust and corresponding adhering resin (containing curing agent), the paste mixture material forming after being fully uniformly mixed; Described adhering resin, the epoxy resin of thermosetting sizing, phenolic resins, novolac epoxy resin, o-cresol formaldehyde epoxy resin and corresponding curing agent.
The manufacture method of 18. electronic devices and components according to claim 10, is characterized in that: in described step (4), and wherein said metal shell, the metallic shield that all kinds of and this electronic devices and components profile of making for copper alloy or aluminium alloy matches; Wherein said plastic shell, the plastic shielding cover that all kinds of and this electronic devices and components profile of making for phenolic plastics, LCP plastics, nylon plastic(s) material matches.
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| CN201310729544.7A CN103714945A (en) | 2013-12-25 | 2013-12-25 | Electronic component and manufacturing method thereof |
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| CN104822107A (en) * | 2015-03-23 | 2015-08-05 | 马根昌 | All direction open type sound box |
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| CN110310814A (en) * | 2018-03-27 | 2019-10-08 | 三星电机株式会社 | Coil block |
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