CN213071071U - Semiconductor crystal grain detection device - Google Patents
Semiconductor crystal grain detection device Download PDFInfo
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- CN213071071U CN213071071U CN202022465165.XU CN202022465165U CN213071071U CN 213071071 U CN213071071 U CN 213071071U CN 202022465165 U CN202022465165 U CN 202022465165U CN 213071071 U CN213071071 U CN 213071071U
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- 238000001514 detection method Methods 0.000 title claims abstract description 50
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- 238000007664 blowing Methods 0.000 claims abstract description 15
- 238000012360 testing method Methods 0.000 claims abstract description 13
- 230000003028 elevating effect Effects 0.000 claims abstract description 9
- 238000007689 inspection Methods 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 4
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- 239000002245 particle Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
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- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000010248 power generation Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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Abstract
The utility model relates to a semiconductor crystal grain detection device in the technical field of semiconductors. The method comprises the following steps: controller, bottom plate, supersonic generator, air pump, place the board of placing of crystalline grain, push down the clamp plate and the lifter plate of crystalline grain, air pump, supersonic generator and controller fixed mounting are on the bottom plate, lifter plate perpendicular to bottom plate and with bottom plate fixed connection, place the board and install on supersonic generator, it is equipped with ultrasonic emission hole and evacuation hole on the board to place, it still fixes the rectangular shape blowing nozzle that is equipped with on the board to place, the clamp plate is elevating movement through elevating system on the lifter plate, the clamp plate bottom is equipped with test probe. The utility model discloses an adopt ultrasonic detection and test probe to detect ingenious setting in same detection device, avoided adopting different detection means to need carry out the shortcoming of transporting to can effectively reduce detection device's size through the three-dimensional design, improved detection efficiency and detection precision.
Description
Technical Field
The utility model relates to the field of semiconductor technology, concretely relates to semiconductor crystal grain detection device.
Background
Semiconductors are widely used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, and the like, and the importance of semiconductors is very great from the viewpoint of scientific and technological or economic development. Most electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to a semiconductor.
Semiconductor units for manufacturing electronic components are generally called semiconductor dies, and the semiconductor dies are cut and polished from a wafer, and some products have defects such as micro cracks or missing corners in the process, so that quality detection and defective sorting are required. The quality detection mainly comprises two modes of manual detection and machine equipment detection. A large amount of manpower and time are consumed for manual detection, and the accuracy of a detection result is relatively low; the precision of the detection of the machine equipment is not high at present, and the main reason is that most of the detection equipment adopts a single structure to detect, and different detection devices are required to detect different detection procedures, so that a crystal grain detection device supporting multiple detection modes is required.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough and defect of prior art, provide a semiconductor crystalline grain detection device.
The purpose of the utility model is realized through the following technical scheme:
a semiconductor die inspection apparatus, comprising: controller, bottom plate, supersonic generator, air pump, place the board of placing of crystalline grain, the clamp plate and the lifter plate of pushing down the crystalline grain, air pump, supersonic generator and controller fixed mounting are on the bottom plate, lifter plate perpendicular to bottom plate and with bottom plate fixed connection, place the board and install on supersonic generator, it is equipped with ultrasonic emission hole and evacuation hole on the board to place, and the extraction hole is connected with the air pump pipeline, it still fixedly is equipped with rectangular shape blowing nozzle on the board to place, rectangular shape blowing nozzle and air pump pipe connection, the clamp plate is elevating movement through elevating system on the lifter plate, the clamp plate bottom is equipped with test probe, test probe and controller signal connection.
Specifically, the air pump and the controller are fixedly arranged on the back plate.
Specifically, the placing plate is further provided with a limiting block.
Specifically, there are two stopper quantity, two stopper difference fixed mounting are in rectangular shape blowing nozzle both sides.
Specifically, still fixed mounting has the promotion cylinder on the ultrasonic transmitter, promotes the cylinder and promotes the end and place board fixed connection.
Specifically, push cylinder quantity is two, and two push cylinder mutually perpendicular set up, and the slide bar that still fixed mounting has the level to set up on being close to the board of placing of push cylinder one side, the slide bar sets up with push cylinder promotion direction is perpendicular, and the slide bar passes push cylinder tip and push cylinder sliding connection.
Specifically, still include the workstation, still be equipped with the locating piece that is used for injecing the bottom plate and the mounting of fixed bottom plate on the workstation.
Compared with the prior art, the utility model following advantage and beneficial effect are included:
(1) the utility model discloses an adopt ultrasonic detection and test probe to detect ingenious setting in same detection device, avoided adopting different detection means to need carry out the shortcoming of transporting to can effectively reduce detection device's size through the three-dimensional design, improved detection efficiency and detection precision.
(2) Because semiconductor crystalline grain glues and dyes the dirt particle easily after the cutting, the utility model discloses a set up rectangular shape blowing nozzle and can clear away the dirt particle in advance, further promote the detection precision.
(3) The utility model discloses still promote the bottom plate through setting up the promotion cylinder and remove, promote the bottom plate through the promotion cylinder and remove the position of crystalline grain when detecting not unidimensional crystalline grain, guarantee that detection probe can both accurate alignment crystalline grain at every turn, improved the utility model discloses a detection range, application scope is more extensive.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a partially enlarged view of a portion a of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and the specific meanings of the above terms in the present invention can be understood in specific situations by those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
As shown in fig. 1 and 2, a semiconductor die inspection apparatus includes: controller 1, bottom plate 2, supersonic generator 3, air pump 4, place the crystalline grain place the board 5, push down the clamp plate 6 and the lifter plate 7 of crystalline grain, air pump 4, supersonic generator 3 and controller 1 fixed mounting are on bottom plate 2, and supersonic generator 3 passes through the crackle state of ultrasonic detection semiconductor crystalline grain, lifter plate 7 perpendicular to bottom plate 2 and with bottom plate 2 fixed connection, place board 5 and install on supersonic generator 3, it is equipped with ultrasonic emission hole 51 and evacuation hole 52 on the board 5 to place, and the evacuation hole is connected with air pump 4 pipe, and evacuation hole 52 is used for adsorbing the semiconductor crystalline grain on bottom plate 2, is convenient for follow-up detection probe (not shown in the figure) and the work of rectangular shape blowing nozzle 53. Place still fixed being equipped with rectangular shape blowing nozzle 53 on the board 5, rectangular shape blowing nozzle 53 and air pump 4 pipe connection, rectangular shape blowing nozzle 53 is used for blowing off the dust particle on the semiconductor crystalline grain for testing result is more accurate when the ultrasonic testing, clamp plate 6 is elevating movement through elevating system on lifter plate 7, and elevating system can be one of linear electric motor, pneumatic cylinder, clamp plate 6 bottom is equipped with detecting probe (not shown in the figure), detecting probe and controller 1 signal connection, detecting probe (not shown in the figure) are used for contacting with the semiconductor crystalline grain to accept the signal of semiconductor crystalline grain feedback, whether qualified for detecting the semiconductor crystalline grain.
In order to further reduce the floor area of the semiconductor crystal grain detection device, a back plate 8 is further arranged, the back plate 8 is vertically and fixedly arranged on the bottom plate 2, the air pump 4 and the controller 1 are fixedly arranged on the back plate 8, the installation area of the air pump 4 and the controller 1 can be effectively reduced by the installation mode, and of course, the installation of the back plate 8, the air pump 4 and the controller 1 cannot influence the action of the pressing plate 6 and the detection of the semiconductor crystal grains, so that the back plate 8 is preferably arranged to be parallel to the lifting plate 7, and the air pump 4 and the controller 1 are arranged on one side far away from the pressing plate 6.
In order to limit the position of the semiconductor crystal grains, the placing plate 5 is further provided with two limiting blocks 54, and the two limiting blocks 54 are fixedly installed on two sides of the elongated air blowing nozzle 53 respectively. The semiconductor crystal grains can be rapidly installed on the placing plate 5 through the arrangement of the limiting block 54, in order to further adapt to rapid installation of the semiconductor crystal grains with different sizes, the limiting block 54 can be further connected with the placing plate 5 in a sliding mode, and the limiting block 54 is fixed after the positions of the limiting blocks 54 are adjusted for the semiconductor crystal grains with different sizes, so that the purpose of rapidly installing the semiconductor crystal grains with different sizes is achieved.
In order to further adapt to the semiconductor crystal grains with different sizes and different types, the ultrasonic transmitter is further fixedly provided with two pushing cylinders 9, the pushing ends of the pushing cylinders 9 are fixedly connected with the placing plate 5, the number of the pushing cylinders 9 is two, the two pushing cylinders 9 are perpendicular to each other, the placing plate 5 close to one side of the pushing cylinders 9 is further fixedly provided with a horizontally arranged sliding rod, the sliding rod is perpendicular to the pushing direction of the pushing cylinders 9, and the sliding rod penetrates through the end parts of the pushing cylinders 9 and is in sliding connection with the pushing cylinders 9. When one of the pushing cylinders 9 pushes the placing plate 5, the placing plate 5 slides with the other pushing cylinder 9 through the sliding rod, and the two pushing cylinders 9 act together to enable the placing plate 5 to move in a plane.
In order to fix the detection device, a workbench 10 is further provided, and a positioning block 101 for limiting the base plate 2 and a fixing member 102 for fixing the base plate 2 are further provided on the workbench 10. The bottom plate 2 can be quickly and fixedly installed on the workbench 10 by arranging the positioning block 101 and the fixing member 102.
The utility model discloses a concrete implementation process as follows: placing a semiconductor crystal grain on a placing plate 5, fixedly installing the semiconductor crystal grain on the placing plate 5 by an air pump 4 through a vacuumizing hole 52, controlling a strip-shaped air blowing nozzle 53 to blow air for a certain time by the air pump 4, then driving a lifting plate 7 to descend by a lifting mechanism to enable a detection probe (not shown in the figure) to contact the semiconductor crystal grain, feeding detected information back into a controller 1 by the detection probe (not shown in the figure), detecting the semiconductor crystal grain by an ultrasonic generator 3 through an ultrasonic emission hole 51 while detecting the semiconductor crystal grain by the detection probe (not shown in the figure), feeding the detected result back into the controller 1, stopping the operation of an ultrasonic emitter after detection is finished, driving the lifting plate 7 to ascend by the lifting mechanism, separating the detection probe (not shown in the figure) from the semiconductor crystal grain, stopping the adsorption of the semiconductor crystal grain by the air pump 4 through the vacuumizing hole 52, and the operator takes down the semiconductor crystal grain to complete one-time detection.
The utility model discloses an adopt ultrasonic detection and test probe (not shown in the figure) to detect ingenious setting in same detection device, avoided adopting different detection means to need carry out the shortcoming of transporting to can effectively reduce detection device's size through the three-dimensional design, improved detection efficiency and detection precision.
The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (7)
1. A semiconductor die inspection apparatus, comprising: controller, bottom plate, supersonic generator, air pump, place the board of placing of crystalline grain, the clamp plate and the lifter plate of pushing down the crystalline grain, air pump, supersonic generator and controller fixed mounting are on the bottom plate, lifter plate perpendicular to bottom plate and with bottom plate fixed connection, place the board and install on supersonic generator, it is equipped with ultrasonic emission hole and evacuation hole on the board to place, and the extraction hole is connected with the air pump pipeline, it still fixedly is equipped with rectangular shape blowing nozzle on the board to place, rectangular shape blowing nozzle and air pump pipe connection, the clamp plate is elevating movement through elevating system on the lifter plate, the clamp plate bottom is equipped with test probe, test probe and controller signal connection.
2. The semiconductor die inspection device of claim 1, further comprising a back plate vertically and fixedly disposed on the bottom plate, wherein the air pump and the controller are fixedly mounted on the back plate.
3. The semiconductor die testing device according to claim 1, wherein a limiting block is further disposed on the placing plate.
4. The semiconductor crystal grain detection device according to claim 3, wherein the number of the limiting blocks is two, and the two limiting blocks are respectively and fixedly installed on two sides of the elongated air blowing nozzle.
5. The semiconductor die testing device according to claim 1, wherein a pushing cylinder is further fixedly mounted on the ultrasonic transmitter, and a pushing end of the pushing cylinder is fixedly connected with the placing plate.
6. The semiconductor die testing device according to claim 5, wherein the number of the pushing cylinders is two, the two pushing cylinders are disposed perpendicular to each other, a horizontally disposed sliding rod is further fixedly mounted on the placing plate near one side of the pushing cylinders, the sliding rod is disposed perpendicular to the pushing direction of the pushing cylinders, and the sliding rod penetrates through the end portions of the pushing cylinders and is slidably connected with the pushing cylinders.
7. The apparatus of claim 1, further comprising a stage, wherein the stage further comprises a positioning block for positioning the base plate and a fixing member for fixing the base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022465165.XU CN213071071U (en) | 2020-10-30 | 2020-10-30 | Semiconductor crystal grain detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022465165.XU CN213071071U (en) | 2020-10-30 | 2020-10-30 | Semiconductor crystal grain detection device |
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| Publication Number | Publication Date |
|---|---|
| CN213071071U true CN213071071U (en) | 2021-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022465165.XU Active CN213071071U (en) | 2020-10-30 | 2020-10-30 | Semiconductor crystal grain detection device |
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| CN (1) | CN213071071U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117388544A (en) * | 2023-12-12 | 2024-01-12 | 扬州奕丞科技有限公司 | Probe station for semiconductor detection |
-
2020
- 2020-10-30 CN CN202022465165.XU patent/CN213071071U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117388544A (en) * | 2023-12-12 | 2024-01-12 | 扬州奕丞科技有限公司 | Probe station for semiconductor detection |
| CN117388544B (en) * | 2023-12-12 | 2024-03-15 | 扬州奕丞科技有限公司 | Probe station for semiconductor detection |
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Effective date of registration: 20220712 Address after: 518000 303, Sichuang science and technology building, No. 021, Gaoxin South 1st Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong Province Patentee after: Shenzhen Xinfu Technology Co.,Ltd. Address before: B203, Shenzhen industry university research base building, Huazhong University of science and technology, No.9, Yuexing Third Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Xintan Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240517 Address after: 518109, 10th Floor, Building 3, Changyi Industrial Plant, No.1 Lirong Road, Xinshi Community, Dalang Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Xintetong (Shenzhen) Semiconductor Co.,Ltd. Country or region after: China Address before: 518000 303, Sichuang science and technology building, No. 021, Gaoxin South 1st Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong Province Patentee before: Shenzhen Xinfu Technology Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right |