CN213029039U - Monitoring display device heat radiation structure - Google Patents

Abstract

The utility model discloses a control display device heat radiation structure, include: the back shroud, set up fin on the back shroud and the conducting strip who is connected with the fin, be provided with the PCBA mainboard on the back shroud, be provided with the chip on the PCBA mainboard, be provided with the through-hole on the back shroud, the one end and the chip contact of conducting strip, the other end of conducting strip turns over upward along the lateral wall of back shroud and turns over and passes the through-hole and be connected with the fin. The utility model discloses a conducting strip contacts with the thermal electronic components that produces to with electronic components's heat transfer to fin department heat dissipation, thereby for monitor display device provides good radiating effect, guarantee monitor display device inside electronic components can not damage because of the heat of scraping together too high, with extension monitor display device's life.

Description

Monitoring display device heat radiation structure

Technical Field

The utility model relates to a surveillance camera technical field especially relates to a monitor display device heat radiation structure.

Background

The monitoring camera is a semiconductor imaging device and has the advantages of high sensitivity, strong light resistance, small distortion, small volume, long service life, vibration resistance and the like. With the increase of people's demand for daily security, the monitoring camera is widely applied to various places. The monitoring display is a component of the monitoring system, is a display part of the monitoring system and is a standard output of the monitoring system. The display user who has had the monitoring display equipment can watch the image that the monitoring camera head transmitted. In order to adapt to different use environments and use conditions, monitoring display devices exist in different types. For places where the number of vehicle-mounted monitoring or monitoring cameras is small, users are more inclined to use portable display devices. Because portable display device is less, and inside electronic components, especially the main control chip of circuit board can produce a large amount of heats at the during operation, because the radiating effect is relatively poor again, causes the damage of components and parts easily, influences the life of equipment.

Accordingly, the prior art is deficient and needs improvement.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the not enough of prior art, provide a monitor display device heat radiation structure.

The technical scheme of the utility model as follows: provided is a monitoring display device heat radiation structure, including: the back shroud, set up in a plurality of fin on the back shroud and with the conducting strip that the fin is connected, be provided with the PCBA mainboard on the back shroud, be provided with the chip on the PCBA mainboard, be provided with the through-hole on the back shroud, the one end and the chip contact of conducting strip, the other end of conducting strip turns over upward along the lateral wall of back shroud and turns over and passes the through-hole and be connected with the fin.

Furthermore, a plurality of heat dissipation ribs are arranged on the heat dissipation fins.

Further, the shell of the rear cover plate is provided with a plurality of cooling fin mounting grooves, and the cooling fins are arranged in the cooling fin mounting grooves.

Furthermore, a connecting sheet is arranged between the two cooling fins in the two adjacent cooling fin mounting grooves.

Furthermore, the heat sink and the heat conducting fin are both made of heat conducting metal sheets.

Furthermore, the material of fin is the aluminum alloy.

Furthermore, the heat conducting strip is made of a copper sheet.

According to the above technical scheme, the utility model discloses a conducting strip contacts with the thermal electronic components of production to the heat transfer with electronic components dispels the heat to fin department, thereby for monitor display device provides good radiating effect, ensures the inside electronic components of monitor display device can not damage because the heat of collecting together is too high, with the life of extension monitor display device.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is an explosion diagram of the present invention.

Fig. 3 is a schematic view of the connection of the heat conductive sheet.

Fig. 4 is a schematic view illustrating the installation of the heat-conducting sheet and the rear cover plate.

Fig. 5 is a schematic view of the installation of the heat sink and the back cover plate.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1 to 3, the present invention provides a monitoring display device heat dissipation structure, including: the heat dissipation structure comprises a rear cover plate 1, a plurality of heat dissipation fins 2 arranged on the rear cover plate 1, and heat conduction fins 3 connected with the heat dissipation fins 2. Be provided with PCBA mainboard 41 on the back shroud 1, be provided with chip 42 on the PCBA mainboard 41. The rear cover plate 1 is provided with a through hole 11. One end of the heat conducting fin 3 is in contact with the chip 42, and the other end of the heat conducting fin 3 is turned upwards along the side wall of the rear cover plate 1, penetrates through the through hole 11 and is connected with the radiating fin 2. Electronic components on the PCBA motherboard 41, particularly the chip 42 on the PCBA motherboard 41, generate a large amount of heat during operation, and contact the chip 41 through one end of the heat-conducting sheet 3, so that the heat generated during operation of the chip 42 is conducted out. The heat conducting fin 3 is in contact with the heat radiating fin 2, so that heat generated by the chip 42 is transferred to the heat radiating fin 2, and the heat is radiated to the outside so as to cool and radiate the inside of the display device. The heat conducting fins 3 are turned upwards along the side wall of the rear cover plate 1, and the turned parts are in contact with the side wall of the rear cover plate 1, so that auxiliary heat dissipation is performed, and heat dissipation is accelerated.

The radiating fins 2 are provided with a plurality of radiating ribs 21. By providing the ribs 21, the contact area of the heat sink 2 with the outside air is increased, thereby accelerating the heat dissipation.

Referring to fig. 4 and 5, the housing of the rear cover plate 1 is provided with a plurality of heat sink installation grooves 12, and the heat sink 2 is disposed in the heat sink installation grooves 12. A connecting piece 22 is arranged between two heat sinks 2 arranged in the two adjacent heat sink mounting grooves 12. Through setting up a plurality of fin 2 to connect adjacent fin 2 through connection piece 22, thereby increase fin 2's the area that sets up for thermal transmission and giving off, reinforcing radiating effect.

The radiating fins 2 and the heat conducting fins 3 are made of heat conducting metal sheets. The heat conducting metal sheet has good heat conducting and radiating effects, and meets the requirements of heat radiation and cooling.

The radiating fins 2 are made of aluminum alloy. For the copper sheet, the heat dispersion of aluminum alloy is stronger, and fin 2 need contact with the external world moreover, can form fine and close oxide film after the aluminum alloy oxidation, nevertheless can not cause the influence to heat conduction, the heat-sinking capability of aluminum alloy, and heat conduction and heat dispersion can significantly reduce after the copper sheet oxidation, therefore better radiating effect can be played to fin 2 of aluminum alloy material.

The heat conducting strip 3 is made of a copper sheet. The heat conductivility of copper sheet is stronger than the aluminum alloy, simultaneously because conducting strip 3 sets up in monitoring display device inboard, is difficult to take place the oxidation, can ensure that conducting strip 3's heat conductivility is more stable.

To sum up, the utility model discloses a conducting strip contacts with the thermal electronic components of production to the heat transfer with electronic components dispels the heat to fin department, thereby for monitor display device provides good radiating effect, ensures that the inside electronic components of monitor display device can not damage because of the heat of collecting together too high, with extension monitor display device's life.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (7)

1. The utility model provides a control display device heat radiation structure which characterized in that includes: the back shroud, set up in a plurality of fin on the back shroud and with the conducting strip that the fin is connected, be provided with the PCBA mainboard on the back shroud, be provided with the chip on the PCBA mainboard, be provided with the through-hole on the back shroud, the one end and the chip contact of conducting strip, the other end of conducting strip turns over upward along the lateral wall of back shroud and turns over and passes the through-hole and be connected with the fin.

2. The cooling structure of monitoring display device according to claim 1, wherein the cooling fins have a plurality of cooling ribs.

3. The monitoring display device heat dissipation structure according to claim 1, wherein the housing of the rear cover plate is provided with a plurality of heat sink mounting grooves, and the heat sink is disposed in the heat sink mounting grooves.

4. The heat dissipation structure of claim 3, wherein a connection piece is disposed between two heat sinks disposed in two adjacent heat sink mounting grooves.

5. The heat dissipation structure of claim 1, wherein the heat sink and the heat conducting plate are made of heat conducting metal plates.

6. The heat dissipation structure of claim 5, wherein the heat sink is made of aluminum alloy.

7. The heat dissipation structure of claim 5, wherein the heat conductive sheet is made of a copper sheet.

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