CN212962966U - Packaging device for manufacturing vacuum cavity vapor chamber - Google Patents

Abstract

The utility model relates to a make packaging hardware of vacuum cavity soaking plate, the object of encapsulation is the semi-manufactured goods soaking plate that has shell, capillary imbibition core structure, bearing structure, and the encapsulation manufacturing process includes semi-manufactured goods soaking plate injection working medium, freezing solidification, vacuum bleed and seal the step etc.. The device of encapsulation includes freezing end subassembly, refrigeration source, refrigerant pipeline, vacuum pump group, vacuum pipeline, sealing end clamping jig etc. can provide the technology that carries out freezing solidification, vacuum bleed and seal under atmospheric pressure environment, has simple structure, and the efficiency of production is high, characteristics such as product yield height are applicable to automation and batch production. The utility model discloses a vapor chamber that technical scheme made is inside can obtain very high vacuum, and the quality of phase transition working medium does not have the loss basically, and the residual of non-condensable gas is few, advantage that production efficiency is high.

Description

Packaging device for manufacturing vacuum cavity vapor chamber

Technical Field

The utility model relates to a soaking plate process technology field, in particular to packaging device for manufacturing vacuum cavity soaking plate.

Background

Miniaturization of electronic devices has become a mainstream trend in the development of modern electronic equipment. The ever decreasing feature sizes of electronic devices (e.g., the feature sizes of microprocessors have decreased from 0.35 m to 0.18m from 1990 to 2000), and the integration level, packaging density, and operating frequency of chips have increased, which have led to a rapid increase in the heat flux density of chips. Studies have shown that over 55% of failure modes of electronic equipment are caused by excessive temperatures, and therefore the design of thermal reliability of electronic devices plays a significant role in the development of electronic devices.

With the improvement of integration and lightness and thinness of electronic products such as mobile phones, tablet computers, OLED televisions, wearable devices, and the like, people expect that products have lighter and thinner shapes, and also expect that the products have higher computing speed and better multimedia performance so as to meet the requirements of high speed, portability, mobile work or mobile entertainment. Under the strong guidance of market demand, electronic devices are continuously developed towards high frequency, high speed and the direction of the density and miniaturization of integrated circuits, so that the power consumption of the electronic devices per unit volume is increased greatly, the heat productivity is increased rapidly, the performance requirements on heat dissipation devices are higher and higher, and the traditional heat dissipation materials such as metal foils, graphite sheets and the like are difficult to meet the requirements.

In the heat dissipation requirements of most electronic components, heat transfer and heat dissipation on a two-dimensional plane are common. A phase change heat transfer element, namely a vapor chamber (vapor chamber), is developed according to the two-dimensional plane heat dissipation. The vapor chamber is one of flat heat pipes, the inside of the vapor chamber is close to vacuum, heat is transmitted by means of phase change circulation of vaporization and condensation of an internal working medium, and heat flow gathered on the surface of a heat source can be rapidly transmitted and diffused to a large-area condensation surface, so that heat dissipation is promoted, heat flow density on the surface of a component is reduced, and reliable work of the component is guaranteed. Due to low thermal resistance, good temperature equalization performance and high critical heat flux density, the vapor chamber is widely applied to heat dissipation of electronic components such as high-power LEDs, CPUs, GPUs, high-speed hard disks and the like at present.

With the rapid expansion of the market of electronic products, the demand on the vapor chamber is increasing, and the market requires that the vapor chamber can realize large-scale production and reduce the application cost of the vapor chamber. Experience in long-term development practice of the vapor chamber shows that the perfusion precision and the degassing condition of the phase change working medium of the vapor chamber are key factors influencing the performance and the stability of the micro heat pipe. The traditional liquid filling and degassing methods applied to the micro heat pipe at present mainly comprise a boiling exhaust method, a vacuum pumping and liquid filling method, a pouring and vacuum pumping method and a secondary degassing method.

The boiling exhaust method is to use a heater and working liquid in a soaking plate to make the working liquid boil and become steam, and drive the non-condensable gas in an inner cavity to be exhausted to the atmosphere through an air pipe. The actual filling rate of the working liquid in the soaking plate after sealing can be controlled by controlling the initial filling amount and the exhaust time of the working liquid. The vacuum degree obtained in the soaking plate manufactured by the method is low, the degassing time is long, and the liquid filling precision is difficult to control.

The vacuumizing and liquid filling method is to use high vacuum equipment to vacuumize the inside of the soaking plate, open a needle valve and close a vacuum valve after reaching the required vacuum degree, and fill the required phase change working medium, for example, the method is disclosed in Chinese patent with application number CN 201210177728.2. And after the pouring process is finished, the sealing device performs cold welding and sealing on the soaking plate. The equipment used by the method is quite complex, the manufacturing cost is very high, and the working liquid is poured under the high vacuum environment, so that the working liquid is instantly frozen, the pipeline is blocked, the pressure of a precision pouring system is increased, and the product quality is unstable.

The vacuum infusion method requires that a certain amount of working fluid is infused into the soaking plate, and then vacuum degassing is performed, which is generally called primary degassing. The vacuum degree obtained by primary degassing is low and is about 100-10 < -1 > Pa. Because the liquid working medium can change the phase along with the improvement of the vacuum degree and generate a large amount of vapor, the non-condensable gas in the soaking plate can not be completely removed, and meanwhile, the liquid working medium can be pumped away by a vacuum system after being vaporized, so that the filling amount of the working medium in the soaking plate is difficult to control.

In order to avoid the excessive temperature difference between the evaporation end and the condensation end of the soaking plate, the non-condensable gas in the soaking plate needs to be further removed, and the method is called a secondary degassing method. First, a vapor chamber is used to evacuate liquid filling equipment for primary degassing, and then boiling exhaust equipment is used to perform secondary degassing, for example, chinese patent No. CN 201220255495.9. The method for producing soaking plates with different specifications and sizes needs to respectively calculate the loss amount of the phase change working medium in secondary degassing and perform corresponding compensation, the process is complex, and meanwhile, the phase change working medium is lost in the vacuumizing process, so that the amount of the phase change working medium filled in the soaking plates is difficult to accurately control.

At present, the liquid filling and degassing process of the vapor chamber has many problems, such as insufficient precision of liquid filling amount of phase change working medium, insufficient internal vacuum degree, residual non-condensable gas, complex process and the like, which causes low yield of finished flat heat pipes, low production efficiency and high cost, and is not beneficial to application and popularization. Therefore, it is of great significance to find a solution to the problem of the liquid-filled degassing process, which is a key process in the vapor chamber manufacturing technology.

Disclosure of Invention

In order to solve the problems in the prior art, the utility model provides a design a packaging hardware of manufacturing vacuum cavity soaking plate, use this method of sealing can produce various thickness, have complicated shape and inner structure's soaking plate, be equally effective at the soaking plate below 0.6mm to the wall thickness. Use the utility model discloses the inside very high vacuum that can obtain of soaking plate that technical scheme made, the quality of phase transition working medium does not have the loss basically, and the residual volume of non-condensable gas is few, and the length that can the limited control seal end is in 0 ~ 2 mm's scope, reduces the required space of soaking plate installation greatly for the soaking plate uses in the mobile terminal of the high PCB integrated level of ultra-thinness to become possible. The technical scheme of the utility model in the device simple structure, the efficient of production, the product yield is high, is applicable to automation and mass production to reduce product cost, be favorable to extensive popularization.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

the utility model provides a make packaging hardware of vacuum cavity soaking plate, the object of encapsulation is the semi-manufactured goods soaking plate that has shell, capillary imbibition core structure, bearing structure, and this semi-manufactured goods reserve the opening before the encapsulation and are used for pouring into working medium and vacuum pumping, its characterized in that: including freezing end subassembly (2), refrigeration source (3), refrigerant pipeline (4), vacuum pump group (5), vacuum pipeline (6), sealing end clamp tool (7), valve (8), wherein:

the freezing end assemblies (2) are positioned at two sides of the semi-finished soaking plate (1), the refrigeration source (3) is connected to the freezing end assemblies (2) through a refrigerant pipeline (4), and sealing end clamping jigs (7) are arranged at two sides of a reserved opening (9) of the semi-finished soaking plate;

the freezing end assembly (2) and the sealing end clamping jig (7) are placed in an atmospheric normal pressure environment, and the vacuum pump unit (5) is connected with a reserved opening of the semi-finished soaking plate (1) through a vacuum pipeline (6);

the refrigeration source (3) is external refrigeration equipment, and a refrigerant is conveyed into the freezing end component (2) through a refrigerant pipeline (4); the freezing end assembly (2) is not contacted with the semi-finished soaking plate (1) and freezes the semi-finished soaking plate in a heat convection and heat radiation mode, or is directly contacted with the semi-finished soaking plate to freeze the semi-finished soaking plate in a heat conduction mode, or is frozen in a mode of filling a heat-conducting medium between the freezing end assembly and the semi-finished soaking plate.

The refrigeration source (3) can be one of a semiconductor electric refrigeration sheet device, a cryogenic device and a cryogenic pump.

The sealing end clamping jig (7) is internally provided with a heating element or is not provided with the heating element.

The thickness of the sealing end clamping jig (7) is less than or equal to 5 mm.

When the freezing end module (2) freezes the soaking plate in direct contact heat conduction mode, the freezing end module is embodied in at least one of the following freezing plane metal plate forms:

a. a freezing metal plate with a refrigerant channel embedded inside; b. the back side is welded with a freezing metal plate of the refrigerant coil pipe; c. a metal plate with a hole channel for the refrigerant coil to pass through; d. two double-layer metal plates with half-hole channels for clamping the refrigerant coil; e. the refrigerant coil is welded on a combined metal plate between two or more independent metal plates; f. the semiconductor electric refrigerating sheet or the metal plate bound with the semiconductor electric refrigerating sheet.

The sealing end clamping jig (7) is connected with hydraulic, pneumatic or electric equipment, and the opening, closing and clamping actions of the sealing end clamping jig are controlled through a movable assembly of the sealing end clamping jig.

The sealing end clamping jig (7) is used as a welding assembly during welding sealing, or the welding assembly is arranged above the sealing end clamping jig (7).

Compared with the prior art, the utility model, following beneficial effect has:

(1) the utility model discloses an earlier to the inside liquid working medium that pours into of soaking board, then freeze into the solid with liquid working medium, the scheme of the working vacuum degree of evacuation to the soaking board settlement again, the vaporization loss of working medium when can furthest reducing the evacuation. Because the boiling point of the liquid is reduced along with the reduction of the air pressure, when the vapor chamber is manufactured, the air pressure in the vapor chamber is required to be ensured to be below 100Pa, the lower the air pressure is, the more easily the liquid working medium is vaporized, the vaporized working medium is taken away by the vacuum-pumping equipment, so that the phase-change working medium filled in the vapor chamber is insufficient, and the heat-conducting property of the vapor chamber is influenced. And the technical scheme of the utility model, after freezing into the solid with liquid working medium, evacuation to the working vacuum degree that the soaking board was set for again, solid working medium evaporation volume when the evacuation is minimum, phase transition working medium that can the filling of accurate control finished product soaking board improves the yields of finished product soaking board, simultaneously, the utility model discloses a technical scheme can not receive soaking board thickness, shape, inner structure's influence.

(2) The technical scheme of the utility model the freezing end subassembly that adopts for the first time is connected to the refrigeration source that can provide the low temperature refrigerant, can be fast with the temperature control of freezing end subassembly at-130 ℃ to-30 ℃, makes the phase transition working medium solidify fast. During vacuum pumping, the low-temperature freezing end can quickly capture residual gas in a vacuum system through the low-temperature condensation effect on the surface of the low-temperature freezing end, so that the vacuum pumping time is greatly shortened, and a clean vacuum environment is obtained. In the prior art, the low-temperature water vapor trapping device is not introduced, so that a certain amount of residual gas exists in the vacuum system when the vacuum system is pumped to a high vacuum environment, more than 80% of the residual gas is water vapor, oil vapor, vapor generated by vaporization of working media and other high-boiling-point vapor, a diffusion pump and a molecular pump are mainly used for obtaining high vacuum degree in the prior art, the capacity of the vacuum pump for pumping the residual gas is low, the pumping time is long, and the non-condensable residual gas is left in the finished soaking plate and can reduce the heat conduction performance of the soaking plate. The utility model discloses a technical scheme in the freezing end subassembly that adopts not only can solidify the phase transition working medium, prevent the vaporization loss, can also improve evacuation efficiency, reduce the inside noncondensable gas of soaking plate, have apparent technological progress.

(3) In the prior art, the pipeline for pumping and filling the phase-change working medium generally has the following two forms: the heat-insulating pipe comprises a copper pipe connected to a soaking plate, grooves pre-pressed on an upper shell plate and a lower shell plate, and a pipeline formed by two opposite grooves when the upper shell plate and the lower shell plate are welded. Under the conditions of high vacuum (0.13-1.3 multiplied by 10 < -6 > Pa) and extremely high vacuum (1.3 multiplied by 10 < -6 > to 1.3 multiplied by 10 < -11 > Pa), the gas presents the characteristic of molecular flow, the collision between gas molecules and the pipe wall occupies the main position at the moment, the molecules freely and linearly move by heat and only collide with the pipe wall and reflect heat to fly through the pipe, the gas flow is formed by overlapping the independent movement of each molecule, the smaller the pipe diameter of the pumping pipeline, the more frequent the collision between the gas molecules and the pipe wall and the longer the time for pumping the high vacuum. The vapor chamber for electronic devices is under a few millimeters thick, and therefore the diameters of the two pumping ducts are small, resulting in long pumping times in the prior art. The utility model discloses a technical scheme in, after freezing the solidification phase change working medium into the solid, bleed to the high vacuum again, because loss when the working medium becomes the evacuation after the solid is minimum again, consequently can open the mouth of bleeding and packing the phase change working medium of reservation very big, the size of the pipeline (circular or square flat pipe) of perhaps connecting is very big to this reduces the time of evacuation, improves production efficiency. In some embodiments, the semi-finished soaking plate does not adopt the two pipeline forms, when the upper shell plate and the lower shell plate are packaged, one of the four edges of the semi-finished product is reserved and is not closed, and the opening part of the semi-finished product is used as a channel for pumping air and filling a phase-change working medium, so that the speed and the efficiency of vacuumizing can be improved to the maximum extent.

(4) The soaking plate packaging device disclosed in the prior art is a boiling exhaust device, a liquid filling device after vacuumizing, a pouring vacuumizing device and a device for secondary degassing after pouring vacuumizing, wherein the boiling exhaust device and the device for secondary degassing after pouring vacuumizing are both required to be placed in a heating device after being filled with a phase change working medium, and the soaking plate packaging device is used for removing non-condensable gas in the soaking plate. The utility model discloses a make packaging hardware of vacuum cavity soaking plate that discloses among the technical scheme, creatively introduces semiconductor electric refrigeration piece device, cryrogenic equipment, cryogenic pump the manufacturing field of soaking plate, has changed current soaking plate packaging hardware's form, and these several kinds of refrigeration plant have refrigeration fast, and the fast characteristics of temperature return after the refrigeration have greatly improved production efficiency.

Drawings

Fig. 1 is a schematic view of an encapsulating apparatus for manufacturing a vapor chamber according to an embodiment of the present invention;

FIG. 2 is a schematic view of a planar freezing metal plate that forms part of a freezing end assembly according to an embodiment of the present invention;

FIG. 3 is a schematic view of a planar freezing metal plate that forms part of a freezing end assembly according to an embodiment of the present invention;

FIG. 4 is a schematic view of a frozen flat metal plate comprising a freezing end assembly according to an embodiment of the present invention;

FIG. 5 is a schematic view of a planar freezing plate that forms part of a freezing end assembly according to an embodiment of the present invention;

FIG. 6 is a schematic view of a frozen flat metal plate comprising a freezing end assembly according to an embodiment of the present invention;

FIG. 7 is a schematic view of a planar freezing plate that forms part of a freezing end assembly according to an embodiment of the present invention;

figure 8 is a schematic view of a frozen flat metal plate comprising a freezing end assembly in accordance with an embodiment of the present invention;

FIG. 9 is a schematic view of the sealing end clamping fixture itself as a welding assembly according to an embodiment of the present invention;

fig. 10 is a schematic view illustrating a welding assembly disposed above the sealing end clamping jig according to an embodiment of the present invention.

Detailed Description

The present invention will be further described with reference to the following embodiments.

As shown in fig. 1, the present invention discloses a packaging device for manufacturing a vapor chamber, wherein the freezing or vacuum pumping process of the phase change working medium inside the vapor chamber is performed in the atmospheric environment. The semi-finished soaking plate sealing device comprises a freezing end assembly (2), a refrigeration source (3), a refrigerant pipeline (4), a vacuum pump set (5), a vacuum pipeline (6), a sealing end clamping jig (7) and a valve (8), wherein the freezing end assembly (2) is located on two sides of the semi-finished soaking plate (1), the refrigeration source (3) is connected to the freezing end assembly (2) through the refrigerant pipeline (4), and the sealing end clamping jig (7) is arranged on two sides of a reserved opening (9) of the semi-finished soaking plate.

The freezing end assembly (2) and the sealing end clamping jig (7) are both positioned in the atmospheric normal-pressure environment, the semi-finished soaking plate is connected with the vacuum pipeline (6) through the reserved opening (9), and a vacuum pump set can be used for vacuumizing the semi-finished soaking plate.

In actual operation, the freezing end assembly (2) needs to be insulated to prevent frosting. The freezing end assembly (2) is composed of freezing plane metal plates positioned at two sides of the semi-finished soaking plate (1), and can be embodied in at least one of the following seven forms:

a. a freezing metal plate with a refrigerant channel embedded inside, as shown in fig. 2;

b. the back side is welded with a freezing metal plate of the refrigerant coil pipe, as shown in figure 3;

c. a metal plate with a hole channel for passing the refrigerant coil pipe through, as shown in fig. 4;

d. two double-layer metal plates with half-hole channels for clamping the refrigerant coil are shown in fig. 5;

e. the refrigerant coil is welded on a combined metal plate between two or more independent metal plates, as shown in fig. 6;

f. semiconductor electric refrigerating sheet, as shown in FIG. 7

g. A metal plate bound with a semiconductor electric cooling plate, as shown in fig. 8.

Above-mentioned plane metal sheet and soaking plate contact surface are according to the different design decisions of soaking plate, if the internal surface of two shells of soaking plate all designs to be connected with the imbibition sandwich layer, then clamp the soaking plate with two freezing metal sheets and realize close contact and then realize freezing, if the soaking plate only the internal surface design of one of them shell is connected with the imbibition sandwich layer, then set up a freezing metal sheet and this soaking plate plane close contact and then realize freezing.

The sealing end clamping jig (7) itself is used as a welding assembly (as shown in fig. 9) for welding the sealing, or the welding assembly is disposed above the sealing end clamping jig (7) (as shown in fig. 10). When the vacuum air exhaust step of the semi-finished soaking plate reaches the end air pressure value, the sealing end clamping jig (7) can be controlled to clamp the reserved opening of the semi-finished soaking plate, then welding and sealing treatment are carried out on the reserved opening, welding actions can be completed by the sealing end clamping jig (7) serving as a welding assembly, and welding actions can also be completed by the welding assembly arranged above the sealing end clamping jig (7).

Claims (8)

1. The utility model provides a make packaging hardware of vacuum cavity soaking plate, the object of encapsulation is the semi-manufactured goods soaking plate that has shell, capillary imbibition core structure, bearing structure, and this semi-manufactured goods reserve the opening before the encapsulation and are used for pouring into working medium and vacuum pumping, its characterized in that: including freezing end subassembly (2), refrigeration source (3), refrigerant pipeline (4), vacuum pump group (5), vacuum pipeline (6), sealing end clamp tool (7), valve (8), wherein:

the freezing end assemblies (2) are positioned at two sides of the semi-finished soaking plate (1), the refrigeration source (3) is connected to the freezing end assemblies (2) through a refrigerant pipeline (4), and sealing end clamping jigs (7) are arranged at two sides of a reserved opening (9) of the semi-finished soaking plate;

the freezing end assembly (2) and the sealing end clamping jig (7) are arranged in the atmosphere normal pressure environment, and the vacuum pump set (5) is connected with the reserved opening of the semi-finished soaking plate (1) through the vacuum pipeline (6).

2. The packaging device for manufacturing the vapor chamber of claim 1, wherein the refrigeration source (3) is an external refrigeration device, and the refrigerant is conveyed into the freezing end component (2) through a refrigerant pipeline (4); the freezing end assembly (2) is not contacted with the semi-finished soaking plate (1) and freezes the semi-finished soaking plate in a heat convection and heat radiation mode, or is directly contacted with the semi-finished soaking plate to freeze the semi-finished soaking plate in a heat conduction mode, or is frozen in a mode of filling a heat-conducting medium between the freezing end assembly and the semi-finished soaking plate.

3. A packaging apparatus for manufacturing a vapor chamber according to claim 1, wherein the cooling source (3) is one of a semiconductor electric cooling fin device, a cryogenic equipment, and a cryopump.

4. The packaging device for manufacturing a vapor chamber according to claim 1, wherein the heating element is disposed inside the closed end clamping jig (7) or is not disposed therein.

5. The packaging device for manufacturing the vapor chamber of claim 1, wherein the thickness of the sealing end clamping jig (7) is less than or equal to 5 mm.

6. A package for a vapor chamber in accordance with claim 1, wherein the freezing end module (2) is in the form of at least one of the following frozen flat metal plates when freezing the vapor chamber by direct contact heat conduction:

(1) a freezing metal plate with a refrigerant channel embedded inside; (2) the back side is welded with a freezing metal plate of the refrigerant coil pipe; (3) a metal plate with a hole channel for the refrigerant coil to pass through; (4) two double-layer metal plates with half-hole channels for clamping the refrigerant coil; (5) the refrigerant coil is welded on a combined metal plate between two or more independent metal plates; (6) the semiconductor electric refrigerating sheet or the metal plate bound with the semiconductor electric refrigerating sheet.

7. The packaging device for manufacturing the vapor chamber of claim 1, wherein the sealing end clamping jig (7) is connected to a hydraulic, pneumatic or electric device, and the opening and closing and clamping actions of the sealing end clamping jig are controlled by a movable assembly thereof.

8. The packaging device for manufacturing a vapor chamber according to claim 1, wherein the sealing end clamping jig (7) is used as a welding assembly for welding the sealing, or the welding assembly is arranged above the sealing end clamping jig (7).

Images