CN212718345U - Sensor assembly and valve device - Google Patents

Abstract

A sensor assembly comprises a pressure sensing unit, a circuit board unit and a temperature sensing unit, wherein an inner cavity and a channel are formed in a shell; the pressure sensing unit comprises a sensing substrate, the sensing substrate is accommodated in the inner cavity and comprises a first surface and a second surface, the first surface and the second surface are positioned on different sides of the sensing substrate in the thickness direction, the channel is positioned on the side of the first surface of the sensing substrate, and the circuit board unit is positioned on the side of the second surface of the sensing substrate; the temperature sensing unit comprises a temperature sensing part and a temperature conducting part, and the temperature sensing part is arranged on the side of the second surface. Compared with the prior art, the temperature sensing part and the circuit board unit are arranged on the same side of the sensing substrate, so that the height of the sensor assembly can be reduced, and the miniaturization of the sensor assembly is facilitated. The present application further discloses a valve apparatus including the sensor assembly.

Description

Sensor assembly and valve device

Technical Field

The application relates to a sensor assembly and a valve device, and belongs to the technical field of measurement and flow limitation.

Background

A temperature and pressure sensor assembly in the related art may be mounted on a member having a fluid flow passage, the temperature and pressure sensor assembly including a housing, a circuit board assembly, a temperature sensor, and a pressure sensor. The shell is provided with an inner cavity and a channel communicated with the inner cavity, the channel is used for flowing in fluid, the pressure sensor can sense the pressure of the fluid, and the temperature sensor can sense the temperature of the fluid. The pressure sensor comprises a pressure sensing substrate, the circuit board assembly is arranged on the upper side of the pressure sensing substrate, the temperature sensor comprises a temperature sensing part and a pin, and the pin is electrically connected with the circuit board assembly. The temperature sensing part is exposed at the lower side of the pressure sensing substrate, the temperature sensing part is directly contacted with the fluid to be corroded by the fluid, and if the temperature sensing part is sealed, the height of the sensor can be increased, so that the temperature sensing part is not beneficial to the miniaturization design of the temperature and pressure sensor assembly.

SUMMERY OF THE UTILITY MODEL

An object of the present application is to provide a miniaturized sensor assembly.

In order to achieve the purpose, the following technical scheme is adopted in the application: a sensor assembly comprises a shell, a pressure sensing unit, a circuit board unit and a temperature sensing unit, wherein the shell is provided with an inner cavity and a channel; the pressure sensing unit comprises a sensing substrate, the sensing substrate is accommodated in the inner cavity of the shell and is electrically connected with the circuit board unit, the sensing substrate comprises a first surface and a second surface, and the first surface and the second surface are positioned on different sides of the sensing substrate in the thickness direction; the sensor assembly is provided with a first cavity and a second cavity, the first cavity is located on the side where the first surface of the induction substrate is located, the second cavity is located on the side where the second surface of the induction substrate is located, the channel is communicated with the first cavity, the first cavity is not communicated with the second cavity, the channel is located on the side where the first surface of the induction substrate is located, and the circuit board unit is located on the side where the second surface of the induction substrate is located; the temperature sensing unit comprises a temperature sensing part and a temperature conducting part, the temperature sensing part is arranged on the side of the second surface, the temperature sensing part is electrically connected with the circuit board unit, the temperature conducting part comprises a first end surface and a second end surface, the first end surface is located on the side of the first surface of the sensing substrate, the second end surface is located on the side of the second surface of the sensing substrate, and the second end surface is in contact with or close to the temperature sensing part.

Compared with the prior art, the temperature sensing part and the circuit board unit are arranged on the same side of the sensing substrate, the channel of the shell is arranged on the other side of the sensing substrate, and the temperature of fluid in the channel is conducted to the temperature sensing part through the temperature conducting part, so that the height of the sensor assembly can be reduced, and the miniaturization of the sensor assembly is facilitated.

Another object of the present application is to provide a miniaturized valve device.

In order to achieve the purpose, the following technical scheme is adopted in the application: a valve device comprises the sensor assembly, and further comprises a valve body portion, wherein the sensor assembly is fixedly installed on the valve body portion, the valve body portion comprises a flow channel, a channel of the sensor assembly is communicated with the flow channel, a pressure sensing unit is used for detecting the pressure of fluid in the flow channel, and a temperature sensing unit is used for detecting the temperature of the fluid in the flow channel.

Compared with the prior art, the temperature sensing part and the circuit board unit are arranged on the same side of the sensing substrate, the channel of the shell is arranged on the other side of the sensing substrate, and the temperature of fluid in the channel is conducted to the temperature sensing part through the temperature conducting part, so that the height of the sensor assembly can be reduced, the miniaturization of the sensor assembly is facilitated, and the miniaturization of the valve device is further facilitated.

Drawings

FIG. 1 is a perspective view of a sensor assembly of the present application in one embodiment.

Fig. 2 is a perspective view of the sensor assembly of fig. 1 from another angle.

Fig. 3 is an exploded schematic view of the sensor assembly shown in fig. 1.

Fig. 4 is another exploded view of the sensor assembly of fig. 3.

Fig. 5 is a further exploded schematic view of the sensor assembly shown in fig. 3.

Fig. 6 is another exploded view of the sensor assembly of fig. 5.

Fig. 7 is a schematic cross-sectional view of the sensor assembly shown in fig. 1.

Fig. 8 is a perspective cut-away schematic view of the sensor assembly shown in fig. 1.

FIG. 9 is a schematic cross-sectional view of a sensor assembly of the present application in another embodiment.

FIG. 10 is a perspective view of an inductive substrate of the present application in one embodiment.

FIG. 11 is an exploded schematic view of a sensor assembly of the present application in yet another embodiment.

Fig. 12 is an exploded view of another perspective of the sensor assembly shown in fig. 11.

Fig. 13 is a perspective view of the temperature guiding portion and the seat holder shown in fig. 11.

Fig. 14 is a perspective cut-away schematic view of the sensor assembly shown in fig. 11.

FIG. 15 is a schematic perspective view of a valve assembly of the present application in one embodiment.

Fig. 16 is a schematic perspective view from another perspective of the valve assembly of fig. 15.

Fig. 17 is an exploded schematic view of the valve assembly of fig. 15.

FIG. 18 is a schematic perspective cut-away view of a valve assembly of the present application in one embodiment.

FIG. 19 is a schematic perspective cut-away view of a valve assembly of the present application in another embodiment.

Detailed Description

Exemplary embodiments of the present application will be described in detail below with reference to the accompanying drawings. If several embodiments exist, the features of these embodiments may be combined with each other without conflict. When the description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The statements made in the following exemplary detailed description do not represent all implementations consistent with the present application; rather, they are merely examples of apparatus, products, and/or methods consistent with certain aspects of the present application, as recited in the claims of the present application.

The terminology used in the present application is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present application. As used in the specification and claims of this application, the singular form of "a", "an", or "the" is intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the terms "first," "second," and the like, as used in the description and claims of this application, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. Unless otherwise indicated, the terms "front," "back," "left," "right," "up," "down," and the like in this application are used for convenience of description and are not limited to a particular position or spatial orientation. The word "comprise" or "comprises", and the like, is an open-ended expression meaning that an element that precedes "includes" or "comprising" includes "that the element that follows" includes "or" comprises "and its equivalents, that do not preclude the element that precedes" includes "or" comprising "from also including other elements. In this application, the meaning of "a number" if it occurs is two as well as more than two.

As shown in fig. 1 to 8, the sensor assembly 100 includes a housing 1, a pressure sensing unit 2, a circuit board unit 3, a temperature sensing unit 4, and a sealing member 5.

As shown in fig. 7 and 8, the housing 1 is provided with an inner cavity 11 and a passage 12. The pressure sensing unit 2 is accommodated in the inner cavity 11, the pressure sensing unit 2 includes a sensing substrate 21, and the sensing substrate 21 is electrically connected to the circuit board unit 3. The sensing substrate 21 is horizontally disposed in the inner cavity 11, and the sensing substrate 21 includes a first surface 211 and a second surface 212, wherein the first surface 211 and the second surface 212 are located on different sides of the sensing substrate 2 in the thickness direction. The channel 12 is located on the side of the first surface 211 of the sensing substrate 21, and the circuit board unit 3 is located on the side of the second surface 212 of the sensing substrate 2.

The temperature sensing unit 4 includes a temperature sensing part 41 and a temperature guiding part 42, the temperature sensing part 41 is disposed on the second surface 212, and the temperature sensing part 41 is electrically connected to the circuit board unit 3. The temperature sensing part 42 includes a first end surface 421 and a second end surface 422, the first end surface 421 is located on the first surface 211 of the sensing substrate 21, the second end surface 422 is located on the second surface 212 of the sensing substrate 21, and the second end surface 422 is in contact with or adjacent to the temperature sensing part 41. The first end surface 421 is located on the side of the first surface 211 of the sensing substrate 2, and the second end surface 422 is located on the side of the second surface 212 of the sensing substrate 2, referring to fig. 7, the first end surface and the second end surface refer to two different sides of the sensing substrate 21 in the vertical direction of the cross section C-C in the middle of the thickness of the sensing substrate. That is, the second end 422 is flush with the second surface 212 of the sensing substrate 2, or the second end 212 is slightly lower than the second surface 212 of the sensing substrate 21, or the second end 212 is slightly higher than the second surface 212 of the sensing substrate 21. The first end surface 421 is flush with the first surface 211 of the sensing substrate 2, or the first end surface 421 is slightly lower than the first surface 211 of the sensing substrate 21, or the first end surface 421 is slightly higher than the first surface 211 of the sensing substrate 21. In the illustrated embodiment, the second end surface 422 is flush with the second surface 212 of the sensing substrate 2, and the first end surface 421 is lower than the first surface 211 of the sensing substrate 21, so as to facilitate the fluid (refrigerant) flowing from the channel 12, whose temperature is rapidly contacted from the first end surface 421 and is conducted to the second end surface 422 by a short distance.

The temperature guiding portion 42 includes an intermediate portion 423, the intermediate portion 423 is connected between the first end surface 421 and the second end surface 422, the sensing substrate 21 includes a duct 213 extending in a thickness direction of the sensing substrate 21, and the intermediate portion 423 is accommodated in the duct 213.

The housing 1 comprises a housing bottom wall 13, housing side walls 161, 171 and a housing top wall 15, said channel 12 being at least partially arranged in the housing bottom wall 13. The top of the seal 5 is in contact with the sensing substrate 21 and the bottom of the seal 5 is in contact with the housing bottom wall 13. In the illustrated embodiment, the seal 5 is a rubber ring. In alternative embodiments, the sealing element may be a sealing structure such as a graphite gasket. The sensor assembly 100 is provided with a first cavity 163 and a second cavity 173, the first cavity 163 is located on the side of the first surface 211 of the sensing substrate 21, the second cavity 173 is located on the side of the second surface 212 of the sensing substrate 21, the channel 12 is communicated with the first cavity 163, and the first cavity 163 and the second cavity 173 are sealed by the sealing member 5 without being communicated. The first cavity 163 is located between the housing bottom wall 13, the first surface 211 of the sensing substrate 21 and the seal 5, and the second cavity 173 is located between the housing top wall 15, the second surface 212 of the sensing substrate 21 and the second housing sidewall 171. The first end surface 421 of the temperature conducting part 42 is located in the first cavity 163, or the first end surface 421 of the temperature conducting part 42 is located in the channel 12. That is, the bottom end of the temperature guiding portion 42 extends from the first surface 421 of the sensing substrate 21 into the first cavity 163, or further extends into the channel 12. In the illustrated embodiment, the first end surface 421 is located in the first cavity 163, and the temperature conduction loss is less due to the shorter length of the temperature conduction portion 42 than the temperature conduction loss due to the extension into the channel 12. When the first end 421 is located in the channel 12, it is closer to the external fluid channel than the first cavity 163, the temperature sensing is more timely, and the temperature error is relatively small.

The housing 1 comprises a first housing 16 and a second housing 17, the first housing 16 being provided with said housing bottom wall 13 and the second housing 17 being provided with said housing top wall 15. The shell side wall 14 includes a first shell side wall 161 and a second shell side wall 171, the first shell side wall 161 is disposed on the first shell 16, the second shell side wall 171 is disposed on the second shell 17, and the first shell side wall 161 is fixedly connected to the second shell side wall 171. The first housing 16 is a metal member and the second housing 17 is a plastic member. The first housing 16 may be formed of an aluminum material and the second housing 17 may be formed of plastic pellet injection molding. As shown in fig. 7, the top of the first housing 16 is provided with a fastening portion 165 that is bent from the first housing side wall 161 to the second housing side wall 171, and the fastening portion 165 is formed by bending and fastened to the second housing 17 to fix the second housing 17. The first housing 16 is provided with a first inner cavity 162 opened upward, the second housing 17 is provided with a second inner cavity 172 opened downward, and the inner cavity 11 is formed by combining the first inner cavity 162 and the second inner cavity 172. The temperature sensing portions 41 of the circuit board unit 3 and the temperature sensing unit 4 are accommodated in the second cavity 172, and the temperature sensing portions 42 of the pressure sensing unit 2 and the temperature sensing unit 4 are accommodated in the first cavity 162. As shown in fig. 1-8, the first outer shell 16 includes a sleeve portion 164 extending downwardly from the shell bottom wall 161, the channel 12 extending through the shell bottom wall 13 and the sleeve portion 164, the sleeve portion 164 being configured to facilitate the flow of refrigerant fluid into and out of the external flow path. In another embodiment, as shown in fig. 9, the sleeve portion 164 may not be provided on the first housing 16, and the channel 12 is directly provided on the housing bottom wall 161, so that the height of the sensor assembly 100 can be further reduced, thereby facilitating the miniaturization of the sensor assembly 100.

As shown in fig. 7, the first housing 16 includes a first step portion 18 and a second step portion 19, a bottom of the first step portion 18 is connected to the housing bottom wall 13, a top of the first step portion 19 is connected to a bottom of the second step portion 18, the first surface 211 of the sensing substrate 21 is supported on a top surface of the first step portion 18, an outer edge of the sealing member 5 is in contact with or close to an inner side surface of the first step portion 19, an outer edge of the sensing substrate 21 is in contact with or close to an inner side surface of the second step portion 19, and the second housing sidewall 171 is at least partially supported on the top surface of the second step portion 19. The radial thickness of the first step 18 in the first casing 16 is greater than the radial thickness of the second step 19 in the first casing 16.

In the illustrated embodiment, the circuit board unit 3 is a flexible circuit board assembly including a flexible circuit board 31 and a number of electronic components 32 mounted on the flexible circuit board 31 in a patch manner. The flexible circuit board 31 includes a first platform portion 311, a second platform portion 312, and a connection portion 313, the first platform portion 311 and the second platform portion 312 are arranged in parallel and horizontally, the connection portion 313 is curved, a bottom portion of the connection portion 313 is connected to the first platform portion 311, and a top portion of the connection portion 313 is connected to the second platform portion 312. Each of the first and second stages 311 and 312 may have a disk shape, and the connection portion 313 may extend in a serpentine shape. The conditioning chip 33 is mounted on the top surface of the first platform portion 311, and the electronic component 32 such as a capacitor or a resistor is mounted on the bottom surface of the second platform portion 312. The top surface of the first platform portion 311 and the bottom surface of the second platform portion are located on the same side surface of the flexible circuit board 31.

In the illustrated embodiment, the pressure sensing unit 2 is a ceramic pressure sensor. As shown in fig. 10, the sensing substrate 21 includes a ceramic diaphragm 214 at a lower end and a ceramic plate 215 above the ceramic diaphragm 214, the thickness of the ceramic diaphragm 214 is smaller than that of the ceramic plate 215, and the ceramic diaphragm 214 and the ceramic plate 215 form a ceramic capacitor. The ceramic diaphragm 214 has a sensing region 216, and the sensing region 216 may be aligned with a plane of the rest of the ceramic diaphragm 214 (see fig. 10) or recessed relative to the rest (see fig. 1-9). The sensing region 216 is electrically connected to three cover wires (not shown), which are embedded in the ceramic membrane 214. The pressure sensing unit 2 further has a conductive pillar 217 electrically connected to the three covered wires, respectively, one end of the conductive pillar 217 is physically connected to the covered wires, and the other end of the conductive pillar 217 is exposed out of the sensing substrate 21. The ceramic pressure sensor is based on the piezoresistive effect, pressure is directly applied to the lower surface of the ceramic diaphragm 214 to cause the diaphragm to generate micro deformation, the thick film resistor is printed on the back surface of the ceramic diaphragm to be connected into a Wheatstone bridge, the bridge generates a voltage signal which is in direct proportion to the pressure, is highly linear and is also in direct proportion to excitation voltage due to the piezoresistive effect of the piezoresistor, the conductive column 217 transmits the voltage signal to the circuit board unit 3, and the conditioning chip 33 on the circuit board unit 3 performs corresponding voltage and pressure conversion, so that the pressure of refrigerant fluid flowing into the first cavity 163 from the channel 12 is obtained.

The sensor assembly 100 further includes a conductive terminal 6, and the conductive terminal 6 may be integrally formed with the second housing 17 by an insert molding process, or the conductive terminal 6 is mounted to the second housing 17 by an assembling method. The sealing performance of the conductive terminal 6 and the second housing 17 is better, and the cost of the method of assembling and fixing the conductive terminal 6 and the second housing 17 is lower. As shown in fig. 5 and 6, the conductive terminal 6 includes a terrace portion 61 and a pin portion 62, the terrace portion 61 is exposed to the outer surface of the second housing 17 for contacting with the outside; the pin portion 62 is partially embedded or housed in the second housing 17, and partially physically and electrically connected to the circuit board assembly 3. The stitch portion 62 is provided with protruding barbs 621, the barbs 621 enhancing the secure connection of the stitch portion 62 to the second housing 17. Of course, the conductive terminals 6 are not limited to the structure shown in the illustrated embodiment, and may be in the shape of springs, one end of which is supported and electrically connected to the circuit board unit 3, and the other end of which is used for supporting and electrically connecting to an external device outside the sensor assembly 100.

The temperature sensing unit 4 is a thermistor temperature sensor, wherein the temperature sensing unit 41 is a temperature sensing probe, and in the illustrated embodiment, the temperature sensing unit 41 is a Surface Mount Technology (SMT) and is surface mounted on the circuit board unit 3. Of course, the temperature sensing probe may be a stitch-type temperature sensing probe in which a stitch-through hole (pin) is mounted on the circuit board unit 3 and the temperature sensing probe is in contact with the temperature guide portion. The surface mount type temperature sensing unit 41 is advantageous for the miniaturization design of the sensor module 100.

As shown in fig. 11-14, another embodiment of a sensor assembly 100. The difference from the embodiment of fig. 1 to 10 is mainly that the sensor assembly 100 further comprises a seat 7 carrying the thermal conductor 42. The seat holder 7 includes a base 71, an extension 72, and a cylindrical portion 73, the extension 72 extending upward from the base 71, and the cylindrical portion 73 extending downward from the base 71. Base portion 71 is interposed between inductive substrate 21 and case bottom wall 13. The extension portion 72 surrounds the periphery of the induction base plate 21, the base portion 71 has a through hole 711, and the through hole 711 communicates with the passage 12. The extension portion 72 defines a third cavity 74 in the middle, and the sensing substrate 21 is accommodated in the third cavity 74. The through hole 711 penetrates the base body portion 71 and the cylindrical body portion 73, and one end of the through hole 711 communicates with the first cavity 163 and the other end communicates with the passage 12. The first cavity 163 is located between the base portion 71, the second seal 52, and the first surface 211 of the sensing substrate 21. The second cavity 173 is located between the second surface 212 of the sensing substrate 21, the case top wall 15, and the second case side wall 171.

The temperature guiding portion 42 includes a first end portion 424, an intermediate portion 423, and a second end portion 425, and the intermediate portion 423 is connected between the first end portion 424 and the second end portion 425. The first end portion 424 is exposed to the seat 7, and the second end portion 425 is exposed to the seat 7. The first end surface 421 is located at the first end portion 424, the second end surface 422 is located at the second end portion 425, the first end portion 424 is located in the through hole 711 and/or the channel 12, and the second end portion 425 is in contact with or close to the temperature sensing portion 41. That is, the first end 424 may extend from the seat support 7 into the through hole 711 or further into the channel 12. The first end 424 may extend from the seat support 7 into the passage 12 only, or into both the through hole 711 and the passage 12. In the illustrated embodiment, the first end portion 424 extends from the seat holder 7 into the through hole 711, and the length of the temperature guiding portion 42 is reduced, so that the temperature loss of the refrigerant fluid flowing into the through hole from the passage 12 is small at the temperature guiding portion 42.

The intermediate portion 423 includes a first intermediate portion 426 and a second intermediate portion 427, the first intermediate portion 426 is embedded in the base portion 71, and the second intermediate portion 427 is embedded in the extending portion 72. The first end portion 424 extends in the same direction as the first intermediate portion 426, and the second end portion 425 extends in a direction perpendicular to the second intermediate portion 427. The first end portion 424 and the second end portion 425 are disposed parallel to each other. The first intermediate portion 426 is provided with a passage 428 along the thickness direction of the first intermediate portion 426, and the seat 7 has a portion filled in the passage 428. The temperature conducting part 42 is a metal part, the seat support 7 is a plastic part, and the seat support 7 is injection-molded on the temperature conducting part 42 in an injection molding manner, that is, the temperature conducting part 42 and the seat support 7 are integrally molded in an insert molding manner. The provision of the aperture 428 facilitates the retention of the seat support 7 to the thermally conductive section 42 during the injection molding process.

The housing 1 comprises a first housing 16 and a second housing 17, the first housing 16 being provided with a housing bottom wall 13 and the second housing 17 being provided with said housing top wall 15. The shell side wall 14 includes a first shell side wall 161 and a second shell side wall 171, the first shell side wall 161 is disposed on the first shell 16, the second shell side wall 171 is disposed on the second shell 17, and the first shell side wall 161 is fixedly connected to the second shell side wall 171.

The housing 1 includes a step part 189, the bottom of the step part 189 is connected to the housing bottom wall 13, the bottom surface of the seat holder 7 is supported on the housing bottom wall 13, and the outer edge of the seat holder 7 is in contact with or close to the inner side surface of the step part 189. The second case side wall 171 is partially supported on the top surface of the step 189, and the second case side wall 161 is partially supported on the top surface of the seat 17.

The bottom wall 13 of the housing is provided with a first groove 131, the seat 7 is provided with a second groove 74, the sensor assembly 100 comprises a first sealing element 51 and a second sealing element 52, the first sealing element 51 is at least partially accommodated in the first groove 131, and the second sealing element 52 is at least partially accommodated in the second groove 74. In the illustrated embodiment, the first seal 51 and the second seal 52 are rubber rings. In alternative embodiments, the first sealing element 51 and the second sealing element 52 may be sealing structures such as graphite gaskets. The bottom of the first seal member 51 is in contact with the case bottom wall 13, and the top of the first seal member 51 is in contact with the bottom of the base portion 71. The bottom of the second seal 52 is in contact with the top of the base portion 71 and the top of the second seal 52 is in contact with the first surface 211 of the sensing substrate 21. The second housing 17, the pressure sensor unit 2, the circuit board unit 3, and the conductive terminals 6 of the embodiment of fig. 11 to 14 are substantially the same as those of the embodiment of fig. 1 to 10, and are not described here.

The embodiment of fig. 1-10 eliminates the seat holder 7, thus reducing the number of seals that seal the seat holder 7, reducing the number of seal points and the risk of seal leakage, and because of the reduced seat holder 7, the height of the sensor assembly 100 can be smaller, thus facilitating miniaturization of the sensor assembly 100. In the embodiment of fig. 11 to 14, the temperature conducting part 42 does not need to penetrate through the sensing substrate 21 due to the load of the seat support 7, so that the difficulty of penetrating and mounting the temperature conducting part 42 to the ceramic sensing substrate 21 is reduced. In the above illustrated embodiment, the temperature sensing parts 41 are all disposed above the sensing substrate 41, so that the risk of corrosion of the temperature sensing parts 41 by the refrigerant is reduced, and the temperature sensing parts 41 do not need to extend downward beyond the housing 1, and no additional component is needed to seal and protect the temperature sensing parts 41, so that the height of the sensor component can be reduced, thereby facilitating the miniaturization design of the sensor component 100.

Referring to fig. 15 and 16, the sensor assembly 100 may be mounted on a fluid component 200 of a fluid flow channel 201, and the fluid component 200 may be an electronic expansion valve, which is used for controlling the flow of refrigerant in an air conditioning system of an automobile to throttle the refrigerant. The sensor assembly 100 acts as a temperature and pressure sensor and may be used to detect the pressure and temperature of the refrigerant passing through the fluid component 200. Of course, the fluid control portion 200 may also be a four-way valve, a heat exchanger, a fluid pipeline thermal management system component, etc., and may implement the measurement of the pressure and temperature of the refrigerant in the thermal management system component.

As shown in fig. 15 to 17, the illustrated embodiment is an electronic expansion valve (valve device) including a sensor assembly 100, a valve body portion 202, and a fixing member 203. The sensor assembly 100 is fixedly mounted on the valve body 202, the valve body 202 includes a flow passage 201, the channel 12 of the sensor assembly 100 is communicated with the flow passage 202, the pressure sensing unit 2 is used for detecting the pressure of fluid (refrigerant) flowing into the channel 12 from the flow passage 201, and the temperature sensing unit 3 is used for detecting the temperature of the fluid (refrigerant) flowing into the channel 12 from the flow passage 201. The valve body 202 includes a mounting cavity 204, the sensor assembly 100 is mounted in the mounting cavity 204, and the fixing member 203 is mounted in the mounting cavity 203 and presses and fixes the sensor assembly 100. The third seal 53 seals between the valve body 202 and the sensor 100. Fig. 18 is a schematic perspective cut-away view of the sensor assembly 100 shown in fig. 1 to 8 applied to an electronic expansion valve (valve device), and fig. 19 is a schematic perspective cut-away view of the sensor assembly 100 shown in fig. 11 to 14 applied to an electronic expansion valve (valve device). Because the temperature sensing parts 41 in the sensor assembly 100 are all arranged above the sensing substrate 21, the risk that the temperature sensing parts 41 are corroded by the refrigerant in the flow channel 201 is reduced, the temperature sensing parts 41 do not need to extend downwards to exceed the shell 1, extra components are not needed to seal and protect the temperature sensing parts 41, the height of the sensor assembly 100 can be reduced, the height of an electronic expansion valve (valve device) can be reduced, and the miniaturization design of the electronic expansion valve (valve device) is facilitated.

The above embodiments are only for illustrating the present application and not for limiting the technical solutions described in the present application, and the present application should be understood by those skilled in the art based on the detailed description of the present application with reference to the above embodiments, but those skilled in the art should understand that the present application can be modified or substituted equally by those skilled in the art, and all technical solutions and modifications thereof without departing from the spirit and scope of the present application should be covered by the claims of the present application.

Claims (11)

1. A sensor assembly is characterized by comprising a shell, a pressure sensing unit, a circuit board unit and a temperature sensing unit, wherein the shell is provided with an inner cavity and a channel;

the pressure sensing unit comprises a sensing substrate, the sensing substrate is accommodated in the inner cavity of the shell and is electrically connected with the circuit board unit, the sensing substrate comprises a first surface and a second surface, and the first surface and the second surface are positioned on different sides of the sensing substrate in the thickness direction;

the sensor assembly is provided with a first cavity and a second cavity, the first cavity is located on the side where the first surface of the induction substrate is located, the second cavity is located on the side where the second surface of the induction substrate is located, the channel is communicated with the first cavity, the first cavity is not communicated with the second cavity, the channel is located on the side where the first surface of the induction substrate is located, and the circuit board unit is located on the side where the second surface of the induction substrate is located;

the temperature sensing unit comprises a temperature sensing part and a temperature conducting part, the temperature sensing part is arranged on the side of the second surface, the temperature sensing part is electrically connected with the circuit board unit, the temperature conducting part comprises a first end surface and a second end surface, the first end surface is located on the side of the first surface of the sensing substrate, the second end surface is located on the side of the second surface of the sensing substrate, and the second end surface is in contact with or close to the temperature sensing part.

2. The sensor assembly of claim 1, wherein: the housing comprises a housing bottom wall, a housing side wall and a housing top wall, and the channel is at least partially arranged on the housing bottom wall;

the sensor assembly further comprises a seal member, the top of the seal member is in contact with the sensing substrate, the bottom of the seal member is in contact with the housing bottom wall, and the first cavity is located between the housing bottom wall, the sensing substrate and the seal member; the first end face of the temperature conduction part is located in the first cavity, or the first end face of the temperature conduction part is located in the channel.

3. The sensor assembly of claim 2, wherein: the temperature conducting part comprises an intermediate part, the intermediate part is connected between the first end face and the second end face, the induction substrate comprises a hole channel extending along the thickness direction of the induction substrate, and the intermediate part is accommodated in the hole channel; the second end face is flush with the second surface of the induction substrate, or the second end face is slightly lower than the second surface of the induction substrate, or the second end face is slightly higher than the second surface of the induction substrate.

4. The sensor assembly of claim 2, wherein: the shell includes first shell and second shell, first shell is equipped with the shell diapire, the second shell is equipped with the shell roof, the shell lateral wall includes first shell lateral wall and second shell lateral wall, first shell lateral wall sets up in first shell, second shell lateral wall sets up in the second shell, first shell lateral wall with second shell lateral wall fixed connection.

5. The sensor assembly of claim 4, wherein: the shell includes first step portion and second step portion, the bottom of first step portion connect in the shell diapire, the top of first step portion connect in the bottom of second step portion, the first surface of response base plate support in the top surface of first step portion, the outer fringe of sealing member contacts or is pressed close to with the medial surface of first step portion, the outer fringe of response base plate with the medial surface contact of second step portion or press close to, second shell lateral wall at least part support in the top surface of second step portion.

6. The sensor assembly of claim 1, wherein: the housing comprises a housing bottom wall, a housing side wall and a housing top wall, and the channel is at least partially arranged on the housing bottom wall;

the sensor assembly further comprises a base support, the base support is provided with a base body part and an extension part, the extension part extends upwards from the base body part, the base body part is clamped between the induction base plate and the bottom wall of the shell, the extension part surrounds the periphery of the induction base plate, the base body part is provided with a through hole, and the through hole is communicated with the channel;

the temperature-sensing part comprises a first end part, a middle part and a second end part, the middle part is connected between the first end part and the second end part, the first end part is exposed on the seat support, the second end part is exposed on the seat support, the first end surface is located at the first end part, the second end surface is located at the second end part, the first end part is located in the through hole and/or the channel, and the second end part is contacted with or attached to the temperature-sensing part.

7. The sensor assembly of claim 6, wherein: the intermediate portion includes a first intermediate portion embedded in the base portion and a second intermediate portion embedded in the extension portion, the first end portion extends in the same direction as the first intermediate portion, the second end portion extends in a direction perpendicular to the second intermediate portion, the first intermediate portion is provided with a tunnel extending in a thickness direction of the first intermediate portion, and the seat holder has a portion filled in the tunnel.

8. The sensor assembly of claim 7, wherein: the bottom wall of the shell is provided with a first groove, the seat support is provided with a second groove, the sensor assembly comprises a first sealing element and a second sealing element, the first sealing element is at least partially accommodated in the first groove, the second sealing element is at least partially accommodated in the second groove, the bottom of the first sealing element is contacted with the bottom wall of the shell, the top of the first sealing element is contacted with the bottom of the base body, the bottom of the second sealing element is contacted with the top of the base body, and the top of the second sealing element is contacted with the first surface of the induction substrate; the first cavity is located between the second seal, the base portion and the induction substrate.

9. The sensor assembly of claim 6, wherein: the shell comprises a first shell and a second shell, the first shell is provided with the shell bottom wall, the second shell is provided with the shell top wall, the shell side walls comprise a first shell side wall and a second shell side wall, the first shell side wall is arranged on the first shell, the second shell side wall is arranged on the second shell, and the first shell side wall is fixedly connected with the second shell side wall;

the shell comprises a step part, the bottom of the step part is connected with the bottom wall of the shell, the bottom surface of the seat support is supported on the bottom wall of the shell, the outer edge of the seat support is in contact with or close to the inner side surface of the step part, the side wall part of the second shell is supported on the top surface of the step part, and the side wall part of the second shell is supported on the top surface of the seat support.

10. The sensor assembly of any one of claims 1 to 9, wherein: the circuit board unit comprises a circuit board, and the temperature sensing part is mounted on the circuit board in a surface mounting mode.

11. A valve device characterized by: comprising a sensor assembly according to any one of claims 1 to 9, the valve device further comprising a valve body portion, the sensor assembly being fixedly mounted to the valve body portion, the valve body portion comprising a flow passage, the passage of the sensor assembly being in communication with the flow passage, the pressure sensing unit being adapted to sense the pressure of the fluid in the flow passage, and the temperature sensing unit being adapted to sense the temperature of the fluid in the flow passage.

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