CN113108117A

CN113108117A - Valve device

Info

Publication number: CN113108117A
Application number: CN202110337887.3A
Authority: CN
Inventors: 万霞; 饶欢欢; 逯新凯; 金骑宏; 黄隆重; 黄宁杰
Original assignee: Hangzhou Sanhua Research Institute Co Ltd
Current assignee: Hangzhou Sanhua Research Institute Co Ltd
Priority date: 2021-03-30
Filing date: 2021-03-30
Publication date: 2021-07-13

Abstract

A valve device comprising: the valve body part and the detection module, the detection module includes shell, base plate, sensing unit and electrically conductive piece. The valve body comprises a supporting wall, a peripheral wall and a bending wall, the peripheral wall extends from the supporting wall to the position close to the third side face, the bending wall bends from the peripheral wall to the position close to the detection module, the shell comprises a bottom and a top, the bottom of the top of the shell, relative to the shell, is close to the third side face, the bending wall presses against the top of the shell, and the bottom of the shell is supported on the supporting wall. The application discloses valve gear, through the fixed module that detects of valve somatic part self, adopt the bolt fastening relatively, be favorable to valve gear's miniaturization.

Description

Valve device

Technical Field

The application belongs to the technical field of refrigeration technology and particularly relates to a valve device.

Background

The valve device in the related art includes: valve body portion and detection module. The valve body part is provided with a flow passage for flowing refrigerant, and the detection module is arranged in the valve body part and used for detecting a temperature signal and a pressure signal of refrigerant fluid in the refrigerant flow passage. The detection module is installed and needs to realize the fixed of detecting the module through the bolt behind the installation cavity of valve body portion, and the setting of bolt, the structure is comparatively complicated, and has just occupied the space of valve body portion, is unfavorable for valve gear's miniaturized design.

Disclosure of Invention

The present application aims to provide a valve device that facilitates a compact design.

A valve device comprising: the valve body part and the detection module;

the valve body part comprises a first side surface, a second side surface and a third side surface connected between the first side surface and the second side surface, the first side surface and the second side surface are positioned on different sides of the valve body part, the valve body part is provided with a first cavity, a first flow passage and an inner wall surface forming the first flow passage, the first flow passage penetrates through the first side surface and the second side surface of the valve body part, and the first cavity penetrates through the third side surface and the inner wall surface of the valve body;

the detection module is at least partially positioned in the first cavity and comprises a shell, a substrate, a sensing unit and a conductive piece, wherein the substrate is accommodated in the shell, and the sensing unit is at least partially positioned in the shell; the detection module is provided with a second cavity and a second flow channel, the second flow channel and the second cavity are positioned on different sides in the thickness direction of the substrate, the second flow channel is communicated with the first flow channel, the second flow channel is not communicated with the second cavity, the conductive piece is provided with a first part positioned in the second cavity and a second part exposed on the outer surface of the shell, and the sensing unit is used for sensing the temperature and/or the pressure of fluid in the second flow channel;

the valve body portion comprises a supporting wall, a peripheral wall and a bent wall, the peripheral wall extends from the supporting wall to the position close to the third side face, the bent wall is bent from the peripheral wall to the position close to the detection module, the shell comprises a bottom and a top, the top of the shell is close to the third side face relative to the bottom of the shell, the bent wall presses against the top of the shell, and the bottom of the shell is supported on the supporting wall.

Compare in correlation technique, the valve body portion self of this application is including pressing the portion of bending that detects the module shell, and the structure is simpler, and the portion of bending occupation space of valve body portion self is less to be favorable to valve device's miniaturized setting.

Drawings

FIG. 1 is a perspective view of a valve assembly of the present application.

Fig. 2 is an exploded view of the valve assembly shown in fig. 1.

Fig. 3 is an exploded view of another view of the valve assembly shown in fig. 1.

Fig. 4 is a schematic perspective cross-sectional view of the valve body portion of fig. 1.

Fig. 5 is an enlarged schematic view of the circled portion a shown in fig. 4.

Fig. 6 is a perspective view of the detecting module shown in fig. 2.

Fig. 7 is a perspective view of the inspection module shown in fig. 2.

Fig. 8 is an exploded view of the detection module shown in fig. 6.

Fig. 9 is an exploded view of the inspection module shown in fig. 6 from another perspective.

Fig. 10 is a schematic perspective cross-sectional view of the detection module shown in fig. 6.

FIG. 11 is a schematic cross-sectional view of the detection module shown in FIG. 6.

Fig. 12 is a schematic perspective cross-sectional view of the inspection module shown in fig. 6.

Fig. 13 is a further exploded view of a portion of the components shown in fig. 9.

Fig. 14 is a further exploded view from another perspective of a portion of the elements shown in fig. 9.

Fig. 15 is a schematic perspective cross-sectional view of the valve device shown in fig. 1.

Fig. 16 is another schematic perspective cross-sectional view of the valve assembly shown in fig. 1.

Fig. 17 is a schematic cross-sectional view of the valve device shown in fig. 1.

FIG. 18 is a schematic perspective cross-sectional view of another embodiment of the detection module of the present application.

FIG. 19 is a schematic cross-sectional view of another embodiment of the detection module of the present application.

FIG. 20 is a schematic perspective cross-sectional view of another embodiment of the detection module of the present application.

FIG. 21 is a schematic diagram of a thermal management system of the present application.

Detailed Description

As shown in fig. 1-3, a valve apparatus 100 consistent with the present application includes: the valve body part 10, the detection module 40, the valve core part 61, the motor part 62, the circuit board 63 and the cover body part 64 are fastened 65.

As shown in fig. 4, the valve body 10 includes a first side 11, a second side 12, a third side 13 connected between the first side 11 and the second side 12, and a fourth side 14. The first side 11 and the second side 12 are located on different sides of the valve body 10, and in the illustrated embodiment, the first side 11 and the second side 12 are located on the front side and the rear side of the valve body 10, respectively, and the third side 13 and the fourth side 14 are located on the upper side and the lower side of the valve body 10, respectively.

The valve body portion 10 is a metal member having a rectangular parallelepiped shape, and the valve body portion 10 is integrally formed by a production process such as machining or forging.

The valve body portion 10 has a first chamber 15, a first flow passage 16, and an inner wall surface 17 forming the first flow passage 16, the first flow passage 16 passing through the first side surface 11 and the second side surface 12 of the valve body portion 10, and the first chamber 15 passing through the third side surface 13 and the inner wall surface 17 of the valve body. The valve body portion 10 has a third chamber 18 and a third flow passage 19, the third flow passage 19 extending through the first and

second sides

11, 12 of the valve body portion, and the third chamber 18 extending through the third side 13 of the valve body portion 10 and communicating with the third flow passage 19.

In some embodiments, first chamber 15 and third chamber 18 each extend in a vertical direction, and first flow passage 16 and third flow passage 19 each extend in a front-to-rear direction. Before the valve body portion 10 is assembled with no other component, the first flow passage 16 and the first chamber 15 communicate with each other, and the third flow passage 19 and the third chamber 18 communicate with each other.

The first chamber 15 is used for mounting the detection module 40 and the third chamber 18 is used for mounting the spool portion 61. The valve core 61 is used for controlling the flow rate of the fluid in the third flow channel 19, and the detection module 40 is used for detecting the temperature and/or pressure of the fluid in the first flow channel 16.

The fluid flowing in the first flow channel 16 and the third flow channel 19 may be a refrigerant or a refrigerant, in the illustrated embodiment, the first flow channel 16 and the third flow channel 19 are arranged in parallel, so that they are not directly communicated in the valve body 10, in an alternative embodiment, the first flow channel 16 and the third flow channel 19 may also be the same flow channel directly communicated in the valve body 10, which is not limited in this application.

The valve body 10 comprises a support wall 21, a peripheral wall 22 and a bent wall 23 provided in the first chamber 15. The peripheral wall 22 extends from the support wall 21 toward the third side 13, and the bent wall 23 is bent from the peripheral wall 22 toward the detection module 40. The valve body portion 10 further includes a peripheral wall 24, the top surface of the peripheral wall 24 being coincident with the third side 13, and the top surfaces of the peripheral wall 22 and the bent wall 23 being lower than the third side 13. The valve body portion 10 further includes a partition wall 25, the partition wall 25 being connected between the peripheral wall 22 and the peripheral wall 24, and an escape space 26 being formed between the peripheral wall 22 and the peripheral wall 24. Before the bent wall 23 is not bent, the bent wall 23 is in a straight cylindrical shape in the same extending direction as the peripheral wall 22, and the arrangement of the avoiding space 26 facilitates the formation of bending the bent wall 23 from the peripheral wall 22 by approximately 90 degrees through the avoiding space 26 by using a tool.

The folded wall 23 is substantially annular and the aperture formed by the folded wall 23 is smaller than the aperture formed by the surrounding wall 22.

The support wall 21 includes a first support wall 27, a second support wall 28, and a recessed portion 29 formed between the first support wall 27 and the second support wall 28, and the peripheral wall 22 extends from the first support wall 27 toward the third side face 13.

The groove portion 29 has a groove bottom surface 291, and the groove bottom surface 291 is closer to the third side surface 13 than the inner wall surface 17. The first support wall 27 and the second support wall 28 each project toward the third side 13 with respect to the groove bottom surface 291, the first support wall 27 is substantially ring-shaped, the second support wall 28 is also substantially ring-shaped, the first support wall 27 includes a first support top surface 271, the second support wall 28 includes a second support top surface 281, and the first support top surface 271 and the second support top surface 281 are substantially equal in height with respect to the groove bottom surface 291 and are thus arranged in alignment.

The first support wall 27 projects in a direction close to the second support wall 28 with respect to the peripheral wall 22, the first support wall 27 being formed with a plurality of spaced apart bosses surrounding the second support wall 28.

As shown in fig. 5, the second support wall 28 has a positioning groove 282 concavely formed from the second support top surface 281 toward the inner wall surface 17. The valve body portion 10 includes a mounting hole 31 penetrating through the inner wall surface 17 and the second support top surface 281, the mounting hole 31 having a first orifice 311 on the inner wall surface 17, the mounting hole 31 having a second orifice 312 on the second support top surface 281, wherein the mounting hole 31 belongs to a portion of the first chamber 15.

As shown in fig. 6 to 14, the detecting module 40 includes a housing 41, a substrate 45, a sensing unit 46, and a conductive member 49, wherein the substrate 45 is accommodated in the housing 41, and the sensing unit 46 is at least partially located in the housing 41.

The detection module 40 has a second cavity 51 and a second flow channel 52, and the second flow channel 52 and the second cavity 51 are located on different sides in the thickness direction of the substrate 45. The conductive member 49 has a first portion 491 located in the second cavity 51 and a second portion 492 exposed to the outer surface of the housing 41, and the sensing unit 46 is used for sensing the temperature and pressure of the fluid in the second flow passage 52.

The housing 41 includes a first case 43 and a second case 44, the first case 43 has an accommodating chamber 430 accommodating the substrate 45, and a second chamber 51 is formed between the second case 44 and the substrate 45. The outer diameter of the second housing 44 is slightly larger than the outer diameter of the first housing 43.

The first housing 43 is provided with a first positioning portion 431, the second housing 44 is provided with a second positioning portion 441, the first positioning portion 431 and the second positioning portion 441 are matched, one of the first positioning portion 431 and the second positioning portion 441 is a convex portion, and the other is a concave portion. In the illustrated embodiment, the first positioning portion 431 is a protruding column or/and a protruding platform extending to the second housing 44 for the first housing 43, the second positioning portion 441 is a through hole/a groove for the second housing 44 to be inserted into, and the first positioning portion 431 and the second positioning portion 441 are matched to position the first housing 43 and the second housing 44, so as to facilitate assembly and positioning between the first housing 43 and the second housing 44. In some embodiments, the first positioning portion 431 and the second positioning portion 441 are in interference fit to fix the first housing 43 and the second housing 44 preliminarily, so that the risk of falling off between the first housing 43 and the second housing 44 during the process of moving the detection module 40 to the first cavity 15 for installation is reduced.

The first housing 43 includes a base portion 432 and a peripheral portion 433 extending from the base portion 432 to near the second housing 44, the peripheral portion 433 surrounding the base plate 45, and the lower side surface of the base portion 432 abutting against the support wall 21 of the valve body portion 10. As shown in fig. 10, the first housing 43 includes a first support 571 and a second support 572 that protrude from the base 432 toward the substrate 45, and a first groove 573 is formed between the first support 571 and the second support 572. The detection module 40 further includes a sealing member 53 disposed between the base plate 45 and the base portion 432, and the sealing member 53 is received in the first groove 573 for sealing the second flow channel 52 and the second cavity 51. In the illustrated embodiment, the sealing member 53 is an O-ring rubber, and the underside of the base plate 45 presses against the O-ring sealing member 53 to seal between the second flow path 52 and the second chamber 51.

In an alternative embodiment, the sealing member 53 may also seal the second flow passage 52 and the second cavity 51 by a sealant such as epoxy resin bonded between the substrate 45 and the first housing 43.

The sensing unit 46 includes a temperature sensing unit 47 and a pressure sensing unit 48, and the temperature sensing unit 47 and the pressure sensing unit 48 are separately provided, or the temperature sensing unit 47 and the pressure sensing unit 48 are integrated. In the embodiment of the present application, the temperature sensing unit 47 and the pressure sensing unit 48 are separately provided as an example.

The detection module 40 includes a circuit board assembly 54 and a spacer 55, the temperature sensing unit 47 includes a temperature sensing portion 471 and a pin portion 472, and the pin portion 472 is electrically connected to the temperature sensing portion 471 and the circuit board assembly 54. The lead part 472 includes a first lead part 473 and a second lead part 474, the peripheral part 433 of the first housing 43 has a receiving part 434, the spacer 55 is located in the receiving part 434, the spacer 55 is spaced between the second lead part 474 and the receiving part 434, the second lead part 474 is fixed to the first housing 43 by the spacer 55, and the first lead part 473 is connected between the temperature sensing part 471 and the second lead part 474.

The spacer 55 is formed by glass fritting and the second lead part 474 is fixed to the first case 43 by glass fritting, or the spacer 55 is formed by an adhesive and the second lead part 474 is fixed to the first case 43 by an adhesive. The first housing 43 is a metal member, and the second housing 44 is an insulating member.

The first housing 43 is made of aluminum metal, so that the weight of the first housing 43 is reduced, the first housing can resist the corrosion of the refrigerant, and the high-temperature sintering of the glass micro-melting isolating piece 55 is facilitated. The first housing 43 is made of metal, which also reduces the interference of external electromagnetic interference to the electronic components inside the detection module 40, and the second housing 44 is made of plastic insulating material, which facilitates electrical isolation between the conductive member 49 and the first housing 43.

As shown in fig. 8 and 9, the circuit board assembly 54 is a flexible circuit board assembly, and includes a first circuit board 541, a second circuit board 542, a first flexible board 543, and a second flexible board 544. The first circuit board 541 and the second circuit board 542 are disposed in parallel at intervals, the first flexible board 543 is connected between the first circuit board 541 and the second circuit board 542, and the second flexible board 544 is formed by extending outward from the second circuit board 542. The hardness of the first circuit board 541 and the second circuit board 542 is greater than the hardness of the first flexible board 543 and the second flexible board 544, the first flexible board 543 and the second flexible board 544 are easier to bend, and the first circuit board 541 and the second circuit board 542 are more difficult to bend.

As shown in fig. 12, electronic components such as a conditioning chip 545, a resistor 546, a capacitor 547, and the like are mounted on the upper surface of the first circuit board 541. The conditioning chip 545, the resistor 546 and the capacitor 547 are used for filtering, amplifying and converting the pressure signal detected by the pressure sensing unit 48 into an electrical signal that can be read by the outside world. As shown in fig. 6, the second flexible board 544 extends from the inside of the casing 41 to the outside of the casing 41 and extends above the second housing 44. The end of the second flexible board 544 is provided with a grounding plate 549, and the bending wall 23 of the valve body 10 is pressed against and contacts the grounding plate 549, so that the detection module 40 and the valve body 10 are connected to the ground together, when an external high-voltage surge is transmitted through a circuit of the detection module, the external high-voltage surge can be directly conducted to the ground, and the possibility of the external high-voltage surge signal damaging the conditioning chip 545 is reduced. In addition, the interference of external electromagnetic interference on the electronic elements in the detection module can be further reduced.

In some embodiments, substrate 45 is a ceramic substrate. The substrate 45 includes a first surface 451 and a second surface 452 in a thickness direction of the substrate 45, the first surface 451 is closer to the second flow path 52 than the second surface 452, and the second surface 452 is closer to the second chamber 51 than the first surface 451. The circuit board assembly 54 is disposed on the second surface 452 side, and the lead portion 472 includes a third lead portion 475 physically and electrically connected to the circuit board assembly 54. A lug 548 projects outward from the outer periphery of the first circuit board 541, and the third lead portion 475 is electrically connected to the first circuit board 541 through the lug 548.

The substrate 45 includes a third surface 453 connected between the first surface 451 and the second surface 452, the first surface 451 and the second surface 452 are planar, and the third surface 453 is arc-shaped. The base plate 45 is further provided with a guide groove 454 recessed inward at the third surface 453, and the first housing 43 includes a guide post 573 protruding into the receiving cavity 430 from the peripheral portion 433, the guide post 573 being engaged with the guide groove 454 to have a guide positioning function when the base plate 45 is mounted to the receiving cavity 430, thereby facilitating the mounting.

The pressure sensing unit 48 includes a sensing region 481, and the sensing region 481 is located on the first surface 451 side of the ceramic substrate 45. The pressure sensing unit 48 is a ceramic capacitor structure, and the sensing region 481 changes a capacitance value when receiving the pressure of the fluid, so as to further convert the capacitance value into an electric signal to be transmitted to an external reading fluid. The hardness of the second pin part 474 is greater than that of the first pin part 473, and the end of the first pin part 473 and the end of the second pin part 474 are fixedly and electrically connected together by welding.

As shown in fig. 13 and 14, the detection module 40 further includes a protection sleeve 56, the first housing 43 includes a fitting portion 435 extending from the base plate 45 away from the peripheral portion 433, and the fitting portion 435 is assembled and fixed with the protection sleeve 56. The fitting part 435 includes a first fitting part 436 and a second fitting part 438 which are disposed at a distance from each other, the first fitting part 436 having a first projection 437, and the second fitting part 438 having a second projection 439. The protective sleeve 56 includes a barrel portion 561 and a baffle 563 disposed in the barrel portion 561, the baffle 563 divides an inner cavity of the barrel portion 561 into a first cavity 564 and a second cavity 565, and the baffle 563 is provided with a through hole 566 penetrating in a thickness direction thereof. The barrel portion 561 is provided with a penetration hole 562 penetrating in a radial direction of the barrel portion 561, and the penetration hole 562 communicates with the second chamber 565 and is provided near the base portion 432. The temperature sensing part 471 is located in the first cavity 564, and the first lead part 473 passes through the through hole 566 from the temperature sensing part 471 and penetrates out of the through hole 562 to be connected to the second lead part 474.

Referring to fig. 2 to 4 and 15 to 17, the detecting module 40 is fixedly installed in the first cavity 15 of the valve body 10, and the detecting module 40 is at least partially located in the first cavity 15. The second flow channel 52 is communicated with the first flow channel 16, so that a refrigeration joint circulating in the first flow channel is conveniently led into the detection module 40 to detect the pressure of the refrigerant, the second flow channel 52 is not communicated with the second cavity 51, and the refrigeration joint is prevented from leaking from the detection module 40 to influence electronic elements in the second cavity 51. The housing 41 includes a bottom 411 and a top 412, the top 412 of the housing 41 is close to the third side 13 relative to the bottom 411 of the housing 41, the bent wall 23 presses the top 412 of the housing 41, and the bottom 411 of the housing 41 is supported on the supporting wall 21. The valve body part 10 is an integrated part, the bending wall 23 of the valve body supports against the detection module 40, and the fixing part for fixing the detection module 40 can be saved, so that the structure is simpler, the element cost is lower, and the space utilization is more reasonable.

In addition, according to the present invention, the bent wall 23 and the peripheral wall 22 of the valve body portion 10 can serve as the housing 41 of the detection module 40, so that the number of housings of the detection module 40 can be reduced, and the occupied space in the valve device 10 can be further saved, thereby being more beneficial to the miniaturization design of the valve device.

As shown in fig. 15 to 17, the bent wall 23 presses against the upper portion of the second housing 44, the lower portion of the second housing 44 presses against the second surface 452 of the substrate 45, and the first surface 451 of the substrate 45 presses against the sealing member 53, so that the first surface 451 of the substrate 45 contacts with the first supporting portion 571, the second supporting portion 572, and the sealing member 53. The second surface 452 of the substrate 45 is substantially aligned with the upper surface of the peripheral portion 433.

The spool portion 61 is at least partially positioned within the third chamber 18, and the motor portion 62 is configured to control movement of the spool portion 61, thereby controlling the flow of fluid within the third flow passage 19. The cap portion 64 is provided on the third side surface 13 side of the valve body portion 10, and the fastener 65 fixes the cap portion 64 and the valve body portion 10. The fastening member 65 may be a device for fastening a bolt or the like, and is not limited to a bolt.

The cover portion 64 has a receiving cavity 641, the circuit board 63 is located in the receiving cavity 641, the second portion 492 of the conductive member 49 abuts against the lower surface of the circuit board 63, and the upper surface of the circuit board 63 contacts with the lower wall surface of the cover portion 64.

The motor part 62 includes a stator 621 and a rotor 622, the stator 621 is fixed to the cover part 64, the stator 621 is electrically connected to the circuit board 63, and the rotor 622 is rotatably connected to the valve core part 61.

The valve device 100 includes a connector 66, the connector 66 including a port portion 661 and a pin portion 662 disposed on the cap portion 64, one end of the pin portion 662 being physically and electrically connected to the circuit board 63, and the other end of the pin portion 662 being received in the port portion 661.

Fig. 18 shows another embodiment of the detection module 40 of the present application. The substrate 45 constitutes a part of a wiring board assembly, the substrate 45 is a ceramic circuit board or a printed circuit board (resin circuit board), and the pressure sensing unit 48 is a Micro Electro Mechanical System (MEMS) chip. The substrate 45 includes a first surface 451 and a second surface 452, the first surface 451 is closer to the second flow channel 52 than the second surface 452, and the second surface 452 is closer to the second cavity 51 than the first surface 451. The pressure sensing chip is disposed on the second surface 452 side, and the temperature sensing unit 47 also employs a pin NTC thermistor. The base plate 45 includes a drainage aperture 456 extending through the thickness of the base plate 45, and the pressure sensing unit 48 is sealingly attached to the second surface 452 of the base plate 45 to block the drainage aperture 456 from communicating with the second chamber 51. The drainage apertures 456 are part of the second flow passage 52. The detection module 40 of the present embodiment is a pressure and temperature detection module combining a back pressure Micro Electro Mechanical System (MEMS) chip and a pin NTC, and has the advantages of fast reaction of refrigerant fluid detected by the pin NTC and small size of the pressure sensing unit relative to the ceramic capacitor. The conductive member 49 of the present embodiment has a spring structure, and has an advantage of easy installation compared to the metal sheet structure of the previous embodiment. Of course, the previous embodiment may also employ spring-loaded conductors 49.

Fig. 19 shows another embodiment of the detection module 40 of the present application. The substrate 45 includes a first surface 451 and a second surface 452, the first surface 451 is closer to the second flow channel 52 than the second surface 452, and the second surface 452 is closer to the second cavity 51 than the first surface 451. The substrate 45 is a ceramic circuit board or a printed circuit board (resin circuit board), the temperature sensing unit 47 is a chip NTC thermistor, the pressure sensing unit 48 is a microcomputer system chip, and the temperature sensing unit 47 and the pressure sensing unit 48 are both soldered to the first surface 451 of the substrate 45. The detection module 40 of the present embodiment is a pressure and temperature detection module combining a positive pressure micro-electro-mechanical system (MEMS) chip and a patch NTC thermistor, and has a smaller volume. The detection module 40 further includes a protective adhesive 54 covering the temperature sensing unit 47 and the pressure sensing unit 48 to reduce the impact of the refrigerant fluid on the welding legs of the temperature sensing unit 47 and the pressure sensing unit 48. In an alternative embodiment, the pressure sensing unit 48 and the temperature sensing unit 47 are integrated micro-electromechanical systems (MEMS) chips.

Fig. 20 shows a further embodiment of the detection module 40 of the present application. The substrate 45 includes a first surface 451 and a second surface 452, the first surface 451 is closer to the second flow channel 52 than the second surface 452, and the second surface 452 is closer to the second cavity 51 than the first surface 451. The temperature sensing unit 47 is a pin thermistor NTC, the pressure sensing unit 48 is a micro-electromechanical system (MEMS) chip, the temperature sensing unit 47 is soldered to the first surface 451 or the second surface 452 of the substrate 45, and the pressure sensing unit 48 is soldered to the first surface 451 of the substrate 45. The detection module 40 of the present embodiment is a pressure and temperature detection module combining a positive pressure Micro Electro Mechanical System (MEMS) chip and a pin NTC thermistor, and has a small volume and a sensitive response.

As shown in fig. 21, the present application also provides a thermal management or air conditioning system 70 that includes a compressor 71, a condenser 72, an expansion valve 73, an evaporator 74, and a sensor 75. The compressor 71 compresses the refrigerant into a high-temperature high-pressure refrigerant, releases heat to air or cooling liquid through the condenser 72, enters the expansion valve 73 to be throttled and decompressed into a low-temperature low-pressure refrigerant, enters the evaporator 74 to absorb heat from the air or the cooling liquid to be evaporated into a gaseous refrigerant, measures the temperature and the pressure of the refrigerant through the sensor 75, and then enters the compressor 71 to circulate. The sensor 74 and the expansion valve 73 are only schematically illustrated in the system, the sensor 74 and the expansion valve 73 are integrated into the valve device 100, and the actual physical structure is referred to above, and the expansion valve 73 is preferably an electronic expansion valve, so that the control is more precise.

The above embodiments are only for illustrating the present application and not for limiting the technical solutions described in the present application, and the present application should be understood by those skilled in the art based on the detailed description of the present application with reference to the above embodiments, but those skilled in the art should understand that the present application can be modified or substituted equally by those skilled in the art, and all technical solutions and modifications thereof without departing from the spirit and scope of the present application should be covered by the claims of the present application.

Claims

1. A valve device, comprising: the valve body part and the detection module;

2. The valve apparatus of claim 1, wherein: the valve device comprises a valve core part and a motor part, wherein the valve core part is connected with the motor part, the valve body part is provided with a third cavity and a third flow channel, the third flow channel penetrates through the first side surface and the second side surface of the valve body part, and the third cavity penetrates through the third side surface of the valve body part and is communicated with the third flow channel;

the valve core part is at least partially positioned in the third cavity, the motor part is used for controlling the movement of the valve core part so as to control the flow of fluid in the third flow channel, and the valve body part is an integrated part.

3. The valve apparatus of claim 2, wherein: the valve device comprises a circuit board, a cover body part and a fastener, wherein the cover body part is arranged on the third side face side of the valve body part, and the fastener fixedly arranges the cover body part and the valve body part;

the cover body part is provided with an accommodating cavity, the circuit board is positioned in the accommodating cavity, the second part of the conductive piece abuts against the lower surface of the circuit board, and the upper surface of the circuit board is in contact with the lower wall surface of the cover body part.

4. A valve device as claimed in claim 3, wherein: the motor part comprises a stator and a rotor, the stator is fixed on the cover body part and electrically connected with the circuit board, and the rotor is rotationally connected with the valve core part;

the valve device comprises a connector, the connector comprises a port part and a pin part, the port part and the pin part are located on the cover body part, one end part of the pin part is physically and electrically connected with the circuit board, and the other end part of the pin part is contained in the port part.

5. The valve apparatus of claim 1, wherein: the sensing unit comprises a temperature sensing unit and a pressure sensing unit, and the temperature sensing unit and the pressure sensing unit are separately arranged or are integrated.

6. The valve apparatus of claim 5, wherein: the shell comprises a first shell and a second shell, the first shell is provided with an accommodating cavity for accommodating the substrate, and the second cavity is formed between the second shell and the substrate;

the first shell is provided with a first positioning part, the second shell is provided with a second positioning part, the first positioning part is matched with the second positioning part, one of the first positioning part and the second positioning part is a convex part, and the other one of the first positioning part and the second positioning part is a concave part;

the first shell comprises a base part and a peripheral part extending from the base part to the position close to the second shell, the peripheral part surrounds the base plate, the detection module further comprises a sealing piece arranged between the base plate and the base part, and the sealing piece seals the second flow channel and the second cavity.

7. The valve apparatus of claim 6, wherein: the first shell is a metal piece, the valve body part is a metal piece, and the second shell is an insulating piece;

the detection module comprises a circuit board assembly and a spacer, the temperature sensing unit comprises a temperature sensing part and a pin part, the pin part is electrically connected with the temperature sensing part and the circuit board assembly, the pin part comprises a first pin part and a second pin part, the surrounding part of the first shell is provided with a containing part, the spacer is positioned in the containing part, the spacer is spaced between the second pin part and the containing part, the second pin part is fixed on the first shell through the spacer, and the first pin part is connected between the temperature sensing part and the second pin part;

the spacer is glass micro-melting, and the second pin part is fixed to the first shell through glass micro-melting sintering, or the spacer is bonding glue, and the second pin part is fixed to the first shell through bonding glue.

8. The valve apparatus of claim 7, wherein: the circuit board assembly is a flexible circuit board assembly, the substrate is a ceramic substrate, the substrate comprises a first surface and a second surface, the first surface is closer to the second flow channel relative to the second surface, the second surface is closer to the second cavity relative to the first surface, the flexible circuit board assembly is arranged on the side of the second surface, and the pin part comprises a third pin part which is physically and electrically connected with the flexible circuit board assembly;

the pressure sensing unit comprises a sensing region formed on the first surface of the ceramic substrate.

9. The valve apparatus of claim 7, wherein: the substrate forms a part of a circuit board assembly, the circuit board assembly is a ceramic circuit board or a printed circuit board, the pressure sensing unit is a micro-electro-mechanical system chip, and the pressure sensing chip is arranged on the first surface side or the second surface side.

10. The valve apparatus of claim 5, wherein: the substrate comprises a first surface and a second surface, the first surface is closer to the second flow channel relative to the second surface, the second surface is closer to the second cavity relative to the first surface, the substrate is a ceramic circuit board or a printed circuit board, the temperature sensing unit is a patch thermistor, the pressure sensing unit is a microcomputer system chip, the temperature sensing unit is welded on the first surface of the substrate, and the pressure sensing unit is welded on the first surface or the second surface of the substrate.