CN212706397U

CN212706397U - Clamp for communicating front surface and back surface of semiconductor device

Info

Publication number: CN212706397U
Application number: CN202021614969.5U
Authority: CN
Inventors: 陈磊磊
Original assignee: Suzhou Sailihong Intelligent Manufacturing Co ltd
Current assignee: Suzhou Sailihong Intelligent Manufacturing Co ltd
Priority date: 2020-08-06
Filing date: 2020-08-06
Publication date: 2021-03-16
Anticipated expiration: 2030-08-06

Abstract

The utility model belongs to the semiconductor processing field, especially, an anchor clamps for communicateing the semiconductor device dead back face, poor stability after fixing to current anchor clamps to semiconductor device to inconvenient adjust the problem to suitable height with semiconductor device, the following scheme is proposed to the present, and it includes the room board, top one side fixedly connected with fixed plate of room board, a plurality of connecting rods of one side fixedly connected with of fixed plate, the spout has been seted up at the top of room board, and slidable mounting has the slide in the spout, and the top both sides of slide are the first board of fixedly connected with and second board respectively, two diaphragms of one side fixedly connected with of second board, the diaphragm fixed connection of the top of first board and below, the same panel of one side fixedly connected with of two diaphragms, and a plurality of connecting rod holes have been seted up to one side of panel. The utility model discloses the practicality is good, conveniently fixes semiconductor device to the convenience is adjusted semiconductor device to suitable height.

Description

Clamp for communicating front surface and back surface of semiconductor device

Technical Field

The utility model relates to a semiconductor processing technology field especially relates to an anchor clamps that is used for communicateing the semiconductor device dead back face.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has application in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and for example, a diode is a device made of the semiconductor.

The prior clamp used for communicating the front surface and the back surface of the semiconductor device has poor stability after fixing the semiconductor device, and the semiconductor device is inconvenient to adjust to a proper height.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the poor stability that exists anchor clamps among the prior art after fixing semiconductor device to inconvenient adjust semiconductor device to the shortcoming of suitable height, and the anchor clamps that are used for the positive back of intercommunication semiconductor device that provide.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a clamp for communicating the front and back surfaces of a semiconductor device comprises a middle plate, wherein one side of the top of the middle plate is fixedly connected with a fixed plate, one side of the fixed plate is fixedly connected with a plurality of connecting rods, the top of the middle plate is provided with a sliding groove, a sliding plate is arranged in the sliding groove in a sliding manner, two sides of the top of the sliding plate are respectively fixedly connected with a first plate and a second plate, one side of the second plate is fixedly connected with two transverse plates, the top of the first plate is fixedly connected with the transverse plate below the first plate, one side of the two transverse plates is fixedly connected with a same panel, one side of the panel is provided with a plurality of connecting rod holes, one end of each connecting rod extends into the corresponding connecting rod hole, a stabilizing seat is arranged below the middle plate, two sides of the stabilizing seat are respectively provided with a moving groove, a moving plate is arranged in the moving groove, the matching plates are provided with horizontal holes, the horizontal plates are slidably mounted in the horizontal holes, one sides of the two horizontal plates, which are close to each other, are fixedly connected with vertical plates, the top of the stabilizing seat is provided with two rectangular grooves, the bottoms of the vertical plates extend into the rectangular grooves, the bottoms of the sides, which are far away from each other, of the two vertical plates are welded with inserting plates, the inner wall of one side, which is far away from each other, of the two rectangular grooves is provided with inserting grooves, the inserting plates are clamped with the lowest inserting grooves, one sides, which are close to each other, of the two matching plates are provided with operating grooves, the same operating shaft is rotatably mounted in the two operating grooves, the outer side of the operating shaft is provided with two external threads, the vertical plates are provided with screw holes, the external threads on the operating shaft are in threaded connection with screw holes, the top of one vertical plate is fixedly connected, the downthehole slidable mounting of cardboard has the cardboard, and the draw-in groove has been seted up to the bottom of slide, cardboard and draw-in groove looks clamping, and the bottom fixedly connected with second set-square of cardboard, second set-square contact with the inclined plane of first set-square, and the top welding of second set-square has the spring, and the top of spring welds in the bottom of board between.

Preferably, one side fixedly connected with locating plate of cardboard, seted up the constant head tank on the inner wall of one side in cardboard hole, locating plate slidable mounting is spacing to the cardboard in the constant head tank.

Preferably, the two external threads on the operating shaft are opposite in thread direction, and the threads in the two screw holes are opposite in thread direction.

Preferably, the fixed plate and the panel are close to each other, a plurality of rubber pads are fixedly connected to one side of the fixed plate and one side of the panel, through holes are formed in the rubber pads, and one end of the connecting rod penetrates through the two through holes.

Preferably, a plurality of slots on the same vertical axis are arranged at equal intervals.

Preferably, the bottom of the moving plate is in contact with the inner wall of the bottom of the moving groove to limit the moving plate.

In the utility model, a clamp for communicating the front and back surfaces of a semiconductor device inserts the semiconductor device into a connecting rod, then pushes a second plate which moves a transverse plate to move, the transverse plate drives a panel to move, so that a rubber pad fixes the semiconductor device, then a middle plate is pulled, a matching plate drives a movable plate to move, the fixed semiconductor device is adjusted to a proper height, then an operating shaft is rotated, external threads on the operating shaft are connected with screw threads to drive a vertical plate to move, the vertical plate drives a plug plate to move, the plug plate is clamped into a slot on the same horizontal axis, the vertical plate drives an upper plate to move, the upper plate drives a traction plate to move, the first triangular plate extrudes the second triangular plate to drive the second triangular plate to move, the second triangular plate extrudes a spring, the second triangular plate drives a clamping plate to move, so that the clamping plate is clamped into the clamping groove to fix the sliding plate.

The utility model discloses the practicality is good, conveniently fixes semiconductor device to the convenience is adjusted semiconductor device to suitable height.

Drawings

Fig. 1 is a schematic structural diagram of a clamp for connecting the front and back surfaces of a semiconductor device according to the present invention;

fig. 2 is a schematic structural diagram of a portion a of a clamp for connecting the front and back surfaces of a semiconductor device according to the present invention;

fig. 3 is a schematic structural diagram of a portion B of a clamp for connecting the front and back surfaces of a semiconductor device according to the present invention.

In the figure: 1. a middle plate; 2. a fixing plate; 3. a connecting rod; 4. a slide plate; 5. a first plate; 6. a second plate; 7. a transverse plate; 8. a panel; 9. a stabilizing base; 10. moving the plate; 11. a mating plate; 12. a horizontal plate; 13. a vertical plate; 14. an operating shaft; 15. inserting plates; 16. an upper plate; 17. a traction plate; 18. a first set square; 19. clamping a plate; 20. a second set square; 21. a spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, a clamp for connecting the front and back of a semiconductor device, comprising a middle plate 1, a fixed plate 2 fixedly connected to one side of the top of the middle plate 1, a plurality of connecting rods 3 fixedly connected to one side of the fixed plate 2, a sliding slot formed in the top of the middle plate 1 and having a sliding plate 4 slidably mounted therein, a first plate 5 and a second plate 6 fixedly connected to both sides of the top of the sliding plate 4, two transverse plates 7 fixedly connected to one side of the second plate 6, the top of the first plate 5 fixedly connected to the lower transverse plate 7, a same face plate 8 fixedly connected to one side of the two transverse plates 7, a plurality of connecting rod holes formed in one side of the face plate 8, one ends of the connecting rods 3 extending into the corresponding connecting rod holes, a stabilizing base 9 disposed below the middle plate 1, moving plate moving grooves formed in both sides of the stabilizing base 9, moving plates 10 slidably mounted in the moving grooves, and a matching plate, the top parts of two matching plates 11 are fixedly connected with the bottom part of a partition plate 1, a horizontal hole is formed in each matching plate 11, a horizontal plate 12 is arranged in the horizontal hole in a sliding mode, a vertical plate 13 is fixedly connected to one side, close to each other, of each horizontal plate 12, two rectangular grooves are formed in the top part of a stabilizing seat 9, the bottoms of the vertical plates 13 extend into the rectangular grooves, inserting plates 15 are welded to the bottoms of the sides, far away from each other, of the two vertical plates 13, inserting grooves are formed in the inner walls of the sides, far away from each other, of the two rectangular grooves, the inserting plates 15 are clamped with the inserting grooves at the lowest part, operation grooves are formed in the sides, close to each other, of the two matching plates 11, the same operation shaft 14 is rotatably installed in the two operation grooves, two external threads are formed in the outer side of the operation shaft 14, screw holes are formed, the top fixedly connected with traction plate 17 of upper plate 16, the first set-square 18 of top fixedly connected with of traction plate 17, the cardboard hole has been seted up on the bottom inner wall of spout, the downthehole slidable mounting of cardboard has cardboard 19, the draw-in groove has been seted up to the bottom of slide 4, cardboard 19 blocks the dress with the draw-in groove mutually, the bottom fixedly connected with second set-square 20 of cardboard 19, second set-square 20 contacts with the inclined plane of first set-square 18, the top welding of second set-square 20 has spring 21, the top of spring 21 welds in the bottom of board 1 between.

In this embodiment, one side fixedly connected with locating plate of cardboard 19 has seted up the constant head tank on the inner wall of one side in cardboard hole, and locating plate slidable mounting carries on spacingly to cardboard 19 in the constant head tank.

In this embodiment, the two external threads on the operating shaft 14 have opposite directions, and the threads in the two threaded holes have opposite directions.

In this embodiment, the fixed plate 2 and the equal a plurality of rubber pads of fixedly connected with in one side that panel 8 are close to each other, have seted up the through-hole on the rubber pad, and two through-holes are run through to the one end of connecting rod 3.

In this embodiment, a plurality of slots located on the same vertical axis are arranged at equal intervals.

In this embodiment, the bottom of the moving plate 10 contacts the inner wall of the bottom of the moving groove to limit the moving plate 10.

In the utility model, when in use, a semiconductor device is inserted into the connecting rod 3, then the second plate 6 is pushed, the second plate 6 drives the sliding plate 4 to move, the second plate 6 drives the transverse plate 7 to move, the transverse plate 7 drives the panel 8 to move, so that the rubber pad fixes the semiconductor device, then the intermediate plate 1 is pulled, the intermediate plate 1 drives the matching plate 11 to move, the matching plate 11 drives the moving plate 10 to move, the fixed semiconductor device is adjusted to a proper height, then the operating shaft 14 is rotated, the external thread on the operating shaft 14 is in threaded connection with the screw hole to drive the vertical plate 13 to move, the vertical plate 13 drives the horizontal plate 12 to move, the vertical plate 13 drives the inserting plate 15 to move, the inserting plate 15 is clamped into the slot on the same horizontal axis with the inserting plate, one vertical plate 13 drives the upper plate 16 to move, the upper plate 16 drives the traction plate 17 to move, the traction plate 17 drives the first triangular plate 18 to move, the first triangular plate 18 extrudes the second triangular plate 20 to drive the second triangular plate 20 to move, the second triangular plate 20 extrudes the spring 21, and the second triangular plate 20 drives the clamping plate 19 to move, so that the clamping plate 19 is clamped into the clamping groove to fix the sliding plate 4.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A clamp for communicating the front and back surfaces of a semiconductor device comprises a middle plate (1) and is characterized in that one side of the top of the middle plate (1) is fixedly connected with a fixed plate (2), one side of the fixed plate (2) is fixedly connected with a plurality of connecting rods (3), the top of the middle plate (1) is provided with a sliding chute, a sliding plate (4) is arranged in the sliding chute in a sliding manner, two sides of the top of the sliding plate (4) are respectively fixedly connected with a first plate (5) and a second plate (6), one side of the second plate (6) is fixedly connected with two transverse plates (7), the top of the first plate (5) is fixedly connected with the transverse plates (7) below, one side of the two transverse plates (7) is fixedly connected with a same panel (8), one side of the panel (8) is provided with a plurality of connecting rod holes, one end of each connecting rod (3) extends into the corresponding connecting rod hole, the two sides of the stabilizing seat (9) are respectively provided with a moving groove, the moving plates (10) are arranged in the moving grooves in a sliding manner, one sides, far away from each other, of the two moving plates (10) are respectively and fixedly connected with a matching plate (11), the tops of the two matching plates (11) are respectively and fixedly connected with the bottom of the intermediate plate (1), the matching plates (11) are respectively provided with a horizontal hole, the horizontal holes are internally and slidably provided with a horizontal plate (12), one sides, near to each other, of the two horizontal plates (12) are respectively and fixedly connected with a vertical plate (13), the top of the stabilizing seat (9) is provided with two rectangular grooves, the bottoms of the vertical plates (13) extend into the rectangular grooves, the bottoms of the sides, far away from each other, of the two vertical plates (13) are respectively welded with an inserting plate (15), the inner wall of one side, far away from each other, of the two rectangular grooves, same operation axle (14) are installed to two operation inslot rotations, two external screw threads have been seted up in the outside of operation axle (14), the screw has been seted up on riser (13), external screw thread and screw threaded connection on operation axle (14), top fixedly connected with upper plate (16) of riser (13), top fixedly connected with traction plate (17) of upper plate (16), the first set-square (18) of top fixedly connected with of traction plate (17), the cardboard hole has been seted up on the bottom inner wall of spout, downthehole slidable mounting of cardboard has cardboard (19), the draw-in groove has been seted up to the bottom of slide (4), cardboard (19) and draw-in groove looks clamping, the bottom fixedly connected with second set-square (20) of cardboard (19), second set-square (20) contact with the inclined plane of first set-square (18), the top welding of second set-square (20) has spring (21), the bottom of top intermediate lamella (1) of spring (21).

2. The clamp for connecting the front and back of a semiconductor device as claimed in claim 1, wherein a positioning plate is fixedly connected to one side of the clamping plate (19), a positioning groove is formed on an inner wall of one side of the clamping plate hole, and the positioning plate is slidably mounted in the positioning groove.

3. The jig for connecting the front and back of a semiconductor device as claimed in claim 1, wherein the two external threads on the operating shaft (14) are oppositely threaded, and the threads in the two screw holes are oppositely threaded.

4. The clamp for connecting the front and back of a semiconductor device as claimed in claim 1, wherein a plurality of rubber pads are fixedly connected to the sides of the fixing plate (2) and the panel (8) close to each other, through holes are formed on the rubber pads, and one end of the connecting rod (3) penetrates through the two through holes.

5. The fixture for connecting the front and back of a semiconductor device as recited in claim 1, wherein the plurality of slots on the same vertical axis are spaced at equal intervals.

6. The jig for connecting the front and back surfaces of a semiconductor device as claimed in claim 1, wherein the bottom of the moving plate (10) is in contact with the inner wall of the bottom of the moving groove.