CN217670319U

CN217670319U - Single-wire cutting machine for semiconductors

Info

Publication number: CN217670319U
Application number: CN202122428615.2U
Authority: CN
Inventors: 戴磊
Original assignee: Jiangsu Jiasheng Precision Equipment Technology Co ltd
Current assignee: Jiangsu Jiasheng Precision Equipment Technology Co ltd
Priority date: 2021-10-09
Filing date: 2021-10-09
Publication date: 2022-10-28
Anticipated expiration: 2031-10-09

Abstract

The utility model discloses a single line wire cut electrical discharge machining for semiconductor, comprising a supporting base, the upper surface swing joint of supporting seat has the support curb plate, the right flank swing joint who supports the curb plate has the movable block, the right flank fixedly connected with connecting plate of movable block, the lower fixed surface of connecting plate is connected with the spliced pole, the lower surface of spliced pole is provided with the electrode line. The utility model discloses, set up a plurality of stoppers on the mounting panel, can adjust the distance between the stopper according to the size of electrode line cutting semiconductor, the semiconductor that can not lead to the cutting to finish drops, and can not influence the cutting of electrode line, set up first magnet, second magnet, the limiting plate, fix the stopper on the mounting panel, and can not take place the phenomenon of rocking, strengthen the stability of stopper, set up splint, the protection pad, carry out the centre gripping to the semiconductor, and be applicable to not unidimensional semiconductor, can not cause the phenomenon of clamp loss to the semiconductor simultaneously.

Description

Single-wire cutting machine for semiconductors

Technical Field

The utility model relates to a semiconductor cutting technical field especially relates to a single line wire cut electrical discharge machining for semiconductor.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc., for example, diodes are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view. Most electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to a semiconductor.

Some single wire cutting machines at present can't carry out position adjustment to the utensil of placing the semiconductor according to the size of semiconductor cutting when cutting the semiconductor, lead to like this to lead to the semiconductor to drop very easily when cutting, also comparatively inconvenient when collecting moreover to some semiconductors cause the damage to the semiconductor easily when fastening.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art, and provides a single-wire cutting machine for semiconductors.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a single-wire cutting machine for semiconductors comprises a supporting seat, wherein the upper surface of the supporting seat is movably connected with a supporting side plate, the right side surface of the supporting side plate is movably connected with a moving block, the right side surface of the moving block is fixedly connected with a connecting plate, the lower surface of the connecting plate is fixedly connected with a connecting column, and the lower surface of the connecting column is provided with an electrode wire;

the upper surface of the supporting seat and positioned on the right side of the supporting seat are fixedly connected with a supporting plate, the upper surface of the supporting plate is fixedly connected with a mounting plate, the interior of the mounting plate is fixedly connected with a hydraulic cylinder, the output end of the hydraulic cylinder is fixedly connected with a traction block, the upper surface of the mounting plate is provided with a clamping plate, and the left side surface of the clamping plate is fixedly connected with a protective pad;

the upper surface of mounting panel just is located and is provided with the stopper between two splint, the lower fixed surface of stopper connects the fixture block, the lower surface of stopper and the both sides that are located the fixture block all are provided with first magnet, the draw-in groove has been seted up to the upper surface of mounting panel and the below that is located the stopper, the upper surface of mounting panel and the both sides that are located the draw-in groove all are provided with second magnet, and the top of stopper is provided with the limiting plate.

As a further description of the above technical solution:

the lower surface of the clamping plate is fixedly connected with the upper surface of the traction block.

As a further description of the above technical solution:

the upper surface of mounting panel just is located the front side of stopper and is provided with the pull groove, the position of pull block is located the inside of pull groove.

As a further description of the above technical solution:

the splint is L-shaped.

As a further description of the above technical solution:

the mounting plate is connected with the limiting block through a clamping block and a clamping groove.

As a further description of the above technical solution:

the first magnet and the second magnet are attracted, and the two ends of the limiting plate penetrate through the clamping plate and are movably connected with the upper surface of the mounting plate.

As a further description of the above technical solution:

the connecting plate is positioned at the rear side of the mounting plate.

As a further description of the above technical solution:

the limiting blocks are not contacted, and the limiting blocks are arranged in an array.

The utility model discloses following beneficial effect has:

1. compared with the prior art, this a single line wire cut electrical discharge machining for semiconductor through set up a plurality of stoppers on the mounting panel, can adjust the distance between the stopper according to the size of electrode line cutting semiconductor, can not lead to the semiconductor that the cutting finishes to drop, and can not influence the cutting of electrode line, improves the device's practicality.

2. Compared with the prior art, this a single line wire cut electrical discharge machining for semiconductor through setting up first magnet, second magnet, limiting plate, can fix the stopper on the mounting panel, and can not take place the phenomenon of rocking, strengthens the stability of stopper.

3. Compared with the prior art, this a single wire cutting machine for semiconductor through setting up splint, protection pad, can carry out the centre gripping to the semiconductor, and is applicable to not unidimensional semiconductor, can not cause the phenomenon of clamp damage to the semiconductor simultaneously.

Drawings

Fig. 1 is a schematic view of an overall structure of a single wire cutting machine for semiconductors according to the present invention;

fig. 2 is a schematic diagram of an internal structure of a single wire cutting machine for semiconductors according to the present invention;

fig. 3 is a front view of a single wire cutting machine for semiconductors according to the present invention;

fig. 4 is an enlarged view of a portion a in fig. 2.

Illustration of the drawings:

1. a supporting base; 2. supporting the side plates; 3. a connecting plate; 4. a moving block; 5. connecting columns; 6. an electrode wire; 7. a support plate; 8. mounting a plate; 9. a hydraulic cylinder; 10. a traction block; 11. a splint; 12. a protective pad; 13. a limiting block; 14. a clamping block; 15. a card slot; 16. a first magnet; 17. a second magnet; 18. and a limiting plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 to 4, the present invention provides a single wire cutting machine for semiconductor: including supporting seat 1, the upper surface swing joint of supporting seat 1 has support curb plate 2, be convenient for drive electrode line 6 and remove about, the right flank swing joint who supports curb plate 2 has movable block 4, be convenient for beat electrode line 6 and carry out the back-and-forth movement, the right flank fixedly connected with connecting plate 3 of movable block 4, the fixed connection post 5 of being convenient for, the position of connecting plate 3 is located the rear side of mounting panel 8, the lower fixed connection of connecting plate 3 has spliced pole 5, the lower surface of spliced pole 5 is provided with electrode line 6.

Supporting seat 1's upper surface and the right side fixedly connected with backup pad 7 that is located supporting seat 1, be convenient for support mounting panel 8, the last fixed surface of backup pad 7 is connected with mounting panel 8, be convenient for install splint 11, stopper 13, mounting panel 8 passes through fixture block 14 with stopper 13, draw-in groove 15 is connected, mounting panel 8's upper surface and the front side that is located stopper 13 are provided with the pull slot, the pull block 10 of being convenient for slides, the position of pull block 10 is located the inside of pull slot, mounting panel 8's inside fixedly connected with pneumatic cylinder 9, pneumatic cylinder 9's output fixedly connected with pull block 10, mounting panel 8's upper surface is provided with splint 11, be convenient for fix the semiconductor, splint 11 set up the shape and be the L type, conveniently carry out the centre gripping to the semiconductor, splint 11's lower surface and the upper surface fixed connection of pull block 10, splint 11's left surface fixedly connected with protection pad 12, avoid causing the semiconductor to press from both sides the loss.

By adopting the structure, the clamping plate 11 and the protective pad 12 are arranged, so that the semiconductor can be clamped, the clamping device is suitable for semiconductors of different sizes, and meanwhile, the phenomenon of clamping damage to the semiconductor cannot be caused.

Mounting panel 8's upper surface just is located and is provided with stopper 13 between two splint 11, the semiconductor of avoiding cutting finishing drops, contactless between the stopper 13, and a plurality of stopper 13 are the array setting, electrode line 6 cutting of being convenient for, stopper 13's lower fixed surface connects fixture block 14, be convenient for install stopper 13, stopper 13's lower surface just is located the both sides of fixture block 14 and all is provided with first magnet 16, be convenient for attract mutually with second magnet 17, first magnet 16 attracts mutually with second magnet 17, mounting panel 8's upper surface just is located the below of stopper 13 and has seted up draw-in groove 15, be convenient for inlay fixture block 14, mounting panel 8's upper surface just is located the both sides of draw-in groove 15 and all is provided with second magnet 17, be convenient for attract mutually with first magnet 16, be convenient for fixed stopper 13, stopper 13's top is provided with limiting plate 18, be convenient for fix stopper 13, splint 11 is run through at limiting plate 18's both ends, and mounting panel 8's upper surface swing joint.

Through setting up this structure, through setting up a plurality of stoppers 13 on mounting panel 8, can adjust the distance between the stopper 13 according to the size of electrode line 6 cutting semiconductor, can not lead to the semiconductor that the cutting finishes to drop, and can not influence the cutting of electrode line 6, set up first magnet 16, second magnet 17, limiting plate 18, can fix stopper 13 on mounting panel 8, and can not take place the phenomenon of rocking, reinforcing stopper 13's stability.

The working principle is as follows: when using, according to the size to the semiconductor cutting size, come to adjust the distance between the stopper 13 with this, when installing stopper 13, move limiting plate 18 to the outside, fixture block 14 on rethread stopper 13 and draw-in groove 15 on the mounting panel 8 install stopper 13 on the mounting panel 8, rethread first magnet 16 and second magnet 17 attract mutually, move limiting plate 18 to the inside again so that fasten stopper 13, strengthen stopper 13's stability, put the semiconductor that will cut on stopper 13, rethread pneumatic cylinder 9 moves splint 11 to the inside, it can to this fix the semiconductor, at last cut the semiconductor through electrode line 6.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions on some technical features, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a single wire cutting machine for semiconductor, includes supporting seat (1), its characterized in that: the upper surface of the supporting seat (1) is movably connected with a supporting side plate (2), the right side surface of the supporting side plate (2) is movably connected with a moving block (4), the right side surface of the moving block (4) is fixedly connected with a connecting plate (3), the lower surface of the connecting plate (3) is fixedly connected with a connecting column (5), and the lower surface of the connecting column (5) is provided with an electrode wire (6);

a supporting plate (7) is fixedly connected to the upper surface of the supporting seat (1) and positioned on the right side of the supporting seat (1), an installation plate (8) is fixedly connected to the upper surface of the supporting plate (7), a hydraulic cylinder (9) is fixedly connected to the interior of the installation plate (8), a traction block (10) is fixedly connected to the output end of the hydraulic cylinder (9), a clamping plate (11) is arranged on the upper surface of the installation plate (8), and a protective pad (12) is fixedly connected to the left side surface of the clamping plate (11);

the upper surface of mounting panel (8) just is located and is provided with stopper (13) between two splint (11), the lower fixed surface of stopper (13) connects fixture block (14), the lower surface of stopper (13) just is located the both sides of fixture block (14) and all is provided with first magnet (16), draw-in groove (15) have been seted up to the upper surface of mounting panel (8) just is located the below of stopper (13), the upper surface of mounting panel (8) just is located the both sides of draw-in groove (15) and all is provided with second magnet (17), the top of stopper (13) is provided with limiting plate (18).

2. A single wire saw for semiconductors according to claim 1, characterized in that: the lower surface of the clamping plate (11) is fixedly connected with the upper surface of the traction block (10).

3. A single wire saw for semiconductors according to claim 1, characterized in that: the upper surface of mounting panel (8) just is located the front side of stopper (13) and is provided with the pull groove, the position of traction block (10) is located the inside of pull groove.

4. A single wire cutting machine for semiconductors according to claim 1, characterized in that: the splint (11) is L-shaped.

5. A single wire saw for semiconductors according to claim 1, characterized in that: the mounting plate (8) is connected with the limiting block (13) through a clamping block (14) and a clamping groove (15).

6. A single wire saw for semiconductors according to claim 1, characterized in that: first magnet (16) and second magnet (17) attract each other, splint (11) are run through at the both ends of limiting plate (18), and with the upper surface swing joint of mounting panel (8).

7. A single wire saw for semiconductors according to claim 1, characterized in that: the connecting plate (3) is positioned at the rear side of the mounting plate (8).

8. A single wire cutting machine for semiconductors according to claim 1, characterized in that: the limiting blocks (13) are not in contact with each other, and the limiting blocks (13) are arranged in an array.