CN212684919U - High heat conduction graphite heat dissipation film - Google Patents
High heat conduction graphite heat dissipation film Download PDFInfo
- Publication number
- CN212684919U CN212684919U CN202021411668.2U CN202021411668U CN212684919U CN 212684919 U CN212684919 U CN 212684919U CN 202021411668 U CN202021411668 U CN 202021411668U CN 212684919 U CN212684919 U CN 212684919U
- Authority
- CN
- China
- Prior art keywords
- graphite
- layer
- film layer
- heat
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a high heat conduction graphite heat dissipation film, which comprises a silica gel protection film layer, a first graphite film layer, a copper foil layer, a second graphite film layer and a release film layer from top to bottom in sequence; the silica gel protective film layer and the first graphite film layer are fixedly bonded through a first heat-conducting adhesive layer; the upper end and the lower end of the copper foil layer are respectively coated with a graphene coating, the first graphite film layer and the graphene coating are fixedly bonded through a second heat-conducting adhesive layer, and the second graphite film layer and the graphene coating are fixedly bonded through a third heat-conducting adhesive layer; the bottom of the second graphite film layer is coated with a carbon nano coating, and through holes are formed in the first graphite film layer and the second graphite film layer at intervals; the release film layer and the carbon nano coating are fixedly bonded through a fourth heat-conducting adhesive layer. The utility model discloses low, the easy scheduling problem that breaks away from and shifts improves to current graphite heat dissipation membrane heat conductivility, the utility model has the advantages of improve graphite heat dissipation membrane heat conductivility, be difficult for breaking away from and shifting.
Description
Technical Field
The utility model relates to a graphite heat dissipation membrane technical field especially relates to a high heat conduction graphite heat dissipation membrane.
Background
The graphite heat dissipation film is a very thin heat conduction material, also called as a heat conduction graphite film, a heat conduction graphite sheet, a graphite heat dissipation sheet and the like, and provides possibility for thinning development of electronic products. The graphite heat dissipation film has good reprocessing performance, can be compounded with other thin film materials such as PET and the like or coated with glue according to the application, has elasticity, can be cut and stamped into any shape, and can be bent for multiple times; the film is suitable for rapid heat conduction for converting a point heat source into a surface heat source, has high heat conduction performance, and is made of a highly oriented graphite polymer film. At present, graphite heat dissipation films are widely applied to PDP, LCD TV, Notebook PC, UMPC, Flat Panel Display, MPU, Projector, Power Supply, LED, MID, mobile phones; a DVD; a digital camera; computers and peripheral equipment; a sensor; a semiconductor production facility; in electronic products such as optical fiber communication equipment. The PI film is subjected to rewinding, carbonization, graphitization, calendering and other steps to obtain the graphite heat dissipation film.
Along with the development of communication technology, electronic components's operating mode is more and more complicated, consequently the heat that its during operation produced is also more and more to there have been some defects and not enough on solving electronic components radiating problem in current graphite heat dissipation membrane, and its heat conductivility has can't satisfy current electronic components radiating demand, breaks away from easily between the middle level and the layer in current graphite heat dissipation membrane in addition and shifts.
To above technical problem, the utility model discloses a high heat conduction graphite heat dissipation membrane, the utility model has the advantages of improve graphite heat dissipation membrane's heat conductivility, be difficult for appearing breaking away from and the phenomenon of aversion.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art not enough, provide a high heat conduction graphite heat dissipation membrane to the heat conductivility of graphite heat dissipation membrane can't satisfy the radiating demand of current electronic components in solving prior art, technical problem such as the phenomenon that breaks away from and shift appears easily between graphite heat dissipation membrane middle level and the layer, the utility model has the advantages of improve graphite heat dissipation membrane heat conductivility, be difficult for appearing breaking away from and the phenomenon of shifting.
The utility model discloses a following technical scheme realizes: the utility model discloses a high heat conduction graphite heat dissipation film, which comprises a silica gel protection film layer, a first graphite film layer, a copper foil layer, a second graphite film layer and a release film layer from top to bottom in sequence; the silica gel protective film layer and the first graphite film layer are fixedly bonded through a first heat-conducting adhesive layer; the upper end and the lower end of the copper foil layer are respectively coated with a graphene coating, the first graphite film layer and the graphene coating are fixedly bonded through a second heat-conducting adhesive layer, and the second graphite film layer and the graphene coating are fixedly bonded through a third heat-conducting adhesive layer; the bottom of the second graphite film layer is coated with a carbon nano coating, and through holes are formed in the first graphite film layer and the second graphite film layer at intervals; the release film layer and the carbon nano coating are fixedly bonded through a fourth heat-conducting adhesive layer.
Furthermore, in order to improve the heat-conducting property of the graphite heat-radiating film, the section of the copper foil layer is in a wave shape.
Furthermore, in order to improve the heat conductivity of the first heat-conducting adhesive layer and the second heat-conducting adhesive layer and further improve the heat conductivity of the whole graphite heat-radiating film, copper foil strips are embedded inside the first heat-conducting adhesive layer and inside the fourth heat-conducting adhesive layer at equal intervals.
Furthermore, the thickness of the silica gel protective film layer is 10-30 μm.
Furthermore, the thickness of the first graphite film layer and the thickness of the second graphite film layer are both 20-120 μm.
Furthermore, the thickness of the copper foil layer is 30-90 μm.
Furthermore, the thickness of the release film layer is 20-40 μm.
The utility model has the advantages of it is following:
(1) the utility model discloses scribble with carbon nanometer coating at the bottom of second graphite rete, be provided with the copper foil layer on the upper portion of second graphite heat dissipation rete, the upper and lower both ends of copper foil layer are all scribbled with graphite alkene coating, inlay the copper foil strip in first heat-conducting glue film and fourth heat-conducting glue film equal interval, thereby the heat conductivility of graphite heat dissipation membrane has been showing to be promoted;
(2) the utility model discloses it is equipped with the through-hole all to separate on first graphite rete and second graphite rete to it is more firm to have improved the bonding between first graphite rete and first heat-conducting glue layer and the second heat-conducting glue layer, makes the bonding between second graphite rete and third heat-conducting glue layer and the fourth heat-conducting glue layer more firm, thereby makes the graphite radiating film middle part and the difficult phenomenon that breaks away from and shift that appears between the layer.
Drawings
FIG. 1 is a cross-sectional view of the present invention;
fig. 2 is a cross-sectional view of a copper foil layer.
In the figure: 1. a silica gel protective film layer; 2. a first graphite film layer; 3. a copper foil layer; 31. a graphene coating; 4. a second graphite film layer; 5. a release film layer; 6. a first heat-conducting adhesive layer; 7. a second heat-conducting adhesive layer; 8. a third heat-conducting adhesive layer; 9. a carbon nanocoating; 10. a through hole; 100. a fourth heat-conducting adhesive layer; 110. a copper foil strip.
Detailed Description
The embodiments of the present invention will be described in detail below, and the present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.
Example 1
Embodiment 1 discloses a high thermal conductivity graphite heat dissipation film, as shown in fig. 1, the high thermal conductivity graphite heat dissipation film sequentially comprises a silica gel protection film layer 1, a first graphite film layer 2, a copper foil layer 3, a second graphite film layer 4 and a release film layer 5 from top to bottom; the silica gel protective film layer 1 and the first graphite film layer 2 are fixedly bonded through a first heat-conducting adhesive layer 6, and the thickness of the silica gel protective film layer 1 is 10-30 mu m; the upper end and the lower end of the copper foil layer 3 are respectively coated with a graphene coating 31, the first graphite film layer 2 and the graphene coating 31 are fixedly bonded through a second heat-conducting adhesive layer 7, and the second graphite film layer 4 and the graphene coating 31 are fixedly bonded through a third heat-conducting adhesive layer 8; as shown in fig. 1 and 2, the section of the copper foil layer 2 is in a wave shape, and the thickness of the copper foil layer 2 is 30-90 μm; the bottom of the second graphite film layer 4 is coated with a carbon nano coating 9, and through holes 10 are formed in the first graphite film layer 2 and the second graphite film layer 4 at intervals; the thickness of the first graphite film layer 2 and the thickness of the second graphite film layer 4 are both 20-120 mu m; bond fixedly between the release film layer 5 and the carbon nano coating 9 through the fourth heat-conducting adhesive layer 100, the thickness of the release film layer 5 is 20-40 μm, and the copper foil strips 110 are embedded in the first heat-conducting adhesive layer 6 and the fourth heat-conducting adhesive layer 100 at intervals.
The principle of the utility model is as follows: the utility model discloses it has carbon nanometer coating 9 to scribble in the bottom of second graphite rete 4, upper portion at second graphite rete 4 is provided with copper foil layer 3, the upper and lower both ends of copper foil layer 3 are all scribbled and are had graphene coating 31, it has copper foil strip 110 to inlay at equal interval in first heat-conducting glue layer 6 and fourth heat-conducting glue layer 100, carbon nanometer coating 9, copper foil layer 3 and graphene coating 31 all have excellent heat conductivility, and the cross-section of copper foil layer 2 is "wave", thereby the area of heat transfer has been increased, interval sets up copper foil strip 110 in first heat-conducting glue layer 6 and second heat-conducting glue layer 100, also make the better inside transmission at first heat-conducting glue layer 6 and fourth heat-conducting glue layer 100 of heat transfer, thereby the heat conductivility of graphite radiating film has been showing to be promoted; the utility model discloses through-hole 10 has been seted up at equal interval on first graphite rete 2 and second graphite rete 4 to it is more firm to have improved the bonding between first graphite rete 2 and first heat-conducting glue layer 6 and the second heat-conducting glue layer 7, and it is more firm to make the bonding between second graphite rete 4 and third heat-conducting glue layer 8 and the fourth heat-conducting glue layer 100, thereby makes the graphite heat dissipation membrane middle part and between the layer be difficult for appearing breaking away from and the phenomenon of aversion.
Claims (7)
1. The high-thermal-conductivity graphite heat dissipation film is characterized by comprising a silica gel protection film layer, a first graphite film layer, a copper foil layer, a second graphite film layer and a release film layer from top to bottom in sequence;
the silica gel protective film layer and the first graphite film layer are fixedly bonded through a first heat-conducting adhesive layer;
the upper end and the lower end of the copper foil layer are respectively coated with a graphene coating, the first graphite film layer and the graphene coating are fixedly bonded through a second heat-conducting adhesive layer, and the second graphite film layer and the graphene coating are fixedly bonded through a third heat-conducting adhesive layer;
the bottom of the second graphite film layer is coated with a carbon nano coating, and through holes are formed in the first graphite film layer and the second graphite film layer at intervals;
and the release film layer and the carbon nano coating are fixedly bonded through a fourth heat-conducting adhesive layer.
2. The high thermal conductivity graphite heat dissipation film of claim 1, wherein the copper foil layer has a "wave-shaped" cross section.
3. The graphite heat dissipation film as recited in claim 1, wherein copper foil strips are embedded in the first layer of heat conductive adhesive and the fourth layer of heat conductive adhesive at intervals.
4. The graphite heat dissipation film of claim 1, wherein the silica gel protective film has a thickness of 10-30 μm.
5. The high thermal conductivity graphite heat dissipation film as recited in claim 1, wherein the thickness of each of the first graphite film layer and the second graphite film layer is 20-120 μm.
6. The graphite heat dissipation film of claim 1, wherein the copper foil layer has a thickness of 30-90 μm.
7. The high thermal conductivity graphite heat dissipation film of claim 1, wherein the thickness of the release film layer is 20-40 μm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021411668.2U CN212684919U (en) | 2020-07-17 | 2020-07-17 | High heat conduction graphite heat dissipation film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021411668.2U CN212684919U (en) | 2020-07-17 | 2020-07-17 | High heat conduction graphite heat dissipation film |
Publications (1)
Publication Number | Publication Date |
---|---|
CN212684919U true CN212684919U (en) | 2021-03-12 |
Family
ID=74899623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202021411668.2U Active CN212684919U (en) | 2020-07-17 | 2020-07-17 | High heat conduction graphite heat dissipation film |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN212684919U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114714687A (en) * | 2022-03-30 | 2022-07-08 | 安徽碳华新材料科技有限公司 | Graphite heat dissipation film free of halogen residues and preparation method thereof |
-
2020
- 2020-07-17 CN CN202021411668.2U patent/CN212684919U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114714687A (en) * | 2022-03-30 | 2022-07-08 | 安徽碳华新材料科技有限公司 | Graphite heat dissipation film free of halogen residues and preparation method thereof |
CN114714687B (en) * | 2022-03-30 | 2023-09-29 | 安徽碳华新材料科技有限公司 | Preparation method of graphite heat dissipation film without halogen residues |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105517423B (en) | A kind of high heat conduction graphene heat radiating metal foil | |
EP1467856B1 (en) | Improved thermal interface material | |
CN208200824U (en) | A kind of graphene Heat dissipation adhesive tape with buffering effect | |
CN212684919U (en) | High heat conduction graphite heat dissipation film | |
CN112208173A (en) | Thermal interface material and preparation method thereof | |
CN204707402U (en) | Heat transfer sheets | |
CN212864650U (en) | Combined type graphite alkene heat dissipation membrane | |
CN210011437U (en) | Heat-conducting silica gel heat-dissipation composite film | |
CN216414615U (en) | Heat conducting film for flexible screen | |
CN212211819U (en) | Composite graphite heat dissipation film | |
CN211307732U (en) | Shielding heat dissipation Mylar film | |
CN209098564U (en) | A kind of NEW TYPE OF COMPOSITE adhesive tape | |
CN103037669A (en) | Graphite heat-conducting flake | |
CN210381699U (en) | PI conducting strip | |
CN202738258U (en) | Efficient heat dissipating flexible circuit board | |
CN215712764U (en) | Heat conduction double-sided tape of aluminium foil substrate | |
CN201805619U (en) | Voltage-proof double-sided circuit board with excellent heat dissipation performance | |
CN218577190U (en) | Copper-clad plate with low thermal expansion coefficient and high heat resistance | |
CN219802966U (en) | High heat conduction interface composite layer structure | |
CN210406048U (en) | Composite heat conduction structure with efficient laminating effect | |
CN215850022U (en) | Graphite flake composite heat dissipation material for electronic product | |
EP3388870B1 (en) | Composite structure and method for producing the same and electronic device | |
CN216236829U (en) | Heat-conducting film for folding screen | |
CN217770449U (en) | Flexible heat dissipation film and printed circuit board | |
CN210956308U (en) | High-stability insulating Mylar film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230103 Address after: 223001 No.1 Heshun Road, Xuyang Street, Huai'an Economic and Technological Development Zone, Huai'an City, Jiangsu Province Patentee after: Huai'an Hengtan New Material Technology Co.,Ltd. Address before: 241000 No.42 Yanghe Road, South District, high tech Industrial Development Zone, Yijiang District, Wuhu City, Anhui Province Patentee before: Anhui hengtan New Material Technology Co.,Ltd. |