CN210381699U - PI conducting strip - Google Patents
PI conducting strip Download PDFInfo
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- CN210381699U CN210381699U CN201920593911.8U CN201920593911U CN210381699U CN 210381699 U CN210381699 U CN 210381699U CN 201920593911 U CN201920593911 U CN 201920593911U CN 210381699 U CN210381699 U CN 210381699U
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- heat
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- conducting
- gel layer
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Abstract
The utility model relates to the field of electronic heat conduction, and discloses a PI heat conducting strip, which comprises a PI layer, a first heat-conducting silica gel layer is attached to one side of the PI layer, a second heat-conducting silica gel layer is attached to the other side of the PI layer, the first heat-conducting silica gel layer and the second heat-conducting silica gel layer are high heat-conducting dealcoholization type RTV silica gel layers, and the PI layer is compounded, so that the electric insulation property of the product is improved, meanwhile, the RTV silicone oil system has excellent physical properties of temperature resistance, corrosion resistance, radiation resistance and the like, has better dielectric property than an addition type silicone oil system, therefore, the dielectric property of the product can be further improved, in addition, the strength and the flexibility of the product are better than those of the common non-base material enhanced heat-conducting silica gel sheet, meanwhile, the operability and the puncture resistance are improved, and in addition, the heat conductivity is better than that of a glass fiber cloth reinforced silica gel sheet (silicon adhesive tape and the like), so that the glass fiber cloth reinforced silica gel sheet can be applied to heat-conducting insulating electronic products with higher requirements.
Description
Technical Field
The utility model relates to an electron heat conduction field, in particular to PI conducting strip.
Background
The existing heat conducting sheet is mainly composed of an addition type silicone resin matrix, and a glass fiber cloth substrate is synthesized inside the heat conducting sheet, so that the heat conducting sheet with the structure has poor dielectric property, low sheet strength and easy deformation and tearing, and is difficult to use in high-requirement heat conducting insulation electronic products due to the large thickness of the heat conducting sheet.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide a PI conducting strip that dielectric property is good, and thin slice intensity is high.
The utility model provides a technical scheme that its technical problem adopted is: the PI heat conducting strip comprises a PI layer, wherein a first heat conducting silica gel layer is attached to one side of the PI layer, and a second heat conducting silica gel layer is attached to the other side of the PI layer.
The PI layer is compounded in the structure, so that the electrical insulation of the product is improved, and the structure has excellent physical properties of temperature resistance, corrosion resistance, radiation resistance and the like.
Further, the method comprises the following steps: the first heat-conducting silica gel layer and the second heat-conducting silica gel layer are high heat-conducting dealcoholization type RTV silica gel layers.
Further, the method comprises the following steps: the first heat-conducting silica gel layer and the second heat-conducting silica gel layer are high heat-conducting oxime-removing RTV silica gel layers.
Further, the method comprises the following steps: the thickness of the PI layer is 25-75 um.
Further, the method comprises the following steps: the thickness of PI conducting strip is 80-300 um.
The utility model has the advantages that: this application is owing to compound the PI layer, the product electrical insulation has been improved, it has the temperature resistance simultaneously, good rerum natura such as anti-corrosion radiation protection, RTV silicone oil system has better dielectric property than addition type silicone oil system in addition, consequently, the product dielectric property can further be improved, product intensity and flexibility are better than general no substrate reinforcing heat conduction silica gel piece in addition, increase maneuverability simultaneously, prevent puncture nature, in addition the heat conductivity is better than glass fine cloth reinforcing silica gel piece (silicon adhesive tape etc.) is effectual, consequently, can apply to in the heat conduction insulating type electronic product of higher requirement.
Drawings
Fig. 1 is a schematic structural view of a PI heat conducting sheet.
Labeled as: a PI layer 1; a first heat-conducting silica gel layer 2; and a second heat-conducting silica gel layer 3.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the following detailed description.
The PI heat conducting strip shown in fig. 1 comprises a PI layer 1, a first heat conducting silica gel layer 2 is attached to one side of the PI layer 1, a second heat conducting silica gel layer 3 is attached to the other side of the PI layer 1, the first heat conducting silica gel layer 2 and the second heat conducting silica gel layer 3 are high heat conducting dealcoholization type RTV silica gel layers, and the framework manufacturing steps are as follows: the RTV heat-conducting glue is coated on a PI film, after solidification, a thin heat-conducting coating with excellent adhesive force, namely a high-heat-conducting dealcoholization type RTV silica gel layer, is formed on the surface, the RTV heat-conducting glue is liquid, and is prepared by alkoxy end-capped modified 107 silicone oil, alumina with different particle sizes, silicon carbide and boron nitride composite heat-conducting powder, compounding part of auxiliaries are uniformly stirred, vacuumizing, bubble discharging, sealing and packaging, and the manufacturing process is a conventional manufacturing process, so that redundant description is not repeated here. This application is owing to compound PI layer 1, the product electrical insulation has been improved, it has the temperature resistance simultaneously, good rerum natura such as anti-corrosion radiation protection, RTV silicone oil system has better dielectric property than addition type silicone oil system in addition, consequently, the product dielectric property can further be improved, product intensity and flexibility are better than general no substrate reinforcing heat conduction silica gel piece in addition, increase maneuverability simultaneously, prevent puncture nature, in addition the heat conductivity is better than glass fine cloth reinforcing silica gel piece (silicon adhesive tape etc.) is effectual, consequently, can apply to in the heat conduction insulation class electronic product of higher requirement.
On the basis, the first heat-conducting silica gel layer 2 and the second heat-conducting silica gel layer 3 are high heat-conducting oxime-removing RTV silica gel layers.
On the basis, the thickness of the PI layer 1 is 25-75um, the thickness of the PI heat conducting sheet is 80-300um, and the thickness enables the high-requirement heat conducting insulating electronic product to be used, so that the application range of the product is enlarged.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (3)
1. A PI conducting strip is characterized in that: including the PI layer, PI layer one side is adhered to there is first heat conduction silica gel layer, PI layer opposite side is adhered to there is second heat conduction silica gel layer, first heat conduction silica gel layer and second heat conduction silica gel layer are high heat conduction dealcoholize formula RTV silica gel layer or high heat conduction deoximation type RTV silica gel layer.
2. The PI heat transfer sheet of claim 1, wherein: the thickness of the PI layer is 25-75 um.
3. The PI heat transfer sheet of claim 1, wherein: the thickness of PI conducting strip is 80-300 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920593911.8U CN210381699U (en) | 2019-04-26 | 2019-04-26 | PI conducting strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920593911.8U CN210381699U (en) | 2019-04-26 | 2019-04-26 | PI conducting strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210381699U true CN210381699U (en) | 2020-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920593911.8U Active CN210381699U (en) | 2019-04-26 | 2019-04-26 | PI conducting strip |
Country Status (1)
| Country | Link |
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| CN (1) | CN210381699U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112078136A (en) * | 2020-08-31 | 2020-12-15 | 广东力王新材料有限公司 | Preparation method of transparent silica gel cloth |
-
2019
- 2019-04-26 CN CN201920593911.8U patent/CN210381699U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112078136A (en) * | 2020-08-31 | 2020-12-15 | 广东力王新材料有限公司 | Preparation method of transparent silica gel cloth |
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