CN212659097U - Element layer for electronic passport and electronic passport - Google Patents
Element layer for electronic passport and electronic passport Download PDFInfo
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- CN212659097U CN212659097U CN202020973341.8U CN202020973341U CN212659097U CN 212659097 U CN212659097 U CN 212659097U CN 202020973341 U CN202020973341 U CN 202020973341U CN 212659097 U CN212659097 U CN 212659097U
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Abstract
The utility model discloses an element layer and electronic passport for electronic passport, including chip module, gap bridge module and bearer layer, the bearer layer is square thin slice structure, a surface of the bearer layer is equipped with antenna coil, two first conductive parts that set up relatively and two second conductive parts that set up relatively respectively; the chip module is clamped between the two first conductive parts and is respectively connected with the two first conductive parts, the two second conductive parts are connected through the bridge module, and the two first conductive parts and the two second conductive parts are respectively arranged at the positions, close to corners, of the bearing layer; the utility model discloses a set up antenna coil, chip module, gap bridge module, two first conductive parts and two second conductive parts and establish ties and form the closed loop's circuit to locate the position that the bearer layer is close to the corner with chip module and gap bridge module, and then make the passport when the fifty percent discount, chip module and the difficult atress damage of gap bridge module, the difficult inefficacy of component layer.
Description
Technical Field
The utility model relates to an element layer radio frequency identification and smart card packaging technical field especially relate to an element layer and electronic passport for electronic passport.
Background
Passports are documents used by citizens when they step out of the country and live in, and are the legal basis for proving the nationality and identity of the licensee. In recent years, with the wide application of RFID (radio Frequency identification), namely, radio Frequency identification technology, an international universal electronic passport is formed by applying RFID to a passport, which is convenient for users to use and more effectively protects the information security of users. In daily use of the electronic passport, the passport is often bent from the center of the passport by a user, and the chip in the element layer is easily damaged by frequent bending, thereby causing the element layer to fail.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: provided are an element layer for an electronic passport and an electronic passport which are less likely to fail.
In order to solve the technical problem, the utility model discloses a technical scheme be: an element layer for an electronic passport comprises a chip module, a bridge module and a bearing layer, wherein the bearing layer is of a square sheet structure, and one surface of the bearing layer is respectively provided with an antenna coil, two first conductive parts which are oppositely arranged and two second conductive parts which are oppositely arranged;
the chip module is clamped between the two first conductive parts and is respectively connected with the two first conductive parts, the two second conductive parts are connected through the bridge module, and the two first conductive parts and the two second conductive parts are respectively arranged at the positions, close to corners, of the bearing layer;
the antenna coil comprises a wiring head part and a wiring tail part, wherein the wiring head part is connected with one first conductive part of the two first conductive parts, the wiring tail part is connected with one second conductive part of the two second conductive parts, and the other first conductive part is connected with the other second conductive part.
Furthermore, a through hole is formed in the position, corresponding to the chip module, of the bearing layer, and the chip module is arranged in the through hole.
Further, the antenna coil is a hollow spiral surrounded antenna, and the hollow shape is a rounded rectangle.
Further, the two first conductive parts are located at corner positions within the hollow range of the antenna.
Further, one of the two second conductive parts is located at a corner position within the hollow range of the antenna, and the other second conductive part is located at an outer side of the antenna.
Further, one of the two second conductive portions is located adjacent to the two first conductive portions within the hollow range of the antenna.
Furthermore, the chip module comprises a chip and two pins, wherein the two pins are oppositely arranged on the chip and are respectively connected with the two first conductive parts in sequence.
Further, the bridge module comprises a bridge protective layer, a bridge conductive layer and a bridge insulating layer which are sequentially arranged, the bridge insulating layer is close to the bearing layer, and the bridge conductive layer is respectively connected with the two second conductive parts.
Furthermore, the element layer for the electronic passport further comprises a front protective layer and a back protective layer, and the front protective layer, the bearing layer and the back protective layer are sequentially arranged in a pressing mode.
The utility model discloses still provide an electronic passport, include above-mentioned an element layer for electronic passport.
The beneficial effects of the utility model reside in that: the antenna coil, the chip module, the gap bridge module, the two first conductive parts and the two second conductive parts are connected in series to form a closed loop circuit, the chip module and the gap bridge module are arranged at the position, close to the corner, of the bearing layer, and therefore when the passport is folded in half, the chip module and the gap bridge module are not prone to stress damage, and the element layer is not prone to failure.
Drawings
Fig. 1 is a schematic structural diagram of an element layer of an electronic passport according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of the chip module shown in FIG. 1;
FIG. 3 is a schematic cross-sectional view of the bridge module of FIG. 1;
fig. 4 is a schematic structural diagram of an antenna coil, two first conductive portions and two second conductive portions in an element layer of an electronic passport according to an embodiment of the present invention;
description of reference numerals:
10. a carrier layer; 20. a chip module; 30. a bridge module;
11. an antenna coil; 121/122, a first conductive portion; 131/132, a second conductive portion;
111. a wiring head; 112. a wiring tail;
21. a chip; 221/222, pins;
31. a bridge insulating layer; 32. a bridge conductive layer; 33. and a bridge protection layer.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.
The utility model discloses the most crucial design lies in: the chip module and the gap bridge module are arranged at the positions, close to the corners, of the bearing layer, so that when the passport is folded in half, the chip module and the gap bridge module are not prone to stress damage, and the element layer is not prone to failure.
Referring to fig. 1-4, an element layer for an electronic passport includes a chip module, a bridge module, and a carrier layer, where the carrier layer is a square sheet structure, and one surface of the carrier layer is respectively provided with an antenna coil, two first conductive portions disposed opposite to each other, and two second conductive portions disposed opposite to each other;
the chip module is clamped between the two first conductive parts and is respectively connected with the two first conductive parts, the two second conductive parts are connected through the bridge module, and the two first conductive parts and the two second conductive parts are respectively arranged at the positions, close to corners, of the bearing layer;
the antenna coil comprises a wiring head part and a wiring tail part, wherein the wiring head part is connected with one first conductive part of the two first conductive parts, the wiring tail part is connected with one second conductive part of the two second conductive parts, and the other first conductive part is connected with the other second conductive part.
From the above description, the beneficial effects of the present invention are: the antenna coil, the chip module, the gap bridge module, the two first conductive parts and the two second conductive parts are connected in series to form a closed loop circuit, the chip module and the gap bridge module are arranged at the position, close to the corner, of the bearing layer, and therefore when the passport is folded in half, the chip module and the gap bridge module are not prone to stress damage, and the element layer is not prone to failure.
Furthermore, a through hole is formed in the position, corresponding to the chip module, of the bearing layer, and the chip module is arranged in the through hole.
As can be seen from the above description, the through holes are formed on the surface of the carrier layer, and the chip modules are placed in the through holes, so as to prevent the chip modules from being exposed on the surface of the carrier layer and from being damaged.
Further, the antenna coil is a hollow spiral surrounded antenna, and the hollow shape is a rounded rectangle.
Further, the two first conductive parts are located at corner positions within the hollow range of the antenna.
As can be seen from the above description, the two first conductive portions are disposed at the corners of the hollow area of the antenna, so as to ensure that the chip module is not damaged along with the folding of the element layer.
Further, one of the two second conductive parts is located at a corner position within the hollow range of the antenna, and the other second conductive part is located at an outer side of the antenna.
As can be seen from the above description, one of the second conductive portions is disposed at a corner of the antenna within the hollow range, so as to ensure that the bridge module is not damaged when the element layer is folded in half under a force.
Further, one of the two second conductive portions is located adjacent to the two first conductive portions within the hollow range of the antenna.
Furthermore, the chip module comprises a chip and two pins, wherein the two pins are oppositely arranged on the chip and are respectively connected with the two first conductive parts in sequence.
As can be seen from the above description, the chip is sequentially connected to the two first conductive parts through the two pins, respectively, for connecting the chip module to the circuit.
Further, the bridge module comprises a bridge protective layer, a bridge conductive layer and a bridge insulating layer which are sequentially arranged, the bridge insulating layer is close to the bearing layer, and the bridge conductive layer is respectively connected with the two second conductive parts.
As can be seen from the above description, the bridge protection layer is used to protect the bridge conductive layer from being damaged by stress; the bridging insulating layer is used for preventing the circuit from being short-circuited when the bridging conductive layer is communicated with the two second conductive parts; the bridging conducting layer is respectively connected with the two second conducting parts and used for forming a closed-loop circuit.
Furthermore, the element layer for the electronic passport further comprises a front protective layer and a back protective layer, and the front protective layer, the bearing layer and the back protective layer are sequentially arranged in a pressing mode.
As can be seen from the above description, the front protective layer and the back protective layer are used to protect the chip module, the bridge module, the antenna coil and the carrier layer from being damaged by stress.
The utility model discloses still provide an electronic passport, include above-mentioned an element layer for electronic passport.
Referring to fig. 1-4, a first embodiment of the present invention is:
as shown in fig. 1, the electronic passport of the present embodiment includes an element layer for an electronic passport, including a chip module 20, a bridge module 30, a carrier layer 10, a front surface protection layer and a back surface protection layer, where the carrier layer 10 is a square sheet structure, and one surface of the carrier layer 10 is respectively provided with a hollow spiral antenna coil 11, two first conductive portions 121/122 disposed opposite to each other, and two second conductive portions 131/132 disposed opposite to each other;
the hollow shape of the antenna coil 11 is a rounded rectangle, the material of the antenna coil 11 is copper foil, and the antenna coil 11 is formed on the bearing layer 10 in an etching mode;
the two first conductive portions 121/122 are respectively located in the hollow range of the antenna coil 11 and at the lower left corner of the rounded rectangle; the second conductive part 131 is located in the hollow range of the antenna coil 11 and at the lower right corner of the rounded rectangle, and the second conductive part 132 is located outside the antenna coil 11;
the antenna coil 11 includes a terminal portion 111 and a terminal portion 112, the terminal portion 111 is connected to the first conductive portion 121, the terminal portion 112 is connected to the second conductive portion 132, and the first conductive portion 122 is connected to the second conductive portion 131 by a wire;
the chip module 20 comprises a chip 21 and two pins 221/222, wherein the two pins 221/222 are oppositely arranged on the chip 21; through holes are formed in the positions, corresponding to the chip modules 20, of the bearing layer 10, and the chips 21 are arranged in the through holes;
the bridge module 30 comprises a bridge protection layer 33, a bridge conductive layer 32 and a bridge insulating layer 31 which are sequentially arranged, and the bridge insulating layer 31 is arranged close to the bearing layer 10;
the chip module 20 is sandwiched between the two first conductive parts 121/122, and two pins 221/222 are respectively and sequentially welded with the two first conductive parts 121/122, and two second conductive parts 131/132 are respectively welded with the bridge conductive layer 32;
the antenna coil 11, the chip module 20, the bridge module 30, the two first conductive parts 121/122 and the two second conductive parts 131/132 are respectively connected in series to form a closed-loop circuit.
The bonding process between the chip module 20 and the two first conductive portions 121/122 is as follows: solder pastes are respectively coated on the welding positions of the two first conductive parts 121/122, and the two pins 221/222 are correspondingly placed on the welding positions; then, the soldering points of the two first conductive portions 121/122 are preheated at 120 degrees to prevent the positions of the solder paste and the chip module 20 from being changed; finally, laser welding is carried out on the welding position, and the solder paste coated on the welding position of the two first conductive parts 121/122 respectively forms rivet-shaped solder blocks under high temperature generated by the laser welding, wherein the two pins 221/222 are respectively and sequentially fixed on the two first conductive parts 121/122 by the rivet-shaped solder blocks; the bridge module 30 is soldered to the two second conductive portions 131/132 in the same soldering manner;
a rivet-shaped tin block can be formed at the welding position of the two first conductive parts 121/122 in a tin ball implanting mode;
the front protective layer, the bearing layer 10 and the back protective layer are sequentially arranged in a pressing manner, the front protective layer is bonded with the bearing layer 10 through an adhesive, the bearing layer 10 is bonded with the back protective layer through an adhesive, and the front protective layer covers the closed-loop circuit to protect the chip module 20, the bridge module 30 and the antenna coil 11 and prevent the chip module, the bridge module and the antenna coil from being damaged by stress;
preferably, the material of the bearing layer 10, the front protective layer and the back protective layer is one of PC, PETG and TESLIN; the bridge protection layer 33 is made of PET or PI, and the bridge conductive layer 32 is made of copper foil or gold foil.
In actual use, the whole element layer is arranged in the interlayer of the passport and is fused with other interlayers of the passport to form a cover sheet of the passport, and after the element layer is read by external equipment, the information stored in the chip 21 is transmitted to the external equipment, so that the aims of verifying authenticity and preventing counterfeiting are fulfilled. The chip 21 and the bridge module 30 are arranged at a position far away from the passport page near the corner; the user can not roll over chip and gap bridge module to the passport from middle fifty percent discount, avoids chip and gap bridge module atress to damage, and then has also avoided the component layer inefficacy.
To sum up, the utility model provides an element layer and electronic passport for electronic passport carries out the circuit that establishes ties and form the closed loop through setting up antenna coil, chip module, gap bridge module, two first conductive parts and two second conductive parts to locate the position that the bearer layer is close to the corner with chip module and gap bridge module, and then make the passport when the fifty percent discount, chip module and the difficult atress damage of gap bridge module, the difficult inefficacy of element layer.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. An element layer for an electronic passport is characterized by comprising a chip module, a bridge module and a bearing layer, wherein the bearing layer is of a square sheet structure, and one surface of the bearing layer is respectively provided with an antenna coil, two first conductive parts which are oppositely arranged and two second conductive parts which are oppositely arranged;
the chip module is clamped between the two first conductive parts and is respectively connected with the two first conductive parts, the two second conductive parts are connected through the bridge module, and the two first conductive parts and the two second conductive parts are respectively arranged at the positions, close to corners, of the bearing layer;
the antenna coil comprises a wiring head part and a wiring tail part, wherein the wiring head part is connected with one first conductive part of the two first conductive parts, the wiring tail part is connected with one second conductive part of the two second conductive parts, and the other first conductive part is connected with the other second conductive part.
2. The component layer of claim 1, wherein the carrier layer has a through hole at a position corresponding to the chip module, and the chip module is disposed in the through hole.
3. The component layer of claim 1, wherein the antenna coil is a hollow spiral antenna and the hollow shape is a rounded rectangle.
4. The device layer of claim 3, wherein the two first conductive portions are located at corners of the hollow area of the antenna.
5. The device layer of claim 3, wherein one of the two second conductive portions is located at a corner of the hollow area of the antenna, and the other of the two second conductive portions is located at an outer side of the antenna.
6. The component layer of claim 4, wherein one of the two second conductive portions is located adjacent to the two first conductive portions within the hollow of the antenna.
7. The device layer of any of claims 1-6, wherein the chip module comprises a chip and two leads, the two leads being disposed opposite to each other on the chip and being connected to the two first conductive portions in sequence.
8. The component layer for an electronic passport according to any one of claims 1 to 6, wherein said bridge module includes a bridge protection layer, a bridge conductive layer and a bridge insulating layer, which are disposed in this order, said bridge insulating layer being disposed adjacent to said carrier layer, said bridge conductive layer being connected to each of the two second conductive portions.
9. The component layer for an electronic passport according to any one of claims 1 to 6, further comprising a front protective layer and a back protective layer, wherein the front protective layer, the carrier layer and the back protective layer are sequentially laminated.
10. An electronic passport, comprising the element layer for an electronic passport according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020973341.8U CN212659097U (en) | 2020-06-01 | 2020-06-01 | Element layer for electronic passport and electronic passport |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020973341.8U CN212659097U (en) | 2020-06-01 | 2020-06-01 | Element layer for electronic passport and electronic passport |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212659097U true CN212659097U (en) | 2021-03-05 |
Family
ID=74748160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020973341.8U Active CN212659097U (en) | 2020-06-01 | 2020-06-01 | Element layer for electronic passport and electronic passport |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212659097U (en) |
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2020
- 2020-06-01 CN CN202020973341.8U patent/CN212659097U/en active Active
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