CN212648450U - Liquid cooling waveguide integrated synthetic network - Google Patents
Liquid cooling waveguide integrated synthetic network Download PDFInfo
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- CN212648450U CN212648450U CN202021680875.8U CN202021680875U CN212648450U CN 212648450 U CN212648450 U CN 212648450U CN 202021680875 U CN202021680875 U CN 202021680875U CN 212648450 U CN212648450 U CN 212648450U
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Abstract
A liquid cooled waveguide integrated composite network, comprising: a main body; the waveguide power distribution network is arranged on one side inside the main body; the waveguide synthesis network is arranged at the other side in the main body; the external input waveguide interface is connected to the outer end of the waveguide power dividing network and arranged on one side of the main body; the external output waveguide interface is connected to the outer end of the waveguide synthesis network; the internal solid-state power amplifier input waveguide interface is connected to the inner side end of the waveguide power distribution network; the internal solid-state power amplifier output waveguide interface is connected to the inner side end of the waveguide synthesis network; a liquid cooling flow passage formed in the main body; the liquid cooling runner output interface is communicated with one end of the liquid cooling runner; the liquid cooling runner input interface is communicated with the other end of the liquid cooling runner; the solid-state power amplifier mounting interfaces are at least one in number and are arranged on the main body. The solid-state power amplifier realizes power synthesis and solves the problem of heat dissipation of the solid-state power amplifier, so that the realization of the solid-state power amplifier can change the power volume ratio and the higher integration level, and the solid-state power amplifier has stronger practicability.
Description
Technical Field
The utility model relates to an integration network especially relates to a liquid cooling waveguide integration network.
Background
With the development of the times, the radio frequency industry has higher and higher requirements on power, volume and weight of the solid-state power amplifier, and on the basis of the requirements, the solid-state power amplifier gradually develops towards high integration, high power and miniaturization on the premise of ensuring the electrical performance. Because the power amplifier chip has low efficiency and is limited by thermal control capability, the power of a single chip is small, and if high-power output needs to be realized, a multi-chip power synthesis mode is usually adopted. During power synthesis, the heat dissipation of the solid-state power amplifier becomes the main bottleneck of the miniaturization of the solid-state power amplifier.
Disclosure of Invention
The utility model provides an integrative synthetic network of liquid cooling waveguide to solve above-mentioned prior art not enough, the structure integrated design of waveguide synthetic network and liquid cooling runner has solved solid-state power amplifier's heat dissipation difficult problem when realizing power synthesis, makes solid-state power amplifier's realization change power volume ratio, higher integrated level possible, has stronger practicality.
In order to realize the purpose of the utility model, the following technologies are adopted:
a liquid cooled waveguide integrated composite network, comprising:
a main body;
the waveguide power distribution network is arranged on one side inside the main body;
the waveguide synthesis network is arranged at the other side in the main body;
the external input waveguide interface is connected to the outer end of the waveguide power dividing network, arranged on one side of the main body, connected with the external input waveguide port and used for transmitting external radio-frequency signals of the waveguide network;
the external output waveguide interface is connected to the outer side end of the waveguide synthesis network, arranged on the other side of the main body, connected with the external output waveguide port and used for transmitting external radio-frequency signals of the waveguide network;
the internal solid power amplifier input waveguide interface is connected to the inner side end of the waveguide power distribution network, and two ends of the internal solid power amplifier input waveguide interface extend out of the main body;
the internal solid power amplifier output waveguide interface is connected to the inner side end of the waveguide synthesis network, and two ends of the internal solid power amplifier output waveguide interface extend out of the main body;
the liquid cooling runner is formed in the main body in a wave-shaped structure and is positioned between the waveguide power distribution network and the waveguide synthesis network;
the liquid cooling flow passage output interface is communicated with one end of the liquid cooling flow passage and is used for installing a fluid quick connector;
the liquid cooling flow passage input interface is communicated with the other end of the liquid cooling flow passage and is used for installing a fluid quick connector;
the solid-state power amplifier mounting interfaces are arranged on the main body, and the number of the solid-state power amplifier mounting interfaces is a plurality, and the solid-state power amplifier mounting interfaces are used for fixing the solid-state power amplifier module.
Further, the main body is formed by welding a pair of structures having the same structure.
Furthermore, the main body is welded by adopting a vacuum brazing mode, a vacuum diffusion welding mode, an electron beam welding mode or a friction stir welding mode.
Further, the waveguide power dividing network is a one-to-many waveguide power dividing network and is distributed in a corner mode.
Furthermore, the waveguide synthesis network is an all-in-one waveguide synthesis network and is distributed in a corner mode.
Furthermore, the external input waveguide interface and the external output waveguide interface adopt a waveguide flange structure.
Furthermore, the liquid cooling flow passage output interface and the liquid cooling flow passage input interface are connected with the fluid quick connector through threads or flanges.
Further, the liquid cooling runner includes a plurality of sections of narrow runner, all communicates there is wide runner between the narrow runner, all is equipped with the conducting strip in the wide runner a plurality ofly.
The technical scheme has the advantages that:
1. the utility model optimizes the space of the waveguide synthesis network through the integrated structure design of the solid-state power amplifier waveguide synthesis network and the liquid cooling runner, and integrates the liquid cooling runner therein, thereby reducing the volume size of the solid-state power amplifier assembly and simultaneously achieving the effect of reducing weight;
2. the utility model discloses because solid-state power amplifier module accessible threaded interface installs in liquid cooling runner top, the waveguide interface can be directly dock with liquid cooling waveguide synthetic network, makes the heat of solid-state power amplifier can conduct fast to the liquid cooling runner inside, takes away the heat of solid-state power amplifier module through the liquid that flows in the runner, and final solid-state power amplifier synthetic system installs convenient, heat dissipation path is extremely short. Because the liquid cooling waveguide integrated synthetic network of the utility model has short internal heat transfer path, high heat transfer efficiency and high space utilization rate, the requirement on the solid-state power amplifier environmental control system is reduced under the same output power, and the volume and the weight of the solid-state power amplifier can be reduced;
3. the utility model discloses small, weight is lighter, heat-sinking capability is strong, so can be applied to the high-power solid-state power amplifier synthesis of various wave bands and the solid-state power amplifier synthesis system of multichannel, and fluid connector interface can match the design according to the actual conditions of the outside environmental control system of system simultaneously, so its range of application is wide, has better market prospect.
Drawings
Fig. 1 shows a perspective view of a first embodiment.
Fig. 2 shows a perspective view of the second embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the products of the present invention are used, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined. For example, "parallel" merely means that the directions are more parallel relative to "perpendicular," and does not mean that the structures are necessarily perfectly parallel, but may be slightly tilted.
Furthermore, the terms "substantially", and the like are intended to indicate that the relative terms are not necessarily strictly required, but may have some deviation. For example: "substantially equal" does not mean absolute equality, but because absolute equality is difficult to achieve in actual production and operation, certain deviations generally exist. Thus, in addition to absolute equality, "substantially equal" also includes the above-described case where there is some deviation. In this case, unless otherwise specified, terms such as "substantially", and the like are used in a similar manner to those described above.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-2, a liquid-cooled waveguide integrated network includes: the main body 1 is formed by welding a pair of structural bodies with the same structure in a vacuum brazing or vacuum diffusion welding or electron beam welding mode, a waveguide power distribution network 2 is arranged on one side of the inner portion of the main body 1 before welding and synthesis, a waveguide synthesis network 7 is arranged on the other side of the main body, one end of the waveguide power distribution network 2 is connected with an external input waveguide interface 3, and the other end of the waveguide power distribution network is connected with eight internal solid-state power amplifier input waveguide interfaces 11. And an external output waveguide interface 6 is arranged at the outer end of the waveguide synthesis network 7, and eight internal solid-state power amplifier input waveguide interfaces 11 are connected to the other end of the waveguide synthesis network. The waveguide synthesis network 7 is an eight-in-one waveguide synthesis network and is distributed in a stepped 90-degree corner mode, the waveguide power distribution network 2 is an one-to-eight waveguide power distribution network and is distributed in a stepped 90-degree corner mode, and meanwhile, the external input waveguide interface 3 and the external output waveguide interface 6 are of waveguide flange structures. The internal solid-state power amplifier input waveguide interface 11 and the internal solid-state power amplifier output waveguide interface 8 are used for connecting the solid-state power amplifier module 14, and the connecting solid-state power amplifier module 14 is fixed on the main body 1 through the solid-state power amplifier mounting interface 9. A liquid cooling flow passage 10 formed in the main body 1 in a wave-shaped structure, wherein the liquid cooling flow passage 10 is arranged between the waveguide power dividing network 2 and the waveguide synthesis network 7, which mainly comprises a plurality of narrow flow passages 100, a plurality of wide flow passages 101 and a heat conducting fin 102, the heat conducting fin 102 can transfer the heat to the cooling liquid in the liquid cooling flow passage 10, meanwhile, the narrow flow passage 100 and the wide flow passage 101 are matched with each other, so that the heat dissipation area is increased, thereby improving the heat dissipation efficiency, and simultaneously prolonging the contact time of the cooling liquid and the heat-conducting fins 102 through the heat-conducting fins 102 arranged in the wide flow passage 101, thereby improving the heat dissipation effect, in order to facilitate the introduction of the cooling liquid, the liquid cooling flow path output interface 4 and the liquid cooling flow path input interface 5 are provided with a corresponding liquid cooling flow path output connector 15 and a corresponding liquid cooling flow path input connector 16, and the liquid cooling flow path output connector 15 and the liquid cooling flow path input connector 16 are connected through threads or flanges.
When in processing and manufacturing, the main body 1 is divided into two halves, and the two halves are respectively processed with the structures of the waveguide power distribution network 2, the external input waveguide interface 3, the liquid cooling runner output interface 4, the liquid cooling runner input interface 5, the external output waveguide interface 6, the waveguide synthesis network 7, the internal solid power amplifier output waveguide interface 8, the solid power amplifier mounting interface 9, the liquid cooling runner 10, the internal solid power amplifier input waveguide interface 11 and the like.
After the two half main bodies 1 are processed to a certain stage, the two half main bodies 1 are welded together by adopting a vacuum brazing, vacuum diffusion welding or electron beam welding mode, and the processing of the liquid cooling waveguide network is completed. After the processing is finished, the liquid cooling flow channel 10 of the liquid cooling waveguide network can bear certain pressure, and the flow channel is ensured not to leak fluid after the external environment control system is connected.
By the integrated design of the waveguide synthesis network, the solid-state power amplifier module 14 and the liquid cooling runner 10, the waveguide synthesis network and the liquid cooling runner 10 are integrated, so that the integrated design of the liquid cooling waveguide network is achieved, the heat dissipation path of the solid-state power amplifier module 14 is shortened, the heat dissipation efficiency is improved, the utilization rate of the synthesis network of the solid-state power amplifier module 14 is improved, and the volume and the weight of a system are reduced.
The hybrid synthesis network integration design realizes vertical signal feed-in of the external input waveguide interface 3 and the external output waveguide interface 6 up and down by adopting an H-T junction and E-T junction power synthesis mode, and meanwhile, the external input waveguide interface 3 and the external output waveguide interface 6 are in a non-standard waveguide form, so that the size of an input port can be effectively reduced, and the miniaturized integration design is facilitated.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is obvious that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (8)
1. A liquid cooling waveguide integrated synthetic network, comprising:
a main body (1);
the waveguide power distribution network (2) is arranged on one side inside the main body (1);
the waveguide synthesis network (7) is arranged on the other side inside the main body (1);
the external input waveguide interface (3) is connected to the outer end of the waveguide power distribution network (2), arranged on one side of the main body (1), connected with the external input waveguide port and used for transmitting external radio-frequency signals of the waveguide network;
the external output waveguide interface (6) is connected to the outer end of the waveguide synthesis network (7), arranged on the other side of the main body (1), connected with the external output waveguide port and used for transmitting external radio-frequency signals of the waveguide network;
the internal solid power amplifier input waveguide interface (11) is connected to the inner side end of the waveguide power dividing network (2), and two ends of the internal solid power amplifier input waveguide interface extend out of the main body (1);
the internal solid power amplifier output waveguide interface (8) is connected to the inner end of the waveguide synthesis network (7), and two ends of the internal solid power amplifier output waveguide interface extend out of the main body (1);
the liquid cooling flow channel (10) is formed in the main body (1) in a wave-shaped structure and is positioned between the waveguide power distribution network (2) and the waveguide synthesis network (7);
the liquid cooling flow channel output interface (4) is communicated with one end of the liquid cooling flow channel (10) and is used for installing a fluid quick connector;
the liquid cooling flow channel input interface (5) is communicated with the other end of the liquid cooling flow channel (10) and is used for installing a fluid quick connector;
the solid-state power amplifier mounting interfaces (9) are at least one in number, are arranged on the main body (1) and are used for fixing the solid-state power amplifier module (14).
2. The integrated liquid-cooled waveguide network as defined in claim 1, wherein the main body (1) is formed by welding a pair of structures having the same structure.
3. The integrated network of liquid-cooled waveguides as claimed in claim 2, wherein the main body (1) is welded by vacuum brazing or vacuum diffusion welding or electron beam welding or friction stir welding.
4. The integrated network of liquid-cooled waveguides as claimed in claim 1, wherein the waveguide power dividing network (2) is a one-to-many waveguide power dividing network, distributed in a corner manner.
5. The integrated fluid-cooled waveguide network as defined in claim 1, wherein the waveguide network (7) is an all-in-one waveguide network, distributed in a corner manner.
6. The integrated liquid-cooled waveguide synthesis network according to claim 1, wherein the external input waveguide interface (3) and the external output waveguide interface (6) are of waveguide flange structure.
7. The integrated liquid cooled waveguide network as claimed in claim 1, wherein the liquid cooled channel output interface (4) and the liquid cooled channel input interface (5) are connected to the fluid quick connector by means of a screw or a flange.
8. The integrated liquid-cooled waveguide network as claimed in claim 1, wherein the liquid-cooled channels (10) comprise a plurality of narrow channels (100), the narrow channels (100) are connected to each other by wide channels (101), and the wide channels (101) are provided with a plurality of heat-conducting fins (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021680875.8U CN212648450U (en) | 2020-08-13 | 2020-08-13 | Liquid cooling waveguide integrated synthetic network |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021680875.8U CN212648450U (en) | 2020-08-13 | 2020-08-13 | Liquid cooling waveguide integrated synthetic network |
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| CN212648450U true CN212648450U (en) | 2021-03-02 |
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| CN202021680875.8U Active CN212648450U (en) | 2020-08-13 | 2020-08-13 | Liquid cooling waveguide integrated synthetic network |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112954989A (en) * | 2021-05-18 | 2021-06-11 | 四川斯艾普电子科技有限公司 | Radar liquid cooling device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112954989A (en) * | 2021-05-18 | 2021-06-11 | 四川斯艾普电子科技有限公司 | Radar liquid cooling device |
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