CN212570946U

CN212570946U - Single wafer cleaning table mechanism

Info

Publication number: CN212570946U
Application number: CN202021865389.3U
Authority: CN
Inventors: 陶为银; 巩铁建
Original assignee: Henan General Intelligent Equipment Co Ltd
Current assignee: Henan General Intelligent Equipment Co Ltd
Priority date: 2020-08-31
Filing date: 2020-08-31
Publication date: 2021-02-19
Anticipated expiration: 2030-08-31

Abstract

The utility model discloses a monolithic wafer clean bench mechanism, the on-line screen storage device comprises a base, the up end of base is fixed with the left side board, and the left surface of left side board installs the solvent case, the upper end of solvent case is connected with the shower, and the lower extreme of shower installs the shower head, the downside of shower head is provided with the clean bench, and the downside of clean bench is provided with the fixed plate, the downside of fixed plate is provided with the motor, and the right side of motor is provided with the right side board, hot-blast case is installed to the right flank of right side board, the outside of clean bench is provided with clamping mechanism. This monolithic wafer clean bench mechanism, the structure sets up rationally, on the basis of original wet-type cleaning method, installs hot-blast case drying device additional, carries out drying process to the remaining liquid on wafer surface, and sets up motor rotary mechanism at the lower extreme of clean bench for some impurity pollutants that do not react with the solvent obtain kinetic energy and directly raise and get rid of, have greatly guaranteed wafer semiconductor's operating characteristic.

Description

Single wafer cleaning table mechanism

Technical Field

The utility model relates to a wafer washs technical field, specifically is a monolithic wafer clean bench mechanism.

Background

At present, it is well known that in the wafer manufacturing process, unnecessary residues left on the wafer surface by the already performed manufacturing operation procedures must be cleaned, and such manufacturing operation examples include plasma etching and chemical mechanical polishing, and if unnecessary residues and particles are left on the wafer surface during the continuous manufacturing operation, these residues and particles will cause defects such as scratches on the wafer surface and inappropriate interactions between metallization features, which in some cases may cause devices on the wafer to become inoperable, in order to avoid additional costs caused by discarding wafers having inoperable devices, and therefore, the wafer surface must be properly and efficiently cleaned after the manufacturing operation procedures that leave unnecessary residues on the wafer surface, and the existing wafer cleaning techniques are broadly classified into two categories, wet and dry-wet, however, in the wet cleaning method, a mixture of liquid acid-base solvent and deionized water is mainly used to clean the surface of the wafer, but this method is easy to leave some solvent mixture on the surface of the wafer, and some special particles that do not react with the solvent cannot be removed completely.

In order to overcome the disadvantages in the market, there is a need for an improved wafer cleaning device, which can better ensure the good functions of the wafer semiconductor and promote the development of the electronic semiconductor industry.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a monolithic wafer clean bench mechanism to solve and still use wet-type cleaning method as the mainstream at present that proposes in the above-mentioned background art, and wet-type cleaning method mainly uses liquid acid-base solvent and deionized water mixture to wash the wafer surface, however this kind of method remains some solvent mixed liquid on the wafer surface easily, and some special particles that do not react with the solvent can't thoroughly clear away the problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a monolithic wafer clean bench mechanism, includes the base, the up end of base is fixed with the left side board, and the left surface of left side board installs the solvent case, the upper end of solvent case is connected with the shower, and the lower extreme of shower installs the shower, the downside of shower is provided with the clean bench, and the downside of clean bench is provided with the fixed plate, the downside of fixed plate is provided with the motor, and the right side of motor is provided with the right side board, hot-blast case is installed to the right flank of right side board, and the upper end of hot-blast case is connected with the tuber pipe, the outside of clean bench is provided with clamping mechanism, and clamping mechanism's inboard is provided with the concave station, the upside of concave station is provided with anchor clamps, and the left side of anchor clamps is.

Preferably, a through hole is formed in the middle of the fixing plate, a bearing is arranged inside the through hole, a transmission shaft is connected to the upper end of the motor and penetrates through the bearing, and the upper end of the transmission shaft is fixed to the center of the bottom of the cleaning table.

Preferably, the cleaning table is circular, a slot is formed in the edge of the cleaning table, the clamping mechanisms are fixed in the slot, and the four clamping mechanisms are symmetrical about the central point of the cleaning table in the vertical and horizontal directions.

Preferably, a handle is arranged on the outer side of the clamping mechanism, a pull rod is fixed on the inner side of the handle, a sliding block is arranged on the inner side of the pull rod, a clamp is arranged on the inner side of the sliding block, and the clamp is fixed at the inner side end of the pull rod.

Preferably, a sliding cylinder is arranged inside the edge of the cleaning table, a spring is arranged inside the sliding cylinder, the spring is an annular spring, one end of the spring is fixed to the outer edge of the cleaning table, the other end of the spring is in contact with the sliding block, a through hole is formed in the middle of the sliding block, and the pull rod penetrates through the through hole and is fixedly connected with the clamp.

Preferably, a round hole is formed in the side face of the cleaning table, the pull rod penetrates through the round hole to be fixedly connected with the handle, one end of the middle of the pull rod is arranged inside the spring, and the diameter of the round hole is smaller than that of the spring.

Preferably, the tuber pipe includes air-out mouth of pipe, hose and gas-supply pipe, and the gas-supply pipe passes through the hose connection air-out mouth of pipe, fixed first fixed plate on the gas-supply pipe, and first fixed plate lower extreme is fixed in the backup pad to the backup pad is fixed on the curb plate, and air-out mouth of pipe rear end is fixed with the second fixed plate, and second fixed plate lower extreme and first fixed plate are articulated, and second fixed plate upper end is connected through articulated telescopic screw with first fixed plate upper end.

Preferably, the sliding block, the pull rod and the sliding barrel are all cylindrical mechanisms, a through hole formed in the sliding block is consistent with the circular hole in size and matched with the outer diameter of the pull rod, and the clamp does not exceed the innermost side edge of the concave table in the state that the spring is completely compressed.

Compared with the prior art, the beneficial effects of the utility model are that: this monolithic wafer clean bench mechanism, the structure sets up rationally, on the basis of original wet-type cleaning method, install hot-blast case drying device additional, carry out drying process to the remaining liquid on wafer surface, and set up motor rotary mechanism at the lower extreme of clean bench, through rotatory centrifugal force effect, make some impurity pollutants that do not react with the solvent obtain kinetic energy and directly raise and get rid of, under the effect that the cooperation hot-blast case blows, thoroughly clear away the pollutant on wafer surface, wafer semiconductor's operating characteristic has greatly been guaranteed.

Drawings

FIG. 1 is a front view of the structure of the present invention;

FIG. 2 is a schematic top view of the structure of the cleaning table of the present invention;

FIG. 3 is a schematic view of the clamping mechanism of the present invention;

FIG. 4 is a schematic side view of the structure cleaning table of the present invention;

fig. 5 is the installation schematic diagram of the structural air duct of the present invention.

In the figure: 1. a base; 2. a motor; 3. a left side plate; 4. a solvent tank; 5. a shower pipe; 6. a cleaning table; 7. a shower head; 8. an air duct; 9. a right side plate; 10. a hot air box; 11. a bearing; 12. a fixing plate; 13. a concave platform; 14. a slider; 15. a clamp; 16. a slide cylinder; 17. a handle; 18. a pull rod; 19. a spring; 21. a drive shaft; 61. a clamping mechanism; 62. a circular hole; 81. an air outlet pipe orifice; 82. a hose; 83. a telescopic screw; 84. a first fixing plate; 85. a support plate; 86. and a second fixing plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a single wafer cleaning table mechanism comprises a base 1, a left side plate 3 is fixed on the upper end face of the base 1, a solvent tank 4 is installed on the left side face of the left side plate 3, solvent mixed liquid in the solvent tank 4 plays a role in dissolving impurity ions, a spray pipe 5 is connected on the upper end of the solvent tank 4, a spray head 7 is installed at the lower end of the spray pipe 5, a cleaning table 6 is arranged on the lower side of the spray head 7, a fixing plate 12 is arranged on the lower side of the cleaning table 6, a motor 2 is arranged on the lower side of the fixing plate 12, a right side plate 9 is arranged on the right side of the motor 2, a hot air tank 10 is installed on the right side face of the right side plate 9, the hot air tank 10 is used for drying residual liquid on the surface of a wafer, double air pipes 8 are connected on the upper end of the hot air tank 10, the air pipes 8 are corrugated hoses, the right side plate 9 and the left side, and the air outlet is provided with a downward inclined notch, so that when drying is carried out, the surface of the wafer is uniformly heated from left to right, and the drying efficiency is accelerated, the air pipe 8 comprises an air outlet pipe orifice 81, a hose 82 and an air pipe, the air pipe is connected with the air outlet pipe orifice 81 through the hose 82, a first fixing plate 84 is fixed on the air pipe, the lower end of the first fixing plate 84 is fixed on a supporting plate 85, the supporting plate 85 is fixed on a side plate, a second fixing plate 86 is fixed at the rear end of the air outlet pipe orifice 81, the lower end of the second fixing plate 86 is hinged with the first fixing plate 84, the upper end of the second fixing plate 86 is connected with the upper end of the first fixing plate 84 through a hinged telescopic screw 83, the length of the telescopic screw 83 is adjusted by rotating the telescopic screw 83, further, the distance between the second fixing plate 86 and the first fixing plate 84, the outer side of the cleaning table 6 is provided with a clamping mechanism 61, the inner side of the clamping mechanism 61 is provided with a concave table 13, the upper side of the concave table 13 is provided with a clamp 15, the left side of the clamp 15 is provided with a slide block 14, the clamping mechanism 61 fixes a wafer placed on the surface of the concave table 13, the middle part of the fixing plate 12 is provided with a through hole, a bearing 11 is arranged in the through hole, the upper end of the motor 2 is connected with a transmission shaft 21, the transmission shaft 21 penetrates through the bearing 11, the upper end of the transmission shaft 21 is fixed with the center of the bottom of the cleaning table 6, the cleaning table 6 is circular, a slotted hole is arranged in the edge of the cleaning table 6, the clamping mechanism 61 is fixed in the slotted hole, the clamping mechanism 61 is four symmetrical in vertical and horizontal directions relative to the center of the cleaning table 6, the outer side of the clamping mechanism 61 is provided with a pull handle 17, the inner side of, and the inner side of the slide block 14 is provided with a clamp 15, the clamp 15 is fixed at the inner side end of a pull rod 18, the edge of the cleaning platform 6 is internally provided with a slide cylinder 16, and a spring 19 is arranged inside the sliding cylinder 16, the spring 19 is an annular spring, one end of the spring 19 is fixed on the outer edge of the cleaning platform 6, the other end of the spring 19 is contacted with the sliding block 14, the middle part of the sliding block 14 is provided with a through hole, the pull rod 18 passes through the through hole to be fixedly connected with the clamp 15, the side surface of the cleaning platform 6 is provided with a round hole 62, the pull rod 18 passes through the round hole 62 to be fixedly connected with the handle 17, one end of the middle part of the pull rod 8 is arranged inside the spring 19, and the diameter of the round hole 62 is smaller than that of the spring 19, the slide block 14, the pull rod 18 and the slide cylinder 16 are all cylindrical mechanisms, and the through hole that the inside of slider 14 was seted up is unanimous with the round hole 62 size, and matches with the external diameter of pull rod 18, and anchor clamps 15 do not exceed the most inboard edge of concave station 13 under the state that spring 19 is complete to compress.

When using this one-chip wafer cleaning table mechanism, the clamp 15 is pulled by the pull handle 17, then the wafer body is placed on the surface of the concave table 13, and then the pull handle 17 is released, under the action of the elastic force of the spring 19, the clamp 15 clamps the wafer body, then the solvent in the solvent box 4 is sprayed on the surface of the wafer body through the spray head 7, after a period of dissolution reaction, the motor 2 and the hot air box 10 are started, the motor 2 drives the cleaning platform 6 to rotate through the transmission shaft 21, further driving the wafer body to rotate, throwing out the liquid on the surface of the wafer body under the action of centrifugal force, then blowing and drying through the hot air bellow 10, so that the residual liquid on the surface of the wafer is dried, and then the residual dry impurity ions are lifted and thrown out under the action of centrifugal force, therefore, the purpose of cleaning the wafer is achieved, and the whole process of the single wafer cleaning table mechanism is completed.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A monolithic wafer wash station mechanism, includes base (1), its characterized in that: the cleaning device is characterized in that a left side plate (3) is fixed on the upper end face of the base (1), a solvent box (4) is installed on the left side face of the left side plate (3), a spray pipe (5) is connected to the upper end of the solvent box (4), a spray head (7) is installed at the lower end of the spray pipe (5), a cleaning table (6) is arranged on the lower side of the spray head (7), a fixing plate (12) is arranged on the lower side of the cleaning table (6), a motor (2) is arranged on the lower side of the fixing plate (12), a right side plate (9) is arranged on the right side of the motor (2), a hot air box (10) is installed on the right side face of the right side plate (9), an air pipe (8) is connected to the upper end of the hot air box (10), a clamping mechanism (61) is arranged on the outer side of the cleaning table (6), a concave table (13) is arranged on, and a slide block (14) is arranged at the left side of the clamp (15).

2. The single wafer cleaning station mechanism of claim 1, wherein: the through-hole has been seted up at the middle part of fixed plate (12), and has bearing (11) at the internally mounted of through-hole, the upper end of motor (2) is connected with transmission shaft (21), and transmission shaft (21) pass bearing (11), and the upper end of transmission shaft (21) is fixed with the bottom center of clean bench (6).

3. The single wafer cleaning station mechanism of claim 1, wherein: the cleaning table (6) is circular, a slotted hole is formed in the edge of the cleaning table (6), the clamping mechanisms (61) are fixed in the slotted hole, and the four clamping mechanisms (61) are arranged to be symmetrical about the central point of the cleaning table (6) in the vertical and horizontal directions.

4. The single wafer cleaning station mechanism of claim 1, wherein: the outer side of the clamping mechanism (61) is provided with a handle (17), the inner side of the handle (17) is fixed with a pull rod (18), the inner side of the pull rod (18) is provided with a sliding block (14), the inner side of the sliding block (14) is provided with a clamp (15), and the clamp (15) is fixed at the inner side end of the pull rod (18).

5. The single wafer cleaning station mechanism of claim 1, wherein: the inside smooth section of thick bamboo (16) that is provided with in the edge of wash platform (6), and the inside of smooth section of thick bamboo (16) is provided with spring (19), and spring (19) set up to annular spring, and the outward flange at wash platform (6) is fixed to the one end of spring (19), and the other end and slider (14) contact, the through-hole has been seted up at the middle part of slider (14), and pull rod (18) pass through-hole and anchor clamps (15) fixed connection.

6. The single wafer cleaning station mechanism of claim 1, wherein: round hole (62) have been seted up to the side of wash platform (6), and pull rod (18) pass round hole (62) and handle (17) fixed connection, and the inside of spring (19) is arranged in to the middle one end of pull rod (18), and the diameter of round hole (62) is less than the diameter of spring (19).

7. The single wafer cleaning station mechanism of claim 1, wherein: tuber pipe (8) are including air-out mouth of pipe (81), hose (82) and air-supply pipe, and the air-supply pipe passes through hose (82) and connects air-out mouth of pipe (81), fixed first fixed plate (84) on the air-supply pipe, and first fixed plate (84) lower extreme is fixed on backup pad (85), and backup pad (85) are fixed on the curb plate, air-out mouth of pipe (81) rear end is fixed with second fixed plate (86), and second fixed plate (86) lower extreme is articulated with first fixed plate (84), and second fixed plate (86) upper end is connected through articulated telescopic screw (83) with first fixed plate (84) upper end.

8. The single wafer cleaning station mechanism of claim 1, wherein: the sliding block (14), the pull rod (18) and the sliding barrel (16) are all cylindrical mechanisms, a through hole formed in the sliding block (14) is consistent with the circular hole (62) in size and matched with the outer diameter of the pull rod (18), and the clamp (15) does not exceed the inner side edge of the concave table (13) in the state that the spring (19) is completely compressed.