CN115116905B - Single wafer type wafer cleaning machine - Google Patents
Single wafer type wafer cleaning machine Download PDFInfo
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- CN115116905B CN115116905B CN202210815719.5A CN202210815719A CN115116905B CN 115116905 B CN115116905 B CN 115116905B CN 202210815719 A CN202210815719 A CN 202210815719A CN 115116905 B CN115116905 B CN 115116905B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 108
- 230000005540 biological transmission Effects 0.000 claims abstract description 45
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 230000006835 compression Effects 0.000 claims abstract description 14
- 238000007906 compression Methods 0.000 claims abstract description 14
- 238000005192 partition Methods 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910021642 ultra pure water Inorganic materials 0.000 claims abstract description 9
- 239000012498 ultrapure water Substances 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims description 34
- 230000000670 limiting effect Effects 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000005406 washing Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 90
- 238000000034 method Methods 0.000 description 9
- 238000007493 shaping process Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the field of semiconductor devices, in particular to a single wafer cleaning machine, which comprises a cleaning machine body, wherein a cleaning pool, a water homogenizing arm, a cleaning liquid nozzle, an ultra-pure water nozzle and a bearing mechanism are arranged in the cleaning machine body; the bearing mechanism comprises a rotary table, a vertical pipe fitting, a circular plate, a horizontal partition plate and a compressed air bag, and the top of the rotary table is provided with a vent hole; the upper end of the compression air bag is provided with a vent pipe; still be equipped with centering subassembly on the washing pond, centering subassembly includes that three support pushing mechanism, and every supports pushing mechanism and all includes radial ejector pin and translation montant, and the outside of disc spare has linked firmly three transmission piece, every the lower extreme of translation montant all with correspond the cooperation of transmission piece inclined plane. The invention utilizes the external atmospheric pressure to generate pressure on the wafer by changing the air pressure in the turntable and the vertical pipe member, and then fixes the wafer on the turntable; according to the invention, the centering assembly is used for positioning the wafer before fixing the wafer, so that the deviation degree of the wafer axis and the turntable axis can be greatly reduced.
Description
Technical Field
The invention relates to the field of semiconductor devices, in particular to a single wafer cleaning machine.
Background
Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon.
In the semiconductor industry, various physical and chemical methods are mainly used for cleaning the surface of the wafer to remove particle pollutants, organic pollutants and metal pollutants on the surface of the wafer, so that the cleanliness of the wafer meets the material processing standard. Two wafer cleaning methods are commonly used in the prior art, one is a tank cleaning and the other is a single wafer cleaning. The groove type cleaning is to put the wafer into the cleaning groove and soak and clean the wafer by the cleaning solution in the cleaning groove, and the groove type cleaning has the advantages that the same cleaning groove can clean a plurality of wafers simultaneously in the same cleaning step, and the wafer cleaning efficiency is high. The single wafer cleaning is to clean only one wafer at a time and wash the surface of the wafer by spraying cleaning liquid through the spray head so as to remove impurities attached to the surface of the wafer. The method has good cleaning effect and can not generate cross contamination among wafers.
During cleaning, a single wafer is usually manually placed on a truncated cone-shaped cleaning table, then the cleaning table is slowly rotated, and cleaning liquid and pure liquid are sequentially sprayed from the upper part of the wafer, wherein the cleaning liquid adopts cleaning liquid with a specific proportion for realizing blending, and ultrapure water in the pure liquid is a better choice, so that the cleaning of the upper surface of the wafer is completed, however, the cleaning method has the following defects: firstly, the wafer is placed on the cleaning table only under the action of gravity, and the friction force between the wafer and the cleaning table is not large, so that the rotating speed of the cleaning table is limited, the wafer can only slowly rotate, otherwise, the wafer can fall off, and the liquid on the upper surface of the wafer is difficult to completely cover, or pure liquid cannot be completely thrown out, so that the cleaning liquid is remained; secondly, because the wafer is manually placed on the cleaning table, the wafer and the cleaning table can only be roughly positioned coaxially, the difficulty of subsequent positioning can be increased, and the cleaning effect is poor.
Disclosure of Invention
In view of the above, it is desirable to provide a single wafer cleaning machine.
In order to solve the problems of the prior art, the invention adopts the technical scheme that:
a single wafer cleaning machine comprises a cleaning machine body, wherein a cleaning pool, a water homogenizing arm positioned above the cleaning pool, a cleaning solution nozzle arranged on the water homogenizing arm, an ultra-pure water nozzle positioned above the cleaning pool and a bearing mechanism which is arranged below the water homogenizing arm and used for bearing a wafer are arranged in the cleaning machine body;
the bearing mechanism comprises:
a turntable horizontally arranged right above the cleaning pool and used for bearing the wafer,
the rotary table is of a hollow structure with an opening at the bottom, the top of the rotary table is provided with an air vent, and the rotary table is coaxially and fixedly connected to the top of the vertical pipe;
the middle part of the circular plate piece is coaxially and slidably arranged at the lower end of the vertical pipe piece along the axial direction of the vertical pipe piece, and the bottom end of the middle part of the circular plate piece is elastically connected with the bottom end of the vertical pipe piece;
the upper end of the compression air bag is provided with an air pipe which is fixedly arranged in the vertical pipe fitting through a horizontal partition plate, the bottom of the compression air bag is abutted against the top of the circular plate fitting, and the compression air bag, the horizontal partition plate, the vertical pipe fitting and the rotary table are connected in a sealing way;
wherein, still be equipped with the centering subassembly that is used for making wafer and revolving stage be coaxial state on the washing pond, the centering subassembly includes three supporting and pushing away the mechanism along circumferencial direction evenly distributed, and every supports and pushes away the mechanism and all includes the radial ejector pin that corresponds radial line translation along the revolving stage and links firmly the translation montant of keeping away from revolving stage axis one end in radial ejector pin, and the outside of disc spare links firmly three one-to-one in the transmission piece of three translation montant, every the lower extreme of translation montant all with correspond transmission piece inclined plane cooperation.
Preferably, radial ejector pin is cylindric structure, the top shaping of translation montant has the first sleeve pipe that is used for the joint cover to locate on radial ejector pin, and first sheathed tube external diameter is unanimous with radial ejector pin external diameter, and the joint recess that adapts to first sleeve pipe is offered to radial ejector pin corresponding end bottom, and every supports and pushes away the mechanism and still includes:
the horizontal box body is of a hollow quadrangular structure, the bottom of the horizontal box body is in an open state, three installation through grooves which correspond to the three horizontal box bodies one by one are formed in the cleaning pool, and the outer end of the radial ejector rod is connected with the side wall of one end, close to the axis of the rotary table, of the horizontal box body in a dynamic sealing mode;
the inner cross rod is parallel to the radial ejector rods and fixedly arranged in the horizontal box body and is positioned right below the radial ejector rods, and the translation vertical rod is sleeved on the inner cross rod in a sliding manner;
the two outer cross rods are symmetrically arranged relative to the inner cross rods, are fixedly inserted into the horizontal box body and are positioned at the same height with the inner cross rods, and two second sleeves used for being in sliding connection with the two outer cross rods are formed on the translation vertical rods;
the outer sleeve is fixedly arranged in the horizontal box body and is sleeved on the radial ejector rod in a sliding manner, and a avoidance through groove for avoiding the vertical translation rod is formed in the bottom of one end, close to the axis of the rotary table, of the outer sleeve;
wherein, the horizontal box body is connected with the inner cross rod, the two outer cross rods and the outer sleeve in a sealing way.
Preferably, horizontal box body includes that outer end and bottom all are the interior box body and the outer closing cap of open mode, and radial ejector pin corresponds lateral wall movive seal with interior box body and is connected, and interior box body bottom links firmly with wasing the pond, and outer closing cap inner shaping has and is used for the circular heavy groove that links firmly with the outer tube, and this end of outer closing cap still shaping has and is used for spacing middle part flange and two side flanges of internal horizontal pole and two external horizontal poles respectively, the outer tube has two to be the symmetric state and slides and inserts the spacing flange of locating in the box body lateral wall near the one end shaping of revolving stage axis, sets up two first heavy grooves that adapt to two spacing flange structures on the interior box body corresponds the end inside wall.
Preferably, a radial shaft sleeve sleeved on the radial ejector rod is fixedly connected to the side wall of one end, close to the axis of the rotary table, of the inner box body, the radial ejector rod is in sliding fit with the radial shaft sleeve, a first through hole used for being fixedly connected with the radial shaft sleeve is formed in the side wall of the inner box body, and a sealing ring used for being connected with the radial ejector rod in a dynamic sealing mode is embedded in the radial shaft sleeve.
Preferably, set up second through-hole and third through-hole that is used for linking firmly with interior horizontal pole and two outer horizontal poles respectively on the lateral wall that interior box body is close to revolving stage axis one end, two outer horizontal pole looks dorsal part still shaped have slide insert locate interior box body correspond the rectangular flange in the lateral wall, interior box body corresponds two lateral wall inboards and sets up the heavy groove of second that adapts to two rectangular flange structures.
Preferably, the one end that every radial ejector pin is close to the revolving stage axis has all linked firmly the piece that supports, and every supports the piece and keeps away from radial ejector pin one end upper portion and has all linked firmly first buffer layer, and the one end that first buffer layer is close to the revolving stage axis is the arc structure of adaptation wafer outer fringe shape.
Preferably, the revolving stage is the narrow inversion round platform column structure down of width, and the bottom shaping of revolving stage has the protruding pipe portion that is used for linking firmly with vertical pipe spare top, and protruding pipe portion bottom opening makes the revolving stage be hollow structure, and the air vent is the first gas pocket that annular array distributes for the shaping in a plurality of at revolving stage top, and the top of revolving stage has still coaxially linked firmly the second buffer layer, has seted up the second gas pocket that a plurality of one-to-one corresponds to the first gas pocket of a plurality of on the second buffer layer.
Preferably, the vertical pipe fitting includes top pipe, well upper tube, well low tube and the bottom tube from top to bottom end to end, and the top and the protruding tube portion bottom of top pipe are coaxial to link firmly, and the spacing ground coupling of top pipe axial is established on wasing the pond, and the shaping is for being used for driving the rotatory synchronizing wheel structure of vertical pipe fitting on the middle and upper outside of tubes cylinder wall, horizontal baffle links firmly between middle and upper tube and well low tube, and the plectane spare sets up on the bottom tube along bottom tube axis slip, and bottom tube bottom coaxial has linked firmly bottom seal board and plectane spare and bottom seal board elastic connection.
Preferably, the circular plate member includes:
the outer circular plate is fixedly connected with three fixed vertical shafts which are uniformly distributed along the circumferential direction in a coaxial mode at the bottom of the cleaning pool, a fixed chassis is fixedly connected with the bottoms of the three fixed vertical shafts, the outer circular plate is arranged on the three fixed vertical shafts in a sliding mode along the axial direction of the rotary table, three connecting portions which correspond to the three transmission blocks one by one and are used for being fixedly connected with the corresponding transmission blocks are formed in the top of the outer side of the outer circular plate, and each connecting portion comprises two connecting vertical plates which are in a symmetrical state;
the spacing coupling of axial sets up the interior plectane on the excircle board, and it comprises circular inner panel and outer ring, and the shaping has three along angular distribution such as circumferencial direction and is used for linking firmly the two riser between circular inner panel and the outer ring, the vertical logical groove of three one-to-one corresponding to three riser of upwards offering of bottom tube bottom, interior plectane slides through three riser and sets up in three vertical logical inslot, be equipped with the spring and the spring that the elasticity was contradicted the two between bottom seal board and the interior plectane and be located the bottom tube.
Preferably, the centering assembly further comprises:
the pen-shaped air cylinder is fixedly arranged at the bottom of the cleaning pool through an air cylinder bracket, and an output shaft of the pen-shaped air cylinder is parallel to one of the translation vertical rods and is fixedly connected with the translation vertical rod;
the transmission plectane, it sets up on well low tube and washs the coaxial anti-bending layer board that is used for preventing the transmission plectane outside recurvation that links firmly to be the spacing coupling of horizontality axial on the pond bottom, sets up the first arc wall of three translation montants of three one-to-one on the transmission plectane, still sets up the second arc wall of three one-to-one corresponding three fixed vertical axes on the transmission plectane.
Compared with the prior art, the invention has the beneficial effects that:
firstly, the invention utilizes the external atmospheric pressure to generate pressure on the wafer by changing the air pressure in the rotary table and the vertical pipe, and then fixes the wafer on the rotary table;
secondly, the wafer is positioned by the centering assembly before the wafer is fixed, so that the deviation degree of the axis of the wafer and the axis of the turntable can be greatly reduced.
Drawings
Fig. 1 is a schematic perspective view of the embodiment.
Fig. 2 is an enlarged view of a portion of a structure at a in fig. 1.
Fig. 3 is a schematic perspective view of the pushing mechanism according to the embodiment.
Fig. 4 is an exploded perspective view of the pushing mechanism of the embodiment.
Fig. 5 is a top view of the embodiment.
Fig. 6 is a first cross-sectional view taken along line B-B of fig. 5.
Fig. 7 is a second sectional view taken along line B-B of fig. 5.
Fig. 8 is an exploded view of the vertical tube member, circular plate member and compression balloon of the embodiment in partial perspective.
Fig. 9 is a first exploded perspective view of the wafer, second buffer layer, turntable, and top tube of the embodiment.
Fig. 10 is a perspective view of the wafer, the second buffer layer, the turntable, and the top pipe according to the second embodiment.
Fig. 11 is a perspective exploded view of the outer circular plate, the transmission block and the translation vertical rod of the embodiment.
Fig. 12 is a schematic perspective view of the driving disk and the translation vertical rod of the embodiment.
The reference numbers in the figures are:
1. a cleaning tank; 2. a water homogenizing arm; 3. a cleaning solution nozzle; 4. an ultra-pure water nozzle; 5. a turntable; 6. a wafer; 7. a vertical pipe fitting; 8. a circular plate member; 9. compressing the air bag; 10. a breather pipe; 11. a horizontal partition plate; 12. a pushing mechanism; 13. a radial ejector rod; 14. translating the vertical rod; 15. a transmission block; 16. a first sleeve; 17. a horizontal box body; 18. an inner cross bar; 19. an outer cross bar; 20. a second sleeve; 21. an outer sleeve; 22. an inner box body; 23. an outer sealing cover; 24. a middle convex pipe; 25. a side convex pipe; 26. a limiting convex plate; 27. a radial shaft sleeve; 28. a seal ring; 29. a long convex plate; 30. a tightening block; 31. a first buffer layer; 32. a convex pipe portion; 33. a first air hole; 34. a second buffer layer; 35. a second air hole; 36. jacking pipes; 37. a middle upper pipe; 38. a middle and lower tube; 39. a bottom tube; 40. a bottom closure plate; 41. a pagoda joint; 42. an outer circular plate; 43. fixing the vertical shaft; 44. fixing the chassis; 45. connecting a vertical plate; 46. a circular inner plate; 47. an outer ring; 48. a vertical plate; 49. a spring; 50. a first splint; 51. a first bearing; 52. a second splint; 53. a pen-shaped cylinder; 54. a cylinder support; 55. a transmission circular plate; 56. a bending prevention supporting plate; 57. a first arc-shaped slot; 58. a second arc-shaped slot; 59. a second bearing.
Detailed Description
For a better understanding of the features and technical solutions of the present invention, as well as the specific objects and functions attained by the present invention, reference is made to the accompanying drawings and detailed description of the invention.
Referring to fig. 1 to 12, a single wafer cleaning machine includes a cleaning machine body, a cleaning pool 1, a water-homogenizing arm 2 located above the cleaning pool 1, a cleaning liquid nozzle 3 located on the water-homogenizing arm 2, and an ultrapure water nozzle 4 located above the cleaning pool 1 are arranged in the cleaning machine body, and the single wafer cleaning machine further includes a supporting mechanism located below the water-homogenizing arm 2 and used for supporting a wafer 6;
the bearing mechanism comprises:
a turntable 5 horizontally arranged right above the cleaning tank 1 for carrying the wafer 6,
the vertical pipe member 7 is coaxially and axially connected to the cleaning pool 1, the vertical pipe member 7 penetrates through the bottom of the cleaning pool 1, the turntable 5 is of a hollow structure with an opening at the bottom, an air vent is formed in the top of the turntable 5, and the turntable 5 is coaxially and fixedly connected to the top of the vertical pipe member 7;
the middle part of the circular plate part 8 is coaxially and slidably arranged at the lower end of the vertical pipe part 7 along the axial direction of the vertical pipe part 7, and the bottom end of the middle part of the circular plate part 8 is elastically connected with the bottom end of the vertical pipe part 7;
the upper end of the compression air bag 9 is provided with an air pipe 10, the air pipe 10 is fixedly arranged in the vertical pipe fitting 7 through a horizontal partition plate 11, the bottom of the compression air bag 9 is abutted against the top of the circular plate fitting 8, and the compression air bag 9, the horizontal partition plate 11, the vertical pipe fitting 7 and the rotary table 5 are connected in a sealing manner;
wherein, still be equipped with the centering subassembly that is used for making wafer 6 and revolving stage 5 to be coaxial state on the washing pond 1, the centering subassembly includes three along circumferencial direction evenly distributed's support and push away mechanism 12, every supports and pushes away mechanism 12 and all includes along the radial ejector pin 13 that revolving stage 5 corresponds radial line translation and link firmly in radial ejector pin 13 and keep away from the translation montant 14 of revolving stage 5 axis one end, and the outside of disc piece 8 has linked firmly three one-to-one corresponding to the transmission piece 15 of three translation montant 14, every the lower extreme of translation montant 14 all with correspond the 15 inclined plane cooperations of transmission piece.
Referring to fig. 3, fig. 4, fig. 5 and fig. 6, the radial push rod 13 is a cylindrical structure, the top molding of the translation vertical rod 14 has a first sleeve 16 for the clamping sleeve to be located on the radial push rod 13, the outer diameter of the first sleeve 16 is consistent with the outer diameter of the radial push rod 13, the bottom of the corresponding end of the radial push rod 13 is provided with a clamping groove adapted to the first sleeve 16, and each pushing mechanism 12 further includes:
the horizontal box body 17 is of a hollow quadrangular prism structure, the bottom of the horizontal box body is in an open state, three installation through grooves which correspond to the three horizontal box bodies 17 one by one are formed in the cleaning pool 1, and the outer end of the radial ejector rod 13 is connected with the side wall of one end, close to the axis of the rotary table 5, of the horizontal box body 17 in a dynamic sealing mode;
the inner cross rod 18 is parallel to the radial ejector rod 13, is fixedly arranged in the horizontal box body 17 and is positioned right below the radial ejector rod 13, and the translation vertical rod 14 is sleeved on the inner cross rod 18 in a sliding manner;
two outer cross rods 19 which are symmetrical relative to the inner cross rod 18 are fixedly inserted into the horizontal box body 17 and are positioned at the same height with the inner cross rod 18, and two second sleeves 20 which are used for being connected with the two outer cross rods 19 in a sliding mode are formed on the translation vertical rod 14;
the outer sleeve 21 is fixedly arranged in the horizontal box body 17 and is sleeved on the radial ejector rod 13 in a sliding manner, and an avoidance through groove for avoiding the translation vertical rod 14 is formed in the bottom of one end, close to the axis of the rotary table 5, of the outer sleeve 21;
wherein, the horizontal box body 17 is connected with the inner cross bar 18, the two outer cross bars 19 and the outer sleeve 21 in a sealing way.
Referring to the figure 1 that the cleaning pool 1 is only shown by the bottom of the pool, the overall structure of the cleaning pool 1 is not shown in the figure, the cleaning pool 1, the horizontal box 17, the radial ejector rods 13, the translation vertical rods 14, the inner transverse rods 18 and the outer transverse rods 19 are made of plastic materials and do not adopt metal materials and relevant lubricating oil, and the cleaning environment in the cleaning machine is convenient to maintain subsequently, the first sleeves 16 can be elastically clamped in the clamping grooves, the second sleeves 20 can also be elastically clamped on the corresponding outer transverse rods 19, so that the inner transverse rods 18 and the two outer transverse rods 19 are fixed in the horizontal box 17, the translation vertical rods 14 can keep translating along the corresponding radial lines of the rotary table 5 due to the limitation of the inner transverse rods 18 and the two outer transverse rods 19, the first sleeves 16 at the tops of the translation vertical rods 14 are clamped in the clamping grooves, the outer diameters of the first sleeves 16 are consistent with the outer diameter of the radial ejector rods 13, the first outer sleeves 21 are sleeved on the radial ejector rods 13, and can prevent the first sleeves 16 from being separated from the clamping grooves, thereby ensuring that the translation vertical rods 14 can be driven to move, one end of the radial ejector rods 13 is connected with the corresponding side wall of the box, and the other end of the radial ejector rod 13, and can also be stably arranged in the outer sleeve 21 and can also be stably fixed in the radial ejector rod.
Referring to fig. 3 and 4, the horizontal box 17 includes an inner box 22 and an outer cover 23, the outer end and the bottom of which are both open, the radial ejector rod 13 is connected with the corresponding side wall of the inner box 22 in a dynamic sealing manner, the bottom of the inner box 22 is fixedly connected with the cleaning tank 1, a circular sinking groove for fixedly connecting with the outer sleeve 21 is formed at the inner end of the outer cover 23, a middle protruding tube 24 and two side protruding tubes 25 are formed at the end of the outer cover 23 and are respectively used for limiting the inner cross rod 18 and the two outer cross rods 19, two limiting protruding plates 26 which are in a symmetrical state and are inserted into the side wall of the inner box 22 in a sliding manner are formed at one end of the outer sleeve 21 close to the axis of the turntable 5, and two first sinking grooves adapted to the structures of the two limiting protruding plates 26 are formed on the inner side wall of the corresponding end of the inner box 22. When in installation, the bottom of the inner box body 22 and the cleaning pool 1 are welded into a whole by ultrasonic wave, then the translation vertical rod 14 is placed in the inner box body 22 from bottom to top, firstly, the radial mandril 13 is inserted into the inner box body 22 from the corresponding end of the inner box body 22 in a sliding way, the first sleeve 16 is clamped in the clamping groove, the two second sleeves 20 are then aligned with the two outer crossbars 19 and the two outer crossbars 19 are inserted in the inner box 22, after the outer cross rods 19 are in place, the corresponding ends of the two outer cross rods 19 are sealed and adhered to the corresponding side walls of the inner box body 22 by using strong sealing, then the inner cross rods 18 are installed, the corresponding ends of the inner cross rods 18 are adhered to the side walls of the inner box body 22 by using strong sealing glue, finally the outer sleeve 21 is aligned to the circular sinking groove, then the outer sealing cover 23 and the outer sleeve 21 are ultrasonically welded or adhered together, then the two limit convex plates 26 are aligned to the first sinking groove, then the outer sleeve 21 is slid into the inner box body 22, meanwhile, the outer sleeve 21 is sleeved on the radial mandril 13, the middle convex tube 24 and the two side convex tubes 25 are respectively sleeved on the inner cross rod 18 and the two outer cross rods 19 after the outer sealing cover 23 is pressed in place, the outer sealing cover 23 is bonded with the inner box body 22 through strong sealant, thus, the inner cross bar 18 and the two outer cross bars 19 are both arranged in the horizontal box body 17 in a limiting way, thereby more stably limiting the vertical translation rod 14, and meanwhile, the two ends of the outer sleeve 21 are also limited and arranged in the horizontal box body 17, so as to ensure the stable translation of the radial ejector rod 13 and the vertical translation rod 14, thus realizing the stable limitation of the radial ejector rod 13 and the vertical translation rod 14, because radial ejector pin 13 and interior box body 22 movive seal link to each other, have also guaranteed to wash between pond 1 and the three horizontal box body 17 sealedly to link to each other, prevent to wash in the pond 1 liquid by horizontal box body 17 department outflow.
Referring to fig. 4, a radial shaft sleeve 27 sleeved on the radial push rod 13 is fixedly connected to a side wall of the inner box 22 close to one end of the axis of the rotary table 5, the radial push rod 13 is in sliding fit with the radial shaft sleeve 27, a first through hole for fixedly connecting with the radial shaft sleeve 27 is formed in the side wall of the inner box 22, and a sealing ring 28 for connecting with the radial push rod 13 in a dynamic sealing manner is embedded in the radial shaft sleeve 27. The radial shaft sleeve 27 is made of plastic materials, the radial shaft sleeve 27 is connected with the inner box body 22 through strong sealant, and the sealing ring 28 ensures dynamic sealing of the radial shaft sleeve 27 and the radial ejector rod 13.
Referring to fig. 4, a second through hole and a third through hole, which are respectively used for being fixedly connected with the inner cross rod 18 and the two outer cross rods 19, are formed in the side wall of the inner box body 22 close to the end of the axis of the turntable 5, a long-strip convex plate 29, which is slidably inserted into the corresponding side wall of the inner box body 22, is further formed on the opposite side of the two outer cross rods 19, and a second sinking groove, which is adapted to the structure of the two long-strip convex plates 29, is formed in the inner side of the corresponding two side walls of the inner box body 22. The second through hole, the third through hole and the second sinking groove are formed, so that the inner cross rod 18 and the outer cross rod 19 can be conveniently installed, strong sealant can be conveniently arranged, and the long convex plate 29 is beneficial to limiting the outer cross rod 19 after being inserted into the outer cross rod 19.
Referring to fig. 3 and 4, one end of each radial ejector rod 13 close to the axis of the turntable 5 is fixedly connected with a supporting block 30, the upper part of one end of each supporting block 30 far away from the radial ejector rod 13 is fixedly connected with a first buffer layer 31, and one end of each first buffer layer 31 close to the axis of the turntable 5 is of an arc structure adapting to the shape of the outer edge of the wafer 6. First buffer layer 31 plays supplementary guard action, prevents that radial ejector pin 13 from driving to support behind tight piece 30 translation and the wafer 6 of contradicting, because hard conflict damages wafer 6, the radian that first buffer layer 31 corresponds end arc structure is unanimous with the outer cylinder wall radian of wafer 6.
Referring to fig. 6 to 10, the turntable 5 is an inverted circular truncated cone-shaped structure with a wide top and a narrow bottom, a protruding pipe portion 32 for being fixedly connected with the top of the vertical pipe 7 is formed at the bottom of the turntable 5, the turntable 5 is of a hollow structure due to an opening at the bottom of the protruding pipe portion 32, the vent holes are first air holes 33 formed at the top of the turntable 5 and distributed in an annular array, the top of the turntable 5 is further coaxially and fixedly connected with a second buffer layer 34, and a plurality of second air holes 35 corresponding to the first air holes 33 are formed in the second buffer layer 34. The turntable 5 is an inverted round table-shaped structure with a wide top and a narrow bottom, so that the contact area between the top of the turntable 5 and the wafer 6 can be kept large, meanwhile, the diameter of the vertical pipe fitting 7 does not need to be too large, the wafer 6 can be adsorbed on the turntable 5 more stably, and the second buffer layer 34 is positioned at the topmost part and is in contact with the wafer 6 to play a role in protecting the wafer 6.
Referring to fig. 6 to 10, the vertical pipe member 7 includes a top pipe 36, an upper middle pipe 37, a lower middle pipe 38 and a bottom pipe 39 connected end to end from top to bottom, the top of the top pipe 36 is coaxially and fixedly connected with the bottom of the protruding pipe portion 32, the top pipe 36 is axially and limitedly axially arranged on the cleaning tank 1, a synchronizing wheel structure for driving the vertical pipe member 7 to rotate is formed on the outer cylindrical wall of the upper middle pipe 37, the horizontal partition plate 11 is fixedly connected between the upper middle pipe 37 and the lower middle pipe 38, the circular plate member 8 is slidably arranged on the bottom pipe 39 along the axis of the bottom pipe 39, the bottom of the bottom pipe 39 is coaxially and fixedly connected with a bottom sealing plate 40, and the circular plate member 8 is elastically connected with the bottom sealing plate 40. The bottom of the cleaning pool 1 is also provided with a speed reducing motor (not shown in the figure) for driving the rotary table 5 to rotate, an output shaft of the speed reducing motor is in transmission connection with the middle and upper pipe 37 through a synchronizing wheel (not shown in the figure) and a synchronizing belt (not shown in the figure), so that the rotary table 5 is driven to rotate through the middle and upper pipe 37 and the top pipe 36, and the top vent pipe 10 of the compression air bag 9 is in sealing connection with the horizontal partition plate 11 through a pagoda joint 41.
Referring to fig. 6 to 11, the circular plate member 8 includes:
the bottom of the cleaning pool 1 is coaxially and fixedly connected with three fixed vertical shafts 43 which are uniformly distributed along the circumferential direction, the bottoms of the three fixed vertical shafts 43 are fixedly connected with fixed chassis 44, the outer circular plate 42 is axially and slidably arranged on the three fixed vertical shafts 43 along the rotary table 5, three connecting parts which correspond to the three transmission blocks 15 one by one and are used for being fixedly connected with the corresponding transmission blocks 15 are formed at the top of the outer side of the outer circular plate 42, and each connecting part comprises two connecting vertical plates 45 which are in a symmetrical state;
the spacing coupling of axial sets up the interior plectane on outer plectane 42, and it comprises circular inner panel 46 and outer ring 47, and the shaping has three along the equal angular distribution of circumferencial direction and is used for linking firmly the two riser 48 between circular inner panel 46 and the outer ring 47, the vertical logical groove of three one-to-one corresponding to three riser 48 of upwards seted up in bottom tube 39 bottom, and interior plectane slides through three riser 48 and sets up in three vertical logical inslot, it is located bottom tube 39 to be equipped with spring 49 and spring 49 that the two of elastic conflict between bottom closure plate 40 and the interior plectane.
The outer circular plate 42 and the three fixed vertical shafts 43 keep vertical sliding, the fixed chassis 44 plays a role in stabilizing the lower ends of the four fixed vertical shafts 43, the upper end and the lower end of the inner circular plate are fixedly connected with two first clamping plates 50 which are in a symmetrical state, a first bearing 51 is clamped between the outer edges of the two first clamping plates 50 and clamps the inner ring of the first bearing 51, the middle of the outer circular plate 42 is provided with a hole, the outer ring of the first bearing 51 is coaxially arranged on the outer circular plate 42, the top of the outer circular plate 42 is also coaxially connected with a second clamping plate 52, and the outer edge of the top of the second clamping plate 52 presses the outer ring of the top of the first bearing 51.
Referring to fig. 6 and 12, the centering assembly further comprises:
the pen-shaped air cylinder 53 is fixedly arranged at the bottom of the cleaning pool 1 through an air cylinder bracket 54, and an output shaft of the pen-shaped air cylinder 53 is parallel to one of the translation vertical rods 14 and is fixedly connected with the translation vertical rod 14;
the transmission circular plate 55 is axially limited in a horizontal state and is connected to the middle lower pipe 38 in a shaft connection mode, the bottom of the cleaning pool 1 is coaxially and fixedly connected with a bending-preventing supporting plate 56 for preventing the outer side of the transmission circular plate 55 from bending downwards, three first arc-shaped grooves 57 corresponding to the three vertical translation rods 14 one by one are formed in the transmission circular plate 55, and three second arc-shaped grooves 58 corresponding to the three vertical fixing shafts 43 one by one are further formed in the transmission circular plate 55.
The middle part of the transmission circular plate 55 is coupled with the middle and lower tubes 38 through the second bearing 59, referring to the structure of the first arc-shaped groove 57 shown in fig. 12, when the pen-shaped cylinder 53 drives the vertical translation rod 14 to move radially, because the transmission circular plate 55 is coupled to the middle and lower tubes 38 and the anti-bending supporting plate 56 has a limiting effect on the transmission circular plate 55, the vertical translation rod 14 can drive the transmission circular plate 55 to rotate through corresponding to the first arc-shaped groove 57, the transmission circular plate 55 drives the other two vertical translation rods 14 to translate synchronously through the other two first arc-shaped grooves 57, and the second arc-shaped groove 58 is used for avoiding the fixed vertical shaft 43 when the transmission circular plate 55 rotates.
The working principle is as follows: referring to fig. 6, it is shown that the output shaft of the pen-shaped cylinder 53 extends to the outermost end, at this time, the translation vertical rod 14 and the radial push rod 13 are pushed to the state farthest away from the wafer 6, the lower end of the translation vertical rod 14 is engaged with the inclined surface of the transmission block 15 at this time, because the outer circular plate 42 is limited by the four fixed vertical shafts 43 and can only move vertically, the transmission block 15 is driven to the lowest position after being engaged with the inclined surface of the translation vertical rod 14, as shown in fig. 7, the outer circular plate 42 drives the circular inner plate 46 to move to the lowest position, at this time, the compression air bag 9 extends to the longest state under the action of gravity and self-elasticity, and the wafer 6 is placed on the top of the turntable 5 before, thereby blocking the vent hole, the air pressure in the rotary table 5 and the vertical pipe member 7 is reduced in the process of extending the compressed air bag 9, the air pressure in the rotary table 5 and the vertical pipe member 7 is smaller than the external atmospheric pressure, so that the wafer 6 is tightly pressed on the rotary table 5 by the external atmospheric pressure, as shown in the reference of fig. 9 and fig. 10, the second buffer layer 34 is arranged at the top of the rotary table 5 to prevent the wafer 6 from being damaged, a plurality of second air holes 35 which correspond to the first air holes 33 one by one are formed in the second buffer layer 34, and the outer diameter of the top of the rotary table 5 is slightly smaller than the outer diameter of the wafer 6 due to the fact that the rotary table 5 is made into an inverted round table structure, so that the atmospheric pressure is uniformly and comprehensively acted on the upper surface of the wafer 6;
in the actual working process, the pen-shaped air cylinder 53 has three stop states, the first stop state is the state that the output shaft of the pen-shaped air cylinder 53 shown in fig. 6 extends to the outermost end, at this time, the wafer 6 is already placed on the rotary table 5 and the centering assembly has already performed centering operation on the wafer 6; the second stop state is that the output shaft of the pen-shaped air cylinder 53 retracts a certain distance, at this time, the vertical translation rod 14 shown in fig. 6 drives the radial push rod 13 to move rightwards for a certain distance, so as to drive the corresponding abutting block 30 to move rightwards, but the first buffer layer 31 still has a certain distance from the outer edge of the wafer 6, in the process, because the vertical translation rod 14 is matched with the inclined surface of the transmission block 15, the circular inner plate 46 moves upwards to the highest point under the elastic force of the spring 49, so that the compression air bag 9 is compressed, and then the air pressure in the rotary table 5 and the vertical pipe member 7 is increased, and in the second stop state, the vertical translation rod 14 is matched with the inclined surface of the transmission block 15 to reach a critical point, namely, when the vertical translation rod 14 shown in fig. 6 continues to move rightwards, because the elastic force of the spring 49 is not enough to drive the circular inner plate 46 to continue to move upwards, the vertical translation rod 14 shown in fig. 6 can separate from the transmission block 15 to move rightwards; the third stop state is that the output shaft of the pen-shaped air cylinder 53 retracts for a certain distance again, the translation vertical rod 14 shown in fig. 6 is separated from the transmission block 15 and moves rightwards, the plurality of abutting blocks 30 move to the position closest to the axis of the rotary table 5, and at the moment, the centering operation of the wafer 6 is realized corresponding to the plurality of abutting blocks 30;
referring to fig. 6, before actual operation, it is first necessary to set the retraction limit position of the output shaft of the pen-shaped air cylinder 53 according to the outer diameter of the wafer 6, or to properly adjust the position of the pen-shaped air cylinder 53 left or right through the air cylinder bracket 54, that is, when the output shaft of the pen-shaped air cylinder 53 retracts to the limit position, assuming that the wafer 6 and the turntable 5 are in the coaxial state at this time, the arc-shaped structures of the plurality of first buffer layers 31 keep a very small distance from the outer cylindrical wall of the wafer 6, so as to achieve the purpose that, when the wafer 6 is placed on the top of the turntable 5 in a manually coarse positioning manner, and the output shaft of the pen-shaped air cylinder 53 retracts to the limit distance, at most two first buffer layers 31 will contact the outer cylindrical wall of the wafer 6, and further push the wafer 6 to be gradually coaxial with the turntable 5, but not to simultaneously push the wafer 6 and then press the wafer 6 inwards, and after the three first buffer layers 31 move to the position closest to the axis of the turntable 5, the wafer 6 may not be coaxial with the turntable 5, but will not collide with the turntable 5 too much deviation;
when the device works, the output shaft of the pen-shaped air cylinder 53 is firstly adjusted to a second stop state, the compressed air bag 9 is in a state of being pushed up and compressed by the circular inner plate 46 at the moment, then the wafer 6 is manually placed on the upper surface of the rotary table 5, then the output shaft of the pen-shaped air cylinder 53 retracts to a third stop state, the three first buffer layers 31 realize the centering effect on the wafer 6, in the process, the translation vertical rod 14 is separated from the transmission block 15, the elasticity of the spring 49 is not enough to support the circular inner plate 46 to move upwards, the compressed air bag 9 is not changed, the air pressure in the rotary table 5 and the vertical pipe member 7 is not changed, the wafer 6 can be pushed by the three first buffer layers 31 on the rotary table 5, then the output shaft of the pen-shaped air cylinder 53 is directly pushed out to the first stop state shown in figure 6, in the process, the translation vertical rod 14 is firstly translated to the transmission block 15, the air pressure in the rotary table 5 and the vertical pipe member 7 is not changed, with the continuous movement of the vertical translation rod 14, the vertical translation rod 14 and the inclined plane of the transmission block 15 cooperate to drive the circular inner plate 46 to descend, and then the compressed air bag 9 is caused to extend under the action of self gravity and elasticity, so that the air pressure in the rotary table 5 and the vertical pipe member 7 is gradually reduced, the pressure of the external air pressure on the wafer 6 is gradually increased until the output shaft of the pen-shaped air cylinder 53 moves to the first stop state shown in fig. 6, the air pressure in the rotary table 5 and the vertical pipe member 7 is reduced to the minimum, the pressure of the external air pressure on the wafer 6 is increased to the maximum, specifically, the maximum pressure exerted by the external air pressure on the wafer 6 can be adjusted by replacing air bags with different sizes and adjusting the maximum extension distance of the output shaft of the pen-shaped air cylinder 53, then the speed reducing motor drives the rotary table 5 to rotate, the water homogenizing arm 2 moves to the position of the bottom of the position close to the upper surface of the wafer 6 shown in fig. 1, and the cleaning liquid nozzle 3 sprays the cleaning liquid prepared in advance, the wafer 6 rotates along with the rotation of the turntable 5, because the bottom of the water homogenizing arm 2 is close to the upper surface of the wafer 6, the cleaning liquid can gradually and completely cover the upper surface of the wafer 6, impurities on the surface of the wafer 6 are washed off, then the ultrapure water nozzle 4 is translated outwards from the right upper part of the center of the turntable 5 and sprays ultrapure water to the upper surface of the wafer 6, so that the impurities and the cleaning liquid on the upper surface of the wafer 6 are washed off, because the air pressure in the turntable 5 and the vertical pipe member 7 is smaller than the external atmospheric pressure, the atmospheric pressure exerts pressure on the wafer 6, the rotating speed of the turntable 5 can be properly increased, and the cleaning liquid and the impurities on the upper surface of the wafer 6 are completely washed off by the ultrapure water.
The above examples, which are intended to represent only one or more embodiments of the present invention, are described in greater detail and with greater particularity, and are not to be construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. A single wafer type wafer cleaning machine comprises a cleaning machine body, wherein a cleaning pool (1), a water homogenizing arm (2) positioned above the cleaning pool (1), a cleaning liquid nozzle (3) arranged on the water homogenizing arm (2) and an ultra-pure water nozzle (4) positioned above the cleaning pool (1) are arranged in the cleaning machine body, and the single wafer type wafer cleaning machine is characterized by further comprising a bearing mechanism which is arranged below the water homogenizing arm (2) and is used for bearing a wafer (6);
the bearing mechanism comprises:
the rotary table (5) is horizontally arranged right above the cleaning pool (1) and is used for bearing the wafer (6);
the vertical pipe (7) is coaxially and axially connected to the cleaning pool (1), the vertical pipe (7) penetrates through the bottom of the cleaning pool (1), the rotary table (5) is of a hollow structure with an opening at the bottom, an air vent is formed in the top of the rotary table (5), and the rotary table (5) is coaxially and fixedly connected to the top of the vertical pipe (7);
the middle part of the circular plate piece (8) is coaxially and slidably arranged at the lower end of the vertical pipe piece (7) along the axial direction of the vertical pipe piece (7), and the bottom end of the middle part of the circular plate piece (8) is elastically connected with the bottom end of the vertical pipe piece (7);
the upper end of the compression air bag (9) is provided with an air pipe (10), the air pipe (10) is fixedly arranged in the vertical pipe fitting (7) through a horizontal partition plate (11), the bottom of the compression air bag (9) is abutted against the top of the circular plate fitting (8), and the compression air bag (9), the horizontal partition plate (11), the vertical pipe fitting (7) and the rotary table (5) are connected in a sealing manner;
the cleaning device comprises a cleaning pool (1) and a cleaning assembly, wherein the cleaning pool (1) is further provided with a centering assembly used for enabling a wafer (6) and a rotary table (5) to be in a coaxial state, the centering assembly comprises three abutting and pushing mechanisms (12) which are uniformly distributed along the circumferential direction, each abutting and pushing mechanism (12) comprises a radial ejector rod (13) which translates along a corresponding radial line of the rotary table (5) and a translation vertical rod (14) which is fixedly connected to one end, far away from the axis of the rotary table (5), of the radial ejector rod (13), three transmission blocks (15) which correspond to the three translation vertical rods (14) one by one are fixedly connected to the outer portion of a circular plate piece (8), and the lower end of each translation vertical rod (14) is in inclined plane fit with the corresponding transmission block (15);
the turntable (5) is of an inverted round table-shaped structure with a wide upper part and a narrow lower part, a convex pipe part (32) fixedly connected with the top of the vertical pipe piece (7) is formed at the bottom of the turntable (5), the turntable (5) is of a hollow structure due to an opening at the bottom of the convex pipe part (32), the vent holes are a plurality of first air holes (33) formed at the top of the turntable (5) and distributed in an annular array manner, the top of the turntable (5) is also coaxially and fixedly connected with a second buffer layer (34), and a plurality of second air holes (35) which correspond to the first air holes (33) one by one are formed in the second buffer layer (34);
the vertical pipe fitting (7) comprises a top pipe (36), an intermediate pipe (37), an intermediate pipe (38) and a bottom pipe (39) which are connected end to end from top to bottom, the top of the top pipe (36) is coaxially and fixedly connected with the bottom of the convex pipe part (32), the top pipe (36) is axially and limitedly arranged on the cleaning pool (1), a synchronous wheel structure for driving the vertical pipe fitting (7) to rotate is formed on the outer cylindrical wall of the intermediate pipe (37), the horizontal partition plate (11) is fixedly connected between the intermediate pipe (37) and the intermediate pipe (38), the circular plate piece (8) is arranged on the bottom pipe (39) in a sliding mode along the axis of the bottom pipe (39), the bottom of the bottom pipe (39) is coaxially and fixedly connected with a bottom sealing plate (40), and the circular plate piece (8) is elastically connected with the bottom sealing plate (40);
the circular plate member (8) includes:
the cleaning device comprises an outer circular plate (42), wherein the bottom of the cleaning pool (1) is coaxially and fixedly connected with three fixed vertical shafts (43) which are uniformly distributed along the circumferential direction, the bottoms of the three fixed vertical shafts (43) are fixedly connected with a fixed chassis (44), the outer circular plate (42) is axially arranged on the three fixed vertical shafts (43) in a sliding manner along a rotary table (5), three connecting parts which correspond to three transmission blocks (15) one by one and are used for being fixedly connected with the corresponding transmission blocks (15) are formed at the top of the outer side of the outer circular plate (42), and each connecting part comprises two connecting vertical plates (45) which are in a symmetrical state;
the axial limiting shaft joint is arranged on an inner circular plate on an outer circular plate (42) and comprises a circular inner plate (46) and an outer circular ring (47), three vertical plates (48) which are distributed at equal angles along the circumferential direction and are used for fixedly connecting the circular inner plate and the outer circular ring (47) are formed between the circular inner plate (46) and the outer circular ring (47), three vertical through grooves which are one-to-one corresponding to the three vertical plates (48) are vertically formed in the bottom end of a bottom tube (39), the inner circular plate is arranged in the three vertical through grooves in a sliding mode through the three vertical plates (48), a spring (49) which elastically supports the circular inner plate and the bottom sealing plate (40) is arranged between the bottom sealing plate and the inner circular plate, and the spring (49) is located in the bottom tube (39);
the centering assembly further comprises:
the pen-shaped air cylinder (53) is fixedly arranged at the bottom of the cleaning pool (1) through an air cylinder bracket (54), and an output shaft of the pen-shaped air cylinder (53) is parallel to one of the translation vertical rods (14) and is fixedly connected with the translation vertical rod (14);
the transmission circular plate (55) is axially limited in the horizontal state and is connected to the middle lower pipe (38) in a shaft connection mode, the bottom of the cleaning pool (1) is coaxially and fixedly connected with a bending-preventing supporting plate (56) used for preventing the outer side of the transmission circular plate (55) from bending downwards, three first arc-shaped grooves (57) corresponding to the three translation vertical rods (14) one by one are formed in the transmission circular plate (55), and three second arc-shaped grooves (58) corresponding to the three fixed vertical shafts (43) one by one are further formed in the transmission circular plate (55).
2. The single wafer cleaning machine as claimed in claim 1, wherein the radial lift rod (13) is a cylindrical structure, a first sleeve (16) for being clamped and sleeved on the radial lift rod (13) is formed at the top of the vertical translation rod (14), the outer diameter of the first sleeve (16) is consistent with the outer diameter of the radial lift rod (13), a clamping groove adapted to the first sleeve (16) is formed at the bottom of the corresponding end of the radial lift rod (13), and each pushing mechanism (12) further comprises:
the horizontal box body (17) is of a hollow quadrangular structure, the bottom of the horizontal box body is in an open state, three installation through grooves which correspond to the three horizontal box bodies (17) one by one are formed in the cleaning pool (1), and the outer end of the radial ejector rod (13) is movably and hermetically connected with the side wall of one end, close to the axis of the rotary table (5), of the horizontal box body (17);
the inner cross rod (18) is parallel to the radial ejector rod (13), is fixedly arranged in the horizontal box body (17) and is positioned right below the radial ejector rod (13), and the translation vertical rod (14) is sleeved on the inner cross rod (18) in a sliding manner;
the two outer cross rods (19) are symmetrically arranged relative to the inner cross rod (18), are fixedly inserted into the horizontal box body (17) and are positioned at the same height with the inner cross rod (18), and two second sleeves (20) which are used for being in sliding connection with the two outer cross rods (19) are formed on the translation vertical rod (14);
the outer sleeve (21) is fixedly arranged in the horizontal box body (17) and is sleeved on the radial ejector rod (13) in a sliding manner, and an avoidance through groove for avoiding the translation vertical rod (14) is formed in the bottom of one end, close to the axis of the rotary table (5), of the outer sleeve (21);
wherein, the horizontal box body (17) is connected with the inner cross bar (18), the two outer cross bars (19) and the outer sleeve (21) in a sealing way.
3. The single wafer cleaning machine according to claim 2, wherein the horizontal box (17) comprises an inner box (22) and an outer sealing cover (23) with an open outer end and an open bottom, the radial lift rod (13) is connected with the corresponding side wall of the inner box (22) in a dynamic sealing manner, the bottom of the inner box (22) is fixedly connected with the cleaning pool (1), a circular sinking groove for fixedly connecting with the outer sleeve (21) is formed at the inner end of the outer sealing cover (23), a middle convex tube (24) and two side convex tubes (25) for respectively limiting the inner cross rod (18) and the two outer cross rods (19) are further formed at the end of the outer sealing cover (23), two limiting convex plates (26) which are in a symmetrical state and are slidably inserted into the side wall of the inner box (22) are formed at one end of the outer sleeve (21) close to the axis of the turntable (5), and two first sinking grooves adapted to the structures of the two limiting convex plates (26) are formed at the corresponding end of the inner side wall of the inner box (22).
4. The single wafer cleaning machine according to claim 3, wherein a radial bushing (27) sleeved on the radial rod (13) is fixedly connected to a sidewall of the inner box (22) near one end of the axis of the turntable (5), the radial rod (13) is in sliding fit with the radial bushing (27), a first through hole for fixedly connecting with the radial bushing (27) is formed in the sidewall of the inner box (22), and a sealing ring (28) for connecting with the radial rod (13) in a dynamic sealing manner is embedded in the radial bushing (27).
5. The single wafer cleaning machine according to claim 3, wherein a second through hole and a third through hole respectively used for being fixedly connected with the inner cross bar (18) and the two outer cross bars (19) are formed in a side wall of the inner box body (22) close to one end of the axis of the turntable (5), a long convex plate (29) inserted into a corresponding side wall of the inner box body (22) in a sliding manner is further formed in the opposite side of the two outer cross bars (19), and a second sinking groove adapted to the structure of the two long convex plates (29) is formed in the inner side of the inner box body (22) corresponding to the two side walls.
6. A single wafer cleaning machine according to claim 1, wherein each radial lifter (13) has a stopper (30) attached to an end thereof adjacent to the axis of the turntable (5), and each stopper (30) has a first cushion layer (31) attached to an upper portion of an end thereof remote from the radial lifter (13), and an end of the first cushion layer (31) adjacent to the axis of the turntable (5) has an arc-shaped configuration adapted to the shape of the outer edge of the wafer (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210815719.5A CN115116905B (en) | 2022-07-12 | 2022-07-12 | Single wafer type wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210815719.5A CN115116905B (en) | 2022-07-12 | 2022-07-12 | Single wafer type wafer cleaning machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115116905A CN115116905A (en) | 2022-09-27 |
| CN115116905B true CN115116905B (en) | 2023-03-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202210815719.5A Active CN115116905B (en) | 2022-07-12 | 2022-07-12 | Single wafer type wafer cleaning machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115805207B (en) * | 2022-12-15 | 2023-07-14 | 安徽富乐德长江半导体材料股份有限公司 | Full-automatic wafer cleaning device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208848857U (en) * | 2018-10-26 | 2019-05-10 | 长鑫存储技术有限公司 | A kind of single-wafer wet type processing device |
| CN211965144U (en) * | 2020-03-23 | 2020-11-20 | 北京新毅东科技有限公司 | Full-automatic single-chip cleaning machine |
| CN212570946U (en) * | 2020-08-31 | 2021-02-19 | 河南通用智能装备有限公司 | Single wafer cleaning table mechanism |
| CN114558839A (en) * | 2022-02-09 | 2022-05-31 | 智程半导体设备科技(昆山)有限公司 | Adsorption rotating device and single-chip wafer cleaning machine |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208848857U (en) * | 2018-10-26 | 2019-05-10 | 长鑫存储技术有限公司 | A kind of single-wafer wet type processing device |
| CN211965144U (en) * | 2020-03-23 | 2020-11-20 | 北京新毅东科技有限公司 | Full-automatic single-chip cleaning machine |
| CN212570946U (en) * | 2020-08-31 | 2021-02-19 | 河南通用智能装备有限公司 | Single wafer cleaning table mechanism |
| CN114558839A (en) * | 2022-02-09 | 2022-05-31 | 智程半导体设备科技(昆山)有限公司 | Adsorption rotating device and single-chip wafer cleaning machine |
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| CN115116905A (en) | 2022-09-27 |
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