CN212390122U

CN212390122U - LED light source and LED lamp with same

Info

Publication number: CN212390122U
Application number: CN202020786591.0U
Authority: CN
Inventors: 苏晶晶; 杨小明
Original assignee: Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Current assignee: Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Priority date: 2020-05-13
Filing date: 2020-05-13
Publication date: 2021-01-22
Anticipated expiration: 2030-05-13

Abstract

The application provides an LED light source, which comprises an LED bracket and an LED wafer attached to the LED bracket; four LED wafers are attached to the LED bracket, and the LED wafers are mutually connected in series and/or in parallel; the LED light source is a patch type LED light source, and the specification of the LED light source is 3030 specification, 3535 specification or 2835 specification. An LED lamp comprises at least one LED light source. The LED light source provided by the application is provided with the four LED wafers, so that the maximum power of the SMD LED light source with the 3030 specification can reach 3W, and the application range of the LED light source is wider. When the LED lamp is applied to the LED lamp, the number of the LED light sources can be reduced under the condition of meeting the same lighting effect, so that the size of the LED lamp can be more miniaturized.

Description

LED light source and LED lamp with same

Technical Field

The application belongs to the technical field of lighting, more specifically relates to an LED light source and have its LED lamps and lanterns.

Background

At present, for the surface mount type LED light source with the specification 3030, the technical scheme of single chip and double chips is mostly used. The maximum power of a single LED light source is generally between 1.4W and 1.6W due to the limitation of the working current. However, in some workplaces, due to the limited size of the lamp, more LED light sources cannot be placed, and thus only a single LED light source can be required to have greater power, while the existing LED light source with the 3030 standard obviously cannot meet the requirement of greater power, so that the application range of the LED light source with the 3030 standard is limited.

SUMMERY OF THE UTILITY MODEL

An object of the embodiments of the present application is to provide an LED light source, so as to solve the technical problem that the application range of an LED light source with the 3030 specification is limited in the prior art.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: provided is an LED light source including: the LED light source comprises an LED bracket, LED wafers attached to the LED bracket and optical elements arranged on the light emitting sides of the LED wafers, wherein the LED bracket is provided with four LED wafers which are connected in series and/or in parallel; the LED light source is a patch type LED light source, and the specification of the LED light source is 3030 specification, 3535 specification or 2835 specification.

In a possible embodiment, four of the LED chips are connected in series in sequence;

or, the four LED wafers are connected in parallel in sequence;

or, the four LED wafers are connected in parallel after being connected in series two by two.

In a possible embodiment, the LED chips are the same size;

or the size of at least one LED wafer is different from the sizes of other LED wafers.

In a possible embodiment, the outline of the LED support is square, the LED support is provided with first bonding pads and second bonding pads arranged at intervals, the size of the second bonding pads is larger than that of the first bonding pads, and each LED wafer is attached to the second bonding pads;

the first bonding pad is an anode bonding pad, and the second bonding pad is a cathode bonding pad;

or, the first bonding pad is a negative bonding pad, and the second bonding pad is a positive bonding pad.

In a possible embodiment, the first pad and the second pad are arranged at an interval along a first direction; the length of the first bonding pad along the first direction is greater than that of the second bonding pad along the first direction, and the length of the first bonding pad along the second direction is equal to that of the second bonding pad along the second direction;

the second direction is perpendicular to the first direction, and the length direction of each LED wafer is parallel to or perpendicular to the second direction.

In a possible embodiment, the LED chips are distributed in two rows and two columns, and each LED chip is attached to the second pad region.

In a possible embodiment, each of the LED chips is distributed in two rows and two columns; two LED wafers close to the first bonding pad at least partially extend out of the second bonding pad and are arranged at intervals with the first bonding pad, and the area of each LED wafer extending out of the second bonding pad is smaller than half of the area of the LED wafer.

In a possible embodiment, a corner cutting mark is arranged at a corner of the second bonding pad, which is far away from the first bonding pad; the LED wafers form two rows and are arranged at intervals along the second direction, the two rows of LED wafers are staggered along the first direction, and the row of LED wafers close to the corner cut mark extends out of the second bonding pad towards the first bonding pad; the area of the LED wafer extending out of the second bonding pad is smaller than half of the area of the LED wafer.

The application also provides an LED lamp which comprises at least one LED light source.

The application provides a LED light source's beneficial effect lies in: compared with the prior art, the LED light source provided by the embodiment of the application integrates the four LED wafers into the patch type LED light source, and the specification of the LED light source is 3030 specification, 3535 specification or 2835 specification, so that the number of the LED wafers integrated by the LED light source with 3030 specification, 3535 specification or 2835 specification is increased compared with the prior art, the maximum power of the whole LED light source is increased, the LED light source with 3030 specification and 3W power is realized, and the application range of the LED light source is wider. Meanwhile, the light efficiency level of the LED light source is higher than that of the LED light source in the prior art, so that when a plurality of LED light sources are applied to the LED lamp, the number of the LED light sources can be saved, the LED lamp is favorably applied to the LED lamp with limited size, and the size of the LED lamp is favorably reduced. In addition, the LED lamp provided by the application can reduce the using amount of the LED light source under the condition of reaching the same lighting effect through the arrangement of the LED light source, so that the LED lamp with the limited size can meet the same requirement, and meanwhile, the size of the LED lamp is miniaturized.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic front view of an LED light source provided in an embodiment of the present application;

FIG. 2 is a schematic front view of an LED light source according to another embodiment of the present application;

FIG. 3 is a schematic front view of an LED light source according to yet another embodiment of the present application;

FIG. 4 is a schematic diagram of a luminous efficacy-power curve of an LED light source provided in an embodiment of the present application;

fig. 5 is a schematic circuit diagram of LED chips according to an embodiment of the present disclosure;

FIG. 6 is a schematic circuit diagram of LED chips according to another embodiment of the present application;

fig. 7 is a schematic circuit diagram of LED chips according to still another embodiment of the present disclosure.

Wherein, in the figures, the respective reference numerals:

10. an LED wafer; 20. an LED support; 21. a first pad; 22. a second pad; 30. marking a corner cut; x-a first direction; y-second direction.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to fig. 3 together, a description will now be given of an LED light source according to an embodiment of the present application.

The LED light source is a patch type LED light source, the LED light source comprises an LED support 20, LED wafers 10 and optical elements, the LED wafers 10 are attached to the LED support 20, the optical elements are arranged on the light emitting sides of the LED wafers 10, and the optical elements are used for uniformly dispersing the light emitted by the LED wafers 10. In the present application, the optical element is epoxy resin encapsulated outside each LED chip 10, and in other embodiments of the present application, the optical element may also be a lamp cover or the like covering outside each LED chip, which is not limited herein.

In this embodiment, the specification of the LED light source is 3030, that is, the overall outline of the LED light source is square, and the length and width dimensions are 3.0mm by 3.0mm respectively. It is understood that in other embodiments of the present application, the specification of the LED light source may be 3535 specification or 2835 specification, which is not limited herein.

The LED support 20 is attached with four LED chips 10, and the LED chips 10 are connected in series and/or in parallel, that is, the four LED chips 10 may be connected in series in sequence, or the four LED chips 10 may be connected in parallel in sequence, or some LED chips 10 may be connected in series, and then the components connected in series are connected in parallel.

In the conventional LED chip 10 with 3V, the current used for a single LED chip 10 does not exceed 240mA, so the maximum power of each LED chip 10 is 0.7W-0.8W. In the calculation of the total power of the LED chips 10, no matter the LED chips 10 are connected in series or in parallel, the maximum power of the whole LED light source is the sum of the maximum powers of the LED chips 10, and the maximum power of the LED light source composed of four LED chips 10 is 2.8-3.2W.

Specifically, in the present embodiment, the maximum power of each LED chip is 0.75W, that is, the maximum power of the LED light source is 3W, and the LED light source can be applied to various application scenarios with power requirements lower than 3W.

In addition, please refer to fig. 4, which is a schematic diagram illustrating a comparison between the luminous efficiency-power curves of the LED light source provided in the present application and the LED light source in the prior art. The present application uses four LED chips 10, and the LED light source in the prior art uses two LED chips. The lighting effect-power curve of the LED light source is positioned above the LED light source, the lighting effect-power curve of the LED light source in the prior art is positioned below the LED light source, and as can be seen from the figure, the lighting effect level of the LED light source is higher than that of the LED light source in the prior art. When this application LED light source is in the condition of same light efficiency with LED light source among the prior art, the power of LED light source among the prior art is 0.2W for example, and the power of the LED light source of this application is 0.4W, also be under the condition of equal light efficiency promptly, the power of this application LED light source is twice of LED light source power among the prior art. When the LED lamp is applied to the LED lamp with the same light efficiency requirement, the number of the LED light sources can be reduced by one time, so that the LED lamp is favorably applied to the LED lamp with the limited size and the size of the LED lamp is favorably reduced.

The LED light source provided by the application integrates four LED wafers 10 in the patch type LED light source, and the specification of the LED light source is 3030 specification, 3535 specification or 2835 specification, so that the number of the LED wafers 10 integrated by the LED light source with 3030 specification, 3535 specification or 2835 specification is increased compared with the prior art, the maximum power of the whole LED light source is increased, the LED light source with the 3030 specification and the power of 3W is further realized, and the application range of the LED light source is wider. Meanwhile, the light efficiency level of the LED light source is higher than that of the LED light source in the prior art, so that when a plurality of LED light sources are applied to the LED lamp, the number of the LED light sources can be saved, the LED lamp is favorably applied to the LED lamp with limited size, and the size of the LED lamp is favorably reduced.

In a specific embodiment, referring to fig. 5, the four LED chips 10 are connected in series and then connected in parallel two by two, that is, the four LED chips 10 are divided into two groups, the two LED chips 10 in each group are connected in series, and then the two groups of LED chips 10 are connected in parallel. As can be seen, such a connection facilitates wiring and facilitates fabrication of the LED support 20. In other embodiments of the present application, according to actual design requirements, the four LED chips 10 may also be connected in other manners, for example, in fig. 6, the four LED chips 10 are sequentially connected in series, and in fig. 7, the four LED chips 10 are sequentially connected in parallel, which is not limited herein.

In one embodiment, referring to fig. 1 to 3, the four LED chips 10 have the same size, so that the raw material purchasing and bonding process is simplified, and labor and manufacturing cost are saved. It is understood that in other embodiments of the present application, the sizes of the LED chips 10 may not be identical due to the limited overall size and the structural layout. For example, the size of the two LED chips 10 on the lower side in fig. 2 may be set to be smaller than the size of the two LED chips 10 on the upper side, and the size of the LED chip 10 on the lower right side in fig. 3 may be set to be smaller than the size of the other LED chips 10, and even the sizes of the four LED chips 10 are different from each other, which is not limited herein.

In a specific embodiment, the four LED chips 10 each have a size of 22mil by 35mil, where mil is one thousandth of an inch, 1inch by 1000mil by 25.4mm, and 22mil by 35mil by 0.5588mm by 0.889 mm.

In this embodiment, four led chips 10 with the size of 22mil by 35mil are connected in series and then in parallel, so as to obtain the light efficiency-power curve shown in fig. 4.

In a specific embodiment, referring to fig. 1 to 3, the LED support 20 has a square outline, the LED support 20 is provided with a first pad 21 and a second pad 22, and the first pad 21 and the second pad 22 are spaced apart from each other. The size of the second bonding pad 22 is larger than that of the first bonding pad 21, and the four LED chips 10 are attached to the second bonding pad 22. Wherein, the first bonding pad 21 is a positive bonding pad, and the second bonding pad 22 is a negative bonding pad; alternatively, the first pad 21 is a negative electrode pad, and the second pad 22 is a positive electrode pad, which is not limited herein.

In a specific embodiment, the overall outline of the first pad 21 and the second pad 22 is square, and the size of the outline is 2.1mm × 2.1 mm. The first pads 21 and the second pads 22 are arranged at intervals along the first direction X, the length of the first pads 21 along the first direction X is greater than the length of the second pads 22 along the first direction X, and the length of the first pads 21 along the second direction Y is equal to the length of the second pads 22 along the second direction Y. The second direction Y is perpendicular to the first direction X, and the length direction of each LED chip 10 is parallel to the second direction Y. The first direction X is specifically the up-down direction in fig. 1, and the second direction Y is specifically the left-right direction in fig. 1, then the sizes of the first pad 21 and the second pad 22 in the left-right direction are both 2.1mm, and in the up-down direction, the size of the first pad 21 is smaller than the size of the second pad 22, and the sizes of the first pad 21 and the second pad 22 are both smaller than 2.1 mm. Therefore, in the layout of the LED chip 10, the length direction of the LED chip 10 is selected to be parallel to the second direction, that is, the length direction of each LED chip 10 is arranged to be attached to the left and right direction, so that each LED chip 10 can be attached to the area of the second bonding pad 22 as much as possible. It is understood that in other embodiments of the present application, the length direction of each LED chip 10 may be perpendicular to the second direction Y with a reasonable layout.

In an embodiment, referring to fig. 1, four LED chips 10 are distributed in two rows and two columns, and a gap is formed between the four LED chips. Each LED chip 10 is attached to the second bonding pad 22 in the region, i.e. no LED chip 10 protrudes from the second bonding pad 22.

In another embodiment of the present application, please refer to fig. 2, four LED chips 10 are distributed in two rows and two columns, and a gap is formed therebetween. The size of the LED chip 10 in this embodiment is set to be larger than the size of the LED chip 10 in the previous embodiment, then the four LED chips 10 cannot be completely attached in the area of the second bonding pads 22, and at this time, the two LED chips 10 close to the first bonding pads 21 can be allowed to at least partially protrude out of the second bonding pads 22 in the direction of the first bonding pads 21, but the two LED chips 10 cannot protrude into the first bonding pads 21, that is, a gap is provided between the two LED chips 10 and the first bonding pads 21. Specifically, each LED chip 10 protrudes beyond the second bonding pad 22 by an area less than half of the area of the LED chip 10.

In another embodiment of the present application, referring to fig. 3, due to the installation requirement, in order to identify the positive electrode and the negative electrode, a corner cut mark 30 is disposed at a corner of the LED support 20, the epoxy encapsulation and the second pad 22 away from the first pad 10, specifically, the corner cut mark 30 is formed at the upper right corner. In order to accommodate the corner cut marks 30, the embodiment arranges the four LED chips 10 in two rows and at intervals along the second direction Y, and each row of LED chips 10 is arranged offset along the first direction X. The row of LED chips 10 near the corner cut mark 30 extends out of the second bonding pads 22 toward the first bonding pads 21, specifically, the two LED chips 10 on the right side are partially moved toward the first bonding pads 21 relative to the two LED chips 10 on the left side to avoid the corner cut mark 30. Specifically, the LED chip 10 located at the lower right corner extends out of the second bonding pad 21, and the area of the LED chip 10 extending out of the second bonding pad 22 is less than half of the area of the LED chip 10.

The present application further provides an LED light fixture comprising at least one LED light source. When the LED lamp comprises an LED light source, the maximum power of the LED lamp can reach 3W; when the LED lamp comprises a plurality of LED light sources, the number of the LED light sources can be reduced on the premise of achieving the same lighting effect and power, so that the LED lamp with the limited size can meet the same requirement, and the size of the LED lamp is miniaturized.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

LED light source, including the LED support, paste and locate LED wafer on the LED support, and locate each the optical element of LED wafer light-emitting side, its characterized in that: the LED bracket is attached with four LED wafers, and the LED wafers are mutually connected in series and/or in parallel; the LED light source is a patch type LED light source, and the specification of the LED light source is 3030 specification, 3535 specification or 2835 specification.
2. The LED light source of claim 1 wherein: the four LED wafers are sequentially connected in series;

or, the four LED wafers are connected in parallel in sequence;

or, the four LED wafers are connected in parallel after being connected in series two by two.
3. The LED light source of claim 1 wherein: the LED wafers have the same size;

or the size of at least one LED wafer is different from the sizes of other LED wafers.
4. The LED light source of claim 1 or 2, wherein: the LED support is square in outline, first bonding pads and second bonding pads are arranged on the LED support at intervals, the size of each second bonding pad is larger than that of each first bonding pad, and each LED wafer is attached to each second bonding pad;

the first bonding pad is an anode bonding pad, and the second bonding pad is a cathode bonding pad;

or, the first bonding pad is a negative bonding pad, and the second bonding pad is a positive bonding pad.
5. The LED light source of claim 4 wherein: the first bonding pad and the second bonding pad are arranged at intervals along a first direction; the length of the first bonding pad along the first direction is greater than that of the second bonding pad along the first direction, and the length of the first bonding pad along the second direction is equal to that of the second bonding pad along the second direction;

the second direction is perpendicular to the first direction, and the length direction of each LED wafer is parallel to or perpendicular to the second direction.
6. The LED light source of claim 5 wherein: the LED wafers are distributed in two rows and two columns, and the LED wafers are attached to the second bonding pad area.
7. The LED light source of claim 5 wherein: the LED wafers are distributed in two rows and two columns; two LED wafers close to the first bonding pad at least partially extend out of the second bonding pad and are arranged at intervals with the first bonding pad, and the area of each LED wafer extending out of the second bonding pad is smaller than half of the area of the LED wafer.
8. The LED light source of claim 5 wherein: a corner cutting mark is arranged at one corner of the second bonding pad, which is far away from the first bonding pad; the LED wafers form two rows and are arranged at intervals along the second direction, the two rows of LED wafers are staggered along the first direction, and the row of LED wafers close to the corner cut mark extends out of the second bonding pad towards the first bonding pad; the area of the LED wafer extending out of the second bonding pad is smaller than half of the area of the LED wafer.
LED lamps and lanterns, its characterized in that: comprising at least one LED light source according to any of claims 1 to 8.