CN212276359U

CN212276359U - Liquid cooling heat abstractor and liquid cooling virtual currency digs ore deposit machine

Info

Publication number: CN212276359U
Application number: CN202021163476.4U
Authority: CN
Inventors: 刘方宇; 陈前; 高阳; 巫跃凤; 宁洪燕
Original assignee: Shenzhen MicroBT Electronics Technology Co Ltd
Current assignee: Shenzhen MicroBT Electronics Technology Co Ltd
Priority date: 2020-06-22
Filing date: 2020-06-22
Publication date: 2021-01-01
Anticipated expiration: 2030-06-22

Abstract

The application discloses a liquid-cooled heat dissipation device and a liquid-cooled virtual currency mining machine, wherein the liquid-cooled heat dissipation device comprises a shell unit and a first liquid-cooled plate unit arranged in the shell unit, and then a first electronic device and a second electronic device are respectively arranged on a first heat dissipation surface and a second heat dissipation surface which are oppositely arranged on the first liquid-cooled plate unit, wherein the first electronic device and the second electronic device can be computation plates for example; that is, in the liquid cooling heat abstractor of this embodiment, two calculation board units are arranged to a liquid cooling board unit correspondence, thus, compare prior art, under the unchangeable circumstances of calculation board quantity, the quantity of the liquid cooling board unit that can significantly reduce, thereby the quantity of the adapter that significantly reduces, and then the quantity of coolant liquid leakage risk point has effectively been reduced, thereby the more technical problem of coolant liquid leakage risk point that leads to when a calculation board corresponds one or two liquid cooling boards has been solved, the technological effect of greatly reduced coolant liquid leakage risk under the prerequisite of guaranteeing liquid cooling radiating effect has been realized.

Description

Liquid cooling heat abstractor and liquid cooling virtual currency digs ore deposit machine

Technical Field

The utility model relates to an electronic equipment's liquid cooling heat dissipation technical field especially relates to a liquid cooling heat abstractor and liquid cooling virtual currency digs ore deposit machine.

Background

The heat dissipation of the heating elements in the electronic equipment, and in particular in the virtual currency miner, has a significant impact on ensuring proper operation thereof. To above-mentioned heat dissipation demand, can adopt the liquid cooling heat dissipation mode of liquid cooling board, promptly, arrange the liquid cooling board in contact on electronic equipment or the ore mining computing board, then circulate in the liquid cooling board through the coolant liquid and flow to make electronic equipment or computing board etc. heat dissipation with the contact of liquid cooling board.

However, it is found that in the prior art, liquid-cooled plates are usually arranged on one side or two sides of one example plate, that is, one example plate usually corresponds to one or two liquid-cooled plates, so that when a plurality of example plates are stacked for use, the number of liquid-cooled plates is large, which results in a large number of adapters, and the joints have a risk of leakage of the cooling liquid, which results in a large number of risk points of leakage of the cooling liquid.

That is, on the premise of ensuring the liquid cooling heat dissipation effect, how to effectively reduce the number of the leakage risk points of the cooling liquid becomes a problem to be solved.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a liquid-cooled heat dissipation device and a liquid-cooled virtual currency mining machine, wherein the liquid-cooled heat dissipation device comprises a shell unit and a first liquid-cooled plate unit arranged in the shell unit, and then a first electronic device and a second electronic device are respectively arranged on a first heat dissipation surface and a second heat dissipation surface which are oppositely arranged on the first liquid-cooled plate unit, wherein the first electronic device and the second electronic device can be calculation plates for example; that is, in the liquid cooling heat abstractor of this embodiment, two calculation board units are arranged to a liquid cooling board unit correspondence, thus, compare prior art, under the unchangeable circumstances of calculation board quantity, the quantity of the liquid cooling board unit that can significantly reduce, thereby the quantity of the adapter that significantly reduces, and then the quantity of coolant liquid leakage risk point has effectively been reduced, thereby the more technical problem of coolant liquid leakage risk point that leads to when a calculation board corresponds one or two liquid cooling boards has been solved, the technological effect of greatly reduced coolant liquid leakage risk under the prerequisite of guaranteeing liquid cooling radiating effect has been realized.

The embodiment of the application provides a liquid cooling heat abstractor, liquid cooling heat abstractor is used for giving the liquid cooling heat dissipation of electronic equipment, liquid cooling heat abstractor includes:

the electronic equipment comprises a shell unit, a first positioning unit and a second positioning unit, wherein the shell unit is used for accommodating the electronic equipment and is provided with a first side plate and a second side plate which are oppositely arranged;

a first liquid cold plate unit fixedly disposed within said housing unit, said first liquid cold plate unit having a first inlet connection and a first outlet connection;

the electronic equipment comprises first electronic equipment and second electronic equipment, the first liquid cooling plate unit is provided with a first radiating surface and a second radiating surface which are oppositely arranged, the first electronic equipment is attached to the first radiating surface, and the second electronic equipment is attached to the second radiating surface;

the first inlet joint and the first outlet joint protrude from the first side plate and are used for being communicated with an external cooling liquid system, and cooling liquid enters from the first inlet joint and flows out from the first outlet joint, so that the first liquid cooling plate unit liquid-cools and dissipates heat of the first electronic device and the second electronic device at the same time.

In the embodiment of the present disclosure, the liquid-cooled heat dissipation device is further configured to perform liquid-cooled heat dissipation on power supply equipment, where the power supply equipment is disposed in the housing unit, and the power supply equipment is electrically connected to the electronic equipment and configured to supply power to the electronic equipment;

wherein, the liquid cooling heat abstractor further includes:

a second liquid cooled panel unit fixedly disposed within the housing unit, the second liquid cooled panel unit having a second inlet fitting and a second outlet fitting projecting from the first side panel; the second liquid cooling plate unit is provided with a third heat dissipation surface, and the power supply equipment is attached to the third heat dissipation surface;

the first outlet connector and the second inlet connector are communicated through a transfer pipe, and the first inlet connector and the second outlet connector are communicated with an external cooling liquid system; or,

the first inlet joint and the second outlet joint are communicated through the adapter tube, and the first outlet joint and the second inlet joint are communicated with an external cooling liquid system; or,

the first inlet joint and the second inlet joint are respectively connected with a first three-way joint, the first outlet joint and the second outlet joint are respectively connected with a second three-way joint, and the first three-way joint and the second three-way joint are communicated with an external cooling liquid system.

In the embodiment of the present disclosure, the liquid-cooled heat dissipation device further includes a connection unit, and the first liquid-cooled plate unit and the second liquid-cooled plate unit are respectively fixed in the housing unit through the connection unit.

In the embodiment of the present disclosure, the first liquid cooling plate unit and the second liquid cooling plate unit are provided with adapter flanges on two sides thereof, the connection unit is respectively disposed on two sides of the first liquid cooling plate unit and the second liquid cooling plate unit, and the connection unit has a guide groove for the adapter flanges to be inserted.

In the embodiment of the present disclosure, the first liquid cooling plate unit and the second liquid cooling plate unit are arranged side by side, and the connection unit between the first liquid cooling plate unit and the second liquid cooling plate unit is integrally arranged.

In the embodiment of the present disclosure, locking screws are disposed at two ends of the guide groove.

In the embodiment of the present disclosure, the housing unit includes a bearing housing, the bearing housing has a bearing groove, the first side plate and the second side plate are installed at two ends of the bearing housing, and an installation cover is disposed on the bearing groove.

In the embodiment of the present disclosure, a power adapter and a communication connector are respectively disposed at two ends of the second side plate.

In the embodiment of the disclosure, two ends of the second side plate are further extended with fixed mounting plates in a protruding manner, and the fixed mounting plates are provided with fixed mounting holes; the fixed mounting plate is outwards bent to be provided with a lifting plate, and the lifting plate is provided with a lifting hole.

In an embodiment of the disclosure, a first protection plate and a second protection plate are respectively disposed on surfaces of the first electronic device and the second electronic device, the surfaces of the first electronic device and the second electronic device being opposite to the first liquid cooling plate.

In the embodiment of the present disclosure, a heat conductive silicone grease is disposed between the first electronic device and the first liquid cooling plate unit, and/or a heat conductive silicone grease is disposed between the second electronic device and the first liquid cooling plate unit.

In an embodiment of the present disclosure, the first electronic device includes a first substrate, the second electronic device includes a second substrate, the first substrate is attached to the first heat dissipation surface, and the second substrate is attached to the second heat dissipation surface;

the first radiating surface and the second radiating surface are planes, the first substrate and the second substrate are aluminum substrates, and heating elements are arranged on the aluminum substrates back to the first liquid cooling plate unit.

The embodiment of the application further provides a liquid cooling virtual currency digger, the liquid cooling virtual currency digger includes the calculation board and bears the liquid cooling heat abstractor of calculation board, wherein, liquid cooling heat abstractor is foretell liquid cooling heat abstractor.

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

in the embodiment of the application, the liquid-cooled heat dissipation device comprises a shell unit and a first liquid-cooled plate unit arranged in the shell unit, and then a first electronic device and a second electronic device are respectively arranged on a first heat dissipation surface and a second heat dissipation surface which are oppositely arranged on the first liquid-cooled plate unit, wherein the first electronic device and the second electronic device can be both computing boards, for example;

that is, in the liquid cooling heat abstractor of this embodiment, two calculation board units are arranged to a liquid cooling board unit correspondence, thus, compare prior art, under the unchangeable circumstances of calculation board quantity, the quantity of the liquid cooling board unit that can significantly reduce, thereby the quantity of the adapter that significantly reduces, and then the quantity of coolant liquid leakage risk point has effectively been reduced, thereby the more technical problem of coolant liquid leakage risk point that leads to when a calculation board corresponds one or two liquid cooling boards has been solved, the technological effect of greatly reduced coolant liquid leakage risk under the prerequisite of guaranteeing liquid cooling radiating effect has been realized.

Drawings

Fig. 1 is a schematic structural diagram of the liquid-cooled heat dissipation device in the embodiment of the present application.

Fig. 2 is a schematic structural diagram of the liquid-cooled heat dissipation device in the embodiment of the present application.

Fig. 3 is a schematic view of the internal structure of the housing unit according to the embodiment of the present application.

Fig. 4 is a schematic structural diagram of the electronic device attached to the first liquid cooling plate unit in the embodiment of the present application.

Fig. 5 is a schematic top view of fig. 3.

Fig. 6 is a partially enlarged view of fig. 5.

Fig. 7 is a schematic structural diagram of the connection unit in the embodiment of the present application.

Reference numerals

10-housing unit, 11-carrying housing, 13-first side plate, 14-second side plate, 15-mounting cover, 16-power adapter, 17-communication adapter,

141-fixed mounting plate, 142-fixed mounting hole, 143-lifting plate, 144-lifting hole,

20-a first liquid cooled plate unit, 21-a first electronic device, 22-a second electronic device, 23-a first shield, 24-a second shield, 25-a first inlet connection, 26-a first outlet connection, 27-a transition flange,

30-a second liquid-cooled panel unit, 31-a power supply device, 35-a second inlet connection, 36-a second outlet connection,

40-a switching tube, wherein the switching tube is connected with a power supply,

50-connecting unit, 51-guide groove, 52-locking screw, 53-screw hole,

60-control panel, 61-switching copper bar.

Detailed Description

In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.

The embodiment of the application provides a liquid-cooled heat dissipation device, which is used for liquid-cooled heat dissipation of electronic equipment and comprises a shell unit 10 and a first liquid-cooled plate unit 20, wherein the shell unit 10 is used for accommodating the electronic equipment, and the shell unit 10 is provided with a first side plate 13 and a second side plate 14 which are oppositely arranged; the first plate unit 20 is fixedly disposed within the housing unit 10, the first plate unit 20 having a first inlet connection 25 and a first outlet connection 26; the electronic device comprises a first electronic device 21 and a second electronic device 22, the first liquid cooling plate unit 20 is provided with a first radiating surface and a second radiating surface which are oppositely arranged, the first electronic device 21 is attached to the first radiating surface, and the second electronic device 22 is attached to the second radiating surface; the first inlet connector 25 and the first outlet connector 26 protrude from the first side plate 13 and are used for communicating with an external coolant system, and the coolant enters from the first inlet connector 25 and flows out from the first outlet connector 26, so that the first liquid-cooled plate unit 20 liquid-cools and dissipates heat to the first electronic device 21 and the second electronic device 22.

Specifically, referring to fig. 1, 2 and 3, the liquid-cooled heat dissipation device is used for carrying and liquid-cooled heat dissipation of an electronic device, a housing unit 10 of the liquid-cooled heat dissipation device has a first side plate 13 and a second side plate 14 which are oppositely arranged, a first liquid-cooled plate unit 20 is arranged in the housing unit 10, the first liquid-cooled plate unit 20 is, for example, plate-shaped and has two oppositely arranged heat dissipation surfaces, i.e., a first heat dissipation surface and a second heat dissipation surface, a cooling liquid channel for circulation of cooling liquid is arranged in the plate-shaped first liquid-cooled plate unit 20, and an inlet and outlet joint of the cooling liquid channel is located at the same end of the first liquid-cooled plate unit, i.e., a first inlet joint 25 and a first outlet joint 26 protrude from the first side plate 13 of the housing unit 10; the first inlet connector 25 and the first outlet connector 26 are then connected to an external coolant system such that coolant enters the first fluid-cooled plate unit from the first inlet connector and exits the first outlet connector, thereby allowing the first fluid-cooled plate unit to cool and dissipate heat from the electronic device disposed on both heat dissipating surfaces.

In this embodiment, the electronic device includes a first electronic device and a second electronic device, and the first electronic device and the second electronic device may be, for example, both the example boards of the virtual currency mining machine, or the first electronic device and the second electronic device may also be other heat generating devices that require liquid cooling for heat dissipation according to actual needs.

Generally, it can be understood that the electronic device includes a substrate and a heating element located on one side of the substrate, for example, the substrate is an aluminum substrate, and the heating element is arranged on one side of the aluminum substrate, in this embodiment, for example, one side of the aluminum substrate, where the heating element is not arranged, may be attached to the heat dissipation surface of the first liquid cooling plate, that is, the heating elements of the two electronic devices are back to the first liquid cooling plate unit, and are arranged on the two heat dissipation surfaces in a mirror image manner, so that most of heat generated by the heating element is conducted to the first liquid cooling plate unit through the aluminum substrate, thereby achieving liquid cooling heat; or, according to actual needs, the heating element can be arranged on the two radiating surfaces towards the first liquid cooling plate unit and in a mirror image mode, at the moment, heat generated by the heating element is directly conducted to the first liquid cooling plate unit, and liquid cooling radiation is achieved.

In this embodiment, through setting up electronic equipment on two cooling surfaces at first liquid cooling board unit, for example the example board, a liquid cooling board unit corresponds arranges two example boards promptly, like this, compare the condition that a prior art example board corresponds one or two liquid cooling boards, under the unchangeable condition of example board quantity, the quantity of liquid cooling board unit that can significantly reduce, thereby the quantity of significantly reduced adapter, and then the quantity of effectively having reduced the coolant liquid leakage risk point, the technological effect of greatly reduced coolant liquid leakage risk under the prerequisite of guaranteeing liquid cooling radiating effect has been realized.

It can be understood that when first liquid cold plate unit is a plurality of, two electronic equipment are all arranged to two cooling surfaces of the first liquid cold plate unit of each, then a plurality of first liquid cold plate unit accessible divide the parallelly connected setting of liquid device, and what need guarantee, a plurality of first liquid cold plate unit need remain an inlet joint and an outlet joint of coolant liquid to the outside coolant liquid system of UNICOM.

In a possible embodiment, the liquid-cooled heat dissipation apparatus is further configured to cool and dissipate heat of the power supply device 31, the power supply device 31 is disposed in the housing unit 10, and the power supply device 31 is electrically connected to the electronic device and configured to supply power to the electronic device; wherein the liquid-cooled heat sink further comprises a second liquid-cooled plate unit 30, the second liquid-cooled plate unit 30 is fixedly disposed in the housing unit 10, the second liquid-cooled plate unit 30 has a second inlet connector 35 and a second outlet connector 36 protruding from the first side plate 13; the second liquid cooling plate unit 30 has a third heat dissipation surface, and the power supply device 31 is attached to the third heat dissipation surface;

wherein the first outlet connection 26 and the second inlet connection 35 are communicated through a transfer pipe 40, and the first inlet connection 25 and the second outlet connection 36 are communicated with an external cooling liquid system; alternatively, the first inlet connector 25 and the second outlet connector 36 are communicated through the adapter tube 40, and the first outlet connector 26 and the second inlet connector 35 are communicated with the external cooling liquid system; alternatively, the first inlet connection 25 and the second inlet connection 35 are connected to a first three-way connection, the first outlet connection 26 and the second outlet connection 36 are connected to a second three-way connection, and the first three-way connection and the second three-way connection are communicated with an external coolant system.

Specifically, referring to fig. 3 and 5, a power supply device 31 is further disposed in the housing unit of the liquid-cooled heat sink, and the power supply device 31 is configured to supply power to the first electronic device 21 and the second electronic device 22; at this time, a second liquid cooling plate unit 30 is further disposed in the housing unit 10, and a heat dissipation surface (a third heat dissipation surface) of the second liquid cooling plate unit 30 is used for attaching the power supply device 31, so that the second liquid cooling plate unit 30 is used for liquid cooling heat dissipation of the power supply device 31.

Referring to fig. 5, the first liquid cooling plate unit 20 and the second liquid cooling plate unit 30 may be, for example, connected in series, and specifically, the first outlet connector 26 and the second inlet connector 35 are connected through a switching tube 40, so that the cooling liquid flows through the first liquid cooling plate unit and then flows through the second liquid cooling plate unit; alternatively, the first inlet connector 25 and the second outlet connector 36 are connected by the adapter tube 40, and at this time, the cooling liquid flows through the second liquid cooling plate unit first and then flows through the first liquid cooling plate unit; that is, in this embodiment, the sequence of the cooling liquid flowing through the electronic device and the power supply device may be determined according to actual needs.

Alternatively, it is understood that the first liquid cooling plate unit 20 and the second liquid cooling plate unit 30 may also be in parallel communication, specifically, the first inlet joint 25 and the second inlet joint 35 are respectively connected to a first three-way joint, meanwhile, the first outlet joint 26 and the second outlet joint 36 are respectively connected to a second three-way joint, and then the first three-way joint and the second three-way joint are further communicated with an external cooling liquid system; in this way, the cooling fluid flows through the first and second fluid cooled plate units simultaneously.

That is, the first liquid cooling plate unit 20 and the second liquid cooling plate unit 30 may specifically adopt the above-mentioned serial communication mode or parallel communication mode according to actual needs.

In this embodiment, the liquid-cooled heat dissipation device can also perform liquid-cooled heat dissipation on the power supply device, the power supply device is electrically connected with the electronic device, for example, the electronic device is a computing board, and thus, the computing board and the power supply device form an integral module, which is convenient to transport and install.

In one possible embodiment, the liquid-cooled heat sink further includes a connection unit 50, and the first liquid-cooled plate unit 20 and the second liquid-cooled plate unit 30 are respectively fixed in the housing unit 10 through the connection unit 50.

In this embodiment, the first liquid cooling plate unit and the second liquid cooling plate unit are respectively fixed in the housing unit through the connection unit.

In one possible embodiment, the first cold plate unit 20 and the second cold plate unit 30 are provided with adapter flanges 27 on both sides thereof, the connection unit 50 is respectively disposed on both sides of the first cold plate unit 20 and the second cold plate unit 30, and the connection unit 50 has a guide groove 51 into which the adapter flanges 27 are inserted.

Referring specifically to fig. 4, the first liquid-cooled board unit 20 has adapter flanges 27 protruding from the electronic device on both sides, and then, referring to fig. 5, 6 and 7, the connection unit 50 has guide grooves 51 into which the adapter flanges 27 are inserted, the two connection units 50 are arranged on both sides of the first liquid-cooled board unit 20, and the guide grooves 51 are arranged to face each other, so that the first liquid-cooled board unit 20 can be inserted into the housing unit 10 along the guide grooves 51; the second liquid cooling plate unit 30 is fixed by the connection unit 50 in a similar manner to the first liquid cooling plate unit, and will not be described again.

In this embodiment, this first liquid cooling board unit and second liquid cooling board unit are fixed in the housing unit through the mode of grafting guide way, and this guide way has limiting displacement to two liquid cooling board units to convenient the dismantlement.

In one possible embodiment, the first cold plate unit 20 and the second cold plate unit 30 are arranged side by side, and the connection unit 50 between the first cold plate unit 20 and the second cold plate unit 30 is integrally arranged.

Referring specifically to fig. 6, the first and second

cold plate units

20 and 30 are arranged side by side, so that it can be understood that the adjacent connection units 50 between the two cold plates can be integrally arranged, i.e., the two guide grooves 51 are oppositely and outwardly arranged on one adapter.

In a possible embodiment, the two ends of the guiding slot 51 are provided with locking screws 52, so that after the adapter flanges at the two sides of the first liquid cooling plate unit and the second liquid cooling plate unit are inserted into the guiding slot, the locking screws 52 are screwed at the two ends of the guiding slot 51, and the two liquid cooling plate units can be limited along the direction of the guiding slot 51, thereby preventing the liquid cooling plate units from sliding.

In the above embodiment, for example, referring to fig. 7, the connecting unit 50 can be fixedly mounted on the housing unit 10 through the screw hole 53 provided at the bent portion of the lower end, and then the guide groove 51 is located at the bent portion of the upper end of the connecting unit.

In a possible embodiment, the housing unit 10 includes a bearing housing 11, the bearing housing 11 has a bearing slot, the first side plate 13 and the second side plate 14 are mounted at two ends of the bearing housing 11, and the bearing slot is provided with a mounting cover 15.

Referring to fig. 1 to 3, the bearing housing 11 is, for example, a flat plate, and two ends of the bearing housing are bent upward to form a bearing slot, the first liquid cooling plate unit 20 and the second liquid cooling plate unit 30 are fixedly disposed in the bearing slot and covered by the mounting cover 15 in fig. 2, and then a first side plate 13 and a second side plate 14 are encapsulated at two ends of the bearing slot, wherein the first side plate 13 has a through hole for protruding the inlet/outlet connector of the liquid cooling plate, and then the outlet connector is communicated with the external cooling liquid system, so that the electronic device inside the housing unit and the connector of the liquid cooling plate and the external cooling liquid system are separated by the first side plate, and the situation that the cooling liquid is sprayed onto the surface of the electronic device to damage the electronic device when the connector of the inlet/outlet of the liquid cooling plate is connected to the external cooling liquid system and the liquid.

In a possible embodiment, the two ends of the second side plate 14 are respectively provided with a power adapter 16 and a communication adapter 17.

The power adapter 16 can be electrically connected to the power device 31, for example, the power device 31 is electrically connected to the control board 60, and then the electronic device is electrically connected to the control board 60 through the adapter copper bar 61; the communication connector 17 is electrically connected to the control board 60; thus, the power cable and the communication cable are respectively connected from two ends of the second side plate 14, mutual interference between strong current and weak current is prevented, and wiring is facilitated.

On the other hand, in combination with the above embodiment, the coolant joint and the electrical joint of the housing unit are respectively arranged on the first side plate and the second side plate which are opposite, so that water and electricity separation is realized, and the use safety is improved.

In a possible embodiment, two ends of the second side plate 14 further protrude and extend to form a fixed mounting plate 141, and a fixed mounting hole 142 is formed on the fixed mounting plate 141; the fixed mounting plate 141 is bent outward to form a pulling plate 143, and the pulling plate 143 is provided with a pulling hole 144.

Referring to fig. 2, the two ends of the second side plate 14 protrude and extend to form a fixed mounting plate 141 relative to the carrying case, and the fixed mounting plate 141 is provided with a fixed mounting hole 142, so that the case unit 10 can be conveniently and fixedly mounted on the external cabinet body through the fixed mounting hole 142; then, the fixed mounting plates 141 at both ends are further provided with a lifting plate 143, for example, which is bent outward vertically, and the lifting plate 143 is provided with a lifting hole 144, which facilitates the hand-held operation.

In a possible embodiment, the first electronic device 21 and the second electronic device 22 are respectively provided with a first protection plate 23 and a second protection plate 24 on the side facing away from the liquid cooling plate.

That is, in addition to fig. 4, in the above-described embodiment, the first shield 23 and the second shield 24 are respectively provided on the surfaces of the heat generating elements of the first electronic device 21 and the second electronic device 22, so that the heat generating elements can be protected.

In one possible embodiment, a thermally conductive silicone grease is provided between the first electronic device 21 and the first liquid-cooled plate unit 20, and/or a thermally conductive silicone grease is provided between the second electronic device 22 and the first liquid-cooled plate unit 20. This heat conduction silicone grease can do benefit to the heat and conduct to first liquid cooling board unit from electronic equipment, promotes the liquid cooling effect.

In one possible embodiment, the first electronic device 21 includes a first substrate, the second electronic device 22 includes a second substrate, the first substrate is attached to the first heat dissipation surface, and the second substrate is attached to the second heat dissipation surface; the first heat dissipation surface and the second heat dissipation surface are planes, the first substrate and the second substrate are aluminum substrates, and a heating element is arranged on one side of the aluminum substrates, which faces away from the first liquid cooling plate unit 20.

In this embodiment, the substrates of the first electronic device and the second electronic device are aluminum substrates, and the surface of the aluminum substrate on which the heating element is disposed faces away from the first liquid cooling plate unit, wherein the aluminum substrate is a metal-based copper-clad plate with a good heat dissipation function, and the aluminum substrate is attached to the heat dissipation surface of the first liquid cooling plate unit, so that heat generated by the heating element can be quickly and efficiently conducted to the first liquid cooling plate unit and further conducted to the cooling liquid, and a quick and efficient heat dissipation effect is achieved.

On the basis of the above embodiment, for example, when the first electronic device and the second electronic device are the abacus board, the power supply device supplies power to the abacus board; that is to say, this application embodiment still discloses a liquid cooling virtual currency digger, and this liquid cooling virtual currency digger includes the liquid cooling heat abstractor of calculation board and bearing calculation board, and wherein, this liquid cooling heat abstractor is foretell liquid cooling heat abstractor.

The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.

The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".

It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of exemplary aspects and embodiments have been discussed above, those of skill in the art will recognize that certain variations, modifications, alterations, additions and sub-combinations thereof are encompassed within the scope of the invention.

Claims

1. The utility model provides a liquid cooling heat abstractor, its characterized in that, liquid cooling heat abstractor is used for giving the electronic equipment liquid cooling heat dissipation, liquid cooling heat abstractor includes:

a housing unit (10), the housing unit (10) being used for accommodating the electronic device, the housing unit (10) having a first side plate (13) and a second side plate (14) which are oppositely arranged;

a first liquid cold plate unit (20), said first liquid cold plate unit (20) being fixedly disposed within said housing unit (10), said first liquid cold plate unit (20) having a first inlet connection (25) and a first outlet connection (26);

the electronic equipment comprises first electronic equipment (21) and second electronic equipment (22), the first liquid cooling plate unit (20) is provided with a first radiating surface and a second radiating surface which are oppositely arranged, the first electronic equipment (21) is attached to the first radiating surface, and the second electronic equipment (22) is attached to the second radiating surface;

the first inlet connector (25) and the first outlet connector (26) protrude from the first side plate (13) and are used for communicating with an external cooling liquid system, and cooling liquid enters from the first inlet connector (25) and flows out from the first outlet connector (26), so that the first liquid cooling plate unit (20) liquid-cools and dissipates heat of the first electronic device (21) and the second electronic device (22) at the same time.

2. The liquid-cooled heat sink of claim 1, wherein the liquid-cooled heat sink is further configured to liquid-cool a power supply device (31), the power supply device (31) being disposed within the housing unit (10), the power supply device (31) being electrically connected to the electronic device for supplying power to the electronic device;

wherein, the liquid cooling heat abstractor further includes:

a second liquid cold plate unit (30), the second liquid cold plate unit (30) being fixedly disposed within the housing unit (10), the second liquid cold plate unit (30) having a second inlet fitting (35) and a second outlet fitting (36) projecting from the first side plate (13); the second liquid cooling plate unit (30) is provided with a third heat dissipation surface, and the power supply equipment (31) is attached to the third heat dissipation surface;

wherein the first outlet connection (26) and the second inlet connection (35) are communicated through a transfer pipe (40), and the first inlet connection (25) and the second outlet connection (36) are communicated with an external cooling liquid system; or,

the first inlet connector (25) and the second outlet connector (36) are communicated through the adapter tube (40), and the first outlet connector (26) and the second inlet connector (35) are communicated with an external cooling liquid system; or the first inlet joint (25) and the second inlet joint (35) are respectively connected with a first three-way joint, the first outlet joint (26) and the second outlet joint (36) are respectively connected with a second three-way joint, and the first three-way joint and the second three-way joint are communicated with an external cooling liquid system.

3. The liquid-cooled heat sink of claim 2, further comprising a connecting unit (50), wherein the first liquid-cooled plate unit (20) and the second liquid-cooled plate unit (30) are respectively fixedly disposed in the housing unit (10) via the connecting unit (50).

4. The liquid-cooled heat sink according to claim 3, characterized in that adapter flanges (27) are provided on both sides of the first liquid-cooled plate unit (20) and the second liquid-cooled plate unit (30), the connection unit (50) is respectively arranged on both sides of the first liquid-cooled plate unit (20) and the second liquid-cooled plate unit (30), and the connection unit (50) has a guide groove (51) into which the adapter flanges (27) are inserted.

5. The liquid-cooled heat sink according to claim 4, wherein the first liquid-cooled plate unit (20) and the second liquid-cooled plate unit (30) are arranged side by side, and the connection unit (50) between the first liquid-cooled plate unit (20) and the second liquid-cooled plate unit (30) is integrally arranged.

6. The liquid-cooled heat sink according to any one of claims 4 and 5, characterized in that locking screws (52) are provided at both ends of the guide groove (51).

7. The liquid-cooled heat sink according to claim 1, wherein the housing unit (10) comprises a load-bearing housing (11), the load-bearing housing (11) having a load-bearing slot, the first side plate (13) and the second side plate (14) being mounted at opposite ends of the load-bearing housing (11), and a mounting cover (15) being provided on the load-bearing slot.

8. The liquid-cooled heat sink according to claim 7, wherein the second side plate (14) has a power adapter (16) and a communication adapter (17) at each end.

9. The liquid-cooled heat sink according to any one of claims 7 and 8, wherein the second side plate (14) further has a fixing mounting plate (141) protruding from both ends thereof, and the fixing mounting plate (141) is provided with a fixing mounting hole (142); the fixed mounting plate (141) is outwards bent with a lifting plate (143), and the lifting plate (143) is provided with a lifting hole (144).

10. The liquid-cooled heat sink according to any one of claims 1 to 5, 7 and 8, wherein the first electronic device (21) and the second electronic device (22) are provided with a first protective plate (23) and a second protective plate (24) on the surfaces thereof facing away from the first liquid-cooled plate unit (20).

11. The liquid-cooled heat sink according to any one of claims 1-5, 7, and 8, wherein a thermally conductive silicone grease is provided between the first electronic device (21) and the first liquid-cooled plate unit (20), and/or a thermally conductive silicone grease is provided between the second electronic device (22) and the first liquid-cooled plate unit (20).

12. The liquid-cooled heat sink according to any one of claims 1-5, 7, and 8, wherein the first electronic device (21) comprises a first substrate, the second electronic device (22) comprises a second substrate, the first substrate is attached to the first heat dissipation surface, and the second substrate is attached to the second heat dissipation surface;

the first radiating surface and the second radiating surface are planes, the first substrate and the second substrate are aluminum substrates, and heating elements are arranged on the surfaces, back to the first liquid cooling plate unit (20), of the aluminum substrates.

13. A liquid-cooled virtual currency miner, comprising a computing board and a liquid-cooled heat sink carrying the computing board, wherein the liquid-cooled heat sink is as claimed in any one of claims 1 to 12.