CN111726970A - Liquid cooling heat abstractor, liquid cooling electronic equipment and liquid cooling virtual currency digger - Google Patents
Liquid cooling heat abstractor, liquid cooling electronic equipment and liquid cooling virtual currency digger Download PDFInfo
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- CN111726970A CN111726970A CN202010639535.9A CN202010639535A CN111726970A CN 111726970 A CN111726970 A CN 111726970A CN 202010639535 A CN202010639535 A CN 202010639535A CN 111726970 A CN111726970 A CN 111726970A
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- heat sink
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- 238000001816 cooling Methods 0.000 title abstract description 55
- 239000007788 liquid Substances 0.000 title abstract description 46
- 230000017525 heat dissipation Effects 0.000 claims abstract description 61
- 239000000110 cooling liquid Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000005065 mining Methods 0.000 claims abstract description 5
- 238000004891 communication Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 238000013021 overheating Methods 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011093 chipboard Substances 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a liquid-cooled heat dissipation device, a liquid-cooled electronic device and a liquid-cooled virtual currency mining machine, wherein the liquid-cooled heat dissipation device comprises a shell unit, the shell unit is provided with a first side end and a second side end, then a first accommodating space in the shell unit is close to the first side end arranged at an opening, the first side end is also provided with a flow adjusting unit, and the flow adjusting unit is provided with a flow adjusting hole; arranging a substrate unit of the operation module in the first accommodating space, wherein the flow adjusting unit is arranged corresponding to the first surface area of the substrate unit, and a heating element is arranged on the first surface of the substrate unit; thus, the flow rate adjusting unit can adjust the heat dissipation efficiency of the cooling liquid to the first surface and the second surface of the substrate unit; therefore, the technical problems that local overheating is easy to occur and the liquid cooling heat dissipation effect is poor due to the structure of the conventional electronic equipment are solved, and the technical effects of pertinence liquid cooling heat dissipation of the operation module and improvement of liquid cooling heat dissipation efficiency and uniformity are achieved.
Description
Technical Field
The invention relates to the technical field of liquid cooling heat dissipation of electronic equipment, in particular to a liquid cooling heat dissipation device, liquid cooling electronic equipment and a liquid cooling virtual currency mining machine.
Background
With the continuous development of the technology, electronic devices are continuously updated, the data volume processed by the electronic devices is larger and larger, the operation density is higher and higher, and in order to ensure stable operation, the heat dissipation capability of the electronic devices needs to be continuously improved.
At present, an air-cooled heat dissipation technology is not suitable for electronic equipment with high power density, a liquid-cooled heat dissipation technology gradually becomes the mainstream, and two liquid-cooled heat dissipation modes exist in the existing liquid-cooled heat dissipation technology, one mode is to additionally mount a liquid-cooled plate on the electronic equipment, and the other mode is to directly soak the electronic equipment in cooling liquid; aiming at immersion type liquid cooling heat dissipation, the prior technical scheme is that a fan of the electronic equipment which originally adopts air cooling is directly dismounted, and then the electronic equipment is directly immersed in cooling liquid which circularly flows from bottom to top.
However, in the above solution, after the fan is removed, the structure of the electronic device is not suitable for immersion type liquid cooling heat dissipation, for example, local overheating is easily generated, which affects heat dissipation efficiency and results in poor heat dissipation effect.
Disclosure of Invention
The embodiment of the application provides a liquid-cooled heat dissipation device, a liquid-cooled electronic device and a liquid-cooled virtual currency mining machine, wherein the liquid-cooled heat dissipation device comprises a shell unit, the shell unit is provided with a first side end and a second side end, then a first accommodating space in the shell unit is close to the first side end arranged at an opening, the first side end is also provided with a flow adjusting unit, and the flow adjusting unit is provided with a flow adjusting hole; arranging a substrate unit of the operation module in the first accommodating space, wherein the flow adjusting unit is arranged corresponding to the first surface area of the substrate unit, and a heating element is arranged on the first surface of the substrate unit; thus, when the housing unit is placed in the cooling liquid flowing from bottom to top in the directions of the first side end facing downwards and the second side end facing upwards, the flow rate adjusting unit can adjust the flow rate of the cooling liquid flowing through the first surface and the second surface of the substrate unit; that is, the flow rate adjusting unit can adjust the heat radiation efficiency of the cooling liquid to the first surface and the second surface of the substrate unit;
that is to say, according to the difference of base plate unit heat transfer performance among the operation module, the liquid cooling heat abstractor of this application embodiment can be through the size of adjustment flow adjustment hole, and then the flow of adjustment coolant flow through base plate unit first surface and second surface to can carry out the liquid cooling heat dissipation of pertinence to the operation module, the technical problem that local overheat appears easily that has solved the structure of current electronic equipment and has leaded to, the liquid cooling radiating effect is not good is solved, the liquid cooling that has realized to the operation module has pointed the heat dissipation, improve the technical effect of liquid cooling radiating efficiency and homogeneity.
The embodiment of the application provides a liquid cooling heat abstractor, liquid cooling heat abstractor includes:
the device comprises a shell unit, a first side end and a second side end, wherein the shell unit is provided with a first side end and a second side end which are oppositely arranged, and the first side end is provided with an opening;
the first accommodating space is arranged inside the shell unit and used for arranging an operation module, and the first accommodating space is close to the first side end;
the flow adjusting unit is arranged at the first side end;
the operation module comprises a substrate unit, wherein the substrate unit is provided with a first surface and a second surface which extend along the direction from the first side end to the second side end and are oppositely arranged, and the first surface is provided with a heating element;
the flow rate adjusting unit is arranged at the first side end and corresponds to the first surface area, and a flow rate adjusting hole is formed in the flow rate adjusting unit, so that when the cooling liquid flows from the first side end to the second side end, the flow rate of the cooling liquid flowing through the first surface and the second surface is adjusted.
In a disclosed embodiment, in the first accommodating space, a plurality of the operation modules are stacked; and corresponding to the first surface area of each operation module, the first side end is provided with the corresponding flow adjusting unit.
In a disclosed embodiment, the first surface is provided with a first heat sink, the second surface is provided with a second heat sink, the heat dissipation fins of the first heat sink and the second heat sink extend in a direction from the first side end to the second side end, and the flow rate adjustment unit covers a height of the heat dissipation fins of the first heat sink.
In a disclosed embodiment, the operation module is mounted in the first accommodating space through a fixed guide rail; the fixed guide rail is fixed to the housing unit through a fixing hole; wherein,
the fixed guide rail is provided with a guide post along a first direction, and the second radiator is provided with a guide groove along the first direction; or,
the fixed guide rail is provided with a guide groove along the first direction, and the second radiator is provided with a guide post along the first direction;
the guide groove supplies the guide post to peg graft, first direction is first side point to the direction of second side.
In a disclosed embodiment, a first end portion of the second heat sink close to the first side end and a second end portion far away from the first side end are fixedly connected inside the housing unit through a first mounting plate and a second mounting plate respectively; wherein,
the two ends of the first mounting plate are fixedly connected to the shell unit through first mounting holes, and the first mounting plate is further provided with a first connecting hole connected with the first end of the second radiator;
the both ends of second mounting panel pass through second mounting hole fixed connection in housing unit, still be equipped with on the second mounting panel with the second connecting hole that the second end connection of second radiator.
In a disclosed embodiment, the flow rate adjusting unit includes a flow rate adjusting plate and the first mounting plate, which are integrally disposed, wherein the flow rate adjusting plate is provided with the flow rate adjusting hole, the flow rate adjusting plate is parallel to the first side end, and the first mounting plate and the flow rate adjusting plate are vertically bent.
In a disclosed embodiment, a second accommodating space is further arranged inside the housing unit, the second accommodating space is communicated with the first accommodating space, the second accommodating space is close to the second side end, and the second accommodating space is used for arranging a power module and a control module; the power module is electrically connected with the operation module through a switching copper bar, and the control module is electrically connected with the operation module through a control line.
In a disclosed embodiment, the second side end is provided with a power supply connector electrically connected with the power module and a communication connector electrically connected with the control module, wherein the power supply connector and the communication connector are respectively located at two ends of the second side end.
The embodiment of the application further provides a liquid cooling electronic device, the liquid cooling electronic device comprises a liquid cooling heat dissipation device and an operation module arranged in the liquid cooling heat dissipation device, wherein the liquid cooling heat dissipation device is the liquid cooling heat dissipation device.
The embodiment of the application further provides a liquid cooling virtual currency digger, the liquid cooling virtual currency digger includes the liquid cooling heat abstractor and arranges in the inside calculation board of liquid cooling heat abstractor, wherein, the liquid cooling heat abstractor is foretell liquid cooling heat abstractor.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
in the embodiment of the application, the liquid cooling heat dissipation device comprises a shell unit, wherein the shell unit is provided with a first side end and a second side end, then a first accommodating space in the shell unit is close to the first side end arranged at the opening, the first side end is also provided with a flow adjusting unit, and the flow adjusting unit is provided with a flow adjusting hole for cooling liquid to flow through; arranging a substrate unit of the operation module in the first accommodating space, wherein the flow adjusting unit is arranged corresponding to the first surface area of the substrate unit, and a heating element is arranged on the first surface of the substrate unit; thus, when the shell unit is placed in the cooling liquid flowing from bottom to top in the directions that the first side end faces downwards and the second side end faces upwards, the flow rate adjusting unit can adjust the flow rate of the cooling liquid flowing through the first surface and the second surface; that is, the flow rate adjusting unit may adjust the heat radiation efficiency of the cooling liquid to the first surface and the second surface;
that is to say, according to the difference of the first surface of base plate unit and the second surface heat, the liquid cooling heat abstractor of this application embodiment can be through the size of adjustment flow adjustment hole, and then the flow of adjustment coolant flow through first surface and second surface to carry out the radiating of pertinence liquid cooling to the operation module, improved radiating efficiency of liquid cooling and homogeneity.
Drawings
Fig. 1 is a schematic structural diagram of the liquid-cooled heat dissipation device in the embodiment of the present application.
Fig. 2 is a schematic diagram of an internal structure of the liquid-cooled heat dissipation device in the embodiment of the present application.
Fig. 3 is a schematic structural diagram of the liquid-cooled heat dissipation device disposed in the cooling device in the embodiment of the present application.
Fig. 4 is a schematic structural diagram of the fixed rail in the embodiment of the present application.
Fig. 5 is a schematic view of an installation structure of the first heat sink and the second heat sink in the embodiment of the present application.
Fig. 6 is a schematic structural diagram of the second mounting plate in the embodiment of the present application.
Fig. 7 is a schematic structural diagram of the flow rate adjustment unit in the embodiment of the present application.
Reference numerals
10-housing unit, 11-first side end, 12-second side end, 13-housing, 14-top cover, 15-fixed guide rail, 16-first mounting plate, 17-second mounting plate, 18-switching copper bar, 19-control line,
111-supply connection, 112-communication connection,
151-guide posts, 152-fixing holes,
161-first mounting hole, 162-first connection hole,
171-a second mounting hole, 172-a second connecting hole, 173-a wire binding hole,
21-a first accommodating space, 22-a second accommodating space,
30-operation module, 31-substrate unit, 32-heating element, 33-first radiator, 34-second radiator, 35-radiating fin,
341-the guide groove(s),
40-flow regulating unit, 41-flow regulating plate, 42-flow regulating hole,
50-a power supply module, 60-a control module,
90-cooling device, 91-cooling liquid inlet, 92-cooling liquid outlet,
a-a first direction, B-a second direction.
Detailed Description
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
The embodiment of the application provides a liquid cooling heat dissipation device, which includes a housing unit 10, a first accommodating space 21 and a flow adjusting unit 40, which are disposed in the housing unit 10, wherein the housing unit 10 has a first side end 11 and a second side end 12 which are oppositely disposed, and the first side end 11 is an opening; the first accommodating space 21 is disposed inside the housing unit 10, the first accommodating space 21 is used for arranging the operation module 30, and the first accommodating space 21 is close to the first side end 11; the flow rate adjusting unit 40 is installed at the first side end 11; wherein, the arithmetic module 30 comprises a substrate unit 31, the substrate unit 31 has a first surface and a second surface extending along the direction from the first side end to the second side end (direction a in fig. 1) and oppositely arranged, the first surface is provided with a heating element 32; the flow rate adjusting unit 40 is disposed corresponding to the first surface area at the first side end 11, and the flow rate adjusting unit 40 is provided with a flow rate adjusting hole 42 to adjust the flow rate of the cooling liquid flowing through the first surface and the second surface when the cooling liquid flows from the first side end 11 to the second side end 12.
It should be noted that, referring to fig. 3, the liquid-cooled heat dissipating apparatus of the embodiment of the present application is internally loaded with an operation module 30, the operation module 30 is an electronic device requiring liquid-cooled heat dissipation, such as an excavator computer board, a chip board, etc., and then the liquid-cooled heat dissipating apparatus is integrally placed in a cooling apparatus 90, the cooling apparatus 90 has a cooling liquid inlet 91 at a lower end thereof and a cooling liquid outlet 92 at an upper end thereof, the cooling liquid circulates under the action of an external power pump, and the liquid level of the cooling liquid in the cooling apparatus 90 is submerged in the liquid-cooled heat dissipating apparatus; therefore, in the cooling device, the cooling liquid flows from bottom to top, namely, the cooling liquid flows from the lower end to the upper end of the liquid-cooling heat dissipation device, so that the circulating cooling liquid continuously exchanges heat with electronic equipment such as a sample plate and the like, and the liquid-cooling heat dissipation of the electronic equipment is realized; it will be appreciated that the cooling fluid should be an electrically insulating cooling fluid, such as an insulating oil-like substance, a fluorinated fluid, etc.
Referring to fig. 1, 2 and 5, in the present embodiment, the liquid-cooled heat sink includes a housing unit 10, the housing unit 10 is, for example, rectangular, the housing unit 10 has a first side end 11 and a second side end 12 opposite to each other, and the first side end 11 is provided as an opening; then, a first accommodating space 21 is provided inside the housing unit 10 near the first side end 11, and the first accommodating space 21 is used for accommodating an operation module 30, such as an operation board, a chip board, etc.; referring to fig. 5, the operation module 30 includes a substrate unit 31, where the substrate unit 31 has a first surface and a second surface opposite to each other, the first surface is a surface of the substrate unit facing upward in fig. 1 and toward left in fig. 5, and the second surface is a surface of the substrate unit facing downward in fig. 1 and toward right in fig. 5; when the substrate unit 31 is placed in the first receiving space 21, the first surface and the second surface are extended in the direction from the first side end to the second side end (direction a in fig. 1), and then, referring to fig. 3, the housing unit 10 is placed in the cooling device 90 with the first side end 11 facing downward and the second side end 12 facing upward, and the second side end 12 of the housing unit 10 is submerged by the cooling liquid.
At this time, at the first side end 11, it is easy to understand that the substrate unit 31 divides the cooling liquid, i.e. a part of the cooling liquid flows through the first surface area to cool and radiate heat to the first surface, and a part of the cooling liquid flows through the second surface area to cool and radiate heat to the second surface; meanwhile, in the present embodiment, the heating element 32 is disposed on the first surface, and then, with reference to fig. 2, a flow rate adjusting unit 40 is disposed at a position of the first side end 11 corresponding to the first surface area, and a flow rate adjusting hole 42 is disposed on the flow rate adjusting unit 40; thus, the flow rate adjustment unit 40 has a blocking effect on the coolant flowing through the first surface, and the coolant can only pass through the flow rate adjustment hole 42; that is, in this embodiment, the flow adjusting unit 40 is disposed at the position of the first side end 11 of the housing unit 10 corresponding to the first surface, and the flow adjusting holes 42 on the flow adjusting unit 40 can adjust the flow of the cooling liquid flowing through the first surface of the substrate unit, so as to adjust the heat dissipation efficiency of the cooling liquid to the first surface and the second surface.
For example, when the substrate unit of the computing module is a common PCB, the heat of the first surface and the second surface of the substrate unit are equivalent, and at this time, the size of the flow adjusting hole 42 may be increased to reduce the resistance of the cooling liquid flowing through the first surface, so that the flow of the cooling liquid flowing through the first surface and the second surface is equivalent; when the substrate unit of the arithmetic module is made of aluminum, the heat transfer performance of the aluminum is strong, so that the heat of the second surface of the substrate unit without the heating element is far larger than that of the first surface, at the moment, the size of the flow adjusting hole 42 can be reduced to increase the resistance of the cooling liquid flowing through the first surface, namely, the cooling liquid is enabled to flow through the second surface in a deviation manner, the heat dissipation efficiency of the second surface is increased, and the local overheating phenomenon caused by the fact that the heat dissipation of the second surface is not timely is prevented.
In the embodiment of the application, the liquid cooling heat dissipation device comprises a shell unit, wherein the shell unit is provided with a first side end and a second side end, then a first accommodating space in the shell unit is close to the first side end arranged at the opening, the first side end is also provided with a flow adjusting unit, and the flow adjusting unit is provided with a flow adjusting hole for cooling liquid to flow through; arranging a substrate unit of the operation module in the first accommodating space, wherein the flow adjusting unit is arranged corresponding to the first surface area of the substrate unit, and a heating element is arranged on the first surface of the substrate unit; thus, when the shell unit is placed in the cooling liquid flowing from bottom to top in the directions that the first side end faces downwards and the second side end faces upwards, the flow rate adjusting unit can adjust the flow rate of the cooling liquid flowing through the first surface and the second surface; that is, the flow rate adjusting unit may adjust the heat radiation efficiency of the cooling liquid to the first surface and the second surface;
that is to say, according to the difference of the first surface of base plate unit and the second surface heat, the liquid cooling heat abstractor of this application embodiment can be through the size of adjustment flow adjustment hole, and then the flow of adjustment coolant flow through first surface and second surface to carry out the radiating of pertinence liquid cooling to the operation module, improved radiating efficiency of liquid cooling and homogeneity, prevent local overheat.
In one possible embodiment, in the first accommodating space 21, a plurality of computing modules 30 are stacked; in addition, corresponding to the first surface area of each operation module 30, the first side end 11 is provided with a corresponding flow rate adjustment unit 40.
That is, a plurality of computing modules 30 can be stacked along a second direction (direction B in fig. 2) perpendicular to the first direction, and at this time, it can be understood that the flow rate adjusting unit 40 is correspondingly disposed on the first surface area of each computing module 30; that is, the first side end 11 is provided with a plurality of flow adjusting units 40 at intervals, and each flow adjusting unit 40 corresponds to a first surface area of one computing module 30; it is also understood that the plurality of flow rate adjustment units 40 may be provided separately, or the plurality of flow rate adjustment units 40 may be provided integrally.
In this embodiment, according to actual needs, a plurality of operation modules may be stacked in the first accommodating space of the housing unit, and at this time, the flow rates of the cooling liquid flowing through the first surface and the second surface of each substrate unit may be respectively adjusted by the plurality of flow rate adjustment units, so that the plurality of operation modules are subjected to targeted liquid cooling heat dissipation at the same time.
In a possible embodiment, the first surface is provided with a first heat sink 33, the second surface is provided with a second heat sink 34, the heat dissipation fins 35 of the first heat sink 33 and the second heat sink 34 extend in a first side end to second side end direction, and the flow rate adjustment unit 40 covers the height of the heat dissipation fins 35 of the first heat sink 33.
In order to further improve the heat dissipation efficiency, a first heat sink 33 and a second heat sink 34 may be fixedly disposed on the first surface and the second surface, respectively, wherein, as shown in fig. 1, 2 and 5, the heat dissipation fins 35 of the two heat sinks should be arranged to extend in the direction from the first side end to the second side end (direction a), so that the coolant can be ensured to flow from the first side end to the second side end from bottom to top, and, at the first side end 11, the flow rate adjusting unit 40 should cover the height of the heat dissipation fins 35 of the first heat sink 33.
In this embodiment, set up first radiator and second radiator respectively at first surface and second surface, the radiating fin of two radiators has increased the area of contact with the coolant to can improve the heat exchange efficiency with the coolant, and then improve liquid cooling efficiency.
In one possible embodiment, the computing module 30 is installed in the first accommodating space 21 through a fixed rail 15.
As mentioned above, the operation module 30 is installed in the first accommodation space 21, in this embodiment, for example, the fixed guide rail 15 may be disposed in the first accommodation space 21, and then the operation module 30 is inserted into the fixed guide rail 15, so as to achieve fixed installation.
Specifically, referring to fig. 4, the fixed rail 15 is provided with a guide post 151 along a first direction (a direction in which the first side end points to the second side end), and referring to fig. 5, two side ends of the second heat sink 34 are provided with a guide slot 341 along the first direction, so that, for example, the fixed rail 15 can be respectively provided at two side ends of the second heat sink 34, and the guide slot 341 is used for the guide post 151 to be inserted, thereby realizing the connection between the fixed rail and the second heat sink; then, the fixed rail 15 is fixed to the housing unit 10 through the fixing hole 152, so that the operation module 30 can be installed in the first accommodating space 21.
It can be understood that the positions of the guide posts and the guide grooves can be interchanged, that is, the guide grooves along the first direction are arranged on the fixed guide rail, and the guide posts along the first direction are arranged on the second radiator.
The first heat sink 33 and the second heat sink 34 can be fixedly connected to the substrate unit 31 by fixing screws, for example, and then, in this embodiment, the second heat sink 34 is provided with guide grooves or guide posts, so that the substrate unit 31 is indirectly fixedly connected to the housing unit 10 through the second heat sink 34, and the second heat sink 34 corresponds to the side of the substrate unit 31 where the heat generating element 32 is not provided, thereby avoiding adverse stress influence on the heat generating element 32.
In a possible embodiment, a first end of the second heat sink 34 close to the first side end 11 and a second end far from the first side end 11 are fixedly connected inside the housing unit 10 by the first mounting plate 16 and the second mounting plate 17, respectively.
With reference to fig. 2, 6 and 7, in this embodiment, the operation module 30 is limited and fixed in the first direction by the first mounting plate 16 and the second mounting plate 17.
Specifically, referring to fig. 2 and 7, two ends of the first mounting plate 16 are fixedly connected to the housing unit 10 through first mounting holes 161, and the first mounting plate 16 is further provided with first connection holes 162 connected to the first end of the second heat sink 34; that is, the first mounting plate 16 is, for example, a rectangular plate, the first mounting plate 16 has first bends at both ends, the first bends are fixedly connected to the housing unit 10 by being opened with first mounting holes 161, then, the first mounting plate 16 has a plurality of first connecting holes 162 at a side facing the first end of the second heat sink 34, the first connecting screws pass through the first connecting holes 162 and are screwed to the first end of the second heat sink 34, and thus the second heat sink 34 is fixedly connected inside the housing unit 10 by the first mounting plate 16.
Similarly, referring to fig. 2 and 6, both ends of the second mounting plate 17 are fixedly connected to the housing unit 10 through second mounting holes 171, and the second mounting plate 17 is further provided with second connecting holes 172 connected to the second end of the second heat sink 34; that is, the second mounting plate 17 is, for example, a rectangular plate, the second mounting plate 17 has second bends at both ends thereof, the second bends are fixedly connected to the case unit 10 by being opened with the second mounting holes 171, then, the second mounting plate 17 has a plurality of second connecting holes 172 on a side thereof facing the second end of the second heat sink 34, and second connecting screws are inserted through the second connecting holes 172 and screwed to the second end of the second heat sink 34, so that the second heat sink 34 is fixedly connected to the inside of the case unit 10 by the second mounting plate 17.
In a possible embodiment, the flow adjusting unit 40 includes a flow adjusting plate 41 and a first mounting plate 16 integrally disposed, wherein the flow adjusting plate 41 is provided with a flow adjusting hole 42, the flow adjusting plate is parallel to the first side end, and the first mounting plate 16 and the flow adjusting plate 41 are vertically bent.
That is, in the embodiment of the present application, the first mounting plate 16 and the flow rate adjustment plate 41 are vertically and integrally provided, so that the number of parts is reduced, and the installation is facilitated.
In a possible embodiment, a second accommodating space 22 is further provided inside the housing unit 10, the second accommodating space 22 is communicated with the first accommodating space 21, the second accommodating space 22 is close to the second side end 12, and the second accommodating space 22 is used for arranging the power module 50 and the control module 60; the power module 50 is electrically connected to the operation module 30, and the control module 60 is electrically connected to the operation module 30.
With reference to fig. 1 and 2, the liquid-cooled heat dissipation apparatus of the present embodiment can further carry a power module 50 for supplying power to the operation module 30 and a control module 60 for controlling the operation of the operation module 30, that is, the liquid-cooled heat dissipation apparatus can further cool and dissipate heat of the power module 50 and the control module 60; in order to facilitate connection and maintenance of external cables, a second accommodating space 22 is provided inside the housing unit 10 near the second side end 12, the power module 50 and the control module 60 are provided in the second accommodating space 22, and the power module 50 and the control module 60 are electrically connected to the operation module 30 respectively.
In one possible embodiment, referring to fig. 2, the power module 50 is electrically connected to the computing module 30 through the via copper bar 18, and the control module 60 is electrically connected to the computing module 30 through the control line 19.
In a possible embodiment, referring to fig. 1, the second side end 12 is provided with a power supply connector 111 electrically connected to the power module 50 and a communication connector 112 electrically connected to the control module 60, wherein the power supply connector 111 and the communication connector 112 are respectively located at two ends of the second side end 12; that is, in the present embodiment, the power supply connector 111 and the communication connector 112 are provided separately at both ends of the second side end 12, thereby preventing mutual interference.
In addition, in combination with the above embodiment and fig. 6, the second mounting plate 17 may further include a cable hole 173, and the cable hole 173 is used for fixing a cable connected to the computing module 30, so as to facilitate wiring and achieve a neat and beautiful appearance.
The embodiment of the application also discloses a liquid-cooled electronic device, which comprises a liquid-cooled heat dissipation device and an operation module arranged in the liquid-cooled heat dissipation device, wherein the liquid-cooled heat dissipation device is the liquid-cooled heat dissipation device.
The embodiment of the application further discloses a liquid-cooled virtual currency mining machine, which comprises a liquid-cooled heat dissipation device and a computing board arranged inside the liquid-cooled heat dissipation device, wherein the liquid-cooled heat dissipation device is the liquid-cooled heat dissipation device.
The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.
The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".
It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of exemplary aspects and embodiments have been discussed above, those of skill in the art will recognize that certain variations, modifications, alterations, additions and sub-combinations thereof are encompassed within the scope of the invention.
Claims (10)
1. A liquid-cooled heat sink, comprising:
a housing unit (10), wherein the housing unit (10) has a first side end (11) and a second side end (12) which are oppositely arranged, and the first side end (11) is arranged in an opening way;
a first accommodating space (21), wherein the first accommodating space (21) is arranged inside the shell unit (10), the first accommodating space (21) is used for arranging an operation module (30), and the first accommodating space (21) is close to the first side end (11);
a flow rate adjustment unit (40), wherein the flow rate adjustment unit (40) is arranged at the first side end (11);
wherein the arithmetic module (30) comprises a substrate unit (31), the substrate unit (31) having a first surface and a second surface extending in the direction from the first side end (11) to the second side end (12) and being arranged opposite to each other, the first surface being provided with a heating element (32);
the flow rate adjusting unit (40) is arranged corresponding to the first surface area at the first side end (11), and a flow rate adjusting hole (42) is arranged on the flow rate adjusting unit (40) so as to adjust the flow rate of the cooling liquid flowing through the first surface and the second surface when the cooling liquid flows from the first side end (11) to the second side end (12).
2. The liquid-cooled heat sink according to claim 1, wherein a plurality of the computing modules (30) are stacked in the first accommodating space (21); and the first side end (11) is provided with the corresponding flow rate adjusting unit (40) corresponding to the first surface area of each operation module (30).
3. The liquid-cooled heat sink according to any one of claims 1 and 2, wherein the first surface is provided with a first heat sink (33), the second surface is provided with a second heat sink (34), the heat dissipation fins (35) of the first heat sink (33) and the second heat sink (34) extend in a direction from the first side end (11) to the second side end (12), and the flow rate adjustment unit (40) covers a height of the heat dissipation fins (35) of the first heat sink (33).
4. The liquid-cooled heat sink according to claim 3, wherein the computing module (30) is mounted in the first accommodating space (21) via a fixed guide rail (15); the fixed rail (15) is fixed to the housing unit (10) through a fixing hole (152); wherein,
the fixed guide rail (15) is provided with a guide column (151) along a first direction, and the second radiator (34) is provided with a guide groove (341) along the first direction; or,
the fixed guide rail (15) is provided with a guide groove (341) along the first direction, and the second radiator (34) is provided with a guide column (151) along the first direction;
the guide groove (341) is used for the guide column (151) to be inserted, and the first direction is the direction in which the first side end (11) points to the second side end (12).
5. The liquid-cooled heat sink according to claim 3, wherein a first end of the second heat sink (34) adjacent to the first side end (11) and a second end thereof remote from the first side end (11) are fixedly attached to the interior of the housing unit (10) by a first mounting plate (16) and a second mounting plate (17), respectively; wherein,
two ends of the first mounting plate (16) are fixedly connected to the shell unit (10) through first mounting holes (161), and the first mounting plate (16) is further provided with a first connecting hole (162) connected with a first end of the second radiator (34);
the both ends of second mounting panel (17) pass through second mounting hole (171) fixed connection in housing unit (10), still be equipped with on second mounting panel (17) with second connecting hole (172) that the second end of second radiator (34) is connected.
6. The liquid-cooled heat sink according to claim 5, wherein the flow adjusting unit (40) comprises a flow adjusting plate (41) and the first mounting plate (16) integrally arranged, wherein the flow adjusting plate (41) is provided with the flow adjusting holes (42), the flow adjusting plate (41) is parallel to the first side end (11), and the first mounting plate (16) and the flow adjusting plate (41) are vertically bent.
7. The liquid-cooled heat sink according to claim 1, wherein a second accommodating space (22) is further provided inside the housing unit (10), the second accommodating space (22) is communicated with the first accommodating space (21), the second accommodating space (22) is close to the second side end (12), and the second accommodating space (22) is used for arranging a power module (50) and a control module (60); the power module (50) is electrically connected with the operation module (30) through a switching copper bar (18), and the control module (60) is electrically connected with the operation module (30) through a control line (19).
8. The liquid-cooled heat sink according to claim 7, wherein the second side end (12) is provided with a power supply connector (111) electrically connected to the power module (50) and a communication connector (112) electrically connected to the control module (60), wherein the power supply connector (111) and the communication connector (112) are respectively located at two ends of the second side end (12).
9. A liquid-cooled electronic device, comprising a liquid-cooled heat dissipating device and an operation module disposed inside the liquid-cooled heat dissipating device, wherein the liquid-cooled heat dissipating device is the liquid-cooled heat dissipating device according to any one of claims 1 to 12.
10. A liquid-cooled virtual currency mining machine, which is characterized by comprising a liquid-cooled heat dissipation device and a computing board arranged inside the liquid-cooled heat dissipation device, wherein the liquid-cooled heat dissipation device is the liquid-cooled heat dissipation device as claimed in any one of claims 1 to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010639535.9A CN111726970A (en) | 2020-07-06 | 2020-07-06 | Liquid cooling heat abstractor, liquid cooling electronic equipment and liquid cooling virtual currency digger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010639535.9A CN111726970A (en) | 2020-07-06 | 2020-07-06 | Liquid cooling heat abstractor, liquid cooling electronic equipment and liquid cooling virtual currency digger |
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| Publication Number | Publication Date |
|---|---|
| CN111726970A true CN111726970A (en) | 2020-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010639535.9A Pending CN111726970A (en) | 2020-07-06 | 2020-07-06 | Liquid cooling heat abstractor, liquid cooling electronic equipment and liquid cooling virtual currency digger |
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| CN (1) | CN111726970A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114976794A (en) * | 2022-05-30 | 2022-08-30 | 禾多科技（北京）有限公司 | Modular central area controller and vehicle control method |
| CN115190739A (en) * | 2022-06-22 | 2022-10-14 | 西安易朴通讯技术有限公司 | Composite cold plate structure and electronic equipment |
| WO2022242587A1 (en) * | 2021-05-18 | 2022-11-24 | 深圳比特微电子科技有限公司 | Liquid-cooled electronic device |
-
2020
- 2020-07-06 CN CN202010639535.9A patent/CN111726970A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022242587A1 (en) * | 2021-05-18 | 2022-11-24 | 深圳比特微电子科技有限公司 | Liquid-cooled electronic device |
| CN114976794A (en) * | 2022-05-30 | 2022-08-30 | 禾多科技（北京）有限公司 | Modular central area controller and vehicle control method |
| CN114976794B (en) * | 2022-05-30 | 2023-04-14 | 禾多科技（北京）有限公司 | Modular central area controller and vehicle control method |
| CN115190739A (en) * | 2022-06-22 | 2022-10-14 | 西安易朴通讯技术有限公司 | Composite cold plate structure and electronic equipment |
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