CN212175049U - Electroplating layer removing device - Google Patents
Electroplating layer removing device Download PDFInfo
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- CN212175049U CN212175049U CN202020647546.7U CN202020647546U CN212175049U CN 212175049 U CN212175049 U CN 212175049U CN 202020647546 U CN202020647546 U CN 202020647546U CN 212175049 U CN212175049 U CN 212175049U
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- tin
- stripping
- molten tin
- tin bath
- move back
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Abstract
The utility model belongs to the technical field of metal surface treatment and specifically relates to a plating layer removing device, including moving back molten tin bath and electrolysis trough, move back the molten tin bath and placed circuit board fixing device, it passes through pipeline with the electrolysis trough and is connected to move back the molten tin bath, it is provided with the charge door to move back the molten tin bath, the electrolysis trough is provided with positive pole and negative pole, positive pole with be provided with the ionic membrane between the negative pole. The utility model discloses following beneficial effect has: the device has the advantages that the alkyl sulfonic acid solution is used as the stripping solution, the waste solution after stripping is conveyed to the anode of the electrolytic cell for electrolysis, the cathode of the electrolytic cell generates metallic tin, the byproduct of the electrolytic reaction is water, the tin stripping process is simple, the cost is low, and the reaction product can be directly reused.
Description
Technical Field
The utility model belongs to the technical field of metal surface treatment and specifically relates to an electroplating layer removing device.
Background
In the production process of printed circuit boards, a large amount of tin stripping waste liquid is generated. When a conductive pattern is formed on a double-sided copper clad laminate by screen printing or photochemical methods, a layer of tin corrosion-resistant metal is plated on the conductive pattern, the portion other than the circuit pattern is etched away, and then the corrosion-resistant metal is removed. The tin plating is to protect the pattern from damage during etching. The tin stripping waste liquid is the waste liquid generated by removing tin from the tin coating of the protective pattern under the condition of not damaging the copper substrate.
The traditional tin stripping machine generally adopts nitric acid-ferric nitrate-urea type tin stripping water to strip tin for the circuit board, and the treated waste liquid contains heterocyclic compounds, polycyclic aromatic compounds, polymers and the like and is difficult to recycle.
SUMMERY OF THE UTILITY MODEL
The electroplated layer removing device comprises a tin removing tank and an electrolytic tank, wherein a circuit board fixing device is placed in the tin removing tank, the tin removing tank is connected with the electrolytic tank through a conveying pipeline, a feed inlet is formed in the tin removing tank, an anode and a cathode are arranged in the electrolytic tank, and an ionic membrane is arranged between the anode and the cathode.
Preferably, a circulating pipeline is further arranged between the tin stripping tank and the electrolytic tank.
Preferably, the liquid injected from the feed inlet is an alkyl sulfonic acid solution.
Preferably, the electrolytic cell is further provided with a drain.
The electroplating layer stripping device has the following effects:
the device has the advantages that the alkyl sulfonic acid solution is used as the stripping solution, the waste solution after stripping is conveyed to the anode of the electrolytic cell for electrolysis, the cathode of the electrolytic cell generates metallic tin, the byproduct of the electrolytic reaction is water, the tin stripping process is simple, the cost is low, and the reaction product can be directly reused.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
the figures are labeled as follows:
1-tin removing tank, 11-circuit board fixing device, 12-charging port, 2-electrolytic tank, 21-ionic membrane, 22-anode, 23-cathode, 24-discharge port, 3-conveying pipeline and 4-circulating pipeline.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are used only for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms will be understood by those skilled in the art according to the specific circumstances.
In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being either a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The electroplated layer stripping device shown in figure 1 comprises a tin stripping tank 1 and an electrolytic tank 2, wherein a circuit board fixing device 11 is placed in the electrolytic tank, the tin stripping tank 1 is connected with the electrolytic tank 2 through a conveying pipeline 3, a feeding opening 12 is formed in the tin stripping tank 1, an anode 22 and a cathode 23 are arranged in the electrolytic tank 2, and an ionic membrane 21 is arranged between the anode 22 and the cathode 23.
Preferably, a circulating pipeline 4 is further arranged between the tin stripping tank 1 and the electrolytic tank 2.
Preferably, the liquid injected from the feed inlet 12 is an alkyl sulfonic acid solution, the alkyl sulfonic acid is the strongest acid among organic acids, the acid strength of the alkyl sulfonic acid is similar to that of sulfuric acid or hydrochloric acid, and the alkyl sulfonic acid directly reacts with metallic tin to generate soluble tin alkyl sulfonate.
Preferably, the electrolytic cell 2 is also provided with a discharge port 24.
The specific working principle of this embodiment is as follows: the circuit board is placed in a tin removing tank 1 after a circuit board fixing device 11, a feed inlet 12 is opened to inject tin removing liquid, the tin removing liquid adopts alkyl sulfonic acid solution, the surface tin removing is carried out on the circuit board, and after the tin removing rate reaches 99%, the circuit board is pumped to an anode 22 of an electrolytic tank 2 through a conveying pipeline 3. Adding alkyl sulfonic acid into the cathode 23 of the electrolytic cell 2, and introducing direct current into the two stages, wherein the direct current voltage is adjusted to 1.5V-3.0V, and the current density is adjusted to 1.0A/dm-2.3A/dm. During electrophoresis, cations such as tin in the waste tin stripping solution pass through the ion membrane 21 and enter the alkyl sulfonic acid solution under the action of an electric field, and metal tin can be obtained at the cathode 23. The electrolyzed alkyl sulfonic acid solution is discharged along with a discharge port 24, the incompletely reacted tin stripping waste liquid is returned to the tin bath 1 through a circulating pipeline 4 pump, and a proper amount of medicament is added for recycling.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (4)
1. The electroplated layer removing device is characterized by comprising a tin removing groove and an electrolytic bath, wherein a circuit board fixing device is placed in the tin removing groove, the tin removing groove is connected with the electrolytic bath through a conveying pipeline, a feeding opening is formed in the tin removing groove, an anode and a cathode are arranged in the electrolytic bath, and an ionic membrane is arranged between the anode and the cathode.
2. A plating layer stripping apparatus as claimed in claim 1, wherein a circulation conduit is provided between the stripping bath and the electrolytic bath.
3. A plating resist removing apparatus according to claim 1, wherein the liquid injected from the feed port is an alkylsulfonic acid solution.
4. A plating layer stripping apparatus as claimed in claim 1, wherein said electrolytic bath is further provided with a drain port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020647546.7U CN212175049U (en) | 2020-04-26 | 2020-04-26 | Electroplating layer removing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020647546.7U CN212175049U (en) | 2020-04-26 | 2020-04-26 | Electroplating layer removing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212175049U true CN212175049U (en) | 2020-12-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020647546.7U Active CN212175049U (en) | 2020-04-26 | 2020-04-26 | Electroplating layer removing device |
Country Status (1)
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| CN (1) | CN212175049U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114990549A (en) * | 2022-05-30 | 2022-09-02 | 高红霞 | Surface galling device and method for automobile stamping die casting |
-
2020
- 2020-04-26 CN CN202020647546.7U patent/CN212175049U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114990549A (en) * | 2022-05-30 | 2022-09-02 | 高红霞 | Surface galling device and method for automobile stamping die casting |
| CN114990549B (en) * | 2022-05-30 | 2024-01-12 | 东莞海雅特汽车科技有限公司 | Surface roughening treatment device and method for automobile stamping die casting |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A device for removing electroplated coatings Effective date of registration: 20230630 Granted publication date: 20201218 Pledgee: Guangfa Bank Co.,Ltd. Meizhou Branch Pledgor: GUANGDONG HONGTAI ELECTRONIC LIMITED BY SHARE Ltd. Registration number: Y2023980046897 |