CN212084082U

CN212084082U - Active cooling system

Info

Publication number: CN212084082U
Application number: CN202020727738.9U
Authority: CN
Inventors: 车彦翮; 马龙; 万丰; 谢韫泽; 刘畅; 谢晓龙; 宫威; 朱孔硕; 罗超; 姚洁
Original assignee: 716th Research Institute of CSIC
Current assignee: 716th Research Institute of CSIC
Priority date: 2020-05-07
Filing date: 2020-05-07
Publication date: 2020-12-04
Anticipated expiration: 2030-05-07

Abstract

The utility model discloses an active heat dissipation system, which comprises a blower, an air duct, a heat pipe, a temperature equalizing plate, a semiconductor refrigerator, a controller, a thermistor and heat dissipation fins; the blower is arranged in the air duct and is positioned at the air inlet; one part of the heat pipe is embedded into the air duct to become a radiating fin parallel to the air duct; the two temperature equalizing plates are respectively arranged at the upper and lower positions of the semiconductor refrigerator, namely a refrigerating end and a radiating end; the two temperature equalizing plates are provided with thermistors; the thermistor, the semiconductor refrigerator and the air blower are all connected with the controller; the air blower is matched with the thermistor, the semiconductor refrigerator and the controller to form closed-loop control; the semiconductor refrigerator is started in the whole process, the controller ensures that the temperature of the temperature equalizing plate at the refrigerating end is constant at a set temperature, when the temperature of the equipment is too high, the temperature is fed back to the controller, the controller controls the rotating speed of the blower, more heat is emitted, and the temperature of the equipment to be cooled is reduced. The system can improve the temperature stability and reliability of the small electronic platform.

Description

Active cooling system

Technical Field

The utility model belongs to the technical field of the circuit heat dissipation, concretely relates to active cooling system.

Background

In the military field, the portable terminal uses a reinforced flat plate and a reinforced notebook computer to execute tactical tasks, such as vehicle navigation, precise mapping, following command control, tactical reconnaissance, data acquisition and processing, data wireless exchange, equipment detection, communication guarantee and the like for a long time, and can realize rapid expansion and rapid retraction operation. The advantages of the reinforced display and control terminal such as a reinforced panel and a notebook computer are small volume and light weight, but the problem of heat dissipation of the small-size reinforced display and control terminal is a technical problem which needs to be solved urgently, and it is known that high temperature is harmful to electronic components, which can cause accelerated aging and even burning of the electronic components and circuit boards. Along with the smaller and smaller size of the reinforced display and control terminal, the operation speed is continuously improved, and the heat productivity power of the CPU, the display and control chip, the CPLD chip, the memory chip and the like in the reinforced display and control terminal is also continuously increased. Therefore, the most main failure mode of the small-size reinforcing display control terminal is thermal failure at present, and the working stability of the electronic equipment is directly influenced by the quality of the heat dissipation condition. Especially for the fan-free medium, small and miniature closed small-size reinforcing display and control terminal, the internal space is narrow, and the temperature of the chassis shell is increased after high-power components such as a CPU (Central processing Unit) are transferred to the chassis shell radiator through heat conduction. Heat is transferred to the external environment through the housing. However, the low heat dissipation efficiency of the housing can make the operating temperature inside the fan-less middle, small, miniature, closed, small-sized reinforcing and display control terminal higher. The components and parts work for a long time under the high temperature environment, and can lead to the fault of low-power heat-sensitive components and parts, influence among the no fan, little, miniature closed small-size consolidate and show the normal work and the use of accuse terminal, increased the human cost that small-size consolidated all-in-one was maintained and was maintained. Under the severe condition of untimely heat dissipation, the surface temperature of the equipment shell is overhigh, the machine case is easy to scald hands, the interference is caused to the periphery of the machine case and other industrial equipment used in a matched mode, and the use experience and the working efficiency are seriously influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an active cooling system, on the leakproofness and the electromagnetic compatibility that do not sacrifice small-size electronic platform, promote small-size electronic platform's temperature stability and reliability.

Realize the utility model discloses the technical solution of purpose does:

an active heat dissipation system is characterized by comprising a blower, an air duct, a heat pipe, a first temperature equalizing plate, a second temperature equalizing plate, a semiconductor refrigerator, a controller, a first thermistor, a second thermistor and heat dissipation fins;

the bottom of one end of the air duct is provided with an air inlet, the other end of the air duct is provided with an air outlet, and the air duct is integrally sealed except the air outlet and the air inlet; the air blower is arranged in the air duct and is positioned at the air inlet; one part of the heat pipe is embedded into the air channel and is jointed with the heat dissipation fins which are arranged in the air channel in parallel with the air; the first temperature equalizing plate and the second temperature equalizing plate are respectively arranged at the upper position and the lower position of the semiconductor refrigerator, namely a refrigerating end and a radiating end; one surface of the first temperature-equalizing plate is arranged at the refrigerating end of the semiconductor refrigerator, and the other surface of the first temperature-equalizing plate is tightly attached to the heating part of the equipment; the first temperature equalizing plate and the second temperature equalizing plate are respectively provided with a first thermistor and a second thermistor, the first thermistor and the second thermistor are close to a heating part and are respectively used for detecting the temperature of a refrigerating end and the temperature of a radiating end of the semiconductor refrigerator; the first thermistor, the second thermistor, the semiconductor refrigerator and the air blower are all connected with the controller; the air blower is matched with the first thermistor and the second thermistor, and the semiconductor refrigerator and the controller form closed-loop control; the semiconductor refrigerator is started in the whole process, the controller ensures that the temperature of the temperature equalizing plate at the refrigerating end is constant at a set temperature, when the temperature of the equipment is too high, the temperature detected by the first thermistor and the second thermistor at the refrigerating end and the heat dissipation end of the semiconductor refrigerator exceeds a temperature wall, the temperature is fed back to the controller, and the controller controls the rotating speed of the air blower.

Compared with the prior art, the utility model, it is showing the advantage and is:

(1) the semiconductor cooler dynamically keeps the temperature of the cooling end of the semiconductor cooler constant, the cooling efficiency is high, the PID controller has high reaction speed, so that the cooled equipment always works in a proper temperature interval, the temperature cannot be increased steeply due to a large amount of scheduling of the equipment, and the service life and the performance of the equipment are reduced.

(2) When the equipment to be radiated is in low dispatching, the temperature does not reach the threshold set by the user, the blower is not started, heat is conducted out by the semiconductor refrigerator and conducted out to the back of the equipment through the heat pipe for radiation, and no noise exists in the period. The noise and heat dissipation requirements of the equipment are considered.

(3) The air blower and the semiconductor radiator of the system are matched with the thermistor and the controller to form closed-loop control, the thermistor detects temperature rise and feeds the temperature rise back to the controller to control the power of the semiconductor radiator, the temperature of equipment is reduced, if the temperature exceeds a threshold value, the controller controls the rotating speed of the air blower, the air speed in the air channel is increased, the temperature of heating components is reduced, the rotating speed of the air blower can be actively adjusted along with the change of the heat dissipation temperature, and the temperature stability and the reliability of the small electronic platform are improved.

(4) A part of the heat pipe is embedded into the air duct to become a heat dissipation fin parallel to the air duct, so that the heat dissipation area is enlarged, and the heat dissipation efficiency of the air blower is improved.

(5) The heat dissipation air duct is separated from the internal space of the equipment to be dissipated, so that internal electronic devices are prevented from being corroded, the equipment has waterproof and dustproof performances to a certain degree, and the closed-loop control of a heat dissipation system can ensure that the equipment is used in high-cold and high-heat areas; can be installed in most small electronic devices.

Drawings

Fig. 1 is a schematic diagram of a semiconductor heat dissipation system.

Fig. 2 is a schematic diagram of an overall structure of an active heat dissipation system.

Fig. 3 is a schematic view of thermistor mounting.

Fig. 4 is a top view of a semiconductor heat dissipation system.

Fig. 5 is a heat dissipation system installation diagram.

Fig. 6 is a diagram of a heat-dissipating component and a heat-dissipating system.

Fig. 7 is a schematic block diagram of a heat dissipation system.

Fig. 8 is a control flow chart of the heat dissipation system.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments.

The utility model relates to an active heat dissipation system, which comprises a blower 1, an air duct 2, a heat pipe 3, a first temperature equalizing plate 4, a second temperature equalizing plate 5, a semiconductor refrigerator 6, a controller 7, a first thermistor 8, a second thermistor 9 and heat dissipation fins 10;

an air inlet 12 is formed in the bottom of one end of the air duct 2, and an air outlet 11 is formed in the other end of the air duct; the air duct 2 is arranged between the required heat dissipation device and the machine body shell and is integrally sealed except for the air outlet 11 and the air inlet 12; the air blower 1 is arranged in the air duct 2 and is positioned at the air inlet 11; a part of the heat pipe 3 is embedded into the air duct 2 and is jointed with a heat dissipation fin 10 which is arranged in the air duct 2 in parallel with the air; the vapor chamber has two: the first temperature equalizing plate 4 and the second temperature equalizing plate 5 are respectively arranged at the upper position and the lower position of the semiconductor refrigerator 6, namely a refrigerating end and a radiating end; one surface of the first temperature equalizing plate 4 is arranged at the refrigerating end of the semiconductor refrigerator 6, and the other surface is tightly attached to a heating part of equipment, one surface of the second temperature equalizing plate 5 is arranged at the radiating end of the semiconductor refrigerator 6, and the other surface is tightly attached to the heat pipe 3; thermistors 8 and 9 are arranged on the first temperature equalizing plate 4 and the second temperature equalizing plate 5, are close to a heating part and are used for detecting the temperature of a refrigerating end and the temperature of a radiating end of the semiconductor refrigerator 6; the thermistors 8 and 9, the semiconductor refrigerator 6 and the air blower 1 are all connected with a controller 7; the blower 1 is matched with the thermistors 8 and 9, the semiconductor refrigerator 6 and the controller 7 to form closed-loop control; the semiconductor refrigerator 6 is opened in the whole process, the first temperature equalizing plate 4 of the refrigerating end is kept at the set temperature by an independent PID controller of the controller 7 which specially controls the semiconductor refrigerator 6, when the temperature of the equipment is too high, the temperature of the refrigerating end and the temperature of the heat dissipation end of the semiconductor refrigerator 6 are detected by thermistors 8 and 9 to exceed the temperature wall, the temperature is fed back to the controller 7, the rotating speed of the air blower 1 is controlled by another set of independent PID controller which specially controls the air blower in the controller 7, the air speed in the air duct 2 is increased, the heat is accelerated to flow through the temperature equalizing plate 5, the heat pipe 3 guides in the heat dissipation fins 10, and the heat is dissipated more than the heat, so that the temperature of the equipment to.

Further, the blower 1 is driven by a brushless motor; the waterproof and dustproof level and the rotating speed detection function of IP67 level or above are achieved;

furthermore, the air inlet 9 and the air outlet 8 are externally provided with dust screens, and the dust screens are made of metal and connected into the shell, so that the EMI of the equipment is reduced.

Further, the air duct 2 is made of aluminum alloy or stainless steel, and the shell of the air blower 1 is made of engineering plastics.

Example 1

With reference to fig. 2, 3, 4, 5 and 6, the heat dissipation system is installed below the heat dissipation components required by the equipment, in the space inside the equipment housing, and near the main heat generation components of the equipment. The CPU 101 and the display control chip 102 are main heat generating components, and need to be attached to the temperature equalizing plate 4 to be actively cooled by the semiconductor refrigerator 6 and the blower 1. The CPLD chip 103, the memory chip 104 and the power supply chip 105 generate less heat, and can be directly attached to the heat pipe 3 without being attached to the temperature equalizing plate 4, and the heat pipe 3 disperses the heat to the equipment shell or the air duct 2 and guides the heat out by the air blower 1, so that the heat dissipation is realized.

With reference to fig. 8, fig. 2, fig. 3, fig. 4, and fig. 5, the semiconductor refrigerator 6 and the blower 1 are respectively controlled by two different PID controllers, the semiconductor refrigerator 6 is always turned on during use, and the independent PID controller controls the dynamic adjustment of the refrigeration power, so as to ensure that the temperature of the heat-radiating part of the equipment is constant within a temperature range interval. When the thermistor 8(A) senses that the temperature of the temperature equalizing plate 4 is less than 40 ℃ and the thermistor 9(B) senses that the temperature of the temperature equalizing plate 5 is less than 45 ℃, the blower 1 is not started, heat is guided to the semiconductor refrigerator 6 through the temperature equalizing plate 4 and then to the temperature equalizing plate 5, guided into the heat pipe 3 and guided to the shell on the back of the whole equipment through the heat pipe 3, and heat dissipation is realized through heat exchange between the shell and the outside.

Example 2

With reference to fig. 8, fig. 2, fig. 3, fig. 4, fig. 5, and fig. 6, if the device to be cooled is heated a lot and cannot keep a constant temperature beyond the semiconductor cooler 6, the blower 1 is turned on, and the blower 1 is controlled by an independent PID controller to dynamically adjust the rotation speed, so as to enhance the cooling efficiency of the semiconductor cooler 6 and ensure that the temperature of the part to be cooled of the device is constant within a temperature range. When thermistor 8(A) response samming board 4 temperature is greater than 40 degrees or thermistor 9(B) response samming board 5 temperature is greater than 45 degrees, air-blower 1 opens, and the heat passes through samming board 4 direction semiconductor refrigerator 6 then direction samming board 5 is leading-in heat pipe 3, via heat pipe 3 direction whole equipment back shell with on the inside heat radiation fin 10 in wind channel, wherein a small part of heat realizes the heat dissipation absolutely by shell and external heat exchange, and most of heat is by the cold air process air intake 12, with heat radiation fin 10 surface convection heat transfer forms hot-blast, hot-blast passing again air-blower 1 transmission to air outlet 11 blow off. After the cooling system operates for a period of time, when the thermistor 9(B) detects that the temperature of the temperature equalizing plate 5 is less than 30 ℃, the system stops the operation of the blower 1 to reduce power consumption.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An active heat dissipation system is characterized by comprising a blower (1), an air duct (2), a heat pipe (3), a first temperature equalizing plate (4), a second temperature equalizing plate (5), a semiconductor refrigerator (6), a controller (7), a first thermistor (8), a second thermistor (9) and heat dissipation fins (10);

an air inlet (12) is formed in the bottom of one end of the air duct (2), an air outlet (11) is formed in the other end of the air duct, and the air duct is integrally sealed except the air outlet (11) and the air inlet (12); the air blower (1) is arranged in the air duct (2) and is positioned at the air inlet (12); a part of the heat pipe (3) is embedded into the air duct (2) and a heat dissipation fin (10) which is arranged in the air duct (2) in parallel to the air and is left behind is attached; the first temperature equalizing plate (4) and the second temperature equalizing plate (5) are respectively arranged at the upper position and the lower position of the semiconductor refrigerator (6), namely a refrigerating end and a radiating end; one surface of the first temperature equalizing plate (4) is arranged at the refrigerating end of the semiconductor refrigerator (6), and the other surface is tightly attached to a heating part of the equipment, one surface of the second temperature equalizing plate (5) is arranged at the radiating end of the semiconductor refrigerator (6), and the other surface is tightly attached to the heat pipe (3); the first temperature equalizing plate (4) and the second temperature equalizing plate (5) are respectively provided with a first thermistor (8) and a second thermistor (9), are close to a heating part and are respectively used for detecting the temperature of a refrigerating end and the temperature of a radiating end of the semiconductor refrigerator (6); the first thermistor (8), the second thermistor (9), the semiconductor refrigerator (6) and the air blower (1) are all connected with the controller (7); the air blower (1) is matched with the first thermistor (8) and the second thermistor (9), and the semiconductor refrigerator (6) and the controller (7) form closed-loop control; the semiconductor refrigerator (6) is opened in the whole process, the controller (7) ensures that the temperature of the temperature equalizing plate (4) at the refrigerating end is constant at a set temperature, when the temperature of the equipment is too high, the temperature of the refrigerating end of the semiconductor refrigerator (6) and the temperature of the first thermistor (8) and the second thermistor (9) at the heat dissipation end exceed the temperature wall, the temperature is fed back to the controller (7), and the air speed in the air duct (2) is increased by the rotating speed of the air blower (1) of the controller (7).

2. The active cooling system according to claim 1, wherein the blower (1) is driven by a brushless motor.

3. The active cooling system of claim 1, wherein the blower (1) meets waterproof and dustproof requirements above IP 67.

4. The active cooling system of claim 1, wherein dust screens are disposed outside the air inlet (12) and the air outlet (11).

5. The active cooling system of claim 4, wherein the dust screen is made of metal and is inserted into a housing of a device to be cooled.

6. The active cooling system of claim 1, wherein a portion of the heat pipe (3) is embedded in the heat dissipation fins (10) of the air duct (2) to become parallel air ducts (2), and cold air passes through the air inlet (12) and exchanges heat with the surfaces of the heat dissipation fins (10) to form hot air, and the hot air is further transmitted to the air outlet (11) through the air blower (1).

7. The active cooling system of claim 1, wherein corresponding air inlets and air outlets are formed in the device housing to be cooled at positions corresponding to the air inlets (12) and the air outlets (11) of the air duct (2), and the air inlets (12) and the air outlets (11) of the air duct (2) and the device housing are correspondingly provided with holes and are in waterproof connection.

8. The active cooling system of claim 1, wherein the material of the air duct (2) is aluminum alloy or stainless steel.

9. The active heat dissipation system of claim 1, wherein the blower (1) housing material is an engineering plastic.