CN212049846U

CN212049846U - Substrate flattening device

Info

Publication number: CN212049846U
Application number: CN202020508501.1U
Authority: CN
Inventors: 陳安順
Original assignee: Group Up Industrial Co ltd
Current assignee: Group Up Industrial Co ltd
Priority date: 2020-04-09
Filing date: 2020-04-09
Publication date: 2020-12-01
Anticipated expiration: 2030-04-09

Abstract

The embodiment of the application provides a substrate flattening device, which is used for flattening a substrate and comprises a suspension mechanism, a first bracing mechanism and a second bracing mechanism; the first bracing mechanism is used for applying force to the substrate outwards in a first direction and comprises a suspension clamp and a fixing clamp, the suspension clamp and the fixing clamp are positioned at two opposite far positions in the first direction, and the suspension clamp is arranged on the suspension mechanism; the second bracing mechanism is used for applying force to the substrate outwards in a second direction and comprises two movable clamps which are oppositely arranged, and the two movable clamps are positioned at two opposite away positions in the second direction so as to provide outwards pulling force for flattening the substrate according to the first direction and the second direction by the first bracing mechanism and the second bracing mechanism.

Description

Substrate flattening device

Technical Field

The application relates to the technical field of conveying machines, in particular to a substrate flattening device.

Background

Before the substrate such as a flexible board is cured or baked, the material of the substrate itself has a certain softness and must be flattened. Therefore, a frame corresponding to the periphery of the substrate is usually used, the frame is first pressed inward to deform, and then the substrate is placed in the frame and fixed, and then the substrate is pulled outward by the natural restoring force of the material of the frame, so that the substrate can be flattened. Finally, the frame and the frame are put into a baking device for baking.

However, the above-mentioned conventional method often causes the frame to be subjected to the reciprocating action of external force for a long time, so that the frame is prone to deformation and elastic fatigue during a certain period of use, which is not enough to provide flattening, and even causes the frame to be frequently replaced during operation, thereby increasing the production cost.

In view of the above, the present invention provides a technical solution for improving and solving the above-mentioned drawbacks, and finally, the present invention provides a technical solution with reasonable design and effective improvement in cooperation with the application of the theory.

SUMMERY OF THE UTILITY MODEL

The present disclosure is directed to a substrate flattening apparatus, which can provide an outward pulling force to a substrate through a machine tool to prevent a frame from being damaged by an external force such as extrusion.

In order to achieve the above object, an embodiment of the present invention provides a substrate flattening apparatus for flattening a substrate, including a suspension mechanism, a first stretching mechanism and a second stretching mechanism; the first bracing mechanism is used for applying force to the substrate outwards in a first direction and comprises a suspension clamp and a fixing clamp, the suspension clamp and the fixing clamp are positioned at two opposite far positions in the first direction, and the suspension clamp is arranged on the suspension mechanism; the second bracing mechanism is used for applying force to the substrate outwards in a second direction and comprises two movable clamps which are oppositely arranged and are positioned at two opposite far positions in the second direction; the second direction is mutually staggered with the first direction on the substrate, so that the first bracing mechanism and the second bracing mechanism provide outward pulling force for flattening the substrate according to the first direction and the second direction.

Drawings

Fig. 1 is a schematic perspective exploded view of an embodiment of the present application.

Fig. 2 is an enlarged perspective view of a fixing clip according to an embodiment of the present application.

Fig. 3 is an enlarged perspective view of the movable clamp according to the embodiment of the present application.

Fig. 4 is a schematic top view of a substrate clamping operation according to an embodiment of the present invention.

Fig. 5 is a schematic front view of the substrate pulling outward according to the embodiment of the present application.

Description of reference numerals:

1-a suspension mechanism;

10-an adjustment groove;

2-a first bracing mechanism;

20-hanging the clamp;

200-an adjusting seat;

201-suspension jaw;

202-a first driver;

21-fixing the clamp;

210-a second driver;

211-fixed jaw;

3-a second bracing mechanism;

30-a movable clamp;

31-a displacement seat;

310-an extension arm;

32-a movable jaw;

320-a third driver;

4-a substrate;

p-direction of travel.

Detailed Description

For the examiner to further understand the technical features and technical solutions of the present application, please refer to the following detailed description and accompanying drawings of the embodiments of the present application, which are provided for reference and illustration only and are not intended to limit the embodiments of the present application.

Please refer to fig. 1, which is a schematic exploded view of an embodiment of the present application. The embodiment of the application provides a substrate flattening device and a flattening method thereof, which can be used for flattening a substrate 4 which is stretched outwards in a suspended state so as to facilitate other subsequent processes. The substrate 4 can be a circuit board, and the substrate flattening device can include a suspension mechanism 1, a first bracing mechanism 2 and a second bracing mechanism 3; wherein:

the suspension mechanism 1 can be a horizontal suspension arm and can move along the advancing direction P; the traveling direction P (e.g., X-axis) can move by driving the suspension mechanism 1 via a mechanism such as a conveying platform (not shown) such as a rail or a conveyor belt, so as to move the substrate 4 vertically suspended below the suspension mechanism 1 to a desired operation position. In more detail, the above-mentioned conveying platform may also make the suspension mechanism 1 move horizontally and convey the substrate 4, and turn over by 90 degrees upwards or downwards after reaching a positioning position such as a pick-up port, so as to make the substrate 4 in a vertically suspended state as shown in fig. 1.

The first bracing mechanism 2 is configured to apply an outward force to the substrate 4 in a first direction (e.g., Z-axis), and includes at least one (i.e., one or more) suspension clamp 20 and at least one (i.e., one or more) fixing clamp 21, and the suspension clamp 20 and the fixing clamp 21 may be located at two positions relatively far away from each other in the first direction (e.g., Z-axis). The plurality of suspension clamps 20 may be disposed on the suspension mechanism 1 for clamping the outer edge (e.g., upper edge) of the substrate 4 in a first direction (e.g., Z-axis), and being transported to the leveling operation in accordance with the movement of the suspension mechanism 1; in the embodiment of the present application, the suspension mechanism 1 is provided with one or more laterally disposed adjustment slots 10, and each suspension clamp 20 has an adjustment base 200, a suspension clamping jaw 201, and a first driver 202 disposed on the adjustment base 200 and controlling the suspension clamping jaw 201 to open and close, wherein the adjustment base 200 can move laterally on the adjustment slot 10 to adjust the position of the substrate 4 to be clamped, and the first driver 202 controls the suspension clamping jaw 201 to clamp the upper edge of the substrate 4.

Referring to fig. 1 and 2, the fixing clamp 21 may be fixed on a base, or other ground of the apparatus. The fixing clamps 21 may be a plurality of fixing clamps, so as to clamp the other outer edge (e.g., the lower edge) of the substrate 4 in the first direction (e.g., the Z-axis direction) after the substrate 4 is transported to the leveling operation; in the embodiment of the present application, each of the fixing clamps 21 has a second driver 210 and a fixing jaw 211 controlled by the second driver 210, and after the substrate 4 is transported to the leveling operation, the fixing jaw 211 can be controlled by the second driver 210 to clamp the lower edge of the substrate 4.

Referring to fig. 1 and 3, the second bracing mechanism 3 is configured to apply an outward force to the substrate 4 in a second direction (e.g., Y-axis), and includes at least two movable clamps 30 disposed opposite to each other, and the two movable clamps 30 may be located at two relatively distant positions in the second direction (e.g., Y-axis). Each movable clamp 30 comprises a displacement seat 31 capable of displacing in the same direction as the traveling direction P and at least one movable clamping jaw 32 supported by the displacement seat 31, and the movable clamping jaw 32 is controlled by a third driver 320 to open and close the clamping jaw, so that the movable clamping jaws 32 of the two movable clamps 30 can respectively clamp two outer edges (such as a left edge and a right edge) of the substrate 4 in a second direction (such as a Y-axis direction); in the embodiment of the present invention, an extension arm 310 may be additionally disposed on the displacement seat 31 of each movable clamp 30, and the extension direction of the extension arm 310 may match the outer edge of the substrate 4, so that a plurality of movable clamping jaws 32 are fixedly disposed on the extension arm 310 to increase the clamping point or the clamping position with the substrate 4. For example, in the embodiment of the present invention, the movable clamping jaws 32 are respectively disposed at the upper end and the lower end of the extension arm 310, and each movable clamping jaw 32 is controlled by the third driver 320, so that the movable clamping jaws 32 of the two movable clamping jaws 30 clamp the left edge and the right edge of the substrate 4.

As shown in fig. 4, after the suspension mechanism 1 transports the substrate 4 to the working position, the suspension clamp 20 of the first bracing mechanism 2 can drive the substrate 4 to move downward slightly so as to be convenient for the fixing clamp 21 to clamp the lower edge of the substrate 4, and the two movable clamps 30 of the second bracing mechanism 3 can move inward slightly from the left edge and the right edge of the substrate 4 respectively so as to clamp the left edge and the right edge of the substrate 4 respectively. As shown in fig. 5, after the suspension clamp 20 and the fixed clamp 21 of the first pulling mechanism 2 and the two movable clamps 30 of the second pulling mechanism 3 are respectively corresponding to and clamping the portions of the substrate 4 to be clamped, outward pulling forces in a first direction (e.g., Z-axis) and a second direction (e.g., Y-axis) are provided to pull the substrate 4 to be flattened, that is, the first direction and the second direction may be different directions staggered with each other on the two-dimensional plane of the substrate 4, and the advancing direction P is further a third direction on the three-dimensional space; in the present embodiment, the outward pulling force in the first direction (e.g., Z-axis) can be provided by the suspension clamp 20 returning to the first position by a slight downward displacement; the outward pulling force in the second direction (e.g., Y-direction) can be applied by the two movable clamps 30 returning to the slightly inward displacement. The outward pulling force in the first direction and the outward pulling force in the second direction can be simultaneously implemented or can be implemented respectively. The tension in the first direction can be implemented first and then the tension in the second direction can be implemented respectively; or the pulling force in the second direction is implemented first and then the pulling force in the first direction is implemented.

Finally, after the substrate 4 is flattened by applying the pulling force in the first direction and the second direction, the substrate 4 may be placed in a jig such as a frame and baked. Thereby finishing the flattening operation of a single substrate 4, and replacing the next substrate 4 to repeat the operation, so as to achieve the purposes of not causing frame damage and reducing the loss of production jigs to avoid cost increase.

With the above structure, the substrate flattening apparatus of the embodiment of the present application can be obtained.

In summary, the embodiments of the present application can achieve the intended purpose of use, solve the problems of the prior art, and completely meet the requirements of the patent application of the utility model due to the novelty and the advancement, and the application is proposed according to the patent law, and the examination and the authorization are respected to ensure the rights of the inventor.

The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, so that all changes, such as equivalents, means, etc., which use the contents of the specification and drawings of the present application are all included in the scope of the present application.

Claims

1. A substrate flattening device is characterized in that the device is used for flattening a substrate; the method comprises the following steps:

a suspension mechanism for vertically suspending the substrate;

the first bracing mechanism is used for applying force to the substrate outwards in a first direction and comprises one or more suspension clamps and one or more fixing clamps, the suspension clamps and the fixing clamps are positioned at two opposite far positions in the first direction, and the suspension clamps are arranged on the suspension mechanism; and

the second bracing mechanism is used for applying force to the substrate outwards in a second direction and comprises two movable clamps which are arranged oppositely, and the two movable clamps are positioned at two opposite far positions in the second direction;

the second direction is staggered with the first direction on the substrate, so that the first bracing mechanism and the second bracing mechanism provide outward pulling force for flattening the substrate according to the first direction and the second direction.

2. The substrate flattening apparatus of claim 1, wherein the suspension mechanism is a transverse suspension arm.

3. The substrate flattening apparatus of claim 1 or 2, wherein the suspension mechanism is movable in a travel direction, and the travel direction is a third direction in three-dimensional space with the first direction and the second direction.

4. The substrate flattening apparatus of claim 1, wherein the suspension clamp includes an adjustment base, a suspension clamp, and a first actuator disposed on the adjustment base and controlling the suspension clamp to open and close.

5. The substrate flattening apparatus of claim 4, wherein the suspension mechanism includes a laterally disposed adjustment slot, and the adjustment block is laterally movable in the adjustment slot.

6. The substrate flattening apparatus of claim 1, wherein the fixture has a second driver and a fixture jaw controlled by the second driver.

7. The substrate flattening apparatus of claim 1, wherein the two movable clamps comprise a displacement base and a movable clamping jaw supported by the displacement base, and the movable clamping jaw is controlled by a third driver to open and close.

8. The substrate flattening apparatus of claim 7, wherein an extension arm is disposed on the displacement base, and the plurality of movable jaws are disposed on the extension arm.