CN212007430U - Tuning fork type material level switch and sensor structure thereof - Google Patents
Tuning fork type material level switch and sensor structure thereof Download PDFInfo
- Publication number
- CN212007430U CN212007430U CN202020931692.2U CN202020931692U CN212007430U CN 212007430 U CN212007430 U CN 212007430U CN 202020931692 U CN202020931692 U CN 202020931692U CN 212007430 U CN212007430 U CN 212007430U
- Authority
- CN
- China
- Prior art keywords
- piezoelectric ceramic
- sensor structure
- sleeve body
- tuning fork
- level switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title description 10
- 239000000919 ceramic Substances 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 239000011229 interlayer Substances 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
Abstract
The utility model discloses a tuning fork type level switch and a sensor structure thereof, wherein the sensor structure comprises a sleeve body, a stud and a piezoelectric ceramic module; the middle part of the sleeve body is hollow, the top of the sleeve body is provided with an opening, and the inner side wall of the sleeve body is provided with threads; the piezoelectric ceramic module is sleeved in the sleeve body; the stud penetrates through the opening at the top of the sleeve body and is fixedly connected with the sleeve body by means of thread matching; the bottom of the stud props against the piezoelectric ceramic module. And an insulating interlayer is arranged between the piezoelectric ceramic module and the sleeve body. A notch is formed in one side of the sleeve body, and a wiring board is arranged at the notch. Compared with the prior art, the utility model discloses a tuning fork formula level switch and sensor compact structure thereof has realized sensor structure and tuning fork formula level switch's miniaturization.
Description
Technical Field
The utility model belongs to the material level switch field specifically is a tuning fork formula material level switch and sensor structure thereof.
Background
The tuning fork type level switch is one of level switches, mainly utilizes the tuning fork resonance principle to measure the level state, and the unique fork body design and the inherent vibration characteristic thereof can ensure the automatic clearing function of the tuning fork and prevent hanging materials to the maximum extent.
The sensor structure part of the existing tuning fork type level switch has larger size and is limited by the structure, so that the miniaturization is difficult to realize.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a first purpose is in order to provide a sensor structure of tuning fork formula level switch. The utility model discloses a sensor structure of a tuning fork type material level switch, which comprises a sleeve body, a stud and a piezoelectric ceramic module; wherein,
the middle part of the sleeve body is hollow, the top of the sleeve body is provided with an opening, and the inner side wall of the sleeve body is provided with threads;
the piezoelectric ceramic module is sleeved in the sleeve body;
the stud penetrates through the opening at the top of the sleeve body and is fixedly connected with the sleeve body by means of thread matching; the bottom of the stud props against the piezoelectric ceramic module.
According to a preferred embodiment, the material of the sheath body is metal.
Furthermore, the bottom of the sleeve body is provided with threads for fixedly connecting with a tuning fork.
Furthermore, an insulating interlayer is arranged between the piezoelectric ceramic module and the sleeve body.
According to a preferred embodiment, the piezoelectric ceramic module comprises a piezoelectric ceramic group and metal gaskets arranged on two sides of the piezoelectric ceramic group, wherein the piezoelectric ceramic group is composed of a plurality of piezoelectric ceramic pieces, and the metal gaskets are also arranged between the piezoelectric ceramic pieces.
Furthermore, one side of the metal gasket extends outwards to form a wiring pin.
Furthermore, a notch is formed in one side of the sleeve body, a wiring board is arranged at the notch, and a wiring pin of the metal gasket is welded on the wiring board of the PCB (printed circuit board).
Furthermore, rigid cushion blocks are arranged on two sides of the piezoelectric ceramic module.
Furthermore, insulating cushion layers are arranged on two sides of the piezoelectric ceramic module.
The second objective of the present invention is to provide a tuning fork level switch. The utility model discloses a tuning fork formula level switch, including sensor structure, tuning fork and shell, the upper portion of tuning fork and the bottom fixed connection of shell, sensor structure cover is located in the shell, and passes through the mode fixed connection of screw-thread fit spot welding with the tuning fork.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the internal assembly layout of the sensor structure is very compact, and the miniaturization of the sensor structure is realized.
2. The lower end of the sensor structure can be fixedly arranged on the upper part of the tuning fork through thread matching, and miniaturization of the tuning fork type level switch is facilitated.
3. The tuning fork type level switch using the sensor structure can reduce the outer diameter to below 13 mm.
Drawings
FIG. 1 is an isometric view of a sensor configuration of a tuning fork level switch according to an embodiment.
Fig. 2 is a schematic view of the glove body of fig. 1.
Fig. 3 is a schematic view of the piezoceramic module of fig. 1.
Fig. 4 is a schematic diagram of a sensor structure provided with a PCB wiring board of the embodiment.
Fig. 5 is a schematic diagram of a piezoelectric ceramic module with rigid pads on both sides.
Fig. 6 is a schematic view showing that insulating pads are disposed on both sides of the piezoelectric ceramic module.
FIG. 7 is a schematic view of an embodiment of a tuning fork level switch.
Fig. 8 is a schematic view of fig. 7 with the housing omitted.
Description of the figure numbers:
10. the piezoelectric ceramic package comprises a package body, 11, an opening at the top of the package body, 12, threads at the bottom of the package body, 13, a notch at one side of the package body, 20, a stud, 30, a piezoelectric ceramic module, 31, a piezoelectric ceramic group, 310, a piezoelectric ceramic sheet, 32, a metal gasket, 33, a rigid cushion block, 34, an insulating cushion layer, 40, an insulating interlayer, 50, a PCB wiring board, 60, a sensor structure, 61, a tuning fork and 62, and a shell.
Detailed Description
The invention is further described with reference to the following figures and specific embodiments.
As shown in fig. 1, the sensor structure of the tuning fork level switch of the present embodiment includes a sleeve body 10, a stud 20, and a piezoelectric ceramic module 30.
Referring to fig. 2, the middle of the sleeve 10 is hollow, and the top of the sleeve is open, and the inner side wall of the sleeve 10 is provided with threads (not shown). The piezoelectric ceramic module 30 is sleeved in the sleeve body 10. The outer side of the stud 20 is also provided with threads (not shown in the figure), and the stud 20 penetrates through the opening 11 at the top of the sleeve body 10 and is fixedly connected with the sleeve body 10 by means of thread matching; the bottom of the stud 20 is pressed against the piezoelectric ceramic module 30, so that the piezoelectric ceramic module 30 is fixedly mounted. The sensor structure is very compact, and the size of the tuning fork type level switch can be greatly reduced.
Preferably, the material of the sheath body 10 is metal. The sensor structure is used for being fixedly connected with a tuning fork to form a tuning fork type material level switch, and a metal sleeve body with better rigidity is used, so that vibration conduction between the piezoelectric ceramic module 30 and the tuning fork is facilitated.
Further, the bottom of the sleeve body 10 is provided with a thread 12 for fixedly connecting with a tuning fork.
Further, an insulating interlayer 40 is disposed between the piezoceramic module 30 and the sleeve body 10 to prevent the piezoceramic module 30 from being in conductive contact with the sleeve body 10.
As shown in fig. 3, preferably, the piezoelectric ceramic module 30 includes a piezoelectric ceramic group 31 and metal pads 32 disposed on two sides of the piezoelectric ceramic group 31, where the piezoelectric ceramic group 31 is composed of a plurality of piezoelectric ceramic pieces 310, and the metal pads 32 are also disposed between the piezoelectric ceramic pieces 310. The number of the piezoelectric ceramic pieces 310 is variable, and when the number of the piezoelectric ceramic pieces 310 needs to be increased/decreased, the stud 20 can adjust the position thereof by means of screw threads to realize the fastening and installation of the piezoelectric ceramic module 30, which is very convenient.
Further, one side of the metal pad 32 extends outward to form a wire bonding pin 320. The metal pad 32 is integrally formed with its terminal pin 320. The wiring pin 320 of metal gasket 32 is used for being connected through wire and power supply circuit, detection circuitry etc. easy to understand, power supply circuit and detection circuitry are tuning fork formula level switch's conventional circuit component, the utility model discloses do not relate to the improvement to the circuit, no longer describe to this repeatedly.
As shown in fig. 4 in combination with fig. 2, further, a notch 13 is formed on one side of the sheath 10, a PCB wiring board 50 is disposed at the notch 13, and the wiring pins 320 of the metal gasket 32 are soldered on the PCB wiring board 50. It will be readily appreciated that the PCB board 50 has vias (not shown) formed therein for soldering pins and wires. The PCB terminal block 50 serves only as a wiring medium and does not include a functional circuit itself, which is a conventional art means in the art and thus will not be described in detail. With the PCB wiring board 50, the wiring stability can be improved by connecting with an external circuit using a wire. By providing the cut-out 13, an installation space of the PCB terminal board 50 is left, so that the entire structure is compact.
As shown in fig. 5, further, rigid pads 33 are disposed on both sides of the piezoelectric ceramic module 30. In this way, the direct contact between the piezoceramic module 33 and other components, such as the stud 20, is avoided, which serves to protect the piezoceramic module 30 and facilitates the conduction of vibrations. In the present invention, the rigid cushion block 33 is preferably a copper column.
As shown in fig. 6, further, the piezoelectric ceramic module 30 is provided with insulating pads 34 on both sides.
The insulating pad 34 is mainly used as insulating layers at the upper and lower sides of the piezoelectric ceramic 30 to play an insulating role; the rigid cushion blocks 33 are mainly used as gaskets on the upper side and the lower side of the piezoelectric ceramic 30, and are beneficial to vibration conduction. The insulating pad 34 and the rigid pad 33 may be used simultaneously, only one of them may be used, or neither of them may be used.
As shown in fig. 7 and 8, the tuning fork level switch of the present embodiment comprises a sensor structure 60, a tuning fork 61 and a housing 62. The upper part of the tuning fork 61 is fixedly connected with the bottom of the outer shell 62, and the sensor structure 60 is sleeved in the outer shell 62 and fixedly connected with the tuning fork 61 in a threaded fit/spot welding manner.
The utility model discloses a sensor compact structure to fastening connection, fixed between each subassembly of sensor have been guaranteed. Compared with the prior art, the size of the tuning fork type level switch can be greatly reduced by using the sensor structure, and the outer diameter of the tuning fork type level switch can be reduced to be less than 13 mm. The miniaturization of the tuning fork type level switch is realized, and the material cost is also reduced.
The above embodiments describe the structure of the tuning fork level switch and the sensor structure thereof in detail, but should not be construed as limiting the present invention. It will be readily understood that modifications, substitutions and further improvements may be made by those skilled in the art based on the teachings of the present invention, but any modifications or equivalents will fall within the scope of the claims of the present invention.
Claims (10)
1. A sensor structure of a tuning fork type level switch is characterized by comprising a sleeve body, a stud and a piezoelectric ceramic module; wherein,
the middle part of the sleeve body is hollow, the top of the sleeve body is provided with an opening, and the inner side wall of the sleeve body is provided with threads;
the piezoelectric ceramic module is sleeved in the sleeve body;
the stud penetrates through the opening at the top of the sleeve body and is fixedly connected with the sleeve body by means of thread matching; the bottom of the stud props against the piezoelectric ceramic module.
2. The sensor structure of claim 1, wherein the sheath is made of a metal.
3. The sensor structure of claim 1, wherein the bottom of the sheath has threads for fixedly coupling with a tuning fork.
4. The sensor structure according to claim 1, characterized in that an insulating barrier is provided between the piezoceramic module and the jacket body.
5. The sensor structure of claim 1, wherein the piezoelectric ceramic module comprises a piezoelectric ceramic group and metal gaskets arranged on two sides of the piezoelectric ceramic group, wherein the piezoelectric ceramic group is composed of a plurality of piezoelectric ceramic plates, and the metal gaskets are also arranged between the piezoelectric ceramic plates.
6. The sensor structure of claim 5, wherein one side of the metal pad extends outward to form a wire bond pin.
7. The sensor structure of claim 6, wherein the sheath has a cut-out at one side thereof, and a wiring board is provided at the cut-out, and the wiring pins of the metal gasket are soldered to the wiring board of the PCB.
8. The sensor structure according to claim 1, characterized in that the piezoceramic modules are provided with rigid spacers on both sides.
9. The sensor structure according to claim 1, characterized in that the piezoceramic modules are provided with insulating cushions on both sides.
10. The utility model provides a tuning fork formula level switch, its characterized in that includes sensor structure, tuning fork and shell, the bottom fixed connection of the upper portion of tuning fork and shell, sensor structure cover is located in the shell, and passes through screw-thread fit/spot welding's mode fixed connection with the tuning fork.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020931692.2U CN212007430U (en) | 2020-05-28 | 2020-05-28 | Tuning fork type material level switch and sensor structure thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020931692.2U CN212007430U (en) | 2020-05-28 | 2020-05-28 | Tuning fork type material level switch and sensor structure thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN212007430U true CN212007430U (en) | 2020-11-24 |
Family
ID=73417325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202020931692.2U Active CN212007430U (en) | 2020-05-28 | 2020-05-28 | Tuning fork type material level switch and sensor structure thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN212007430U (en) |
-
2020
- 2020-05-28 CN CN202020931692.2U patent/CN212007430U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6335669B1 (en) | RF circuit module | |
WO2006064669A1 (en) | Solid electrolytic capacitor and structure for mounting this solid electrolytic capacitor on board | |
KR20110049690A (en) | Power semiconductor module | |
JP4478049B2 (en) | Semiconductor device | |
US8570745B2 (en) | Electrical connector assembly | |
US20070066092A1 (en) | Connecting component | |
JP4807235B2 (en) | Electronic component module | |
CN201218704Y (en) | Electronic detonator control circuit component | |
CN212007430U (en) | Tuning fork type material level switch and sensor structure thereof | |
CN102044531A (en) | Apparatus and method for vertically-structured passive components | |
CN213691998U (en) | Novel power semiconductor module of design | |
US6081418A (en) | Chip type solid electrolytic capacitor | |
TW200417140A (en) | Dielectric component array | |
CN111128898B (en) | Crimping type SiC power module packaging structure | |
CN211045412U (en) | Crimping type SiC power module packaging structure | |
TW202207762A (en) | Electrode structure | |
KR102620523B1 (en) | Electronic component and board having the same mounted thereon | |
JP4163360B2 (en) | Power module | |
KR20220079230A (en) | Electronic component | |
CN214592492U (en) | Motor drive module | |
CN215496677U (en) | Chip packaging structure and semiconductor device | |
JP2005039118A (en) | Semiconductor device | |
CN214378387U (en) | Chip packaging structure and semiconductor device | |
CN218632025U (en) | Power module | |
CN220383360U (en) | Circuit board with waterproof structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |