CN211880725U - Plug-in hole structure of circuit board - Google Patents

Abstract

The utility model relates to a plug-in components hole structure of circuit board for peg graft electronic component, expand hole and conducting layer including base plate, plug-in components hole, several. The substrate is provided with a first surface and a second surface; the plug-in hole and the plurality of expansion holes are arranged on the substrate and penetrate through the first surface and the second surface; the expansion holes are arranged at intervals and are annularly arranged on the outer periphery of the plug-in hole, and the expansion holes are communicated with the plug-in hole to form a plug-in hole together; the conductive layer is formed on the inner wall surface of the plug hole, so that the pins of the electronic component can be well welded to the plug-in hole, and the process yield of the circuit board is improved.

Description

Plug-in hole structure of circuit board

Technical Field

The present invention relates to a circuit board structure, and more particularly, to a plug-in hole (solder hole) structure of a circuit board and a method for manufacturing the same.

Background

In general, except for the arrangement of electronic circuits on a circuit board, other circuit boards need to be plugged with electronic components; because some electronic components have pins, when the electronic components are combined with the circuit board, corresponding plug-in holes (welding holes) are needed to be arranged on the circuit board so as to penetrate through the pins of the electronic components, and the pins of the electronic components are welded on the back surface of the circuit board.

Furthermore, in order to achieve rapid and mass production, the pins of the electronic components on the circuit board are usually soldered by a wave solder process (wave solder process) using a solder pot, so that the pins (pins) of the electronic components inserted into the insertion holes are bonded to the circuit board, and the purpose of electrical connection is achieved. However, since the wave soldering process usually takes a short time, but the heat conduction of the plug-in hole of the circuit board is slow, the tin material in the tin furnace cannot climb onto the pin of the electronic component in a short time, which causes the defects of poor tin adhesion and the like, affects the electrical characteristics of the electronic component, and reduces the yield of the circuit board.

In view of the above, the present inventor has made an intensive study on the above prior art and applied the study in cooperation with the theory to try to solve the above problems, which is an improved objective of the present inventor.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a plug-in hole structure of a circuit board, so as to make the pins of the electronic components for plugging well welded to the plug-in holes, thereby improving the welding speed, reliability and process yield of the circuit board.

In order to achieve the above object, the present invention provides a plug-in hole structure of a circuit board, including a substrate, a plug-in hole, a plurality of expansion holes and a conductive layer. The substrate is provided with a first surface and a second surface which are opposite; the plug-in hole is arranged on the substrate and penetrates through the first surface and the second surface; the plurality of expansion holes are arranged on the substrate and penetrate through the first surface and the second surface, are arranged at intervals and are annularly arranged on the periphery of the plug-in hole, and are communicated with the plug-in hole to form a plug-in hole together with the plug-in hole; and the conductive layer is formed on the inner wall surface of the plug hole.

Compared with the prior art, the structure of the plug-in hole of the circuit board of the utility model mainly comprises the steps of firstly arranging a plurality of expansion holes which are arranged at intervals and in an annular shape on the substrate, then arranging the plug-in hole at the central position surrounded by the plurality of expansion holes, and enabling the plug-in hole to be communicated with the plurality of expansion holes to jointly form the plug-in hole, thereby expanding the range of the plug-in hole, and in addition, forming a conductive layer on the inner wall surface of the plug-in hole to complete the electrical conduction connection of the plug-in hole and the circuit board; subsequently, the pins of the electronic assembly are inserted into the plug holes of the circuit board and are sent into a tin furnace for welding, and accordingly, the soldering tin is attached to the pins and the conducting layers of the plug holes; therefore, the pin of the circuit board of the utility model can accelerate the welding speed when the plug-in hole is used, and can save the welding time; in addition, electronic component's pin can weld well in the plug-in components hole and make electronic component combine on the circuit board, borrow this to improve the processing procedure goodness rate of circuit board, increase the utility model discloses a practicality.

Drawings

Fig. 1 is a schematic diagram of the circuit board and the electronic component of the present invention before plugging.

Fig. 2 is a schematic flow chart of a manufacturing method of the plug-in hole of the circuit board according to the present invention.

Fig. 3 to 7 are schematic views illustrating a manufacturing process of the plug-in hole of the circuit board according to the present invention.

Fig. 8 is a schematic view of the circuit board and the electronic component of the present invention after being plugged.

Symbolic illustration in the drawings:

1, a circuit board; 2, an electronic component; 3, connecting pins; 4, soldering tin; 10: a substrate; 11: a first surface; 12: a second surface; 20, plug-in holes; 200, inserting holes; 30, expanding the hole; 40, a conductive layer; 41, a first welding pad; 42, a second welding pad; a) d) step (c).

Detailed Description

The following detailed description and technical contents of the present invention are described with reference to the drawings, but the drawings are only for reference and illustration and are not intended to limit the present invention.

Fig. 1 is a schematic diagram of the circuit board and the electronic component of the present invention before plugging. The utility model provides a plug-in components hole structure of circuit board for at least an electronic component 2 pegs graft, expand hole 30 and a conducting layer 40 including a base plate 10, a plug-in components hole 20, several. The plug-in hole 20 and the plurality of expansion holes 30 are disposed on the substrate 10, and the conductive layer 40 is disposed on inner walls of the plug-in hole 20 and the plurality of expansion holes 30, thereby forming a circuit board 1. The structure of the card hole of the circuit board 1 and the manufacturing method will be described in more detail.

Please refer to fig. 2, which is a flow chart of the manufacturing method of the plug-in hole of the circuit board according to the present invention; please refer to fig. 3 to fig. 7, which are schematic diagrams illustrating a manufacturing process of the plug-in hole of the circuit board according to the present invention. The method for manufacturing the plug-in hole of the circuit board 1 of the present invention is as follows. As shown in fig. 3, step a), first, a substrate 10 is provided, the substrate 10 having a first surface 11 and a second surface 12 opposite to each other; preferably, the substrate 10 is a multi-layer substrate, such as a bakelite board or a fiberglass substrate.

In addition, referring to fig. 4, in step b), a plurality of expansion holes 30 penetrating through the first surface 11 and the second surface 12 are drilled on the substrate 10, and the plurality of expansion holes 30 are arranged at intervals and are arranged in a ring shape. Referring to fig. 5, step c), a plug-in hole 20 penetrating through the first surface 11 and the second surface 12 is drilled on the substrate 10, and the plug-in hole 20 is communicated with the plurality of expansion holes 30 and forms a plug-in hole 200 together with the plurality of expansion holes 30.

In this embodiment, the plug-in hole 20 is configured as a circular hole, and in addition, the plurality of expansion holes 30 are respectively configured as a half of open holes, and two ends of each expansion hole 30 are respectively connected to the periphery of the plug-in hole 20; accordingly, the plurality of expansion holes 30 are radially arranged on the periphery of the plug hole 20, for example, the plug hole 200 may be contoured in a plum blossom shape.

Referring to fig. 6 and 7, in step d), a conductive layer 40 is formed on the inner wall of the plug hole 200 (formed by the plug hole 20 and the plurality of expansion holes 30). Preferably, the conductive layer 40 is a copper foil layer, and the conductive layer 40 is electrically connected to a circuit (not shown) of the substrate 10.

Specifically, the expansion holes 30 are disposed at intervals and annularly arranged on the outer periphery of the plug-in hole 20, and the expansion holes 30 are communicated with the plug-in hole 20 to form the plug-in hole 200 together with the plug-in hole 20. In addition, the conductive layer 40 is formed on the inner wall surface of the insertion hole 200.

In an embodiment of the present invention, the method for manufacturing the plug-in hole 20 of the circuit board 1 further includes step e) of forming a first solder pad 41 on the first surface 11, and forming a second solder pad 42 on the second surface 12, wherein the conductive layer 40 connects the first solder pad 41 and the second solder pad 42. Preferably, the first bonding pad 41, the second bonding pad 42 and the conductive layer 40 are integrally formed by an electroplating process.

That is, the card hole structure of the circuit board 1 further includes a first solder pad 41 and a second solder pad 42. The first solder pad 41 is formed around the periphery of the insertion hole 200 and located on the first surface 11, and the second solder pad 42 is formed around the periphery of the insertion hole 200 and located on the second surface 12. The conductive layer 40 connects the first bonding pad 41 and the second bonding pad 42 for mutual conduction.

It should be noted that, in the present embodiment, the plug Hole 200 is a Through Hole (planar Through Hole), which is not limited in practical implementation, and the plug Hole 200 can be simply set as a Through Hole to complete electrical conduction Through the first bonding pad 41 and/or the second bonding pad 42.

Please refer to fig. 8, which is a schematic diagram of the circuit board and the electronic component of the present invention after being plugged. The method for manufacturing the plug-in hole of the circuit board 1 of the present invention further includes step f) of placing an electronic component 2 on the substrate 10 and inserting the pin 3 thereof into the plug-in hole 200.

Finally, step g) is performed, the circuit board 1 inserted with the electronic component 2 is sent into a solder furnace (not shown) having solder 4, so that part of the solder 4 adheres to the pin 3, and part of the solder 4 also adheres to the second solder pad 42 and the conductive layer 40 of the insertion hole 200; note that a portion of the solder 4 adheres to the first bonding pad 41 along the conductive layer 40. Thereby, the pins 3 of the electronic component 2 are bonded in the insertion holes 200 through the solder 4, and the electronic component 2 is bonded on the circuit board 1 accordingly.

For example, in the case that the diameter of the card hole 20 formed on the conventional circuit board is 0.66mm, a plurality of expansion holes 30 are formed at intervals and annularly arranged on the periphery of the card hole 20 to form the plug hole 200, and the diameter of the plug hole 200 is about 1.27 mm. In this case, when welding is performed at the position of the insertion hole 200, the welding time can be greatly shortened, for example, when the welding time under the hole diameter of the original insert hole 20 needs 12.5 seconds, the welding time under the change of the hole diameter of the insertion hole 200 can be shortened to 7.5 to 6 seconds; when the welding time required for the diameter of the original plug-in hole 20 is 5.5 seconds, the welding time required for changing the diameter of the plug-in hole 200 can be reduced to 3.5 seconds.

Furthermore, when the conventional circuit board has a large area of solder pads (copper foil) around the periphery of the plug-in hole 20, the solder flow is slow due to the fast heat dissipation, and the soldering speed is slow. On the other hand, when the plug hole 200 of the present invention has the first bonding pad 41 and the second bonding pad 42 (copper foil with a larger area), the bonding speed is significantly faster than the conventional one.

In addition, when the pin 3 of the electronic component 2 is inserted into the plug-in hole 20 of the conventional circuit board, a portion of the pin may be inclined, which may cause uneven gap between the pin 3 and the conductive layer 40, and thus the pin 3 may not be soldered at a small gap. On the other hand, the plug hole 200 of the present invention can let the soldering tin flow to the smaller space of the pin 3 by means of the arrangement of the expansion hole 30, so as to improve the welding yield of the pin 3.

To sum up, the utility model discloses a circuit board 1 is through the setting of this spliced eye 200 and accelerates welding speed to save weld time, and increase the reliability and improve the acceptance rate.

The above only preferred embodiments of the present invention are described, not to limit the scope of the present invention, other applications the equivalent changes of the patent spirit of the present invention should be all included in the scope of the present invention.

Claims (5)

1. A plug-in hole structure of a circuit board for plugging at least one electronic component is characterized by comprising:

a substrate having a first surface and a second surface opposite to each other;

the plug-in hole is arranged on the substrate and penetrates through the first surface and the second surface;

the plurality of expansion holes are arranged on the substrate and penetrate through the first surface and the second surface, are arranged at intervals and are annularly arranged on the outer periphery of the plug-in hole, and are communicated with the plug-in hole to form a plug-in hole together with the plug-in hole; and

a conductive layer formed on the inner wall of the plug hole.

2. The board of claim 1, wherein the board hole is a circular hole, and the plurality of expansion holes are half holes; the expansion holes are radially arranged on the periphery of the plug-in hole.

3. The board of claim 2, wherein the two ends of each expansion hole are connected to the periphery of the card hole.

4. The board of claim 1, further comprising a first solder pad formed around the periphery of the socket and located on the first surface and a second solder pad formed around the periphery of the socket and located on the second surface, wherein the conductive layer connects the first solder pad and the second solder pad.

5. The board of claim 4, wherein the first solder pad, the second solder pad and the conductive layer are integrally formed by a plating process.

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