CN113543513A - Plug-in hole structure of circuit board and manufacturing method thereof - Google Patents
Plug-in hole structure of circuit board and manufacturing method thereof Download PDFInfo
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- CN113543513A CN113543513A CN202010294129.3A CN202010294129A CN113543513A CN 113543513 A CN113543513 A CN 113543513A CN 202010294129 A CN202010294129 A CN 202010294129A CN 113543513 A CN113543513 A CN 113543513A
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- hole
- plug
- circuit board
- substrate
- holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a plug-in hole structure of a circuit board and a manufacturing method thereof, wherein the manufacturing method comprises a) providing a substrate, wherein the substrate is provided with a first surface and a second surface; b) drilling a plurality of expansion holes which are arranged at intervals in a ring shape on a substrate; c) drilling plug-in holes on the substrate, wherein the plug-in holes are communicated with the plurality of expansion holes and form plug-in holes together; and d) forming a conductive layer on the inner wall surface of the plugging hole. The invention also provides a plug-in hole structure of the circuit board, thereby the pins of the electronic component can be well welded to the plug-in hole, and the process yield of the circuit board is improved.
Description
Technical Field
The present invention relates to a circuit board structure, and more particularly, to a plug-in hole (solder hole) structure of a circuit board and a method for manufacturing the same.
Background
In general, except for the arrangement of electronic circuits on a circuit board, other circuit boards need to be plugged with electronic components; because some electronic components have pins, when the electronic components are combined with the circuit board, corresponding plug-in holes (welding holes) are needed to be arranged on the circuit board so as to penetrate through the pins of the electronic components, and the pins of the electronic components are welded on the back surface of the circuit board.
Furthermore, in order to achieve rapid and mass production, the pins of the electronic components on the circuit board are usually soldered by a wave solder process (wave solder process) using a solder pot, so that the pins (pins) of the electronic components inserted into the insertion holes are bonded to the circuit board, and the purpose of electrical connection is achieved. However, since the wave soldering process usually takes a short time, but the heat conduction of the plug-in hole of the circuit board is slow, the tin material in the tin furnace cannot climb onto the pin of the electronic component in a short time, which causes the defects of poor tin adhesion and the like, affects the electrical characteristics of the electronic component, and reduces the yield of the circuit board.
In view of the above, the present inventors have made extensive studies and studies to solve the above problems in combination with the application of the above prior art, and as a result, the present inventors have improved the present invention.
Disclosure of Invention
An objective of the present invention is to provide a plug-in hole structure of a circuit board, so that a pin of an electronic component for plugging can be well soldered to the plug-in hole, thereby increasing the soldering speed, reliability and process yield of the circuit board.
In order to achieve the above object, the present invention provides a method for manufacturing a card hole of a circuit board, for forming a card hole structure for inserting at least one electronic component on the circuit board, comprising a) providing a substrate having a first surface and a second surface opposite to each other; b) drilling a plurality of expansion holes penetrating through the first surface and the second surface on the substrate, wherein the plurality of expansion holes are arranged at intervals and are annularly arranged; c) drilling a plug-in hole penetrating through the first surface and the second surface on the substrate, wherein the plug-in hole is communicated with the plurality of expansion holes and forms a plug-in hole together with the plurality of expansion holes; and d) forming a conductive layer on the inner wall surface of the inserting hole.
In order to achieve the above object, the present invention is a plug-in hole structure of a circuit board, including a substrate, a plug-in hole, a plurality of expansion holes and a conductive layer. The substrate is provided with a first surface and a second surface which are opposite; the plug-in hole is arranged on the substrate and penetrates through the first surface and the second surface; the plurality of expansion holes are arranged on the substrate and penetrate through the first surface and the second surface, are arranged at intervals and are annularly arranged on the periphery of the plug-in hole, and are communicated with the plug-in hole to form a plug-in hole together with the plug-in hole; and the conductive layer is formed on the inner wall surface of the plug hole.
Compared with the prior art, the manufacturing method of the plug-in hole of the circuit board mainly comprises the steps that a plurality of expansion holes which are arranged at intervals in a ring shape are arranged on a substrate, then the plug-in hole is arranged at the central position surrounded by the plurality of expansion holes, and the plug-in hole is communicated with the plurality of expansion holes to form the plug-in hole together, so that the range of the plug-in hole is enlarged, and in addition, a conductive layer is formed on the inner wall surface of the plug-in hole to finish the electrical conduction connection of the plug-in hole and the circuit board; subsequently, the pins of the electronic assembly are inserted into the plug holes of the circuit board and are sent into a tin furnace for welding, and accordingly, the soldering tin is attached to the pins and the conducting layers of the plug holes; therefore, the pins of the circuit board can accelerate the welding speed when being inserted into the plug-in holes, and can save the welding time; in addition, the pins of the electronic component can be well welded in the plug-in holes so that the electronic component is combined on the circuit board, thereby improving the reliability and the excellent rate of the manufacturing process of the circuit board and increasing the practicability of the invention.
Drawings
Fig. 1 is a schematic diagram of a circuit board and an electronic component of the present invention before plugging.
Fig. 2 is a flow chart illustrating a method for manufacturing a card hole of a circuit board according to the present invention.
Fig. 3 to 7 are schematic views illustrating a manufacturing process of a card hole of a circuit board according to the present invention.
Fig. 8 is a combination diagram of the circuit board and the electronic component of the invention after plugging.
Symbolic illustration in the drawings:
1, a circuit board; 2, an electronic component; 3, connecting pins; 4, soldering tin; 10: a substrate; 11: a first surface; 12: a second surface; 20, plug-in holes; 200, inserting holes; 30, expanding the hole; 40, a conductive layer; 41, a first welding pad; 42, a second welding pad; a) d) step (c).
Detailed Description
The following detailed description and technical contents of the present invention are described with reference to the drawings, which are provided for reference and illustration purposes only and are not intended to limit the present invention.
Fig. 1 is a schematic diagram of a circuit board and an electronic component before being plugged. The invention provides a plug-in hole structure of a circuit board, which is used for plugging at least one electronic component 2 and comprises a substrate 10, a plug-in hole 20, a plurality of expansion holes 30 and a conducting layer 40. The plug-in hole 20 and the plurality of expansion holes 30 are disposed on the substrate 10, and the conductive layer 40 is disposed on inner walls of the plug-in hole 20 and the plurality of expansion holes 30, thereby forming a circuit board 1. The structure of the card hole of the circuit board 1 and the manufacturing method will be described in more detail.
Please refer to fig. 2, which is a flow chart of the manufacturing method of the card hole of the circuit board of the present invention; fig. 3 to 7 are schematic views of a manufacturing process of the board with the plug-in hole of the invention. The method of manufacturing the board 1 of the present invention is as follows. As shown in fig. 3, step a), first, a substrate 10 is provided, the substrate 10 having a first surface 11 and a second surface 12 opposite to each other; preferably, the substrate 10 is a multi-layer substrate, such as a bakelite board or a fiberglass substrate.
In addition, referring to fig. 4, in step b), a plurality of expansion holes 30 penetrating through the first surface 11 and the second surface 12 are drilled on the substrate 10, and the plurality of expansion holes 30 are arranged at intervals and are arranged in a ring shape. Referring to fig. 5, step c), a plug-in hole 20 penetrating through the first surface 11 and the second surface 12 is drilled on the substrate 10, and the plug-in hole 20 is communicated with the plurality of expansion holes 30 and forms a plug-in hole 200 together with the plurality of expansion holes 30.
In this embodiment, the plug-in hole 20 is configured as a circular hole, and in addition, the plurality of expansion holes 30 are respectively configured as a half of open holes, and two ends of each expansion hole 30 are respectively connected to the periphery of the plug-in hole 20; accordingly, the plurality of expansion holes 30 are radially arranged on the periphery of the plug hole 20, for example, the plug hole 200 may be contoured in a plum blossom shape.
Referring to fig. 6 and 7, in step d), a conductive layer 40 is formed on the inner wall of the plug hole 200 (formed by the plug hole 20 and the plurality of expansion holes 30). Preferably, the conductive layer 40 is a copper foil layer, and the conductive layer 40 is electrically connected to a circuit (not shown) of the substrate 10.
Specifically, the expansion holes 30 are disposed at intervals and annularly arranged on the outer periphery of the plug-in hole 20, and the expansion holes 30 are communicated with the plug-in hole 20 to form the plug-in hole 200 together with the plug-in hole 20. In addition, the conductive layer 40 is formed on the inner wall surface of the insertion hole 200.
In an embodiment of the present invention, the method for manufacturing the interposer 20 of the circuit board 1 further includes step e) of forming a first bonding pad 41 on the first surface 11, and forming a second bonding pad 42 on the second surface 12, wherein the conductive layer 40 connects the first bonding pad 41 and the second bonding pad 42. Preferably, the first bonding pad 41, the second bonding pad 42 and the conductive layer 40 are integrally formed by an electroplating process.
That is, the card hole structure of the circuit board 1 further includes a first solder pad 41 and a second solder pad 42. The first solder pad 41 is formed around the periphery of the insertion hole 200 and located on the first surface 11, and the second solder pad 42 is formed around the periphery of the insertion hole 200 and located on the second surface 12. The conductive layer 40 connects the first bonding pad 41 and the second bonding pad 42 for mutual conduction.
It should be noted that, in the present embodiment, the plug Hole 200 is a Through Hole (planar Through Hole), which is not limited in practical implementation, and the plug Hole 200 can be simply set as a Through Hole to complete electrical conduction Through the first bonding pad 41 and/or the second bonding pad 42.
Please refer to fig. 8, which is a schematic diagram of the circuit board and the electronic component of the present invention assembled after plugging. The method for manufacturing the card hole of the circuit board 1 of the present invention further comprises step f) of placing an electronic component 2 on the substrate 10 and inserting the pins 3 thereof into the card holes 200.
Finally, step g) is performed, the circuit board 1 inserted with the electronic component 2 is sent into a solder furnace (not shown) having solder 4, so that part of the solder 4 adheres to the pin 3, and part of the solder 4 also adheres to the second solder pad 42 and the conductive layer 40 of the insertion hole 200; note that a portion of the solder 4 adheres to the first bonding pad 41 along the conductive layer 40. Thereby, the pins 3 of the electronic component 2 are bonded in the insertion holes 200 through the solder 4, and the electronic component 2 is bonded on the circuit board 1 accordingly.
For example, in the case that the diameter of the card hole 20 formed on the conventional circuit board is 0.66mm, a plurality of expansion holes 30 are formed at intervals and annularly arranged on the periphery of the card hole 20 to form the plug hole 200, and the diameter of the plug hole 200 is about 1.27 mm. In this case, when welding is performed at the position of the insertion hole 200, the welding time can be greatly shortened, for example, when the welding time under the hole diameter of the original insert hole 20 needs 12.5 seconds, the welding time under the change of the hole diameter of the insertion hole 200 can be shortened to 7.5 to 6 seconds; when the welding time required for the diameter of the original plug-in hole 20 is 5.5 seconds, the welding time required for changing the diameter of the plug-in hole 200 can be reduced to 3.5 seconds.
Furthermore, when the conventional circuit board has a large area of solder pads (copper foil) around the periphery of the plug-in hole 20, the solder flow is slow due to the fast heat dissipation, and the soldering speed is slow. On the other hand, when the plug hole 200 of the present invention has a larger area of the first bonding pad 41 and the second bonding pad 42 (a larger area of copper foil), the bonding speed is significantly faster than the conventional one.
In addition, when the pin 3 of the electronic component 2 is inserted into the plug-in hole 20 of the conventional circuit board, a portion of the pin may be inclined, which may cause uneven gap between the pin 3 and the conductive layer 40, and thus the pin 3 may not be soldered at a small gap. On the other hand, the plug hole 200 of the present invention can allow the solder to flow to the small gap of the pin 3 by the arrangement of the expansion hole 30, thereby increasing the welding yield of the pin 3.
In summary, the circuit board 1 of the present invention increases the soldering speed by the arrangement of the insertion holes 200, thereby saving soldering time, increasing reliability and improving yield.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, but rather as an equivalent to the spirit of the present invention.
Claims (10)
1. A method for manufacturing a plug-in hole of a circuit board, which is used for forming a plug-in hole structure for plugging at least one electronic component on the circuit board, is characterized by comprising the following steps:
a) providing a substrate, wherein the substrate is provided with a first surface and a second surface which are opposite;
b) drilling a plurality of expansion holes penetrating through the first surface and the second surface on the substrate, wherein the plurality of expansion holes are arranged at intervals and are annularly arranged;
c) drilling a plug-in hole penetrating through the first surface and the second surface on the substrate, wherein the plug-in hole is communicated with the plurality of expansion holes and forms a plug-in hole together with the plurality of expansion holes; and
d) a conductive layer is formed on the inner wall of the plugging hole.
2. The method of claim 1, further comprising e) forming a first solder pad on the first surface and a second solder pad on the second surface, wherein the conductive layer connects the first and second solder pads.
3. The method of claim 1, further comprising f) placing the electronic component on the substrate and inserting the pins of the electronic component into the holes.
4. The method of claim 3, further comprising g) feeding the circuit board with the electronic component inserted therein into a solder furnace having solder to adhere the solder to the conductive layer of the insertion hole, the pins of the electronic component being bonded in the insertion hole by the solder.
5. The method for manufacturing a card hole of a circuit board according to claim 1, wherein the plurality of expansion holes in the step b) are respectively configured as half open holes; the plug-in hole in the step c) is set as a round hole.
6. A plug-in hole structure of a circuit board for plugging at least one electronic component is characterized by comprising:
a substrate having a first surface and a second surface opposite to each other;
the plug-in hole is arranged on the substrate and penetrates through the first surface and the second surface;
the plurality of expansion holes are arranged on the substrate and penetrate through the first surface and the second surface, are arranged at intervals and are annularly arranged on the outer periphery of the plug-in hole, and are communicated with the plug-in hole to form a plug-in hole together with the plug-in hole; and
a conductive layer formed on the inner wall of the plug hole.
7. The board of claim 6, wherein the board hole is a circular hole, and the plurality of expansion holes are half holes; the expansion holes are radially arranged on the periphery of the plug-in hole.
8. The board of claim 7, wherein the two ends of each expansion hole are connected to the periphery of the card hole.
9. The board of claim 6, further comprising a first solder pad formed around the periphery of the socket and located on the first surface and a second solder pad formed around the periphery of the socket and located on the second surface, wherein the conductive layer connects the first solder pad and the second solder pad.
10. The board of claim 9, wherein the first solder pad, the second solder pad and the conductive layer are integrally formed by a plating process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010294129.3A CN113543513A (en) | 2020-04-15 | 2020-04-15 | Plug-in hole structure of circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010294129.3A CN113543513A (en) | 2020-04-15 | 2020-04-15 | Plug-in hole structure of circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113543513A true CN113543513A (en) | 2021-10-22 |
Family
ID=78088185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010294129.3A Pending CN113543513A (en) | 2020-04-15 | 2020-04-15 | Plug-in hole structure of circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113543513A (en) |
-
2020
- 2020-04-15 CN CN202010294129.3A patent/CN113543513A/en active Pending
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