CN211872081U - Exhaust device and semiconductor device - Google Patents
Exhaust device and semiconductor device Download PDFInfo
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- CN211872081U CN211872081U CN201922056924.4U CN201922056924U CN211872081U CN 211872081 U CN211872081 U CN 211872081U CN 201922056924 U CN201922056924 U CN 201922056924U CN 211872081 U CN211872081 U CN 211872081U
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Abstract
The utility model provides an exhaust device and semiconductor equipment, the exhaust device is applied to the semiconductor equipment, comprising an exhaust pipeline, a valve and a first detection component, wherein, the exhaust pipeline is communicated with a process chamber and a tail gas treatment device of the semiconductor equipment; the valve is arranged on the exhaust pipeline; the first detection assembly is arranged on the exhaust pipeline, is positioned between the valve and the tail gas treatment device and is used for detecting a gas pressure value or a gas flow value in the exhaust pipeline. Use the utility model discloses can confirm the jam state of exhaust duct and valve, prevent that process chamber pressure is too big, the explosion etc. takes place even to the safety of protection reaction chamber.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically, relate to an exhaust apparatus and semiconductor device.
Background
Chemical Vapor Deposition (CVD) is a process in which Vapor of a gaseous or liquid reactant containing a film-forming element and other gases required for reaction are introduced into a reaction chamber and chemically reacted on the surface of a substrate to form a film. The CVD apparatus allows epitaxial growth, for example of silicon, by transporting a silicon compound (SiHCl) over a substrate at high temperature (> 1000 ℃ C.)3Or SiH2Cl2Etc.), with hydrogen (H)2) And carrying out reduction reaction on the surface of the substrate to precipitate silicon, thereby realizing epitaxial growth of the silicon. Generally, a CVD apparatus includes a transport system, a reaction chamber, an air inlet system, an exhaust system, and a temperature control system, all of which are used in the reaction chamber to form a reaction environment meeting the process requirements.
For CVD equipment for performing an atmospheric (or low pressure) silicon epitaxy process, the reaction gas used in the process is typically SiHCl3And H2Due to SiHCl3The reaction temperature is usually set to > 1100 ℃. Wherein a part of the reaction gas reacts on the surface of the substrate to form silicon atoms, reaction by-products and unreacted SiHCl3The gas mixture, such as a gas, is exhausted from the reaction chamber through an exhaust system. When a gas mixture with higher temperature passes through the stainless steel exhaust pipeline, the temperature of the gas mixture is reduced, and the gas mixture is easy to deposit in the exhaust pipeline, particularly on the inner surface of a ball valve arranged on the exhaust pipeline, so that the pressure fluctuation of a reaction chamber is caused, the defects of fog, particles and the like are formed on the surface of a silicon epitaxial wafer, and the yield and the productivity of products are influenced; when the pressure is serious, the ball valve can block the exhaust pipeline, so that the reaction chamber is burst due to the overlarge pressure of the chamber and is harmful to the existing reaction chamberThe personal safety of field personnel causes great losses such as economy.
Therefore, it is important to monitor the pressure in the exhaust pipe and the blockage of the ball valve in real time.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide an exhaust apparatus and semiconductor device.
According to the utility model discloses an aspect provides an exhaust apparatus, is applied to semiconductor device, including exhaust duct, valve and first determine module, wherein:
the exhaust pipeline is communicated with a process chamber of the semiconductor equipment and a tail gas treatment device;
the valve is arranged on the exhaust pipeline;
the first detection assembly is arranged on the exhaust pipeline, is positioned between the valve and the tail gas treatment device and is used for detecting a gas pressure value or a gas flow value in the exhaust pipeline.
Optionally, the system further comprises a protection pipeline and a controller;
one end of the protection pipeline is communicated with the part of the exhaust pipeline between the valve and the process chamber, the other end of the protection pipeline is communicated with the part of the exhaust pipeline between the valve and the tail gas treatment device, and the protection pipeline is provided with an on-off switch;
the controller is connected with the first detection assembly and the on-off switch and is used for controlling the on-off switch to be switched on when the gas pressure value or the gas flow value detected by the first detection assembly is smaller than or equal to a first threshold value.
Optionally, the exhaust gas treatment device further comprises a second detection assembly, wherein the second detection assembly is arranged on the exhaust pipeline, is located between the process chamber and the valve, and is used for detecting a gas pressure value or a gas flow value in the exhaust pipeline.
Optionally, the first detection assembly is disposed proximate to the valve.
Optionally, the controller is further configured to determine a degree of blockage of the valve according to a relationship between the detected gas pressure value or gas flow value and the preset pressure value or preset flow value.
Optionally, the controller is further configured to determine that the valve is blocked when the gas pressure value or the gas flow value detected by the first detection component is less than or equal to the first threshold value.
Optionally, the controller is further configured to determine that the protection pipeline is also blocked when the gas pressure value or the gas flow value detected by the first detection assembly is still less than or equal to the first threshold value after the on-off switch is turned on.
Optionally, the controller is further configured to send a valve cleaning prompt after determining that the valve is blocked.
Optionally, the controller is further configured to send a safety alarm message after determining that the protection pipe is also blocked.
According to a second aspect of the present invention, there is provided a semiconductor device comprising the exhaust apparatus of the first aspect.
The utility model discloses following beneficial effect has:
the utility model provides an exhaust apparatus can detect the pressure value or the flow value of the gas between valve and the tail gas processing apparatus to according to the gas pressure value or the gas flow value that detect, confirm the jam state of exhaust duct and valve. Therefore, the blocking condition of the valve and the exhaust pipeline can be accurately monitored, the phenomenon that the pressure in the process chamber is too high and even explosion occurs due to the blocking of the valve and the exhaust pipeline is avoided, and the safety of the reaction chamber is protected.
Drawings
FIG. 1 is a schematic structural view of a CVD apparatus according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of an exhaust apparatus according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of another exhaust apparatus provided in the embodiment of the present application.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
The following describes the technical solutions of the present application and how to solve the above technical problems in specific embodiments with reference to the accompanying drawings.
The present embodiment provides an exhaust apparatus applied to a semiconductor device, and is described by taking the CVD apparatus shown in fig. 1 as an example, the CVD apparatus includes a process chamber 200, and a transfer system 400, an air intake system 300, an exhaust system 100 and a temperature control system 500 all acting on the process chamber 200, wherein the specific structures of the process chamber 200, the transfer system 400, the air intake system 300 and the temperature control system 500 may be any structures in the prior art, and are not described herein again.
The exhaust apparatus provided in this embodiment may be a part of an exhaust system 100 of the CVD apparatus, as shown in fig. 2, the exhaust apparatus includes an exhaust pipe 10, a valve 20, and a first detection assembly 30, wherein: the exhaust pipeline 10 is communicated with a process chamber 200 of the semiconductor equipment and the tail gas treatment device 40; the valve 20 is arranged on the exhaust pipeline 10; the first detecting component 30 is disposed on the exhaust pipeline 10 and located between the valve 20 and the exhaust gas treatment device 40, and is configured to detect a gas pressure value or a gas flow value in the exhaust pipeline 10.
In the present embodiment, the exhaust amount of the exhaust system 100 is controlled by the valve 20, after the pressure in the process chamber 200 reaches the reaction pressure and the process is stable, the valve 20 is in an open state, and the exhaust pipe 10 can be controlled to exhaust according to a preset value (a preset pressure value or a flow value) (at this time, there is no any blockage).
In the exhaust apparatus provided in this embodiment, the first detection component 30 is disposed on the exhaust pipeline 10 between the valve 20 and the exhaust gas treatment device 40, and is capable of detecting a real-time pressure value or a flow value of the gas between the valve 20 and the exhaust gas treatment device 40 in real time, so that the blocking states of the exhaust pipeline 10 and the valve 20 can be determined according to the gas pressure value or the gas flow value detected by the first detection component 30. Therefore, the blockage of the valve 20 and the exhaust pipe 10 can be accurately monitored, and the excessive pressure in the process chamber 200, even the explosion and the like caused by the blockage of the valve 20 and the exhaust pipe 10 can be prevented, so that the safety of the process chamber 200 is protected. The maintenance period of the valve 20 and the exhaust pipe 10 may also be determined according to the gas pressure value or the gas flow value detected by the first detection assembly 30 (specifically, the time interval between two cleanings may be taken as the maintenance period). The pressure variation of the process chamber 200 can also be determined according to the data fluctuation of the gas pressure value or the gas flow value detected by the first detection assembly 30, so as to check the defect problem of the epitaxial wafer.
It should be noted that, in this embodiment, specific materials and structures of the exhaust duct 10, the valve 20 and the first detection element 30 are not limited, and the functions of the exhaust duct 10, the valve 20 and the first detection element 30 may be realized, so long as the exhaust and the exhaust amount of the process chamber 200 can be controlled, and the pressure value or the flow rate value in the exhaust duct 10 can be detected.
Specifically, the first sensing assembly 30 may be disposed proximate the valve 20. Since a certain time is required for the gas to flow, when the valve 20 is blocked, the pressure value or the flow value of the gas near the position of the valve 20 changes obviously, so that the real-time pressure value or the flow value near (downstream) the valve 20 can be detected more accurately in time by arranging the first detection assembly 30 near the position of the valve 20, so as to determine whether the valve 20 and the exhaust pipeline 10 are blocked according to the real-time detection value and the preset value of the first detection assembly 30.
Further, the first detection assembly 30 may include a pressure sensor for detecting a first pressure value of the gas in the exhaust pipe 10 and between the valve 20 and the exhaust gas treatment device 40 in real time; alternatively, the first detection assembly 30 comprises a gas flow meter for detecting in real time a first flow value of the gas within the exhaust conduit 10 between the valve 20 and the exhaust gas treatment device 40. Since the value detected by the first detection assembly 30 may be a gas pressure value or a gas flow value, accordingly, the first detection assembly 30 may include a pressure sensor or a gas flow meter, and the pressure sensor is selected for comparison with the reaction pressure in the process chamber 200, which may be more intuitive and lower in cost; the gas flow meter is selected to detect the flow change passing through the valve 20 more timely and accurately, and the blocking condition of the valve 20 can be judged more directly. It should be noted that the present embodiment does not limit the specific model and type of the pressure sensor or the gas flowmeter, as long as the above-mentioned detection function can be realized. For example, the gas flow meter may be, but is not limited to, a gas flow controller.
In one embodiment, as shown in fig. 3, the exhaust apparatus further comprises a protection pipe 50 and a controller; the protection pipeline 50 is disposed on the exhaust pipeline 10, one end of the protection pipeline 50 is communicated with a portion of the exhaust pipeline 10 located between the valve 20 and the process chamber 200, and the other end of the protection pipeline 50 is communicated with a portion of the exhaust pipeline 10 located between the valve 20 and the tail gas treatment device 40, and the protection pipeline 50 is provided with an on-off switch 60. The controller is connected to the first detection assembly 30 and the on-off switch 60, and is configured to control the on-off switch 60to be turned on when the pressure value or the flow value detected by the first detection assembly 30 is less than or equal to a first threshold (different thresholds may also be set for the pressure value and the flow value, respectively). Thus, by arranging the protection pipeline 50 connected in parallel with the valve 20 and arranging the on-off switch 60 (normally in an off state) on the protection pipeline 50, when the pressure value or the flow value detected by the first detection component 30 is less than or equal to the first threshold value, that is, the valve 20 is blocked, the controller can control the on-off switch 60to be switched on, so that the gas at the upstream of the valve 20 can be discharged through the protection pipeline 50, the influence of the blockage of the valve 20 on the exhaust pipeline 10 and the process chamber 200 can be effectively relieved, the explosion of the process chamber 200 caused by the blockage of the valve 20 can be effectively prevented, the process chamber 200 can be further protected, and the maintenance period of the valve 20 and the exhaust pipeline 10 can be further prolonged. It should be noted that the present embodiment does not limit the specific connection position of the protection pipe 50, as long as it can be installed in parallel with the valve 20, and the air is exhausted when the valve 20 is blocked.
It should be noted that, the embodiment does not limit the specific structure of the controller, and the controller may be a simple controller with a circuit control function, or may be a control system including a processor and an operation interface, as long as the function of controlling the on/off switch to be turned on is achieved.
Further, the controller may be further configured to determine whether the valve 20 is blocked according to a relationship between the gas pressure value or the gas flow value detected by the first detection assembly 30 and the preset pressure value or the preset flow value. Since the pressure value or the flow value at any position in the exhaust pipe 10 is generally equal to the preset pressure value or the preset flow value when the exhaust pipe 10 is not blocked, and is equivalent to the reaction pressure of the process chamber 200; when the valve 20 and the exhaust pipe 10 are blocked, the pressure value or the flow value detected by the first detecting element 30 is smaller than the preset pressure value or the preset flow value. Therefore, the controller can determine whether the valve is blocked according to the relationship between the detected gas pressure value or gas flow value and the preset pressure value or preset flow value, so that a user can know the blocking condition of the exhaust pipeline 10 and the valve 20 more conveniently.
Furthermore, the controller can send out a valve cleaning prompt message after finding the blocking condition, and perform safety pre-warning, so as to perform corresponding automatic or manual treatment on the blocking condition, and prevent the process chamber 200 from being blocked by the valve 20 and the exhaust pipe 10, which causes excessive pressure in the chamber, even explosion and the like, thereby protecting the safety of the process chamber 200. The maintenance period of the valve 20 and the exhaust pipe 10 may also be determined according to the real-time detection value of the first detection assembly 30 (specifically, the time interval between two cleanings may be taken as the maintenance period).
Specifically, the controller is further configured to determine that the valve 20 is blocked when the gas pressure value or the gas flow value detected by the first detection assembly 30 is less than or equal to the first threshold value; when the gas pressure value or the gas flow value detected by the first detection assembly 30 is less than or equal to the second threshold value, determining that the valve 20 is seriously blocked, and cleaning the valve 20; wherein the first threshold is greater than the second threshold.
In the present embodiment, since the channel structure of the valve 20 is complex in general and is more likely to be clogged than the exhaust pipe 10, when it is determined that the exhaust apparatus is clogged, it is usually determined that the valve 20 is clogged (at this time, the exhaust pipe 10 may have deposited some impurities); if the gas pressure value or the gas flow value detected by the first detection assembly 30 is less than or equal to the second threshold value, it may be determined that the valve 20 is severely blocked (at this time, the exhaust pipe 10 may have deposited more impurities), and the valve 20 (and the exhaust pipe 10) is cleaned. It should be noted that, in this embodiment, specific values of the first threshold and the second threshold are not limited, the first threshold may be any value that is smaller than a preset pressure value or a preset flow value and is larger than zero, the second threshold is any value that is smaller than the first threshold, for example, a difference between the first threshold and the preset flow value may be 10torr (pressure unit, 760torr is equal to 1 standard atmospheric pressure), and a difference between the second threshold and the preset flow value may be 30 torr.
In one embodiment, the controller is further configured to determine that the protection pipe 50 is blocked and clean the protection pipe 50 when the gas pressure value or the gas flow value detected by the first detection component 30 is still less than or equal to the first threshold value after the on-off switch 60 is turned on.
In this embodiment, if the gas pressure value or the gas flow value detected by the first detection assembly 30 is not substantially changed and still less than or equal to the first threshold after the on-off switch 60 is turned on, it can be determined that the protection pipeline 50 is also blocked. Further, after the protection pipeline 50 is also blocked, safety alarm information can be sent to perform safety alarm, so that the protection pipeline 50 can be cleaned in time, and other measures for reducing the pressure of the process chamber 200 (such as air inflow reduction, air extraction and the like) can be taken in time under the condition of requirement (specifically, automatic treatment or manual treatment can be performed), so that the problem that the process chamber 200 is over-high in pressure and burst due to the fact that the protection pipeline 50 is blocked and the function is failed is prevented, the exhaust device can detect the blocking condition of the valve 20, the blocking condition of the protection pipeline 50 and the maintenance period of the protection pipeline 50, and the safety of the process chamber 200 is further guaranteed.
In one embodiment, the exhaust apparatus further comprises a second detection assembly 70, wherein the second detection assembly 70 is disposed on the exhaust conduit 10 and between the process chamber 200 and the valve 20, and is used for detecting a gas pressure value or a gas flow value in the exhaust conduit 10.
In the present embodiment, since the explosion of the process chamber 200 may also be caused by other reasons (the non-valve 20 and the exhaust pipe 10 are blocked, for example, the intake pressure of the intake system 300 is suddenly increased), and at this time, since the opening degree of the valve 20 is fixed (the valve 20 is in the normally open state after the process is stabilized, and the opening degree is kept unchanged), the first detection assembly 30 may not detect a value greater than the preset value, and the situation that the pressure of the process chamber 200 is too high due to the pressure increase of the intake system 300 may not be identified. And the placement of the second sensing assembly 70 between the process chamber 200 and the valve 20, preferably near the process chamber 200, allows for the timely sensing of the gas pressure in the exhaust line 10 near the process chamber 200.
Further, when the detected gas pressure value or gas flow value is greater than the preset value, the controller may control the on-off switch 60 on the protection pipe 50 to be turned on, so as to discharge the gas in the process chamber 200 in time, thereby avoiding the occurrence of the condition that the pressure of the process chamber 200 is too high due to the blockage of other non-exhaust pipes 10 and valves 20, and further improving the safety of the process chamber 200. Specifically, the second sensing assembly 70 may also include a pressure sensor or a gas flow meter, as with the first sensing assembly 30.
Based on the same conception of the above exhaust apparatus, the present invention also provides a semiconductor device including the exhaust apparatus in any of the above embodiments. Similarly, the semiconductor device at least has the beneficial effects of the above exhaust device, and the description thereof is omitted here.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (10)
1. The utility model provides an exhaust apparatus, is applied to semiconductor equipment, its characterized in that includes exhaust duct, valve and first detection element, wherein:
the exhaust pipeline is communicated with a process chamber of the semiconductor equipment and a tail gas treatment device;
the valve is arranged on the exhaust pipeline;
the first detection assembly is arranged on the exhaust pipeline, is positioned between the valve and the tail gas treatment device and is used for detecting a gas pressure value or a gas flow value in the exhaust pipeline.
2. The exhaust apparatus of claim 1, further comprising a protection conduit and a controller;
one end of the protection pipeline is communicated with the part of the exhaust pipeline between the valve and the process chamber, the other end of the protection pipeline is communicated with the part of the exhaust pipeline between the valve and the tail gas treatment device, and the protection pipeline is provided with an on-off switch;
the controller is connected with the first detection assembly and the on-off switch and is used for controlling the on-off switch to be switched on when the gas pressure value or the gas flow value detected by the first detection assembly is smaller than or equal to a first threshold value.
3. The exhaust apparatus of claim 2, further comprising a second sensing assembly disposed on the exhaust conduit between the process chamber and the valve for sensing a gas pressure value or a gas flow value within the exhaust conduit.
4. An exhaust apparatus according to any of claims 1 to 3, wherein the first sensing arrangement is located adjacent the valve.
5. The exhaust apparatus of claim 2, wherein the controller is further configured to determine whether the valve is clogged based on a relationship between a gas pressure value or a gas flow value detected by the first detection assembly and the preset pressure value or the preset flow value.
6. The exhaust apparatus of claim 5, wherein the controller is further configured to determine that the valve has been blocked when the gas pressure value or the gas flow value detected by the first detection component is less than or equal to the first threshold value.
7. The exhaust apparatus according to claim 6, wherein the controller is further configured to determine that the protection pipe is also blocked when the gas pressure value or the gas flow value detected by the first detection component is still less than or equal to the first threshold value after the on-off switch is turned on.
8. The exhaust apparatus as claimed in claim 6, wherein the controller is further configured to issue a valve cleaning prompt after determining that the valve has been blocked.
9. The exhaust apparatus of claim 7, wherein the controller is further configured to issue a safety warning message upon determining that the protection pipe has also become plugged.
10. A semiconductor device comprising the exhaust apparatus according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922056924.4U CN211872081U (en) | 2019-11-25 | 2019-11-25 | Exhaust device and semiconductor device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922056924.4U CN211872081U (en) | 2019-11-25 | 2019-11-25 | Exhaust device and semiconductor device |
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| CN211872081U true CN211872081U (en) | 2020-11-06 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112899663A (en) * | 2021-01-15 | 2021-06-04 | 长鑫存储技术有限公司 | Detection method and detection device of gas transmission equipment and gas transmission equipment |
| CN113113333A (en) * | 2021-04-01 | 2021-07-13 | 北京北方华创微电子装备有限公司 | Exhaust device and semiconductor processing equipment |
| CN113585269A (en) * | 2021-09-27 | 2021-11-02 | 国能大渡河大数据服务有限公司 | Construction safety monitoring method and system for hydropower engineering |
-
2019
- 2019-11-25 CN CN201922056924.4U patent/CN211872081U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112899663A (en) * | 2021-01-15 | 2021-06-04 | 长鑫存储技术有限公司 | Detection method and detection device of gas transmission equipment and gas transmission equipment |
| CN113113333A (en) * | 2021-04-01 | 2021-07-13 | 北京北方华创微电子装备有限公司 | Exhaust device and semiconductor processing equipment |
| CN113113333B (en) * | 2021-04-01 | 2024-05-17 | 北京北方华创微电子装备有限公司 | Exhaust device and semiconductor processing equipment |
| CN113585269A (en) * | 2021-09-27 | 2021-11-02 | 国能大渡河大数据服务有限公司 | Construction safety monitoring method and system for hydropower engineering |
| CN113585269B (en) * | 2021-09-27 | 2021-12-17 | 国能大渡河大数据服务有限公司 | Construction safety monitoring method and system for hydropower engineering |
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