CN211858604U - Semiconductor packaging, chip arranging and glue discharging integrated machine - Google Patents
Semiconductor packaging, chip arranging and glue discharging integrated machine Download PDFInfo
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- CN211858604U CN211858604U CN202020613665.0U CN202020613665U CN211858604U CN 211858604 U CN211858604 U CN 211858604U CN 202020613665 U CN202020613665 U CN 202020613665U CN 211858604 U CN211858604 U CN 211858604U
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- side plate
- gear
- glue
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- fixedly connected
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Abstract
The utility model discloses a semiconductor encapsulation row piece binder all-in-one, the on-line screen storage device comprises a base, the base top is equipped with first curb plate and second curb plate, and first curb plate and second curb plate and base top welding, be equipped with base plate, drive roll, driven voller and conveyer belt between first curb plate and the second curb plate, and drive roll and driven voller are located the conveyer belt, the conveyer belt top is equipped with the boss, and boss bottom and conveyer belt top bond, the conveyer belt top is equipped with the diaphragm, and the diaphragm top is equipped with electric telescopic handle, the diaphragm below is equipped with glues the case, and glues the bottom of the case and be equipped with the binder removal pipe, and the binder removal pipe side is equipped with the solenoid valve, second curb plate side is equipped with first gear and second gear, and first gear and second gear have the meshing of tooth part, the second gear outside is equipped with the. The utility model discloses not only improve the quality when arranging the piece and the accuracy when arranging the glue, still improved semiconductor package's efficiency simultaneously.
Description
Technical Field
The utility model relates to a semiconductor package technical field especially relates to a semiconductor package arranges piece binder removal all-in-one.
Background
With the development of microelectronic technology, the processing equipment of semiconductor electrical components gradually develops towards automation, and the semiconductor needs to be packaged during production, wherein the chip arrangement and glue arrangement are indispensable steps in the semiconductor packaging process.
The conventional semiconductor chip arrangement and glue arrangement are manually completed, so that the semiconductor packaging efficiency is low, and the manual operation has larger error, so that more defective products are generated during semiconductor packaging.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a semiconductor packaging, sheet arranging and glue discharging integrated machine.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a semiconductor packaging, chip arranging and glue discharging integrated machine comprises a base, wherein a first side plate and a second side plate are arranged at the top of the base, the first side plate and the second side plate are welded with the top of the base, a base plate, a driving roller, a driven roller and a conveyor belt are arranged between the first side plate and the second side plate, the driving roller and the driven roller are positioned in the conveying belt, the top of the conveying belt is provided with a boss, the bottom of the boss is bonded with the top of the conveying belt, a transverse plate is arranged above the conveying belt, an electric telescopic rod is arranged at the top of the transverse plate, a glue box is arranged below the transverse plate, a glue discharging pipe is arranged at the bottom of the glue box, the side surface of the rubber discharge pipe is provided with an electromagnetic valve, the side surface of the second side plate is provided with a first gear and a second gear, and the first gear and the second gear are meshed with each other in a toothed part, a rotating motor is arranged on the outer side of the second gear, and an output shaft of the rotating motor is welded with the outer side of the second gear.
Preferably, the driving roller and the driven roller are respectively positioned at two ends of the conveying belt, and the driving roller and the driven roller are rotatably connected with the conveying belt.
Preferably, the base plate is located above the conveyor belt with the base plate on top of the boss.
Preferably, the tops of the first side plate and the second side plate are respectively provided with a stand column, the bottom of each stand column is welded with the tops of the first side plate and the second side plate, the bottom of the transverse plate is located at the top of each stand column, and the bottom of the transverse plate is welded with the top of each stand column.
Preferably, the output shaft of the electric telescopic rod penetrates through the transverse plate to be welded with the top of the rubber box, the top of the rubber discharge pipe is welded with the bottom of the rubber box, and the rubber box and the rubber discharge pipe are communicated and the communicated part is sealed.
Preferably, the first side plate and the second side plate are internally provided with a first connecting rod and a second connecting rod, one end parts of the two first connecting rods respectively penetrate through the first side plate and the second side plate to be welded with two ends of the driving roller, one end parts of the two second connecting rods respectively penetrate through the first side plate and the second side plate to be welded with two ends of the driven roller, and the other end parts of the first connecting rods in the second side plate penetrate through the outer side of the second side plate to be welded with the inner side of the first gear.
Preferably, still be equipped with the carousel in the second curb plate, and carousel and the inside rotation of second curb plate are connected, be equipped with the bearing between second gear and the carousel, and the bearing passes the second curb plate and welds with second gear side and carousel side respectively.
The utility model has the advantages that:
1. the utility model discloses, drive second gear rotation through the rotating electrical machines, the second gear has the tooth part to drive first gear rotation, and first gear drives the conveyer belt and rotates, and the conveyer belt drives the base plate and removes, and through the frictional force between multiplicable base plate of boss and the conveyer belt, the effectual base plate of having avoided takes place the skew on the conveyer belt to the quality when arranging the piece has been improved.
2. The utility model discloses, can drive through electric telescopic handle and glue the case and reciprocate, it reciprocates to glue the case and drive the rubber hose, make the distance between rubber hose and the base plate adjustable, avoid when the rubber hose is arranged, because of base plate and rubber hose interval are too big, and cause glue to spatter all around, thereby the quality when the rubber hose is arranged has been improved, the switch of rethread solenoid valve control rubber hose, can arrange the rubber to the base plate, it is big to avoid artifical manual rubber hose error, do not have the rotation that tooth part can pause the conveyer belt through the second gear after that, and then accuracy when having increased the rubber hose.
The utility model discloses, can arrange the piece simultaneously and arrange the glue, need not to change equipment to the efficiency of semiconductor package has been improved.
Drawings
Fig. 1 is a schematic structural view of a semiconductor packaging, chip-arranging and glue-discharging all-in-one machine provided by the present invention;
fig. 2 is a top cross-sectional view of the semiconductor packaging, chip-arranging and glue-discharging all-in-one machine provided by the present invention;
fig. 3 is the utility model provides a first gear and second gear plan view of semiconductor package row piece binder all-in-one.
In the figure: the automatic glue feeding device comprises a base 1, a first side plate 2, a base plate 3, a second side plate 4, a glue box 5, an electric telescopic rod 6, a transverse plate 7, an upright post 8, a glue discharging pipe 9, an electromagnetic valve 10, a conveying belt 11, a first connecting rod 12, a driving roller 13, a first gear 14, a rotating motor 15, a second gear 16, a driven roller 17, a second connecting rod 18 and a boss 19.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, a semiconductor packaging and chip and glue discharging integrated machine comprises a base 1, wherein a first side plate 2 and a second side plate 4 are arranged at the top of the base 1, the first side plate 2 and the second side plate 4 are welded with the top of the base 1, a base plate 3, a driving roller 13, a driven roller 17 and a conveyor belt 11 are arranged between the first side plate 2 and the second side plate 4, the driving roller 13 and the driven roller 17 are positioned in the conveyor belt 11, a boss 19 is arranged at the top of the conveyor belt 11, the bottom of the boss 19 is bonded with the top of the conveyor belt 11, a transverse plate 7 is arranged above the conveyor belt 11, an electric telescopic rod 6 is arranged at the top of the transverse plate 7, a glue discharging box 5 is arranged below the transverse plate 7, a glue discharging pipe 9 is arranged at the bottom of the glue discharging box 5, an electromagnetic valve 10 is arranged on the side surface of the glue discharging pipe 9, a first gear 14 and a second gear 16 are arranged on the side surface of the second, the rotating motor 15 is arranged on the outer side of the second gear 16, and the output shaft of the rotating motor 15 is welded with the outer side of the second gear 16.
The utility model discloses, drive roll 13 and driven voller 17 are located 11 both ends of conveyer belt respectively, and rotate between drive roll 13 and driven voller 17 and the conveyer belt 11 and be connected. The substrate 3 is positioned above the conveyor belt and the substrate 3 is on top of the boss 19. First curb plate 2 and 4 tops of second curb plate all are equipped with stand 8, and 8 bottoms of stand and first curb plate 2 and 4 top welding of second curb plate, and diaphragm 7 bottom is located 8 tops of stand, and 7 bottoms of diaphragm and 8 top welding of stand. The output shaft of electric telescopic handle 6 passes diaphragm 7 and glues 5 top welding of case, and arranges the welding of rubber tube 9 top and gluey 5 bottoms of case, and it is sealed to communicate and communicate the department between gluey case 5 and the rubber tube 9. The first side plate 2 and the second side plate 4 are internally provided with a first connecting rod 12 and a second connecting rod 18, one end parts of the two first connecting rods 12 penetrate through the first side plate 2 and the second side plate 4 respectively to be welded with two ends of a driving roller 13, one end parts of the two second connecting rods 18 penetrate through the first side plate 2 and the second side plate 4 respectively to be welded with two ends of a driven roller 17, and the other end parts of the first connecting rods 12 in the second side plate 4 penetrate through the outer side of the second side plate 4 to be welded with the inner side of a first gear 14. Still be equipped with the carousel in the second curb plate 4, and carousel and the inside rotation of second curb plate 4 are connected, are equipped with the bearing between second gear 16 and the carousel, and the bearing passes second curb plate 4 and welds with second gear 16 side and carousel side respectively.
The working principle is as follows: in actual use, firstly, the rotating motor 15 drives the second gear 16 to rotate, the toothed part of the second gear 16 drives the first gear 14 to rotate, the first gear 14 drives the conveyor belt 11 to rotate, the conveyor belt 11 drives the substrate 3 to move, and the boss 19 can increase the friction force between the substrate 3 and the conveyor belt 11, thereby effectively avoiding the substrate 3 from deviating on the conveyor belt 11, improving the quality during film discharging, when in glue discharging, the electric telescopic rod 6 can drive the glue box 5 to move up and down, the glue box 5 can drive the glue discharging pipe 9 to move up and down, so that the distance between the glue discharging pipe 9 and the substrate 3 can be adjusted, avoiding that when in glue discharging, glue is splashed due to overlarge distance between the substrate 3 and the glue discharging pipe 9, thereby improving the quality during glue discharging, and then the electromagnetic valve 10 controls the switch of the glue discharging pipe 9 to discharge glue from the substrate 3, avoiding large error caused by manual glue discharging, the rotation of the conveyor belt 11 can then be halted by the toothless part of the second gear wheel 16, which increases the accuracy of the glue discharge.
Having shown and described the basic principles and essential features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof, and it is therefore intended that the embodiments be considered as exemplary and not limiting in any way, since the scope of the invention is defined by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein and are therefore not to be embraced therein by any reference numerals in the claims.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A semiconductor packaging and chip and glue discharging integrated machine comprises a base (1) and is characterized in that a first side plate (2) and a second side plate (4) are arranged at the top of the base (1), the first side plate (2) and the second side plate (4) are fixedly connected with the top of the base (1), a base plate (3), a driving roller (13), a driven roller (17) and a conveying belt (11) are arranged between the first side plate (2) and the second side plate (4), the driving roller (13) and the driven roller (17) are positioned in the conveying belt (11), a boss (19) is arranged at the top of the conveying belt (11), the bottom of the boss (19) is bonded with the top of the conveying belt (11), a transverse plate (7) is arranged above the conveying belt (11), an electric telescopic rod (6) is arranged at the top of the transverse plate (7), a glue box (5) is arranged below the transverse plate (7), and a glue discharging pipe (9) is, and the side of the rubber discharge pipe (9) is provided with an electromagnetic valve (10), the side of the second side plate (4) is provided with a first gear (14) and a second gear (16), the first gear (14) and the second gear (16) are meshed with each other in a toothed part, the outer side of the second gear (16) is provided with a rotating motor (15), and an output shaft of the rotating motor (15) is fixedly connected with the outer side of the second gear (16).
2. The integrated semiconductor packaging, chip discharging and glue discharging machine as claimed in claim 1, wherein the driving roller (13) and the driven roller (17) are respectively located at two ends of the conveyor belt (11), and the driving roller (13) and the driven roller (17) are rotatably connected with the conveyor belt (11).
3. The integrated machine for semiconductor packaging, chip arranging and glue discharging of claim 2, wherein the substrate (3) is located above the conveyor belt, and the substrate (3) is on top of the boss (19).
4. The semiconductor packaging, chip discharging and glue discharging all-in-one machine according to claim 3, wherein the top of each of the first side plate (2) and the second side plate (4) is provided with a column (8), the bottom of each column (8) is fixedly connected with the top of each of the first side plate (2) and the second side plate (4), the bottom of the transverse plate (7) is located at the top of each column (8), and the bottom of the transverse plate (7) is fixedly connected with the top of each column (8).
5. The semiconductor packaging, chip discharging and glue discharging integrated machine according to claim 4, wherein an output shaft of the electric telescopic rod (6) penetrates through the transverse plate (7) to be fixedly connected with the top of the glue box (5), the top of the glue discharging pipe (9) is fixedly connected with the bottom of the glue box (5), and the glue box (5) and the glue discharging pipe (9) are communicated and the communicated part is sealed.
6. The semiconductor packaging, chip discharging and glue discharging integrated machine according to claim 5, wherein a first connecting rod (12) and a second connecting rod (18) are respectively arranged inside the first side plate (2) and the second side plate (4), one end of each of the two first connecting rods (12) respectively penetrates through the first side plate (2) and the second side plate (4) to be fixedly connected with two ends of the driving roller (13), one end of each of the two second connecting rods (18) respectively penetrates through the first side plate (2) and the second side plate (4) to be fixedly connected with two ends of the driven roller (17), and the other end of each of the first connecting rods (12) in the second side plate (4) penetrates through the outer side of the second side plate (4) to be fixedly connected with the inner side of the first gear (14).
7. The semiconductor packaging, chip discharging and glue discharging integrated machine according to claim 6, wherein a turntable is further arranged in the second side plate (4), the turntable is rotatably connected with the inside of the second side plate (4), a bearing is arranged between the second gear (16) and the turntable, and the bearing penetrates through the second side plate (4) and is fixedly connected with the side face of the second gear (16) and the side face of the turntable respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020613665.0U CN211858604U (en) | 2020-04-22 | 2020-04-22 | Semiconductor packaging, chip arranging and glue discharging integrated machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020613665.0U CN211858604U (en) | 2020-04-22 | 2020-04-22 | Semiconductor packaging, chip arranging and glue discharging integrated machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211858604U true CN211858604U (en) | 2020-11-03 |
Family
ID=73176864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020613665.0U Expired - Fee Related CN211858604U (en) | 2020-04-22 | 2020-04-22 | Semiconductor packaging, chip arranging and glue discharging integrated machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211858604U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112461835A (en) * | 2020-12-04 | 2021-03-09 | 金陵科技学院 | Computer hardware detection platform |
-
2020
- 2020-04-22 CN CN202020613665.0U patent/CN211858604U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112461835A (en) * | 2020-12-04 | 2021-03-09 | 金陵科技学院 | Computer hardware detection platform |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201103 Termination date: 20210422 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |