CN211763601U - Notebook bonding tool with location structure - Google Patents
Notebook bonding tool with location structure Download PDFInfo
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- CN211763601U CN211763601U CN202020116489.XU CN202020116489U CN211763601U CN 211763601 U CN211763601 U CN 211763601U CN 202020116489 U CN202020116489 U CN 202020116489U CN 211763601 U CN211763601 U CN 211763601U
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Abstract
The utility model discloses a notebook bonding tool with location structure, including lower mould and last mould structure, offer the die cavity of placing that is used for placing the alloy spare at the top surface of lower mould, it includes the framed, framed shape is the same with the shape of plastic part, the direction round hole has been seted up at the top surface border of lower mould, be fixed with the direction cylinder in framed bottom, it still includes the moulded board to go up mould structure, swallow-tail spout has been seted up on framed inner wall, integrated into one piece has the swallow-tail slider with swallow-tail spout matched with on framed border, it keeps away the position chamber to have seted up the spliced pole on the moulded board and keep away hole and side and buckle, be provided with the stopper in the swallow-tail spout, set up the vertical cavity that is linked together with swallow-tail spout on framed lateral wall, be provided with the clamping screw rod in the vertical cavity. The utility model discloses a structure sets up rationally, can effectually guarantee the location of alloy spare and plastic part, guaranteed adhesive precision, improves adhesive qualification rate, and the suitability is strong and the practicality is good.
Description
Technical Field
The utility model belongs to the technical field of the notebook processing equipment, concretely relates to notebook bonding tool with location structure.
Background
In the design and manufacture process of the notebook computer shell, the shell of the notebook computer mostly adopts a combined structure of alloy and plastic for the purposes of beauty, light weight and convenient processing. The alloy part and the plastic part are required to be bonded together in the manufacturing process of the shell of the notebook computer, and glue is required to be used for bonding in the bonding process, so that the bonding strength of the alloy part and the plastic part is ensured. However, the glue needs to be heated to promote the solidification of the glue, so as to ensure the bonding strength between the alloy part and the plastic part, and the relative position between the alloy part and the plastic part needs to be kept unchanged in the heating process. Be provided with the spliced pole on the plastic part on notebook computer's shell and be used for playing the connection side and the buckle of sealing connection effect, consequently can't use conventional tool to carry out bonding operation to the alloy part and the plastic part of notebook computer shell, and can't guarantee the location between alloy part and the plastic part, there is the skew in adhesive shell, can't guarantee the qualification rate, so suitability and practicality receive the restriction.
Disclosure of Invention
The utility model aims at providing a structure setting and suitability are strong notebook bonding tool with location structure.
The technical scheme for realizing the purpose of the utility model is that the notebook bonding jig with the positioning structure comprises a lower die and an upper die structure, wherein a placing die cavity for placing an alloy part is arranged on the top surface of the lower die, the upper die structure comprises a die frame, the shape of the die frame is the same as that of a plastic part, a guide round hole is arranged on the top surface edge of the lower die, a guide cylinder is fixed at the bottom of the die frame, the die frame is inserted into the guide round hole through the guide cylinder to realize positioning, the upper die structure also comprises a die pressing plate, a dovetail-shaped chute is arranged on the inner wall of the die frame, a dovetail-shaped sliding block matched with the dovetail-shaped chute is integrally formed on the edge of the die pressing plate, a connecting post avoiding hole and a side edge and a buckle avoiding cavity are arranged on the die pressing plate, and a limit block is arranged in the dovetail-shaped chute, the side wall of the die frame is provided with a vertical groove communicated with the dovetail-shaped sliding groove, a locking screw is arranged in the vertical groove, the locking screw is connected with the limiting block, and the limiting block is locked and fixed through the locking screw when the dovetail-shaped sliding groove is adjusted in a lifting mode.
The lower die is characterized in that a lifting vertical plate is fixed on the side wall of the lower die, a supporting plate is fixed at the top of the lifting vertical plate, a small air cylinder is fixed on the supporting plate, a pressing plate is fixed on the bottom surface of the small air cylinder, and the pressing plate is pressed on the top surface of the molded plate when the molded plate is pressed with the lower die.
The bottom of the side wall of the die frame is uniformly provided with exhaust holes, and an electric heating block is fixed in the die pressing plate.
An external air pump connector and a small-sized air cylinder start-stop button are arranged on the lifting vertical plate.
The utility model discloses has positive effect: the utility model discloses a structure sets up rationally, and it is when the operation, places the alloy part earlier in the die cavity of lower mould, spouts bonding glue, then places the framed on the lower mould, places the plastic part in the framed this moment again, places the clamp plate at last, can effectually guarantee the location of alloy part and plastic part, has guaranteed adhesive precision, improves adhesive qualification rate, and the suitability is strong and the practicality is good.
Drawings
In order that the present invention may be more readily and clearly understood, the following detailed description of the present invention is provided in connection with the following specific embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
(example 1)
Fig. 1 shows a specific embodiment of the present invention, wherein fig. 1 is a schematic structural diagram of the present invention.
Referring to fig. 1, a notebook computer bonding jig with a positioning structure comprises a lower die 1 and an upper die structure 2, wherein a placing die cavity 3 for placing an alloy part is arranged on the top surface of the lower die, the upper die structure 2 comprises a die frame 21, the die frame is the same as a plastic part in shape, a guide round hole 4 is arranged on the edge of the top surface of the lower die, a guide cylinder 5 is fixed at the bottom of the die frame, the die frame is inserted into the guide round hole through the guide cylinder to realize positioning, the upper die structure 2 further comprises a die pressing plate 22, a dovetail-shaped sliding groove 24 is arranged on the inner wall of the die frame, a dovetail-shaped sliding block 25 matched with the dovetail-shaped sliding groove is integrally formed on the edge of the die pressing plate, a connecting column avoiding hole 26 and a side edge and buckle avoiding cavity 23 are arranged on the die pressing plate, a limiting block 6 is arranged in the dovetail-shaped sliding groove, the side wall of the die frame is provided with a vertical groove 7 communicated with the dovetail-shaped sliding groove, a locking screw 8 is arranged in the vertical groove, the locking screw is connected with a limiting block, and the limiting block is locked and fixed through the locking screw when lifting and adjusting in the dovetail-shaped sliding groove.
A lifting vertical plate 9 is fixed on the side wall of the lower die, a supporting plate 10 is fixed at the top of the lifting vertical plate, a small air cylinder 11 is fixed on the supporting plate, a pressing plate 12 is fixed on the bottom surface of the small air cylinder, and the pressing plate is pressed on the top surface of the molded plate when the molded plate is pressed with the lower die.
The bottom of the side wall of the die frame is uniformly provided with exhaust holes 13, and an electric heating block 16 is fixed in the die pressing plate.
An external air pump joint 14 and a small-sized air cylinder start-stop button 15 are arranged on the lifting vertical plate.
The utility model discloses a structure sets up rationally, and it is when the operation, places the alloy part earlier in the die cavity of lower mould, spouts bonding glue, then places the framed on the lower mould, places the plastic part in the framed this moment again, places the clamp plate at last, can effectually guarantee the location of alloy part and plastic part, has guaranteed adhesive precision, improves adhesive qualification rate, and the suitability is strong and the practicality is good.
The standard parts used in the present embodiment may be purchased directly from the market, and the non-standard structural components described in the specification and drawings may be obtained by processing without any doubt according to the common general knowledge in the art, and the connection manner of the respective parts is by the conventional means developed in the art, and the machines, parts and equipment are of the conventional type in the art, so that the detailed description thereof is omitted.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And such obvious changes and modifications which fall within the spirit of the invention are deemed to be covered by the present invention.
Claims (4)
1. The utility model provides a notebook bonding tool with location structure, includes lower mould and last mode structure, its characterized in that: the die structure comprises a die frame, a die pressing plate, a dovetail sliding groove, a dovetail sliding block, a connecting column avoiding hole, a side edge and a buckle avoiding cavity, wherein the die frame is the same as a plastic part in shape, a guide round hole is formed in the edge of the top surface of the lower die, a guide cylinder is fixed at the bottom of the die frame, the die frame is inserted into the guide round hole through the guide cylinder to realize positioning, the inner wall of the die frame is provided with the dovetail sliding groove, the edge of the die pressing plate is integrally formed with the dovetail sliding block matched with the dovetail sliding groove, the die pressing plate is provided with a connecting column avoiding hole, a side edge and a buckle avoiding cavity, the dovetail sliding groove is internally provided with a limiting block, the side wall of the die frame is provided with a vertical groove communicated with the dovetail sliding groove, and the vertical groove is internally provided with a locking screw rod, the position locking screw is connected with the limiting block, and the limiting block is used for locking and fixing through the position locking screw when the dovetail-shaped sliding groove is adjusted in a lifting mode.
2. The notebook computer bonding jig with positioning structure as claimed in claim 1, wherein: the lower die is characterized in that a lifting vertical plate is fixed on the side wall of the lower die, a supporting plate is fixed at the top of the lifting vertical plate, a small air cylinder is fixed on the supporting plate, a pressing plate is fixed on the bottom surface of the small air cylinder, and the pressing plate is pressed on the top surface of the molded plate when the molded plate is pressed with the lower die.
3. The notebook computer bonding jig with positioning structure as claimed in claim 2, wherein: the bottom of the side wall of the die frame is uniformly provided with exhaust holes, and an electric heating block is fixed in the die pressing plate.
4. The notebook computer bonding jig with positioning structure as claimed in claim 3, wherein: an external air pump connector and a small-sized air cylinder start-stop button are arranged on the lifting vertical plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020116489.XU CN211763601U (en) | 2020-01-19 | 2020-01-19 | Notebook bonding tool with location structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020116489.XU CN211763601U (en) | 2020-01-19 | 2020-01-19 | Notebook bonding tool with location structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211763601U true CN211763601U (en) | 2020-10-27 |
Family
ID=72894899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020116489.XU Active CN211763601U (en) | 2020-01-19 | 2020-01-19 | Notebook bonding tool with location structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211763601U (en) |
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2020
- 2020-01-19 CN CN202020116489.XU patent/CN211763601U/en active Active
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