CN110944100A - Photosensitive assembly manufacturing method, photosensitive assembly, camera module and intelligent terminal - Google Patents
Photosensitive assembly manufacturing method, photosensitive assembly, camera module and intelligent terminal Download PDFInfo
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- CN110944100A CN110944100A CN201811107016.7A CN201811107016A CN110944100A CN 110944100 A CN110944100 A CN 110944100A CN 201811107016 A CN201811107016 A CN 201811107016A CN 110944100 A CN110944100 A CN 110944100A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention relates to a photosensitive assembly manufacturing method, a photosensitive assembly, a camera module and an intelligent terminal, wherein the photosensitive assembly manufacturing method comprises the following steps: providing a circuit board, wherein the circuit board comprises an upper surface and a lower surface opposite to the upper surface, and the circuit board is provided with a plurality of through holes for communicating the upper surface with the lower surface; providing a plane photosensitive chip with a plane photosensitive surface, fixing the central area of the plane photosensitive chip at the inner side of a graph formed by enclosing a plurality of through holes, and covering the through holes by the peripheral area of the plane photosensitive chip; providing a plurality of guide pillars, respectively facing the guide pillars to the through holes, and respectively penetrating the guide pillars through the through holes to jack up the peripheral area of the plane photosensitive chip; and filling a packaging colloid in a gap between the planar photosensitive chip and the circuit board, and curing to form the curved photosensitive chip with a curved photosensitive surface. The photosensitive assembly has simple manufacturing process and better forming effect.
Description
Technical Field
The invention relates to the technical field of cameras, in particular to a photosensitive assembly manufacturing method, a photosensitive assembly, a camera module and an intelligent terminal.
Background
Along with the application of the smart machine with the function of making a video recording in life is more and more popularized, the user is to making a video recording the requirement of module more and more high. The traditional camera module adopts a plane photosensitive chip, wherein the plane photosensitive chip (also called a plane image sensor) refers to a photosensitive chip with a plane photosensitive surface, and the phenomena of distortion, corner light loss, acute angle drop and the like easily occur at the edge position of the plane photosensitive chip due to the fact that the optical path difference between the edge part and the central part of the plane photosensitive chip is different, so that the imaging pixels of the camera module are reduced. In order to solve the above problems, the camera module starts to use a curved surface photosensitive chip, which is a photosensitive chip with a curved photosensitive surface (also called a curved surface image sensor). However, in the conventional camera module, the photosensitive assembly with the curved photosensitive chip generally separately manufactures the curved photosensitive chip in the manufacturing process, and then the formed curved photosensitive chip is mounted on the circuit board, so that the manufacturing process is complex.
Disclosure of Invention
Therefore, it is necessary to provide a photosensitive assembly manufacturing method, a photosensitive assembly, a camera module and an intelligent terminal for solving the problem that a manufacturing process of a photosensitive assembly with a curved photosensitive chip is complex.
A manufacturing method of a photosensitive assembly comprises the following steps:
providing a circuit board, wherein the circuit board comprises an upper surface and a lower surface opposite to the upper surface, through holes for communicating the upper surface with the lower surface are formed in the circuit board, and the number of the through holes is multiple;
providing a plane photosensitive chip with a plane photosensitive surface, fixing the central area of the plane photosensitive chip at the inner side of a graph formed by enclosing the through holes, and covering the through holes by the peripheral area of the plane photosensitive chip;
providing a plurality of guide pillars, respectively facing the guide pillars to the through holes, and respectively penetrating the guide pillars through the through holes to jack up the peripheral area of the plane photosensitive chip;
filling a packaging colloid in a gap between the planar photosensitive chip and the circuit board, and curing to form a curved photosensitive chip with a curved photosensitive surface; and
and separating the guide post from the through hole.
According to the manufacturing method of the photosensitive assembly, the circuit board is provided with the through holes for communicating the upper surface with the lower surface, the central area of the plane photosensitive chip is fixed on the inner side of the graph formed by enclosing the through holes, and the peripheral area of the plane photosensitive chip covers the through holes, so that the photosensitive assembly with the characteristics can jack up the peripheral area of the plane photosensitive chip after the guide post penetrates through the through holes, and the curved surface photosensitive chip is formed under the curing action of the packaging colloid. Compared with the existing manufacturing process of the photosensitive assembly with the curved photosensitive chip, the curved photosensitive chip in the photosensitive assembly can be directly formed on the circuit board, the process that the formed curved photosensitive chip is attached to the circuit board is omitted, and the manufacturing process is simple. In the forming process of the curved surface photosensitive chip, the curved surface photosensitive chip can be manufactured on the premise of not contacting the imaging surface of the photosensitive chip, the imaging surface of the chip cannot be polluted, and the better photosensitive effect is achieved.
In one embodiment, the fixing the central region of the planar photosensitive chip inside the pattern formed by enclosing the plurality of through holes specifically includes:
forming an adhesive layer on the upper surface of the circuit board, the adhesive layer being located inside the pattern;
and attaching the central area of the plane photosensitive chip to the bonding layer.
Therefore, on the premise that the central area of the plane photosensitive chip can be fixed on the circuit board through the bonding layer, the guide post can jack up the peripheral area of the plane photosensitive chip conveniently.
In one embodiment, the forming of the bonding layer on the upper surface of the circuit board and located inside the pattern includes:
forming an adhesive layer on the upper surface of the circuit board in a central region of the pattern.
Therefore, in the manufacturing method of the photosensitive assembly, the force applied to the peripheral area of the plane photosensitive chip by the guide pillar can be distributed more uniformly, and the curved surface shape of the curved surface photosensitive chip is formed.
In one embodiment, the aligning the plurality of guide pillars with the plurality of through holes respectively specifically includes:
fixing the circuit board to a jig;
the through holes are respectively opposite to the guide holes formed in the jig;
and respectively enabling the guide posts to be opposite to the guide holes so as to enable the guide posts to be respectively opposite to the through holes.
So, can realize that the guide pillar wears to locate the accurate location of through-hole process, can increase the stability of the peripheral region process of guide pillar jack-up plane sensitization chip simultaneously.
In one embodiment, the fixing the circuit board to a fixture specifically includes:
and enabling the circuit board to be adsorbed and fixed on the jig through the vacuum holes of the jig.
So, before the guide pillar jacks up the peripheral area of the plane photosensitive chip, the lower surface of the circuit board and the jig can be mutually attracted through the vacuum hole, so that the circuit board is tightly attached to the jig, and the circuit board is not separated from the jig along with the upward movement of the plane photosensitive chip when the peripheral area of the plane photosensitive chip is jacked up.
In one embodiment, before the plurality of guide pillars are respectively inserted through the plurality of through holes to jack up the peripheral region of the planar photosensitive chip, the method for manufacturing a photosensitive assembly further includes the following steps:
and providing a conductive wire, and electrically connecting two ends of the conductive wire with the planar photosensitive chip and the circuit board respectively.
So, before the guide pillar runs through the peripheral region of through-hole jack-up plane sensitization chip, the preferential wire bonding of plane sensitization chip and circuit board has avoided wire bonding again behind the curved surface sensitization chip shaping, causes the unevenness bonding of chip and the insecure risk of bonding.
In one embodiment, before the plurality of guide pillars are respectively inserted through the plurality of through holes to jack up the peripheral region of the planar photosensitive chip, the method for manufacturing a photosensitive assembly further includes the following steps:
and providing a fixed block, and attaching the fixed block to the upper surface of the circuit board so as to assist the guide pillar to jack up the peripheral area of the plane photosensitive chip.
So, can promote the stability of guide pillar jack-up sensitization chip process, prevent that the circuit board from upwards moving along with plane sensitization chip together.
In one embodiment, after the step of separating the guide pillars from the through holes, the method for manufacturing a photosensitive assembly further includes the steps of:
and providing a filling piece, and filling the filling piece into the through holes.
So, the filler is filled in the through-hole on the circuit board for curved surface sensitization chip is after the shaping, and the circuit board has better support intensity, can support components and parts such as curved surface sensitization chip, camera lens subassembly.
Meanwhile, the invention also provides a photosensitive assembly, which comprises:
the circuit board comprises an upper surface and a lower surface opposite to the upper surface, through holes for communicating the upper surface with the lower surface are formed in the circuit board, and the number of the through holes is multiple;
the light sensing surface of the curved surface light sensing chip is a curved surface, the central area of the curved surface light sensing chip is fixed on the inner side of a graph formed by the enclosing of the through holes, and the curved surface light sensing chip is electrically connected with the circuit board;
and the packaging colloid is filled in a gap between the curved surface photosensitive chip and the circuit board.
Above-mentioned photosensitive assembly, curved surface photosensitive chip direct molding has removed the process that curved surface photosensitive chip carried out the laminating on the circuit board again after the shaping on the circuit board, and is easy and simple to handle.
In one embodiment, the central region of the curved photosensitive chip is fixed to the inner side of the pattern formed by the enclosing of the plurality of through holes by specifically fixing the adhesive layer on the upper surface of the circuit board and located on the inner side of the pattern formed by the enclosing of the plurality of through holes, and the central region of the curved photosensitive chip is attached to the adhesive layer so that the central region of the curved photosensitive chip is fixed to the inner side of the pattern formed by the enclosing of the plurality of through holes.
Therefore, on the premise that the central area of the plane photosensitive chip can be fixed on the circuit board through the bonding layer, the guide post can jack up the peripheral area of the plane photosensitive chip conveniently.
In one embodiment, the curved photosensitive chip is electrically connected to the circuit board by a conductive wire, and two ends of the conductive wire are electrically connected to the curved photosensitive chip and the circuit board respectively, so that the curved photosensitive chip is electrically connected to the circuit board.
Therefore, the curved surface photosensitive chip is convenient to be electrically conducted with the circuit board.
In one embodiment, the photosensitive assembly further comprises a filling member, and the filling member is filled in the through holes.
Above-mentioned sensitization subassembly, the filler is filled in the through-hole on the circuit board for curved surface sensitization chip is after the shaping, and the circuit board has better support intensity, can support components and parts such as curved surface sensitization chip, lens subassembly.
In one embodiment, the adhesive layer is located in a central region of a pattern formed by the plurality of through holes in a surrounding mode.
Therefore, the symmetry of the structure of the photosensitive assembly is favorably ensured.
In one embodiment, the encapsulant extends inward and is coupled to the adhesive layer.
Therefore, the connection firmness of the curved surface photosensitive chip and the circuit board is further improved.
In one embodiment, the encapsulant extends outward to a side away from the curved surface photosensitive chip.
Therefore, the connection firmness of the curved surface photosensitive chip and the circuit board is further improved.
In one embodiment, an end of the conductive wire connected to the circuit board is embedded in the encapsulant.
Therefore, the conductive wire can be prevented from being exposed out of the packaging adhesive body, the risk of damage of the conductive wire is reduced, and the service life is prolonged.
Meanwhile, the invention also provides a camera module, which comprises:
the photosensitive assembly; and
the lens assembly is arranged on the photosensitive path of the photosensitive assembly.
Therefore, the photosensitive assembly with the curved photosensitive chip can be arranged on the lens assembly to form the camera module.
Meanwhile, the invention also provides an intelligent terminal, which comprises:
the camera module; and
the terminal body, the module of making a video recording locates on the terminal body.
So, can obtain the intelligent terminal who has above-mentioned module of making a video recording.
Drawings
Fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of the light sensing assembly of FIG. 1;
FIG. 3 is a schematic structural diagram of the circuit board of FIG. 2;
FIG. 4 is a schematic structural view of the circuit board of FIG. 3 with a bonding layer disposed on the upper surface thereof;
FIG. 5 is a schematic view of the structure of FIG. 4 with a flat photosensitive chip disposed on the adhesive layer;
FIG. 6 is a schematic structural view of the planar photosensitive chip and the circuit board of FIG. 5 connected by a conductive wire;
FIG. 7 is a schematic structural view of the circuit board of FIG. 6 with a fixing block disposed on the upper surface thereof;
FIG. 8 is a schematic structural view of the planar photosensitive chip of FIG. 7 with the peripheral region thereof being lifted by the lifting device to form a curved photosensitive chip;
FIG. 9 is a schematic structural view of the gap between the curved photosensitive chip and the circuit board in FIG. 8 after being filled with an encapsulant;
FIG. 10 is a schematic view of a via fill filler of the light sensing assembly of FIG. 9;
fig. 11 is a schematic structural view of the light sensing assembly in fig. 10 after filling the through hole with a filling member.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, a camera module 10 according to an embodiment of the present invention is applied to an intelligent terminal. Specifically, in the present embodiment, the intelligent terminal includes a terminal body and a camera module 10 disposed on the terminal body. More specifically, in this embodiment, the smart terminal is a smart terminal such as a smart phone, a notebook computer, a tablet computer, a portable phone, a video phone, a digital still camera, an electronic book reader, a Portable Multimedia Player (PMP), a mobile medical device, or a wearable device.
In the present embodiment, the camera module 10 includes a photosensitive element 10a and a lens element 10 b. The lens assembly 10b is disposed on a photosensitive path of the photosensitive assembly 10a, and light from the object side passes through the lens assembly 10b and then reaches the photosensitive assembly 10a, thereby realizing imaging.
As shown in fig. 2, in the present embodiment, the photosensitive assembly 10a of the invention includes a circuit board 100, an adhesive layer 200 (which may be omitted), a curved photosensitive chip 300, and an encapsulant 400. The circuit board 100 is used for carrying components such as the curved photosensitive chip 300. The Circuit Board 100 may be a Printed Circuit Board (PCB), a rigid-flex Circuit Board (FPC), or a Flexible Printed Circuit (FPC) after reinforcement, where the rigid-flex Circuit Board includes a stacked PCB and a stacked FPC, the Flexible Circuit Board after reinforcement includes a stacked FPC and a reinforcing sheet, and the reinforcing sheet may be a sheet such as a steel sheet with good heat dissipation performance.
The circuit board 100 includes an upper surface 110 and a lower surface 120 opposite to the upper surface 110, through holes 101 communicating the upper surface 110 and the lower surface 120 are formed in the circuit board 100, and the number of the through holes 101 is plural.
The adhesive layer 200 is disposed on the upper surface 110, and the adhesive layer 200 is located inside a pattern formed by surrounding the plurality of through holes 101. Specifically, in the present embodiment, the adhesive layer 200 is provided in the central region of the pattern formed by the plurality of through holes 101. More specifically, in the present embodiment, the central axis of the pattern formed by the plurality of through holes 101 coincides with the central axis of the circuit board 100, and the adhesive layer 200 is provided in the central region of the circuit board 100. The pattern formed by enclosing the plurality of through holes 101 may be, but is not limited to, a circle, a rectangle, a polygon, and the like.
The curved surface photosensitive chip 300 is also called a curved surface image sensor, and is a Device that converts an optical signal into an electrical signal and has a curved surface, and the curved surface photosensitive chip 300 may be a CCD (Charge-coupled Device) photosensitive chip or a CMOS (Complementary Metal-Oxide-Semiconductor) photosensitive chip. The center region of the curved surface photosensitive chip 300 is connected to the adhesive layer 200, and the curved surface photosensitive chip 300 is electrically connected to the circuit board 100. It is understood that in other embodiments, when the curved photosensitive chip 300 can be fixed on the upper surface 110 of the circuit board 100 by other methods (for example, the central region of the curved photosensitive chip and the upper surface of the circuit board are provided with a snap and a slot which are matched with each other, the central region of the curved photosensitive chip and the circuit board are fixedly connected by the snap and the slot, or the central region of the curved photosensitive chip and the upper surface of the circuit board are fixedly connected by magnetic connection), the adhesive layer 200 may be omitted.
The encapsulant 400 is filled in the gap between the curved surface photo sensor 300 and the circuit board 100. Thus, the curved photosensitive chip 300 can be firmly fixed on the circuit board 100, the molding effect of the curved photosensitive chip 300 can be maintained, and the structural strength of the entire photosensitive assembly 10a can be increased. In other embodiments, the encapsulant 400 may be replaced by a supporting pillar fixed on the upper surface 110 of the circuit board 100, specifically, one end of the supporting pillar abuts against a surface of the curved photosensitive chip 300 close to the circuit board 100, and the other end of the supporting pillar is fixed on the upper surface 110 of the circuit board 100, and at this time, the supporting pillar and the through hole 101 are disposed in a staggered manner and are independent of each other.
Referring to fig. 2, 8 and 9, the circuit board 100 is provided with a through hole 101, and the guide post 21 penetrating the through hole 101 can apply an acting force to a peripheral area of the planar photosensitive chip 300a (the planar photosensitive chip 300a is also called a planar image sensor, and is a device that converts an optical signal into an electrical signal and has a planar photosensitive surface), so that the planar photosensitive chip 300a is bent, and then the curved photosensitive chip 300 is formed under the curing action of the encapsulant 400, so that the curved photosensitive chip 300 can be manufactured by using the planar photosensitive chip 300a as an original material. In the photosensitive assembly 10a, the curved photosensitive chip 300 for imaging is closer to the retina which is also curved, and the imaging effect is better than that of the flat photosensitive chip 300 a. The planar photosensitive chip 300a in the embodiment of the present application may be a flexible planar photosensitive chip, or may also be a rigid planar photosensitive chip, which is not limited in the present application.
Further, with reference to fig. 2, in the present embodiment, the projection of the curved photosensitive chip 300 on the upper surface 110 of the circuit board 100 is rectangular and covers the through hole 101, and the through hole 101 is located in the middle of four corners or four sides of the projection of the curved photosensitive chip 300 on the upper surface 110. Thus, when the flat photosensitive chip 300a is used as a raw material to manufacture the curved photosensitive chip 300, the force applied to the peripheral area of the flat photosensitive chip 300a by the guide posts 21 (see fig. 8) can be distributed more uniformly, which is beneficial to forming the curved shape of the curved photosensitive chip 300.
Further, in the present embodiment, the photosensitive assembly 10a of the present invention further includes a filling member 500, and the filling member 500 is filled in the plurality of through holes 101. Therefore, after the planar photosensitive chip 300a is used as a raw material to form the curved photosensitive chip 300, the filling member 500 filled in the through hole 101 can make the circuit board 100 have better supporting strength and can support the curved photosensitive chip 300, the lens assembly 10b and other components. Specifically, in the present embodiment, the filling member 500 is a hole burying adhesive, and the hole burying adhesive is in a liquid state or a semi-solid state. After the embedding glue in the through hole 101 is cured, the filling member 500 of the photosensitive assembly 10a is formed.
Further, in the present embodiment, the encapsulant 400 extends inward and is coupled to the adhesive layer 200. Specifically, in this embodiment, the encapsulant 400 may also extend outward to a side away from the curved surface of the photosensitive chip 300. Thus, the connection between the curved photosensitive chip 300 and the circuit board 100 is further improved.
Further, in the present embodiment, the curved photosensitive chip 300 is electrically connected to the circuit board 100 by the conductive wire 600, and two ends of the conductive wire 600 are electrically connected to the curved photosensitive chip 300 and the circuit board 100, respectively, so as to electrically connect the curved photosensitive chip 300 to the circuit board 100. Specifically, in the present embodiment, one end of the conductive trace 600 connected to the circuit board 100 is embedded in the encapsulant 400. Therefore, the conductive wire 600 can be prevented from being exposed outside the encapsulant 400, the risk of damage to the conductive wire 600 can be reduced, the service life can be prolonged, and the structural firmness of the entire photosensitive assembly 10a can be increased. The material of the conductive wire 600 may be metal, alloy, nonmetal, etc. having conductive properties. Specifically, in this embodiment, the conductive wire 600 is a gold wire.
In other embodiments, the conductive wire 600 may be replaced by a conductive post, specifically, one end of the conductive post abuts against a surface of the curved surface photosensitive chip 300 close to the circuit board 100 to be electrically connected, and the other end of the conductive post is soldered to the upper surface 110 of the circuit board 100 to be electrically connected, and at this time, the conductive post and the through hole 101 are disposed in a staggered manner and are independent of each other.
The following describes the method for manufacturing the photosensitive assembly according to the present invention with reference to fig. 3 to 11.
In step S41, a circuit board 100 is provided. In this embodiment, as shown in fig. 3, fig. 3 is a schematic structural diagram of the circuit board 100. The circuit board 100 includes an upper surface 110 and a lower surface 120 opposite to the upper surface 110, through holes 101 communicating the upper surface 110 and the lower surface 120 are formed in the circuit board 100, and the number of the through holes 101 is plural.
In step S42, as shown in fig. 4, an adhesive layer 200 is formed on the upper surface 110 of the circuit board 100, and the adhesive layer 200 is located inside a pattern formed by the plurality of through holes 101. Specifically, in the present embodiment, the adhesive layer 200 is formed in the central region of the pattern formed by the plurality of through holes 101 being surrounded. More specifically, in the present embodiment, the central axis of the pattern formed by the plurality of through holes 101 coincides with the central axis of the circuit board 100, and the adhesive layer 200 is formed in the central region of the circuit board 100.
In step S43, a planar photosensitive chip 300a is provided. The planar photo sensor chip 300a is also called a planar image sensor, and is a device that converts an optical signal into an electrical signal and has a planar photo sensing surface. The planar photosensitive chip 300a may be a flexible planar photosensitive chip or a rigid planar photosensitive chip. As shown in fig. 5, the central region of the planar photosensitive chip 300a is attached to the adhesive layer 200, and the peripheral region of the planar photosensitive chip 300a covers the through hole 101. It is understood that in other embodiments, when the central region of the planar photosensitive chip 300a can be fixed inside the pattern formed by the surrounding of the plurality of through holes 101 by other means (for example, a snap and a slot are provided in the central region of the curved photosensitive chip and the upper surface of the circuit board, and the curved photosensitive chip and the circuit board are fixedly connected by the snap and the slot, or the central region of the curved photosensitive chip and the upper surface of the circuit board are magnetically connected and fixed), step S42, that is, the step of forming the adhesive layer 200 on the upper surface 110 of the circuit board 100, can be omitted.
Step S44a, providing the conductive line 600. As shown in fig. 6, two ends of the conductive wire 600 are electrically connected to the planar photosensitive chip 300a and the circuit board 100, respectively. Thus, before the guide post 21 penetrates through the through hole 101 to jack up the peripheral region of the planar photosensitive chip 300a (see step S46 and fig. 8 below), the planar photosensitive chip 300a and the circuit board 100 are preferentially wire-bonded, so that the risk of uneven bonding and weak bonding of the chip due to wire bonding after the curved photosensitive chip 300 is molded is avoided.
It is understood that, in other embodiments, the two ends of the conductive wire 600 may be electrically connected to the curved photosensitive chip 300 and the circuit board 100 after the curved photosensitive chip 300 is formed.
In step S44b, the fixing block 30 is provided. As shown in fig. 7, the fixing block 30 is disposed on the upper surface 110 of the circuit board 100 to assist the guide posts 21 to lift up the peripheral area of the planar photosensitive chip 300a (see step S46 and fig. 8 below). Specifically, in the present embodiment, the fixing block 30 can increase the weight of the circuit board 100. Thus, in the process of the guide post 21 jacking up the peripheral area of the planar photosensitive chip 300a, the circuit board 100 can be prevented from being jacked up along with the planar photosensitive chip 300a, and the molding effect of the curved photosensitive chip 300a can be prevented from being affected.
In this embodiment, the planar photosensitive chip 300a is attached to the adhesive layer 200 and covers the through hole 101, and then the fixing block 30 is disposed on the upper surface 110 of the circuit board 100.
In another embodiment, the fixing block 30 may be disposed on the upper surface 110 of the circuit board 100, the adhesive layer 200 may be formed on the upper surface 110 of the circuit board 100, and then the central region of the planar photosensitive chip 300a may be attached to the adhesive layer 200, such that the peripheral region of the planar photosensitive chip 300a covers the through hole 101.
Specifically, in the present embodiment, the fixing block 30 may be a hollow structure with two open ends, and the planar photosensitive chip 300a is located inside the fixing block 30. Thus, the weight of the circuit board 100 is increased, and the circuit board 100 is further prevented from moving upward along with the planar photosensitive chip 300 a. It is understood that in other embodiments, the fixing block 30 may be omitted, and in this case, the circuit board 100 may be fixed on the work table by vacuum suction or the like.
It should be noted that step S44a and step S44b are not in sequence.
In step S45, the jacking device 20 is provided. As shown in fig. 8, the jacking device 20 includes a plurality of guide posts 21 and a driver 22 connected to each other. The driver 22 may be a stepping motor or a linear motor.
In step S46, the guide posts 21 are aligned with the through holes 101, and the driver 22 drives the guide posts 21 through the through holes 101 to lift up the peripheral area of the planar photosensitive chip 300 a. Specifically, in the present embodiment, the plurality of guide columns 21 are driven by one driver 22. It will be appreciated that in other embodiments, a plurality of guide posts 21 may also be driven by a plurality of drivers 22, respectively. It should be noted that the guide posts 21 can also be pushed by human power, and the driver 22 can be omitted.
In step S47, as shown in fig. 9, the encapsulant 400 is filled in the gap between the planar photosensitive chip 300a and the circuit board 100, and cured to form the curved photosensitive chip 300. Specifically, in the present embodiment, the encapsulant 400 surrounds the adhesive layer 200, such that the encapsulant 400 extends inward, is connected to the adhesive layer 200, and extends outward to a side away from the curved surface of the photo sensor chip 300. Thus, the curved photosensitive chip 300 can be firmly fixed on the circuit board 100, the molding effect of the curved photosensitive chip 300 can be maintained, and the structural strength of the entire photosensitive assembly 10a can be increased.
The curved photosensitive chip 300 with the curved surface effect can be obtained by adopting the manufacturing method of the photosensitive assembly, and in the manufacturing method of the photosensitive assembly, the curved photosensitive chip 300 is directly formed on the circuit board 100, so that the process that the formed curved photosensitive chip 300 is attached to the circuit board 100 is omitted, and the manufacturing process is simpler. In the forming process of the curved photosensitive chip 300, the curved photosensitive chip can be manufactured without contacting the imaging surface of the chip (i.e., without contacting the photosensitive surface of the chip), the imaging surface of the chip is not polluted, and the curved photosensitive chip has a better photosensitive effect. Moreover, the guide post 21 is driven by the driver 22, so that the automation and the precise movement of the process of jacking the planar photosensitive chip 300a by the guide post 21 are realized, and the molding effect of the curved photosensitive chip 300 is better.
Further, with reference to fig. 8, in the present embodiment, the jacking device 20 further includes a jig 23, and the jig 23 is provided with a plurality of guide holes 231. Before step S46, i.e. before the driver 22 drives the guide posts 21 to pass through the through holes 101, the circuit board 100 is fixed on the fixture 23 such that the through holes 101 are respectively aligned with the guide holes 231, and the guide posts are respectively aligned with the guide holes so as to be aligned with the through holes, respectively, for the guide posts 21 to pass through the guide holes 231. So, can realize that guide pillar 21 wears to locate the accurate location of through-hole 101 process, can increase the stability of guide pillar 21 jack-up chip process simultaneously.
Further, referring to fig. 8, a vacuum hole 232 is formed in the center of the fixture 23, and the vacuum hole 232 and the guiding hole 231 are independent from each other. In the step of fixing the circuit board 100 on the fixture 23, the vacuum hole 232 is communicated with the air extractor, and when the air extractor works, the circuit board 100 is firmly fixed on the fixture 23 due to vacuum absorption. Specifically, in the present embodiment, the number of the vacuum holes 232 is one and is located inside the plurality of guide holes 231. Thus, in the process that the driver 22 drives the guide posts 21 to jack up the planar photosensitive chip 300a, the circuit board 100 and the jig 23 can be attracted to each other through the vacuum holes 232, so that the circuit board 100 is tightly attached to the jig 23, and the circuit board 100 does not move upward along with the chip to be separated from the jig 23 when the chip is jacked up.
Further, after step S47, that is, after the curved photosensitive chip 300 is formed, the method for manufacturing a photosensitive assembly further includes the following steps:
in step S48a, the guide post 21 is separated from the through hole 101 and the guide hole 231. Specifically, the driver 22 drives the guide post 21 to move toward a side away from the curved photosensitive chip 300, so that the guide post 21 is withdrawn from the through hole 101 and the guide hole 231.
Step S48b, the circuit board 100 is separated from the jig 23. Specifically, after the air extractor stops working, the circuit board 100 is removed from the jig 23.
Step S48c, the fixing block 30 is separated from the circuit board 100.
Thus, the photosensitive element 10a having the curved photosensitive chip 300 can be obtained, and the photosensitive element 10a can continue to be subjected to the subsequent packaging process. The step S48c is not in sequence with the step S48a and the step S48b, respectively.
Further, after step S48b, the method for manufacturing a photosensitive assembly further includes the steps of:
in step S49, the filling member 500 is provided. Referring to fig. 10 and 11, the filling member 500 is filled in the plurality of through holes 101. Specifically, the filling member 500 is a hole burying adhesive, which is in a liquid state or a semi-solid state. After the embedding glue in the through hole 101 is cured, the filling member 500 of the photosensitive assembly 10a is formed.
Thus, the circuit board 100 has better supporting strength and can support the curved photosensitive chip 300, the lens assembly 10b and other components.
Specifically, in the present embodiment, the step of filling the packing 500 includes:
in step S49a, as shown in fig. 10, the photosensitive assembly 10a having the curved photosensitive chip 300 obtained by separating the lifting device 20 and the fixing block 30 is inverted, that is, the circuit board 100 is located right above the curved photosensitive chip 300.
In step S49b, the filler 500 is filled into each through hole 101, and the state shown in fig. 11 is established.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (17)
1. A manufacturing method of a photosensitive assembly comprises the following steps:
providing a circuit board, wherein the circuit board comprises an upper surface and a lower surface opposite to the upper surface, through holes for communicating the upper surface with the lower surface are formed in the circuit board, and the number of the through holes is multiple;
providing a plane photosensitive chip with a plane photosensitive surface, fixing the central area of the plane photosensitive chip at the inner side of a graph formed by enclosing the through holes, and covering the through holes by the peripheral area of the plane photosensitive chip;
providing a plurality of guide pillars, respectively facing the guide pillars to the through holes, and respectively penetrating the guide pillars through the through holes to jack up the peripheral area of the plane photosensitive chip; and
filling a packaging colloid in a gap between the planar photosensitive chip and the circuit board, and curing to form a curved photosensitive chip with a photosensitive film as a curved surface; and
and separating the guide post from the through hole.
2. The method for manufacturing a photosensitive assembly according to claim 1, wherein the fixing the central region of the planar photosensitive chip to the inner side of the pattern formed by the enclosing of the plurality of through holes specifically comprises:
forming an adhesive layer on the upper surface of the circuit board, the adhesive layer being located inside the pattern;
and attaching the central area of the plane photosensitive chip to the bonding layer.
3. The method for manufacturing a photosensitive assembly according to claim 2, wherein the step of forming a bonding layer on the upper surface of the circuit board is performed by:
forming an adhesive layer on the upper surface of the circuit board in a central region of the pattern.
4. The method for manufacturing a photosensitive assembly according to claim 1, wherein said aligning the plurality of guide posts with the plurality of through holes respectively comprises:
fixing the circuit board to a jig;
the through holes are respectively opposite to the guide holes formed in the jig;
and respectively enabling the guide posts to be opposite to the guide holes so as to enable the guide posts to be respectively opposite to the through holes.
5. The method for manufacturing a photosensitive assembly according to claim 4, wherein the step of fixing the circuit board to a jig comprises:
and enabling the circuit board to be adsorbed and fixed on the jig through the vacuum holes of the jig.
6. The method of claim 1, wherein before the step of ejecting the peripheral region of the planar photosensitive chip after the step of passing the plurality of guide posts through the plurality of through holes respectively, the method further comprises the steps of:
and providing a conductive wire, and electrically connecting two ends of the conductive wire with the planar photosensitive chip and the circuit board respectively.
7. The method of claim 1, wherein before the step of ejecting the peripheral region of the planar photosensitive chip after the step of passing the plurality of guide posts through the plurality of through holes respectively, the method further comprises the steps of:
and providing a fixed block, and attaching the fixed block to the upper surface of the circuit board so as to assist the guide pillar to jack up the peripheral area of the plane photosensitive chip.
8. The method of claim 1, wherein after the step of separating the pillars from the through holes, the method further comprises the steps of:
and providing a filling piece, and filling the filling piece into the through holes.
9. A photosensitive assembly, comprising:
the circuit board comprises an upper surface and a lower surface opposite to the upper surface, through holes for communicating the upper surface with the lower surface are formed in the circuit board, and the number of the through holes is multiple;
the light sensing surface of the curved surface light sensing chip is a curved surface, the central area of the curved surface light sensing chip is fixed on the inner side of a graph formed by the enclosing of the through holes, and the curved surface light sensing chip is electrically connected with the circuit board; and
and the packaging colloid is filled in a gap between the curved surface photosensitive chip and the circuit board.
10. The photosensitive assembly of claim 9, wherein the central region of the curved photosensitive chip is fixed to the inner side of the pattern formed by the through holes, and is fixed by an adhesive layer, the adhesive layer is formed on the upper surface of the circuit board and located on the inner side of the pattern formed by the through holes, and the central region of the curved photosensitive chip is attached to the adhesive layer, so that the central region of the curved photosensitive chip is located on the inner side of the pattern formed by the through holes.
11. The photosensitive assembly of claim 9, wherein the curved photosensitive chip is electrically connected to the circuit board by a conductive wire, and two ends of the conductive wire are electrically connected to the curved photosensitive chip and the circuit board respectively, so that the curved photosensitive chip is electrically connected to the circuit board.
12. The photosensitive assembly of claim 9, further comprising a filler, wherein the filler is filled in the plurality of through holes.
13. A photosensitive assembly according to claim 10, wherein the adhesive layer is located in a central region of a pattern formed by the plurality of through holes.
14. A photosensitive assembly according to claim 10, wherein the encapsulant extends inwardly and is coupled to the adhesive layer; and/or
The packaging colloid extends outwards to the outside of one side far away from the curved surface photosensitive chip.
15. The photosensitive assembly of claim 11, wherein an end of the conductive trace connected to the circuit board is embedded in the encapsulant.
16. The utility model provides a module of making a video recording which characterized in that includes:
the photosensitive assembly of any one of claims 9 to 15; and
the lens assembly is arranged on the photosensitive path of the photosensitive assembly.
17. An intelligent terminal, comprising:
a terminal body; and
the camera module of claim 16, wherein the camera module is disposed on the terminal body.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811107016.7A CN110944100A (en) | 2018-09-21 | 2018-09-21 | Photosensitive assembly manufacturing method, photosensitive assembly, camera module and intelligent terminal |
| PCT/CN2019/103013 WO2020057334A1 (en) | 2018-09-21 | 2019-08-28 | Method for manufacturing photosensitive assembly, photosensitive assembly, image capturing module, and smart terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811107016.7A CN110944100A (en) | 2018-09-21 | 2018-09-21 | Photosensitive assembly manufacturing method, photosensitive assembly, camera module and intelligent terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110944100A true CN110944100A (en) | 2020-03-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811107016.7A Withdrawn CN110944100A (en) | 2018-09-21 | 2018-09-21 | Photosensitive assembly manufacturing method, photosensitive assembly, camera module and intelligent terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110944100A (en) |
| WO (1) | WO2020057334A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112532942A (en) * | 2020-11-30 | 2021-03-19 | 黑龙江合师惠教育科技有限公司 | Camera-based educational behavior analysis monitoring equipment and manufacturing method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6135109B2 (en) * | 2012-12-07 | 2017-05-31 | ソニー株式会社 | Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus |
| JP6539075B2 (en) * | 2015-03-17 | 2019-07-03 | キヤノン株式会社 | Imaging device, control method therefor, program, storage medium |
| CN107995399A (en) * | 2017-12-19 | 2018-05-04 | 信利光电股份有限公司 | A kind of curved surface imaging sensor and its welding structure and camera module with wiring board |
| CN107872630A (en) * | 2017-12-25 | 2018-04-03 | 信利光电股份有限公司 | A kind of imaging sensor |
| CN208956159U (en) * | 2018-09-21 | 2019-06-07 | 南昌欧菲光电技术有限公司 | Photosensory assembly, camera module and intelligent terminal |
-
2018
- 2018-09-21 CN CN201811107016.7A patent/CN110944100A/en not_active Withdrawn
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2019
- 2019-08-28 WO PCT/CN2019/103013 patent/WO2020057334A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112532942A (en) * | 2020-11-30 | 2021-03-19 | 黑龙江合师惠教育科技有限公司 | Camera-based educational behavior analysis monitoring equipment and manufacturing method thereof |
| CN112532942B (en) * | 2020-11-30 | 2021-08-10 | 黑龙江合师惠教育科技有限公司 | Image sensor device, manufacturing method thereof, camera and educational behavior analysis monitoring equipment |
Also Published As
| Publication number | Publication date |
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| WO2020057334A1 (en) | 2020-03-26 |
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Application publication date: 20200331 |