CN211743127U - Packaging structure of quartz wafer - Google Patents
Packaging structure of quartz wafer Download PDFInfo
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- CN211743127U CN211743127U CN202020879733.8U CN202020879733U CN211743127U CN 211743127 U CN211743127 U CN 211743127U CN 202020879733 U CN202020879733 U CN 202020879733U CN 211743127 U CN211743127 U CN 211743127U
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- quartz wafer
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Abstract
The utility model discloses a quartz wafer's packaging structure relates to quartz wafer technical field. Including ceramic base, ceramic base's upper surface is close to the edge and is provided with the protruding circle of metal, the upper surface of the protruding circle of metal is provided with metal covering plate, be formed with the installation cavity between metal covering plate and the ceramic base, the corresponding ceramic base upper surface of installation cavity is provided with first metal respectively and places piece and second metal and place the piece, first metal is placed piece and second metal and is placed the piece and place the fixed mounting through conductive adhesive between the piece upper surface and be equipped with quartz wafer body, first metal is placed piece and second metal and is placed piece lower surface all with lead electrical pillar fixed connection. The utility model discloses make the sealed effect between ceramic substrate and the metal cover better, it is stronger to avoid the effect, further dwindle packaging structure volume simultaneously, and space utilization is high, and the accessible is just pasting and side subsides are installed, and it is more convenient to install, and sound construction is not fragile.
Description
Technical Field
The utility model relates to a quartz wafer technical field specifically is a quartz wafer's packaging structure.
Background
The quartz crystal resonator generally comprises a piezoelectric quartz wafer and a packaging shell, wherein the piezoelectric quartz wafer is rectangular or circular, the packaging shell is made of ceramics, glass, metal and the like, electrodes are evaporated on the upper surface and the lower surface of the piezoelectric quartz wafer and are fixed in the packaging shell by conductive adhesive, the electrodes are connected with base pins of the packaging shell through leads which are hermetically packaged, and alternating-current voltage is communicated with the upper electrode and the lower electrode of the quartz wafer through the pins, so that the quartz wafer generates an inverse piezoelectric effect and generates oscillation, but the existing quartz wafer packaging structure also has the following problems:
1. in the prior art, the base and the cover plate are mostly connected together in a manner of bonding by using a sealant, so that the situation of poor sealing effect is easy to occur, and the evasion effect on specific environmental factors is weak;
2. in the prior art, the quartz wafer usually adopts a plug-in type tubular structure, occupies a large space in practical application, is single in installation mode, cannot be laterally attached, is inconvenient to use and has low utilization rate.
SUMMERY OF THE UTILITY MODEL
The utility model provides a quartz wafer's packaging structure possesses that the sealed effect that makes between ceramic substrate and the metal cover plate is better, and it is stronger to avoid the effect, and space utilization is high, and it is more convenient to install, sound construction, not fragile advantage to solve the base and lap the not good condition of sealed effect appears easily, occupation space is big, and the mounting means is single, can't carry out the problem of side subsides.
For the realization makes the sealed effect between ceramic substrate and the metal cover better, it is stronger to avoid the effect, and space utilization is high, and it is more convenient to install, sound construction, not fragile purpose, the utility model provides a following technical scheme: a packaging structure of a quartz wafer comprises a ceramic base, wherein a metal raised ring is arranged on the upper surface of the ceramic base close to the edge, the upper surface of the metal raised ring is provided with a metal cover plate, an installation cavity is formed between the metal cover plate and the ceramic base, the upper surface of the ceramic base corresponding to the mounting cavity is respectively provided with a first metal placing sheet and a second metal placing sheet, a quartz wafer body is fixedly arranged between the upper surfaces of the first metal placing sheet and the second metal placing sheet through conductive adhesive, the lower surfaces of the first metal placing sheet and the second metal placing sheet are fixedly connected with the conductive posts which are fixedly embedded in the ceramic base, the lower surface of the ceramic base corresponding to the conductive columns is respectively and fixedly embedded with an anode support leg and a cathode support leg, and the anode support leg and the cathode support leg are respectively and fixedly connected with the corresponding conductive columns.
As an optimized technical scheme of the utility model, the mounting groove that supplies the protruding circle of metal installation is seted up to metal cover plate's lower surface.
As an optimized technical proposal of the utility model, a protective film is fixedly arranged on the inner wall of the upper side of the metal cover plate, and the thickness of the protective film is 10-15 μm.
As an optimal technical scheme of the utility model, ceramic base's lower surface is seted up the type groove that supplies anodal stabilizer blade and negative pole stabilizer blade to install respectively.
As an optimal technical scheme of the utility model, anodal stabilizer blade and negative pole stabilizer blade are the L type structure that the level was placed.
As an optimized technical scheme of the utility model, positive pole stabilizer blade and negative pole stabilizer blade all spill ceramic substrate's lower surface and right side off-plate 0.5mm-1 mm.
Compared with the prior art, the utility model provides a quartz wafer's packaging structure possesses following beneficial effect:
1. this packaging structure of quartz wafer through set up in the protruding circle melting of metal and the mounting groove of metal apron lower surface, makes the sealed effect between ceramic substrate and the metal apron better, avoids the effect to special environment stronger.
2. This packaging structure of quartz wafer, through setting up to lead electrical pillar and anodal stabilizer blade and negative pole stabilizer blade electric connection, replace to participate in, further reduce the packaging structure volume, space utilization is high, and the anodal stabilizer blade and the negative pole stabilizer blade of L type are simultaneously just pasted and are installed with the side subsides, and it is more convenient to install, and the sound construction is not fragile.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a cross-sectional view of the present invention;
fig. 3 is a right side view of the present invention;
fig. 4 is a top view of the ceramic base according to the present invention.
In the figure: 1. a ceramic base; 2. a metal raised ring; 3. a metal cover plate; 4. a mounting cavity; 5. a first metal placement sheet; 6. a second metal placing sheet; 7. a conductive adhesive; 8. a quartz wafer body; 9. a conductive post; 10. a positive electrode support leg; 11. a negative pole support leg; 12. mounting grooves; 13. a protective film; 14. a profiled groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention discloses a quartz wafer packaging structure, including a ceramic base 1, a metal raised ring 2 is disposed near an edge of an upper surface of the ceramic base 1, a metal cover plate 3 is disposed on an upper surface of the metal raised ring 2, a mounting cavity 4 is formed between the metal cover plate 3 and the ceramic base 1, a first metal placing plate 5 and a second metal placing plate 6 are respectively disposed on an upper surface of the ceramic base 1 corresponding to the mounting cavity 4, a quartz wafer body 8 is fixedly mounted between the first metal placing plate 5 and the upper surface of the second metal placing plate 6 through a conductive adhesive 7, lower surfaces of the first metal placing plate 5 and the second metal placing plate 6 are both fixedly connected with a conductive column 9, the conductive column 9 is fixedly embedded in the ceramic base 1, an anode support leg 10 and a cathode support leg 11 are respectively fixedly embedded on a lower surface of the ceramic base 1 corresponding to the conductive column 9, the positive pole support foot 10 and the negative pole support foot 11 are respectively and fixedly connected with the corresponding conductive columns 9.
Specifically, the lower surface of the metal cover plate 3 is provided with an installation groove 12 for installing the metal raised ring 2.
In this embodiment, 12 canvas of mounting groove are installed protruding circle 2 of metal, establish the position to the lid of metal covering 3 simultaneously and carry on spacingly, make ceramic base 1 upper surface and 3 lower surfaces of metal covering laminate more.
Specifically, a protective film 13 is fixedly mounted on the inner wall of the upper side of the metal cover plate 3, and the thickness of the protective film 13 is 10-15 μm.
In this embodiment, the protective film 13 shields the metal cover plate 3 and seals the joint.
Specifically, the lower surface of the ceramic base 1 is respectively provided with a groove 14 for mounting the anode support leg 10 and the cathode support leg 11.
In this embodiment, the groove 14 facilitates installation of the positive support leg 10 and the negative support leg 11, so that the positive support leg and the negative support leg are not easily exposed and damaged.
Specifically, the positive pole support leg 10 and the negative pole support leg 11 are both horizontally arranged L-shaped structures.
In this embodiment, the positive electrode support leg 10 and the negative electrode support leg 11 are mounted on the lower surface and the right side surface of the ceramic base 1, so that the ceramic base can be pasted positively or laterally, and the mounting manner is more flexible.
Specifically, the positive pole support leg 10 and the negative pole support leg 11 both leak out of the lower surface and the right side surface of the ceramic base 1 by 0.5mm-1 mm.
In this embodiment, the connection and welding of the positive electrode support leg 10 and the negative electrode support leg 11 with the circuit board are more convenient.
The utility model discloses a theory of operation and use flow: when the sealing structure is used, the metal cover plate 3 is covered on the upper surface of the ceramic base 1, the sealing effect between the ceramic base 1 and the metal cover plate 3 is better through the melting of the metal raised ring 2 and the mounting groove 12 on the lower surface of the metal cover plate 3, meanwhile, the protective film 13 covers the inner wall of the metal cover plate 3, the sealing effect between the ceramic base 1 and the metal cover plate 3 is stronger, the avoiding effect on special environments is stronger, the quartz wafer body 8 enables the positive electrode and the negative electrode to be respectively electrically connected with the corresponding conductive posts 9 through the first metal placing piece 5 and the second metal placing piece 6, the positive electrode and the negative electrode are respectively electrically connected with the corresponding conductive posts 9, the conductive posts 9 are electrically connected with the positive electrode support leg 10 and the negative electrode support leg 11, the pins are replaced, the volume of the packaging structure is further reduced, the space utilization rate is high, meanwhile.
In conclusion, the packaging structure of the quartz wafer has the advantages that the sealing effect between the ceramic base 1 and the metal cover plate 3 is better, the avoiding effect is stronger, the size of the packaging structure is further reduced, the space utilization rate is high, the packaging structure can be mounted by being pasted and laterally pasted, the mounting is more convenient, the structure is firm, and the damage is not easy.
It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A quartz wafer packaging structure comprises a ceramic base (1), and is characterized in that: the upper surface of the ceramic base (1) is provided with a metal raised ring (2) close to the edge, the upper surface of the metal raised ring (2) is provided with a metal cover plate (3), an installation cavity (4) is formed between the metal cover plate (3) and the ceramic base (1), the upper surface of the ceramic base (1) corresponding to the installation cavity (4) is respectively provided with a first metal placing piece (5) and a second metal placing piece (6), a quartz wafer body (8) is fixedly arranged between the upper surfaces of the first metal placing piece (5) and the second metal placing piece (6) through a conductive adhesive (7), the lower surfaces of the first metal placing piece (5) and the second metal placing piece (6) are fixedly connected with a conductive column (9), the conductive column (9) is fixedly embedded in the ceramic base (1), and the lower surface of the ceramic base (1) corresponding to the conductive column (9) is respectively fixedly embedded with a positive support leg (10) and a negative support leg (11), the positive pole support leg (10) and the negative pole support leg (11) are respectively and fixedly connected with the corresponding conductive columns (9).
2. The package structure of a quartz wafer as claimed in claim 1, wherein: the lower surface of the metal cover plate (3) is provided with a mounting groove (12) for mounting the metal raised ring (2).
3. The package structure of a quartz wafer as claimed in claim 1, wherein: and a protective film (13) is fixedly arranged on the inner wall of the upper side of the metal cover plate (3), and the thickness of the protective film (13) is 10-15 mu m.
4. The package structure of a quartz wafer as claimed in claim 1, wherein: the lower surface of the ceramic base (1) is respectively provided with a groove (14) for installing the anode support leg (10) and the cathode support leg (11).
5. The package structure of a quartz wafer as claimed in claim 1, wherein: the anode support leg (10) and the cathode support leg (11) are both of L-shaped structures which are horizontally placed.
6. The package structure of a quartz wafer as claimed in claim 1, wherein: the anode supporting leg (10) and the cathode supporting leg (11) are both exposed out of the lower surface and the right side surface of the ceramic base (1) by 0.5-1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020879733.8U CN211743127U (en) | 2020-05-23 | 2020-05-23 | Packaging structure of quartz wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020879733.8U CN211743127U (en) | 2020-05-23 | 2020-05-23 | Packaging structure of quartz wafer |
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| CN211743127U true CN211743127U (en) | 2020-10-23 |
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| CN202020879733.8U Active CN211743127U (en) | 2020-05-23 | 2020-05-23 | Packaging structure of quartz wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114826185A (en) * | 2022-05-23 | 2022-07-29 | 河北时硕微芯科技有限公司 | Surface acoustic wave filter packaging method and structure |
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2020
- 2020-05-23 CN CN202020879733.8U patent/CN211743127U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114826185A (en) * | 2022-05-23 | 2022-07-29 | 河北时硕微芯科技有限公司 | Surface acoustic wave filter packaging method and structure |
| CN114826185B (en) * | 2022-05-23 | 2023-03-10 | 河北时硕微芯科技有限公司 | Surface acoustic wave filter packaging method and structure |
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