CN211698827U - Case heat radiation structure of stacked rocket-borne computer - Google Patents
Case heat radiation structure of stacked rocket-borne computer Download PDFInfo
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- CN211698827U CN211698827U CN202020715190.6U CN202020715190U CN211698827U CN 211698827 U CN211698827 U CN 211698827U CN 202020715190 U CN202020715190 U CN 202020715190U CN 211698827 U CN211698827 U CN 211698827U
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Abstract
The utility model discloses a range upon range of formula arrow carries quick-witted case heat radiation structure of computer, including quick-witted case and heat radiation structure, heat radiation structure includes: the grille type heat dissipation structure is arranged on the outer wall of the case and is used for dissipating heat inside the case to the outside of the case; the switching type heat dissipation structure is arranged in the case, is used for installing the heating functional module on the case and is used for transferring heat generated by the heating functional module outwards; and the diffusion type heat dissipation structure is arranged in the concentrated heating area of the case and used for diffusing the heat of the concentrated heating area outwards. Through the combination of the grid type overall heat dissipation, the targeted module switching heat dissipation, the targeted local heat dissipation, the increased space heat dissipation and other heat dissipation structural forms, the quick heat dissipation requirements of some heating functional modules with large heat productivity and local areas in the case are met, the overall heat dissipation capacity of the stacked rocket-type computer is improved, various functional modules with different heat productivity can be conveniently installed in the case, and the environment adaptability of the stacked rocket-type computer is improved.
Description
Technical Field
The utility model relates to a computer architecture technical field is carried to the arrow, concretely relates to range upon range of formula arrow carries quick-witted case heat radiation structure of computer.
Background
The aerospace electronic system tends to be increasingly developed in a comprehensive and integrated manner, and an rocket-borne computer serving as the core of a carrier rocket is the brain center of the carrier rocket. Generally, rocket-borne computers are customized products, are developed corresponding to models, need to be developed again when new functions are added or purposes are changed, and accordingly, the development period is prolonged and the development cost is increased.
The chinese utility model patent with publication number CN110471508A discloses a general pin-connected panel VPN box, and this kind of VPN box adopts integrated modular design, and every layer of chassis holds one or more functional modules, tailors the combination through the modularization and can satisfy the electrical design demand of different rockets, realizes the integration of rocket-borne computer different functions, also can be applied to the application of other subsystems through cutting down the module. The problems of low applicability and low expandability of the rocket-borne computer of the carrier rocket are solved through a laminated detachable, interchangeable and replaceable structural form.
However, after various functional modules are installed in the stacked VPN box body to form an arrow-mounted computer, the overall heat dissipation capacity of the arrow-mounted computer is large, only one side surface of the VPN box body is provided with a heat dissipation fin as a heat dissipation structure of the chassis, the heat dissipation form is single, and the rapid heat dissipation requirements of some functional modules with large heat productivity cannot be met.
SUMMERY OF THE UTILITY MODEL
Therefore, the to-be-solved technical problem of the utility model lies in overcoming prior art arrow year computer's heat radiation structure singleness, can't carry out the radiating defect of pertinence to the main position of generating heat of arrow year computer to a machine case heat radiation structure of stack formula arrow year computer is provided.
In order to solve the technical problem, the technical scheme of the utility model as follows:
a machine case heat radiation structure of stacked rocket-borne computer, includes quick-witted case and heat radiation structure, be equipped with the accommodation space that supplies functional module to install on it in the quick-witted incasement, heat radiation structure includes:
the grid type heat dissipation structure is arranged on the outer wall of the case and is used for dissipating heat inside the case to the outside of the case;
the switching type heat dissipation structure is arranged in the case, is used for installing a heating functional module on the switching type heat dissipation structure and is used for transferring heat generated by the heating functional module outwards;
and the diffusion type heat dissipation structure is arranged in the concentrated heating area of the case and used for diffusing the heat of the concentrated heating area outwards.
Furthermore, the case is formed by splicing a plurality of case bodies in a laminated manner, and the grid-type heat dissipation structure is a heat dissipation fin arranged on an outer side plate of the case body.
Furthermore, the chassis outer side plate and the radiating fins are both made of aluminum alloy materials.
Furthermore, the adapter type heat dissipation structure is an adapter plate which is arranged in one or more boxes and used for positioning and installing the heating functional module on the adapter plate, and the adapter plate is used for transferring heat generated by the heating functional module arranged on the adapter plate outwards.
Furthermore, the adapter plate is made of a metal copper material.
Furthermore, the diffusion type heat dissipation structure is a heat dissipation plate which is arranged in one or more boxes in an overhead mode, and at least one surface of the heat dissipation plate is in contact with the concentrated heating area.
Further, the heat dissipation plate is made of an aluminum alloy material.
Furthermore, the case also comprises an upper cover covering the case body on the uppermost layer; the heat dissipation structure further includes: the space-expanding type heat dissipation structure is arranged on the upper cover and used for expanding the distance between the upper cover and the heating functional module in the case so as to increase the heat dissipation space.
Furthermore, the space-enlarging heat dissipation structure is a groove which is arranged on the inner wall of the upper cover and used for increasing the distance between the upper cover and the heating functional module in the case.
Further, the upper cover is made of an aluminum alloy material.
The utility model discloses technical scheme has following advantage:
1. the utility model provides a quick-witted case heat radiation structure of range upon range of formula arrow year computer, quick-witted case is through the whole heat dissipation of grid-type, the module switching heat dissipation of pertinence, the local heat dissipation of pertinence, increase the mode that heat radiation structure forms such as space heat dissipation combined together, satisfy the quick heat dissipation requirement of some function module and local area that generate heat that give out heat big of machine incasement, the whole heat-sinking capability of range upon range of formula arrow year computer has been improved, the function module of the various differences that give out heat of convenient installation in each box of quick-witted case, the environment adaptability of range upon range of formula arrow.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic overall structural diagram of a stacked arrow-mounted computer case according to an embodiment of the present invention;
fig. 2 is an exploded schematic view of a stacked arrow-mounted computer case according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a switching heat dissipation structure with a heat generation functional module installed in a stacked arrow-mounted computer chassis according to an embodiment of the present invention on a base;
fig. 4 is a schematic structural diagram of a switching heat dissipation structure without a heat-generating functional module installed in a stacked arrow-mounted computer chassis according to an embodiment of the present invention on a base;
fig. 5 is a schematic structural diagram of a diffusion heat dissipation structure in a stacked arrow-mounted computer chassis on a modular case according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an enlarged space type heat dissipation structure on an upper cover in a stacked arrow-mounted computer case according to an embodiment of the present invention.
Description of reference numerals: 10. a chassis; 11. a base; 12. a modular box body; 13. an upper cover; 21. a grid type heat dissipation structure; 22. a switching type heat dissipation structure; 23. a diffusive heat dissipation structure; 24. expanding the space type heat dissipation structure; 3. and a heating functional module.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The case heat dissipation structure of the stacked rocket-borne computer shown in fig. 1-5 includes a case 10 and a heat dissipation structure, wherein an accommodating space for installing a functional module thereon is provided in the case, and the heat dissipation structure includes a grid type heat dissipation structure 21, a switching type heat dissipation structure 22 and a diffusion type heat dissipation structure 23. The grille-type heat dissipation structure 21 is disposed on an outer wall of the chassis 10, so that heat inside the chassis 10 is dissipated to the outside of the chassis 10; the switching type heat dissipation structure 22 is arranged in the case 10, and is used for mounting the heating functional module 3 thereon and transferring heat generated by the heating functional module 3 outwards; the diffusion type heat dissipation structure 23 is disposed in the concentrated heat generation region of the chassis 10, and is used for diffusing heat in the concentrated heat generation region outwards.
In the present embodiment, the chassis 10 includes a base, a plurality of modular cases 12, and an upper cover 13. The base 11 is used for providing a mounting interface between the rocket-mounted computer and the carrier rocket, and also serves as a basis for mounting other functional modules. The modular box body 12 is a frame structure which is enclosed on four sides and is communicated up and down, the upper end and the lower end of the modular box body 12 are both nested and butted interfaces, and the modular box bodies 12 are arranged on the base 11 in a layer-by-layer nested mode to form a laminated structure; the outer side plate of the modularized box body 12 is provided with an installation interface for installing each functional module. The upper cover 13 covers the uppermost modular box 12, so that the modular boxes 12 are nested layer by layer to form a stacked closed body. The top cover 13, the plurality of modular housings 12 and the base 11 are fixed together from top to bottom by means of compression screws located at the four corners of the housing 10. When the type of each layer of modular box 12 and the number of modular boxes 12 need to be changed, the modular boxes 12 and the functional modules mounted on the corresponding modular boxes 12 can be replaced quickly by loosening the compression screws.
In this embodiment, the grid-type heat dissipation structure 21 is a heat dissipation fin disposed on the outer side plates of the base 11 and the modular box 12, and the heat dissipation fin can effectively increase the heat dissipation area of the outer surface of the chassis 10, thereby improving the overall heat dissipation effect of the heat dissipation chassis 10. The base 11, the modular box body 12 and the radiating fins are all made of aluminum alloy materials; the base 11 and the heat dissipation fins thereon, the modular case 12 and the heat dissipation fins thereon are all of an integrated structure.
In the present embodiment, the adapting heat dissipation structure 22 is an adapting plate mounted on the base 11 and used for positioning and mounting the heat generating functional module 3 thereon, and the adapting plate is used for transferring heat generated by the heat generating functional module 3 mounted thereon to the outside; for example, the heat generated by the heat generating functional module 3 is quickly transferred to the outer wall of the enclosure 10 and quickly dissipated to the outer wall of the enclosure 10 through the grille-type heat dissipation structure 21. Specifically, be equipped with a plurality of mounting holes that supply the functional module 3 location installation of generating heat on the keysets, the functional module 3 that generates heat installs back on the keysets, can with keysets in close contact with to improve the heat radiating area of single functional module 3 that generates heat, utilize the switching heat dissipation to outwards shift the heat fast, improve the functional module 3 that generates heat in the quick-witted case 10, especially some great functional module's of calorific capacity radiating effect. In other embodiments, the adapter plate may also be installed in one or more of the modular boxes 12, and the specific installation position of the adapter plate may be adjusted specifically according to the installation position of the heat-generating functional module 3 on the chassis 10.
Specifically, in order to improve the heat dissipation effect of the adapting heat dissipation structure 22, the adapting plate serving as the adapting heat dissipation structure 22 is made of a metal copper material.
In the present embodiment, the diffusive heat dissipation structure 23 is a heat dissipation plate mounted in one or more of the modular boxes 12 via a column, and at least one surface of the heat dissipation plate is in contact with the concentrated heat generation region. The heat in the concentrated heating area in the case 10 can be diffused outwards quickly through the heat dissipation plate, so that the local heat dissipation effect in the case 10 is improved; moreover, the heat dissipation plate is located above the heating functional module 3 after being lifted by the upright posts, so that the heat above the heating functional module 3 can be prevented from being accumulated. Specifically, the heat dissipation plate is made of an aluminum alloy material.
In this embodiment, the heat dissipation structure of the chassis 10 further includes an enlarged-space heat dissipation structure 24 provided with the upper cover 13 and used for enlarging a distance between the upper cover 13 and the heat-generating functional module 3 in the chassis 10 to increase a heat dissipation space. Specifically, the space-enlarging heat dissipation structure 24 is a groove formed in the inner wall of the upper cover 13, and the groove can increase the distance between the upper cover 13 and the heat-generating functional module 3 in the chassis 10, thereby increasing the heat dissipation space. The upper cover 13 is made of an aluminum alloy material.
According to the heat dissipation structure of the case 10, through the combination of the grid type overall heat dissipation, the targeted module switching heat dissipation, the targeted local heat dissipation, the space expansion heat dissipation and other heat dissipation structure forms, the rapid heat dissipation requirements of some heating functional modules 3 with large heat productivity and local areas in the case 10 are met, the overall heat dissipation capacity of the stacked rocket-borne computer is improved, various functional modules with different heat productivity can be conveniently installed in each box body of the case 10, and the environment adaptability of the stacked rocket-borne computer is improved.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (10)
1. The utility model provides a quick-witted case heat radiation structure of stack formula arrow year computer which characterized in that, includes quick-witted case (10) and heat radiation structure, be equipped with the accommodation space that supplies the functional module to install on it in quick-witted case (10), heat radiation structure includes:
the grille type heat dissipation structure (21) is arranged on the outer wall of the case (10) and is used for dissipating heat inside the case (10) to the outside of the case (10);
the switching type heat dissipation structure (22) is arranged in the case (10), is used for installing a heating functional module on the switching type heat dissipation structure, and is used for transferring heat generated by the heating functional module outwards;
the diffusion type heat dissipation structure (23) is arranged in the concentrated heating area of the case (10) and used for diffusing the heat of the concentrated heating area outwards.
2. The case heat dissipation structure of the stacked arrow-mounted computer according to claim 1, wherein the case (10) is formed by stacking and assembling a plurality of cases, and the grid-type heat dissipation structure (21) is a heat dissipation fin disposed on an outer side plate of the case.
3. The case heat dissipation structure of the stacked arrow-based computer of claim 2, wherein the outer side plate of the case (10) and the heat dissipation fins are made of an aluminum alloy material.
4. The chassis heat dissipation structure of the stacked arrow-based computer according to claim 2, wherein the adapter heat dissipation structure (22) is an adapter board mounted in one or more of the boxes and used for positioning and mounting the heat-generating functional module thereon, and the adapter board is used for transferring heat generated by the heat-generating functional module mounted thereon to the outside.
5. The stacked arrow-mounted computer case heat dissipation structure as set forth in claim 4, wherein the adapter plate is made of a metal copper material.
6. The case heat dissipation structure of the stacked arrow-based computer according to claim 5, wherein the heat dissipation structure (23) is a heat dissipation plate mounted in an overhead manner in one or more of the cases, and at least one surface of the heat dissipation plate is in contact with the concentrated heat generation region.
7. The stacked rocket-mounted computer case heat dissipation structure of claim 6, wherein the heat dissipation plate is made of an aluminum alloy material.
8. The case heat dissipation structure of the stacked arrow-based computer according to claim 2, wherein the case (10) further comprises an upper cover (13) covering the uppermost case; the heat dissipation structure further includes: the space-expanding type heat dissipation structure (24) is arranged on the upper cover (13) and used for expanding the distance between the upper cover (13) and the heating functional module in the case (10) to increase the heat dissipation space.
9. The case heat dissipation structure of the stacked arrow-based computer according to claim 8, wherein the space-enlarging heat dissipation structure (24) is a groove provided on an inner wall of the upper cover (13) for increasing a distance between the upper cover (13) and the heat generating functional module in the case (10).
10. The stacked arrow-based computer case heat dissipation structure of claim 8, wherein the upper cover (13) is made of an aluminum alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020715190.6U CN211698827U (en) | 2020-04-30 | 2020-04-30 | Case heat radiation structure of stacked rocket-borne computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020715190.6U CN211698827U (en) | 2020-04-30 | 2020-04-30 | Case heat radiation structure of stacked rocket-borne computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211698827U true CN211698827U (en) | 2020-10-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020715190.6U Active CN211698827U (en) | 2020-04-30 | 2020-04-30 | Case heat radiation structure of stacked rocket-borne computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211698827U (en) |
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- 2020-04-30 CN CN202020715190.6U patent/CN211698827U/en active Active
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Address after: 100045 1-14-214, 2nd floor, 136 Xiwai street, Xicheng District, Beijing Patentee after: Beijing Star glory Space Technology Co.,Ltd. Patentee after: Beijing Star glory Technology Co.,Ltd. Address before: 329, floor 3, building 1, No. 9, Desheng South Street, Daxing Economic and Technological Development Zone, Beijing 100176 Patentee before: BEIJING XINGJIRONGYAO SPACE TECHNOLOGY Co.,Ltd. Patentee before: Beijing Star glory Technology Co.,Ltd. |