CN211629051U

CN211629051U - Even tray of gluing suitable for multiple size wafer

Info

Publication number: CN211629051U
Application number: CN202020711522.3U
Authority: CN
Inventors: 冀然
Original assignee: Germanlitho Co ltd
Current assignee: Germanlitho Co ltd
Priority date: 2020-05-05
Filing date: 2020-05-05
Publication date: 2020-10-02
Anticipated expiration: 2030-05-05

Abstract

The utility model discloses an even tray of gluing suitable for multiple size wafer, including the tray, annular vacuum groove has been seted up at the top of tray, and the vacuum hole that is linked together with annular vacuum groove has been seted up to the top center department of tray, and the lower lateral wall fixedly connected with of tray cup joints the atmosphere pipe at the vacuum tube lateral wall, and first atmosphere groove has been seted up to the upper surface of tray, and first big gas pocket has been seted up to the bottom in first atmosphere groove, and first big gas pocket is linked together through first connecting pipe and atmosphere pipe, and the top of tray adsorbs there is the wafer. The pressure of the edge of the wafer and the position of the contact of the tray is the same as the pressure in the atmosphere tube, and no pressure difference exists between the two positions, so that the photoresist cannot enter the vacuum tube at the center of the tray, the vacuum pump is prevented from being blocked, and the position of the sealing block of the blocking mechanism is adjusted, so that the communication between the edge of the wafer with different sizes and the atmosphere tube is met, the vacuum blocking mechanism is suitable for adsorption fixation of the wafers with different sizes, and the cost is saved.

Description

Even tray of gluing suitable for multiple size wafer

Technical Field

The utility model relates to a nanometer impression technical field specifically is a tray is glued to even suitable for multiple size wafer.

Background

In the existing nanoimprint lithography, a spin coating process is a commonly used photoresist coating process, and the process can remove redundant photoresist from the surface of a wafer by using a spin centrifugal force and finally form a uniform thin film. However, in the actual use process, the problems that the vacuum pump is blocked by glue entering from the vacuum pipeline and the like often occur. The utility model patent of patent No. cn201920689435.x discloses "spin coater vacuum spin coater" is used for solving above-mentioned problem, but a tray can only be applicable to a size, and the wafer of different sizes need use the tray of different sizes, and the cost is higher.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a tray is glued to even suitable for multiple size wafer to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an even tray of gluing suitable for multiple size wafer, includes the tray, annular vacuum groove has been seted up at the top of tray, the top center department of tray sets up the vacuum hole that is linked together with annular vacuum groove, the bottom fixedly connected with of tray has the one end of the vacuum tube that is connected with the vacuum hole, the other end fixed connection vacuum pump of vacuum tube, the lower lateral wall fixedly connected with of tray cup joints the atmosphere pipe at the vacuum tube lateral wall, first atmosphere groove has been seted up to the upper surface of tray, first atmosphere hole has been seted up to the bottom in first atmosphere groove, first atmosphere hole is linked together through first connecting pipe and atmosphere pipe, the top of tray is used for placing the wafer, the fixed shutoff mechanism that is equipped with in the atmosphere pipe.

Preferably, a second atmosphere groove is formed in the top of the tray, a second atmosphere hole is formed in the bottom of the second atmosphere groove, and the second atmosphere hole is communicated with the atmosphere pipe through a second connecting pipe.

Preferably, the top of the tray is provided with a third atmosphere groove, the bottom of the third atmosphere groove is provided with a third atmosphere hole, and the third atmosphere hole is communicated with the atmosphere pipe through a third connecting pipe.

Preferably, the plugging mechanism comprises electric telescopic rods which are symmetrically and fixedly installed in the inner cavity of the atmospheric pipe, the output end of each electric telescopic rod is fixedly connected with a sealing block, and the sealing blocks are sleeved in the inner cavity of the atmospheric pipe.

Preferably, the sealing block comprises an upper sealing block and a lower sealing block, the upper sealing block is made of hard rubber, and the lower sealing block is made of silicon rubber.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model provides an even gluey tray suitable for multiple size wafer, the intercommunication through the vacuum hole of tray center department and vacuum tube, vacuum pump opens the back and adsorbs the wafer through annular vacuum groove, be provided with big trachea and shutoff mechanism, communicate through keeping the atmospheric groove and the atmospheric tube of the fixed wafer outside edge that adsorbs, thereby the pressure that makes the edge of wafer and the position of tray contact is the same with the pressure in the atmospheric tube, there is not pressure differential in two positions, therefore the photoresist can not enter into in the vacuum tube of tray center department, avoided causing the jam to the vacuum pump, the size through the fixed wafer that adsorbs is different, adjust the position of the seal block of shutoff mechanism, thereby satisfy not unidimensional wafer edge and big trachea's intercommunication, be applicable to the absorption of not unidimensional wafer fixed, and save the cost.

Drawings

Fig. 1 is a schematic structural view of the present invention when adsorbing a small-sized wafer.

Fig. 2 is a schematic structural view of the present invention when adsorbing a middle-sized wafer.

Fig. 3 is a schematic structural diagram of the present invention when adsorbing a large-sized wafer.

In the figure: 1. tray, 2, annular vacuum groove, 3, vacuum hole, 4, vacuum tube, 5, vacuum pump, 6, atmosphere pipe, 7, first atmosphere groove, 8, first atmosphere hole, 9, first connecting pipe, 10, wafer, 11, plastic film, 12, shutoff mechanism, 121, electric telescopic handle, 122, sealing block, 13, second atmosphere groove, 14, second atmosphere hole, 15, second connecting pipe, 16, third atmosphere groove, 17, third atmosphere hole, 18, third connecting pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: a glue homogenizing tray suitable for wafers of various sizes comprises a tray 1, wherein an annular vacuum groove 2 is formed in the top of the tray 1, a vacuum hole 3 communicated with the annular vacuum groove 2 is formed in the center of the top of the tray 1, one end of a vacuum tube 4 connected with the vacuum hole 3 is fixedly connected to the bottom of the tray 1, a vacuum pump 5 is fixedly connected to the other end of the vacuum tube 4, the vacuum pump 5 is connected with an external power supply, the annular vacuum groove 2 is kept vacuum through the vacuum tube 4 and the vacuum hole 3 after the vacuum pump 5 is powered on and opened, so that adsorption can be carried out on wafers on the surface of the tray 1, an atmosphere tube 6 sleeved on the outer side wall of the vacuum tube 4 is fixedly connected to the lower side wall of the tray 1, a first atmosphere groove 7 is formed in the upper surface of the tray 1, a first atmosphere hole 8 is formed in the bottom of the first atmosphere groove 7, and the first atmosphere hole 8 is communicated with the atmosphere tube 6, the top of the tray 1 is used for adsorbing a wafer 10, when the wafer 10 is small in size, the outer side wall of the tray is sleeved with a plastic film 11, the plastic film 11 is set according to the size of the wafer 10 which needs to be adsorbed and fixed, when the second atmosphere groove 13 and the third atmosphere groove 16 are not used, the second atmosphere groove 13 and the third atmosphere groove 16 are shielded and protected, and the blocking mechanism 12 is fixedly assembled in the atmosphere pipe 6.

The top of the tray 1 is provided with a second atmosphere groove 13, the bottom of the second atmosphere groove 13 is provided with a second atmosphere hole 14, and the second atmosphere hole 14 is communicated with the atmosphere pipe 6 through a second connecting pipe 15.

The top of the tray 1 is provided with a third atmosphere groove 16, the bottom of the third atmosphere groove 16 is provided with a third atmosphere hole 17, and the third atmosphere hole 17 is communicated with the atmosphere pipe 6 through a third connecting pipe 18.

The plugging mechanism 12 comprises an electric telescopic rod 121 which is fixedly arranged in an inner cavity of a gas pipe 6 in a bilateral symmetry manner, the output end of the electric telescopic rod 121 is fixedly connected with a sealing block 122, the sealing block 122 is sleeved in the inner cavity of the gas pipe 6 and comprises an upper sealing block and a lower sealing block, the upper sealing block is made of hard rubber, the lower sealing block is made of silicon rubber, the electric telescopic rod 121 is connected with an external controller, the external controller is connected with an external power supply, the electric telescopic rod 121 is powered by the external controller, the output end of the electric telescopic rod 121 is controlled by the external controller, the telescopic length of the electric telescopic rod 121 is controlled, so that the position of the sealing block 122 is changed, the upper sealing block and the sealing block are fixedly adhered, the upper sealing block is made of hard rubber, the electric telescopic rod 121 is ensured to drive the sealing block 122 to move, and the lower, ensuring the sealing effect in the atmosphere pipe 6.

The working principle is as follows: as shown in fig. 1, when the size of the fixed wafer 10 is small, a disposable plastic film as large as the tray 1 is first placed on the tray 1, with the center hollowed out at the same size as the wafer 10, the wafer 10 is placed at the center of the tray 1, then the electric telescopic rod 121 is controlled, the electric telescopic rod 121 drives the sealing block 122 to move to the upper part of the first connecting pipe 9, then the vacuum pump 5 is started, the wafer 10 is adsorbed and fixed through the annular vacuum groove 2, because the edge of the wafer 10 is contacted with the first atmosphere groove 7, the first atmosphere groove 7 is communicated with the atmosphere pipe 6, the pressure of the position where the edge of the wafer 10 is contacted with the tray 1 is the same as the pressure in the atmosphere pipe 6, no pressure difference exists between the two positions, therefore, the photoresist can not enter the vacuum tube 4 at the center of the tray, and the vacuum pump 5 is prevented from being blocked;

as shown in fig. 2, when the size of the fixed wafer 10 is moderate, firstly, a disposable plastic film with the size equal to that of the tray 1 is placed on the tray 1, the middle hollow position is the same as the size of the wafer 10, the wafer 10 is placed at the center of the tray 1, then the electric telescopic rod 121 is controlled, the electric telescopic rod 121 drives the sealing block 122 to move to the upper part of the second connecting pipe 15, the second atmosphere groove 13 is communicated with the atmosphere pipe 6, then the vacuum pump 5 is started, and the wafer 10 is adsorbed and fixed through the annular vacuum groove 2;

as shown in fig. 3, when the fixed wafer 10 and the tray 1 have the same size, the wafer 10 is placed on the surface of the tray 1, and then the electric telescopic rod 121 is controlled, so that the electric telescopic rod 121 drives the sealing block 122 to move to the upper side of the third connecting pipe 18, so that the third atmosphere tank 16 is communicated with the atmosphere pipe 6, and then the vacuum pump 5 is started to perform the adsorption fixing on the wafer 10 through the annular vacuum tank 2.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a glue homogenizing tray suitable for multiple size wafer, includes tray (1), its characterized in that: the top of the tray (1) is provided with an annular vacuum groove (2), the center of the top of the tray (1) is provided with a vacuum hole (3) communicated with the annular vacuum groove (2), the bottom of the tray (1) is fixedly connected with one end of a vacuum tube (4) connected with the vacuum hole (3), the other end of the vacuum tube (4) is fixedly connected with a vacuum pump (5), the lower side wall of the tray (1) is fixedly connected with a large air tube (6) sleeved on the outer side wall of the vacuum tube (4), a first atmosphere groove (7) is arranged on the upper surface of the tray (1), a first atmosphere hole (8) is arranged at the bottom of the first atmosphere groove (7), the first atmospheric hole (8) is communicated with the atmospheric pipe (6) through a first connecting pipe (9), the top of the tray (1) is used for placing a wafer (10), and a plugging mechanism (12) is fixedly assembled in the atmosphere pipe (6).

2. The spin-on tray of claim 1, wherein: a second atmosphere groove (13) is formed in the top of the tray (1), a second atmosphere hole (14) is formed in the bottom of the second atmosphere groove (13), and the second atmosphere hole (14) is communicated with an atmosphere pipe (6) through a second connecting pipe (15).

3. The spin-on tray of claim 1, wherein: the top of the tray (1) is provided with a third atmosphere groove (16), the bottom of the third atmosphere groove (16) is provided with a third atmosphere hole (17), and the third atmosphere hole (17) is communicated with the atmosphere pipe (6) through a third connecting pipe (18).

4. The spin-on tray of claim 1, wherein: the plugging mechanism (12) comprises electric telescopic rods (121) which are symmetrically and fixedly installed in the inner cavity of the atmosphere pipe (6), the output ends of the electric telescopic rods (121) are fixedly connected with sealing blocks (122), and the sealing blocks (122) are sleeved in the inner cavity of the atmosphere pipe (6).

5. The spin-on tray of claim 4, wherein: the sealing block (122) comprises an upper sealing block and a lower sealing block, the upper sealing block is made of hard rubber, and the lower sealing block is made of silicon rubber.