CN211563576U - Ultrasonic sensor - Google Patents
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- CN211563576U CN211563576U CN201921847829.XU CN201921847829U CN211563576U CN 211563576 U CN211563576 U CN 211563576U CN 201921847829 U CN201921847829 U CN 201921847829U CN 211563576 U CN211563576 U CN 211563576U
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Abstract
The utility model discloses an ultrasonic sensor contains: the bearing body is provided with a first surface and a second surface which are opposite to each other by separating the bearing body; the piezoelectric body is in contact with the first surface of the bearing body; a first acoustic impedance matching layer having a third surface and a fourth surface opposite to each other across the first acoustic impedance matching layer, the third surface being in contact with the second surface of the carrier and the first acoustic impedance matching layer having a thickness less than 1/4 of a wavelength of an ultrasonic wave emitted from the ultrasonic sensor at an operating frequency in the first acoustic impedance matching layer; a second acoustic impedance matching layer in contact with the fourth surface of the first acoustic impedance matching layer; the first shock absorption body wraps the piezoelectric body and the first surface of the bearing body, and a gap is formed between the first shock absorption body and the piezoelectric body; and the second damping body coats the first damping body and the bearing body, wherein the first acoustic resistance matching layer and the second acoustic resistance matching layer are exposed out of the second damping body.
Description
Technical Field
The utility model relates to an ultrasonic sensor (ultrasonic transducer), especially relate to an ultrasonic sensor with double-deck shock attenuation body.
Background
The existing ultrasonic sensor (ultrasonic transducer) can be used for short-distance object detection, and the distance between the ultrasonic sensor and an object to be detected can be calculated through the time difference of the emitted ultrasonic waves reflected back after colliding with the object. For ultrasonic testing, the type and properties of the object to be tested are not so limited, including various surface colors, transparencies, hardness, solid, liquid or powder, etc., which can be tested with the ultrasonic sensor. Therefore, nowadays, the ultrasonic sensor is widely used in the fields of parking radar (parking sensor), level sensor (level sensor), sheet layer detection (multiple sheet detection), flow rate detection (flow meter), and the like.
The main component of an ultrasonic sensor is a piezoelectric ceramic (piezoelectric ceramic), such as a ceramic made of lead zirconate titanate (PZT) material, and the two surfaces of the piezoelectric ceramic are coated with conductive layers. Applying a high-frequency alternating current signal during operation can cause the piezoelectric ceramic to generate high-frequency vibration, wherein the high-frequency vibration is a sound wave, and if the frequency of the sound wave falls within the ultrasonic range, the high-frequency vibration is ultrasonic vibration. However, in order for the generated ultrasonic energy to be transmitted from the piezoelectric ceramic to the air, the acoustic impedance (acoustic impedance) of the piezoelectric ceramic must be matched to that of the air.
Acoustic resistance (Z) is material density (ρ) ultrasonic sound velocity (C), and acoustic resistance of piezoelectric ceramic is about 30-35MRayl (10)6Kilogram per square meter per second), the acoustic resistance of air is about 430Rayl (kilogram per square meter per second), and the acoustic resistance of piezoelectric ceramics is very different from that of air, so that the ultrasonic energy generated by piezoelectric ceramics cannot be transmitted into air. Therefore, a matching layer (matching layer) is a necessary component of the ultrasonic sensor, and is disposed between the piezoelectric ceramic and the air, so that the acoustic resistances of the piezoelectric ceramic and the air are matched, and the ultrasonic waves can be effectively transmitted to the air. The acoustic resistance of the matching layer for an air sensor (air transducer) is optimally: while the V (35M 430) Rayl is about 0.12MRayl, it is difficult to find a durable material with an acoustic resistance lower than 1MRayl in nature, and the commonly used matching layer material is a high polymerThe composite material formed by mixing the resin and the hollow glass spheres achieves lower sound resistance characteristic and has better weather resistance and reliability.
Since the ultrasonic sensor needs to generate sound waves by high-frequency vibration, how to reduce aftershock (vibration) of the ultrasonic sensor and make the ultrasonic sensor quickly recover to its stationary state without reducing its performance and reliability becomes an important issue. At present, the industry often sets up a shock absorber around the ultrasonic sensor to absorb shock, but the shock absorption effect and the reliability of the ultrasonic sensor need to be further improved.
The above background disclosure is only provided to aid understanding of the inventive concepts and solutions of the present invention, and it does not necessarily pertain to the prior art of this patent application, and it should not be used to assess the novelty and inventive step of this application without explicit evidence to suggest that such matter has been disclosed at the filing date of this patent application.
SUMMERY OF THE UTILITY MODEL
The following paragraphs provide a brief description of the present invention in order to give the reader a basic understanding of the objects of the invention. This summary is not an extensive overview of the disclosure and is not intended to identify key or essential elements of the invention or to delineate the scope of the invention, but rather to present some concepts thereof in a simplified form to the extent that the detailed description of the invention that follows is discussed.
The utility model discloses a main aim at provides an ultrasonic sensor, and it improves current ultrasonic sensor's shock attenuation effect and reliability through double-deck shock attenuation body.
One of the objects of the present invention is to provide an ultrasonic sensor, which comprises: the bearing body is provided with a first surface and a second surface which are opposite to each other by separating the bearing body; a piezoelectric body in contact with the first surface of the carrier; a first acoustic impedance matching layer having a third surface and a fourth surface opposite to each other across the first acoustic impedance matching layer, the third surface being in contact with the second surface of the carrier and the first acoustic impedance matching layer having a thickness less than 1/4 of a wavelength of an ultrasonic wave emitted by the ultrasonic sensor at an operating frequency when the ultrasonic wave is in the first acoustic impedance matching layer; a second acoustically resistive matching layer in contact with the fourth surface of the first acoustically resistive matching layer; a first vibration damper covering the piezoelectric body and the first surface of the carrier, wherein a gap is formed between the first vibration damper and the piezoelectric body; and the second shock absorber body coats the first shock absorber body and the bearing body, wherein the first acoustic resistance matching layer and the second acoustic resistance matching layer are exposed out of the second shock absorber body.
Another object of the present invention is to provide an ultrasonic sensor, which includes: a barrel-shaped carrier having a barrel bottom and a barrel body, and having a first surface and a second surface opposite to each other across the barrel bottom of the barrel-shaped carrier, and an inner surface and an outer surface opposite to each other across the barrel body; a piezoelectric body; a first acoustic impedance matching layer having a third surface and a fourth surface opposite to each other with the first acoustic impedance matching layer interposed therebetween, the third surface being in contact with one surface of the piezoelectric body, the first acoustic impedance matching layer having a thickness smaller than 1/4 of a wavelength of an ultrasonic wave emitted from the ultrasonic sensor at an operating frequency in the first acoustic impedance matching layer; a second acoustic impedance matching layer having a fifth surface and a sixth surface opposite to each other with the second acoustic impedance matching layer interposed therebetween, the fifth surface being in contact with the fourth surface of the first acoustic impedance matching layer, and the sixth surface being in contact with the first surface of the barrel carrier; the first shock absorption body is arranged in the barrel of the barrel-shaped bearing body and covers the piezoelectric body, and a gap is formed between the first shock absorption body and the piezoelectric body; and the second damping body coats the first damping body and the barrel-shaped bearing body.
These and other objects of the present invention will become more apparent to the reader after reading the detailed description of the embodiments described in the following figures and drawings.
Drawings
FIG. 1 is a cross-sectional view of an embodiment of an ultrasonic sensor in an embodiment of the invention;
FIG. 2 is a cross-sectional view of another embodiment of an ultrasonic sensor in an embodiment of the invention;
FIG. 3 is a cross-sectional view of another embodiment of an ultrasonic sensor in an embodiment of the invention;
FIG. 4 is a cross-sectional view of another embodiment of an ultrasonic sensor in an embodiment of the invention;
FIG. 5 is a cross-sectional view of another embodiment of an ultrasonic sensor in an embodiment of the invention;
FIG. 6 is a cross-sectional view of another embodiment of an ultrasonic sensor in an embodiment of the invention;
fig. 7 is a cross-sectional view of another embodiment of an ultrasonic sensor in an embodiment of the invention.
Description of reference numerals:
100. 200, 300 ultrasonic sensor
102. 202, 302 carrier
102a, 202a, 302a first surface
102b, 202b, 302b second surface
104. 204, 304 piezoelectric body
104a groove
106. 306 lead wire
108. 208, 308 first acoustic impedance matching layer
108a, 208a, 308a, a third surface
108b, 208b, 308b fourth surface
109 mesh sheet
110. 210, 310 second acoustic impedance matching layer
111 particles
112. 212, 312 first damper
112a projection
113. 213, 313 voids
114. 214, 314 second damper
302c bottom of barrel
302d ladle body
310a fifth surface
310b sixth surface
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments.
In the following detailed description of the present invention, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific embodiments in which the embodiments may be practiced. Such embodiments will be described in sufficient detail to enable those skilled in the art to practice them. The dimensions of some of the elements in the figures may be exaggerated for clarity of illustration. It is to be understood that other embodiments may be utilized and structural, logical, and/or electrical changes may be made without departing from the scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the embodiments included therein are defined by the scope of the appended claims.
Referring first to fig. 1, a cross-sectional view of an embodiment of an ultrasonic sensor 100 according to the present invention is shown. In this embodiment, the ultrasonic sensor 100 includes a barrel-shaped carrier 102 having a first surface 102a and a second surface 102b opposite to each other with the carrier 102 therebetween. A piezoelectric body 104 attached to the first surface 102a of the carrier 102 and directly contacting with the first surface, a conductive layer of the piezoelectric body 104 can be connected with a lead 106 (or connected via the carrier 102 directly contacting with the lead), and an external high-frequency alternating current signal can be electrically connected to the piezoelectric body 104 to generate high-frequency vibration, thereby emitting ultrasonic waves. The piezoelectric body 104 may comprise a solid square, polygonal, or circular piezoelectric material, or a multi-layered ceramic piezoelectric material. The piezoelectric materials may include lead-containing piezoelectric materials such as lead zirconate titanate (pb (zrti) O3) and lead titanate (PbTiO3), or lead-free piezoelectric materials such as barium titanate (BaTiO3) and potassium sodium niobate ((NaK) NbO3), which have acoustic resistances of about 30-35MRayl, which is much greater than acoustic resistance 430Rayl of air, and therefore, an acoustic resistance matching layer is required to match the acoustic resistances of the two. The material of the carrier 102 may include, but is not limited to, metal or nonmetal, such as stainless steel, copper, iron, aluminum, nickel, silicon, glass, polyvinylidene fluoride (PVDF), Polytetrafluoroethylene (PTFE), polybutylene terephthalate (PBT), Acrylonitrile Butadiene Styrene (ABS), Nylon (Nylon), polyphenylene sulfide (PPS), Liquid Crystal Polymer (LCP), or Polyetheretherketone (PEEK).
With continued reference to fig. 1, a first acoustic impedance matching layer 108 having a third surface 108a and a fourth surface 108b opposite to each other across the first acoustic impedance matching layer 108, wherein the third surface 108a is attached to and in direct contact with the second surface 102b of the carrier. A second acoustically matched layer 110 is disposed on the fourth surface 108b of the first acoustically matched layer 108. In this embodiment, the material of the first acoustic impedance matching layer 108 may be an organic polymer material, or a composite material formed by mixing an organic polymer material and hollow or solid powder. For example, the organic polymer material includes Epoxy resin (Epoxy), vinyl ester resin (vinyl ester resin), ultraviolet curing glue (UV glue), polyurethane (polyurethane), or acrylic resin (acrylic resin). The hollow or solid powder may be hollow glass sphere particles or solid glass sphere particles, which are uniformly dispersed in the organic polymer material as a filler to adjust the overall density of the first acoustic impedance matching layer 108. In this embodiment, the thickness of the first acoustic impedance matching layer 108 is smaller than 1/4, which is the wavelength of the ultrasonic wave emitted by the piezoelectric body 104 at the operating frequency in the first acoustic impedance matching layer 108, so that the best ultrasonic transmission effect can be achieved.
With continued reference to fig. 1, as mentioned above, the second acoustic impedance matching layer 110 is tightly adhered to the carrier 102 by the first acoustic impedance matching layer 108, forming a dual-layered acoustic impedance matching layer structure. The advantage of the double acoustic impedance matching layer is that the bandwidth of the ultrasonic sensor can be significantly increased. In this embodiment, the material of the second acoustic impedance matching layer 110 may be an organic polymer material, or a composite material formed by mixing an organic polymer material with hollow or solid powder, where the organic polymer material includes a ringOxygen resins (epoxy), phenolic resins (phenolic resins), vinyl ester resins (vinyl ester resins), polyurethanes (polyurethanes), acrylic resins (acrylic resins) or cyanate ester resins (cyanatester resins). The hollow or solid powder may be hollow glass sphere particles or solid glass sphere particles, which are uniformly dispersed in the organic polymer material as a filler to adjust the overall density of the second acoustic impedance matching layer 110. The density of the hollow glass sphere particles is between 0.1g/cm3～0.6g/cm3(g/cc). Since the acoustic resistance is proportional to the density of the material, the lower the density of the second acoustic impedance matching layer 110 is, the lower the obtained acoustic resistance is, and therefore the more the acoustic impedance matching effect can be achieved. Glass ball particles with different volume ratios are added into the organic polymer material, and the mixture is mixed, defoamed, cured and the like to prepare the second acoustic impedance matching layer 110 with different densities.
With continued reference to fig. 1. In addition to the above components, the ultrasonic sensor 100 of the present invention may further include a shock absorbing structure. As shown in fig. 1, a first vibration-damping body 112 is disposed in the barrel of the barrel-shaped supporting body 102, and the first vibration-damping body 112 is disposed in the space between the barrel-shaped supporting body 102 and the piezoelectric body 104 and covers the first surface 102a of the barrel-shaped supporting body 102 and the piezoelectric body 104, so that under the high-frequency vibration during the operation of the piezoelectric body 104, the first vibration-damping body 112 can effectively damp vibration and reduce the aftershock (vibration) of the ultrasonic sensor. In the present embodiment, a gap 113 exists between the first damper 112 and the piezoelectric body 104. The existence of the gap 113 can make the first vibration absorber 112 and the piezoelectric body 104 not completely close, so that the design can provide a swing space when the piezoelectric body 104 vibrates, thereby achieving both vibration and vibration absorption effects and improving the reliability. In addition, a second shock absorber 114 can be disposed to cover the first shock absorber 112 and the barrel-shaped carrier 102, so as to provide a further shock absorbing effect. As shown in fig. 1, the second shock absorber 114 can cover the entire barrel-shaped carrier 102 including the side walls and the side wings, and the conductive surfaces of the first acoustic impedance matching layer 108 and the second acoustic impedance matching layer 110 are exposed from the second shock absorber 114. The second shock absorbing body 114 may also have an effect of fixing the wire 106. In the present embodiment, the damping coefficients of the first damping body 112 and the second damping body 114 may be different, and the hardness of the first damping body 112 and the hardness of the second damping body 114 may also be different. For example, the hardness of the first vibration-damping body 112 is less than or equal to the hardness of the second vibration-damping body 114, so that the two different types and arrangements of the vibration-damping bodies can more effectively enable the piezoelectric body 104 under the high-frequency vibration operation to return to the static state, thereby enabling the vibration-damping effect to be better and the operation of the ultrasonic sensor to be more convenient. The material of the first shock absorbing body 112 includes a porous Elastomer or a fibrous Elastomer, and may specifically include Silicone (Silicone), Rubber (Rubber), ethylene-vinyl acetate copolymer (EVA), styrene Elastomer (styrene Elastomer), Polyester Elastomer (Polyester Elastomer), Olefin Elastomer (Olefin Elastomer), thermoplastic vulcanizate (TPV), Thermoplastic Polyurethane (TPU), Epoxy resin (Epoxy), cork (wood cord), Polyester cotton, wool felt, glass fiber, or foam cotton. The material of the second shock absorber 114 includes Styrene Elastomer (Styrene Elastomer), Polyester Elastomer (Polyester Elastomer), Olefin Elastomer (Olefin Elastomer), thermoplastic vulcanizate (TPV), Thermoplastic Polyurethane (TPU), or Epoxy resin (Epoxy).
Referring next to fig. 2, a cross-sectional view of another embodiment of an ultrasonic sensor according to the present invention is shown. The embodiment of fig. 2 is substantially the same as the embodiment of fig. 1, and the difference is that a plurality of protrusions 112a are formed on the surface of the first damper 112 in the embodiment of fig. 2 to be in direct contact with the piezoelectric body 104. The protrusions 112a may be rib-shaped structures, which are used to prevent the first vibration absorbing body 112 from completely contacting the piezoelectric body 104 during the manufacturing process, so that no void 113 is formed. This design ensures contact between the piezoelectric body 104 and the first damper body 112, while preserving the design of the void 113.
Referring next to fig. 3, a cross-sectional view of another embodiment of an ultrasonic sensor according to the present invention is shown. In the embodiments of fig. 1 and 2, the piezoelectric body and the acoustic impedance matching layer are disposed on a carrier having a barrel-shaped profile, while in the present embodiment, the piezoelectric body and the acoustic impedance matching layer are disposed on a surface of a flat carrier. As shown in fig. 3, the ultrasonic sensor 200 includes a plate carrier 202 having a first surface 202a and a second surface 202b opposite to each other with the plate carrier 202 therebetween. A piezoelectric body 204 attached to and in direct contact with the first surface 202a of the plate carrier 202. A first acoustic impedance matching layer 208 having a third surface 208a and a fourth surface 208b opposite to each other across the first acoustic impedance matching layer 208, wherein the third surface 208a is attached to and in direct contact with the second surface 202b of the flat carrier 202. A second acoustically resistive matching layer 210 disposed on the fourth surface 208b of the first acoustically resistive matching layer 208. Likewise, the ultrasonic sensor 200 may also include a shock absorbing structure. A first damper 212 covers the piezoelectric body 204, and a gap exists between the first damper 212 and the piezoelectric body 204. The existence of the gap enables the first vibration absorbing body 212 and the piezoelectric body 204 not to be completely sealed, so as to provide a swing space for the piezoelectric body 204 to vibrate, achieve vibration and vibration absorbing effects, and improve reliability. In addition, a second shock absorber 214 may be disposed to cover the entire periphery of the first shock absorber 212 and the plate carrier 202. In the embodiment, the damping coefficients of the first damping body 212 and the second damping body 214 are different, so that the two different types and the arranged damping bodies can more effectively enable the piezoelectric body 204 under the high-frequency vibration operation to be rapidly restored to the static state, so that the damping effect is better and the reliability is better. Other detailed features of the ultrasonic sensor 200 are the same as those of the ultrasonic sensor 100 shown in fig. 1, and will not be described herein.
Next, refer to fig. 4, which is a schematic cross-sectional view of another embodiment of an ultrasonic sensor according to the present invention. The embodiment of fig. 4 is substantially the same as that of fig. 1, and the difference is that the mesh sheet (mesh sheet)109 with openings is included in the first acoustic impedance matching layer 108 of the embodiment of fig. 4, which has the function of precisely controlling the thickness of the first acoustic impedance matching layer 108 to obtain a good acoustic impedance matching effect. In actual manufacturing, the mesh sheet 109 is first placed on the surface intended to form the first acoustic impedance matching layer 108, such as the second surface 102b of the carrier 102. Then, the material of the first acoustic impedance matching layer 108 is uniformly coated on the mesh sheet 109 and the second surface 102b of the carrier 102, so that the material and the mesh sheet 109 together constitute the first acoustic impedance matching layer 108. The material of the mesh sheet 109 includes a metal material selected from the following group or a combination thereof: copper, iron, nickel, stainless steel, aluminum, or titanium, or a non-metallic material from the group: teflon (PTFE), polyethylene terephthalate (PET), Nylon (Nylon), carbon fiber (carbon fiber), or glass fiber (glass fiber).
With the mesh sheet 109, when the second acoustic impedance matching layer 110 is laminated on the material of the first acoustic impedance matching layer 108 in the subsequent manufacturing process, the material of the first acoustic impedance matching layer 108 can be used as an adhesive to tightly adhere the second acoustic impedance matching layer 110 to the carrier 102, and the mesh sheet 109 inside the first acoustic impedance matching layer can play a supporting role, so that the thickness of the laminated first acoustic impedance matching layer 108 can be equal to the thickness of the mesh sheet 109, thereby achieving the effect of controlling the thickness of the acoustic impedance matching layer. In this embodiment, the thickness of the first acoustic impedance matching layer 108, i.e., the thickness of the mesh sheet 109, needs to be smaller than 1/4, which is the wavelength of the ultrasonic wave emitted by the piezoelectric body 104 at the operating frequency in the first acoustic impedance matching layer 108, so that the best ultrasonic transmission effect can be achieved.
Reference is now made to fig. 5, which is a schematic cross-sectional view of an ultrasonic sensor according to another embodiment of the present invention. The embodiment of fig. 5 is substantially the same as that of fig. 1, except that the particles 111 are contained in the first acoustic impedance matching layer 108 of the embodiment of fig. 5, which functions as the mesh-shaped sheet 109 of fig. 4, and the thickness of the first acoustic impedance matching layer 108 can be precisely controlled to obtain a good acoustic impedance matching effect. In actual manufacturing, the particles 111 are mixed with the first acoustic impedance matching layer 108. Then, the mixed material of the first acoustic resistance matching layer 108 and the particles 111 is uniformly coated on the second surface 102b of the carrier 102, so that the material and the particles 111 together constitute the first acoustic resistance matching layer 108. The particles 111 may be made of inorganic or organic materials, and may be spheres with fixed size, such as hollow or solid glass spheres, ceramic spheres, or plastic spheres.
Reference is next made to fig. 6, which is a schematic cross-sectional view of another implementation of an ultrasonic sensor according to an embodiment of the invention. The embodiment of fig. 6 is substantially the same as the embodiment of fig. 1, with the difference that the piezoelectric body 104 of the embodiment of fig. 6 has grooves 104 a. The long axis direction of the groove 104a is perpendicular to the two opposing surfaces of the piezoelectric body 104. Forming such grooves 104a on the piezoelectric body 104 helps to reduce the overall acoustic resistance of the piezoelectric body.
Finally, fig. 7 is a schematic cross-sectional view of an ultrasonic sensor according to another embodiment of the present invention. The embodiment shown in fig. 1 is a basic aspect of the ultrasonic sensor of the present invention, and the piezoelectric body and the acoustic resistance matching layer are respectively disposed inside and outside the barrel of the barrel-shaped supporting body 102, or respectively disposed on both sides of the flat supporting body 202. The basic structure of the ultrasonic sensor in the embodiment of fig. 7 is the same as that of the embodiment shown in fig. 1, but the difference is that the piezoelectric body and the acoustic impedance matching layer are both disposed in the barrel of the barrel-shaped carrier.
As shown in fig. 7, the ultrasonic sensor 300 includes a barrel-shaped carrier 302 having a barrel bottom 302c and a barrel body 302d, and having a first surface 302a and a second surface 302b opposite to each other across the barrel bottom, and a piezoelectric body 304. A first acoustic impedance matching layer 308 having a third surface 308a and a fourth surface 308b opposite to each other with the first acoustic impedance matching layer 308 therebetween, wherein the third surface 308a is attached to and directly contacted with one surface of the piezoelectric body 304, and conductive wires 306 can be connected to conductive layers on the front and back sides of the piezoelectric body 304 to electrically connect an external high-frequency alternating current signal to the piezoelectric body 304, so as to generate high-frequency vibration, thereby emitting ultrasonic waves. In the present embodiment, the thickness of the first acoustic impedance matching layer 308 is smaller than 1/4 of the wavelength of the ultrasonic wave generated by the piezoelectric body 304 at the operating frequency in the first acoustic impedance matching layer 308, so that the best ultrasonic transmission effect can be achieved.
With continued reference to fig. 7, a second acoustic impedance matching layer 310 has a fifth surface 310a and a sixth surface 310b opposite to each other across the second acoustic impedance matching layer 310, wherein the fifth surface 310a is attached to and directly contacts the fourth surface 308b of the first acoustic impedance matching layer 308, and the sixth surface 310b is attached to the first surface 302a of the barrel carrier 302. The ultrasonic sensor 300 also has a shock-absorbing structure. As shown in fig. 7, a first vibration absorbing body 312 is disposed in the barrel of the barrel-shaped supporting body 302, and the vibration absorbing body 312 is disposed in the space between the barrel-shaped supporting body 302 and the piezoelectric body 304 and covers the piezoelectric body 304, so that under the high-frequency vibration during the operation of the piezoelectric body 304, the vibration absorbing body 312 can effectively absorb the vibration and reduce the aftershock (vibration) of the ultrasonic sensor. Similarly, a gap 313 exists between the first damper 312 and the piezoelectric body 304. The existence of the gap 313 enables the first vibration absorbing body 312 and the piezoelectric body 304 not to be completely sealed, thereby providing a swing space when the piezoelectric body 304 vibrates, and improving the reliability of the piezoelectric body while simultaneously achieving the vibration and vibration absorbing effects. In addition, a second shock absorbing body 314 may be disposed to cover the entire periphery of the first shock absorbing body 312 and the barrel-shaped carrier 302. In the present embodiment, the damping coefficients of the first and second damping bodies 312 and 314 may be different, and the hardness of the first and second damping bodies 312 and 314 may also be different. For example, the hardness of the first vibration-damping body 312 is less than or equal to the hardness of the second vibration-damping body 314, so that the two different types and arrangements of the vibration-damping bodies can more effectively enable the piezoelectric body 304 under the high-frequency vibration operation to return to the static state, and the vibration-damping effect and the reliability are better. Other detailed features of the ultrasonic sensor 300 are the same as those of the ultrasonic sensor 100 shown in fig. 1, and will not be described herein.
Unlike the embodiment shown in fig. 1, the acoustic impedance matching layers 308 and 310 in the embodiment of fig. 7 are disposed in the barrel of the barrel-shaped carrier 302 together with the piezoelectric body 304, which is more suitable for the environment more severe than the design of fig. 1, and can effectively protect the acoustic impedance matching layers from being damaged.
According to the utility model discloses ultrasonic sensor of aforementioned each embodiment forms the space and can improve the performance of original sensor and compromise the reliability between piezoelectricity and shock absorber. Moreover, the mutual combination effect of the double shock absorbers designed by different parameters can further improve the shock absorption effect.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the technical field of the utility model belongs to the prerequisite of not deviating from the utility model discloses, can also make a plurality of equal substitution or obvious variants, performance or usage are the same moreover, all should regard as belonging to the utility model's scope of protection.
Claims (18)
1. An ultrasonic sensor, comprising:
the bearing body is provided with a first surface and a second surface which are opposite to each other by separating the bearing body;
a piezoelectric body in contact with the first surface of the carrier;
a first acoustic impedance matching layer having a third surface and a fourth surface opposite to each other across the first acoustic impedance matching layer, the third surface being in contact with the second surface of the carrier and the first acoustic impedance matching layer having a thickness less than 1/4 of a wavelength of an ultrasonic wave emitted by the ultrasonic sensor at an operating frequency when the ultrasonic wave is in the first acoustic impedance matching layer;
a second acoustically resistive matching layer in contact with the fourth surface of the first acoustically resistive matching layer;
a first vibration damper covering the piezoelectric body and the first surface of the carrier, wherein a gap is formed between the first vibration damper and the piezoelectric body; and the number of the first and second groups,
and the second shock absorber body wraps the first shock absorber body and the bearing body, wherein the first acoustic resistance matching layer and the second acoustic resistance matching layer are exposed out of the second shock absorber body.
2. The ultrasonic sensor of claim 1, wherein the first damper has a hardness less than or equal to a hardness of the second damper.
3. The ultrasonic sensor according to claim 1, wherein the first damper has a plurality of protrusions in contact with the piezoelectric body.
4. The ultrasonic sensor of claim 3, wherein the plurality of protrusions are rib structures.
5. The ultrasonic sensor of claim 1, wherein the material of the first vibration damper comprises a porous elastomer or a fibrous elastomer, including silicone, ethylene-vinyl acetate copolymer, styrene elastomer, polyester elastomer, olefin elastomer, thermoplastic vulcanizate, thermoplastic polyurethane, epoxy resin, cork, polyester cotton, wool felt, fiberglass, or foam cotton.
6. The ultrasonic sensor of claim 1, wherein the material of the second damper comprises a styrene elastomer, a polyester elastomer, an olefin elastomer, a thermoplastic vulcanizate, a thermoplastic polyurethane, or an epoxy resin.
7. The ultrasonic sensor of claim 1, wherein the carrier is a barrel-shaped carrier, the piezoelectric body is disposed within a barrel of the barrel-shaped carrier, and the first acoustic impedance matching layer and the second acoustic impedance matching layer are disposed outside the barrel of the barrel-shaped carrier.
8. The ultrasonic sensor of claim 1, wherein the carrier is a flat carrier.
9. The ultrasonic transducer of claim 1, wherein the material of the carrier comprises a metal or a non-metal, comprising stainless steel, copper, iron, aluminum, nickel, silicon, glass, polyvinylidene fluoride, polytetrafluoroethylene, polybutylene terephthalate, acrylonitrile-butadiene-styrene copolymer, nylon, polyphenylene sulfide, liquid crystal polymer, or polyetheretherketone.
10. The ultrasonic transducer of claim 1, further comprising a mesh sheet or particle on the first acoustic impedance matching layer for controlling the thickness of the first acoustic impedance matching layer.
11. The ultrasonic sensor according to claim 1, wherein the piezoelectric body comprises a piezoelectric material of a solid square, polygonal or circular shape, or a multilayer ceramic piezoelectric material, or a piezoelectric material having grooves.
12. An ultrasonic sensor, comprising:
a barrel-shaped carrier having a barrel bottom and a barrel body, and having a first surface and a second surface opposite to each other across the barrel bottom of the barrel-shaped carrier, and an inner surface and an outer surface opposite to each other across the barrel body;
a piezoelectric body;
a first acoustic impedance matching layer having a third surface and a fourth surface opposite to each other with the first acoustic impedance matching layer interposed therebetween, the third surface being in contact with one surface of the piezoelectric body, the first acoustic impedance matching layer having a thickness smaller than 1/4 of a wavelength of an ultrasonic wave emitted from the ultrasonic sensor at an operating frequency in the first acoustic impedance matching layer;
a second acoustic impedance matching layer having a fifth surface and a sixth surface opposite to each other with the second acoustic impedance matching layer interposed therebetween, the fifth surface being in contact with the fourth surface of the first acoustic impedance matching layer, and the sixth surface being in contact with the first surface of the barrel carrier;
the first shock absorption body is arranged in the barrel of the barrel-shaped bearing body and covers the piezoelectric body, and a gap is formed between the first shock absorption body and the piezoelectric body; and the number of the first and second groups,
and the second shock absorption body coats the first shock absorption body and the barrel-shaped bearing body.
13. The ultrasonic sensor of claim 12, wherein the first damper has a stiffness less than or equal to a stiffness of the second damper.
14. The ultrasonic sensor according to claim 12, wherein the first damper has a plurality of protrusions which are in contact with the piezoelectric body.
15. The ultrasonic sensor according to claim 12, wherein a contact surface of the first damper body with the piezoelectric body has a protruding rib structure.
16. The ultrasonic sensor of claim 12, wherein the material of the first vibration damper comprises a porous elastomer or a fibrous elastomer, including silicone, ethylene/vinyl acetate copolymer, styrene elastomer, polyester elastomer, olefin elastomer, thermoplastic vulcanizate, thermoplastic polyurethane, epoxy resin, cork, polyester cotton, wool felt, fiberglass, or foam cotton.
17. The ultrasonic sensor of claim 12, wherein the material of the second damper comprises a styrene elastomer, a polyester elastomer, an olefin elastomer, a thermoplastic vulcanizate, a thermoplastic polyurethane, or an epoxy resin.
18. The ultrasonic transducer of claim 12, wherein the material of the carrier comprises a metal or a non-metal, comprising stainless steel, copper, iron, aluminum, nickel, silicon, glass, polyvinylidene fluoride, polytetrafluoroethylene, polybutylene terephthalate, acrylonitrile-butadiene-styrene copolymer, nylon, polyphenylene sulfide, liquid crystal polymer, or polyetheretherketone.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921847829.XU CN211563576U (en) | 2019-10-30 | 2019-10-30 | Ultrasonic sensor |
| TW109212151U TWM606176U (en) | 2019-10-30 | 2020-09-16 | Ultrasonic transducer |
| JP2020004634U JP3231102U (en) | 2019-10-30 | 2020-10-27 | Ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921847829.XU CN211563576U (en) | 2019-10-30 | 2019-10-30 | Ultrasonic sensor |
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|---|---|
| CN211563576U true CN211563576U (en) | 2020-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921847829.XU Active CN211563576U (en) | 2019-10-30 | 2019-10-30 | Ultrasonic sensor |
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| Country | Link |
|---|---|
| JP (1) | JP3231102U (en) |
| CN (1) | CN211563576U (en) |
| TW (1) | TWM606176U (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI816239B (en) * | 2021-11-26 | 2023-09-21 | 詠業科技股份有限公司 | Ultrasonic transducer |
| CN114101019B (en) * | 2022-01-26 | 2022-04-26 | 青岛鼎信通讯股份有限公司 | Ultrasonic transducer applied to water meter |
-
2019
- 2019-10-30 CN CN201921847829.XU patent/CN211563576U/en active Active
-
2020
- 2020-09-16 TW TW109212151U patent/TWM606176U/en unknown
- 2020-10-27 JP JP2020004634U patent/JP3231102U/en active Active
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| Publication number | Publication date |
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| JP3231102U (en) | 2021-03-11 |
| TWM606176U (en) | 2021-01-01 |
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