CN211557633U - Flexible composite circuit board - Google Patents
Flexible composite circuit board Download PDFInfo
- Publication number
- CN211557633U CN211557633U CN201921967063.9U CN201921967063U CN211557633U CN 211557633 U CN211557633 U CN 211557633U CN 201921967063 U CN201921967063 U CN 201921967063U CN 211557633 U CN211557633 U CN 211557633U
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- copper foil
- foil layer
- power supply
- layer
- circuit board
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Abstract
The utility model discloses a flexible composite circuit board, which comprises a substrate layer and a copper foil layer A, wherein the copper foil layer A is arranged on the top of the substrate layer, the bottom of the substrate layer is provided with a copper foil layer B, the copper foil layer A and the copper foil layer B are respectively and horizontally arranged on two sides of the substrate layer, terminals are respectively arranged at two ends of the copper foil layer A and the copper foil layer B, one side of the substrate layer is provided with a ground wire hole and a power supply hole, the ground wire hole is vertically arranged at the edge position of one side of the substrate layer, the power supply hole is vertically arranged at one side of the ground wire hole, and the ground wire hole and the power supply hole are embedded with connection pads, the surfaces of the copper foil layer A and the copper foil layer B are horizontally provided with covering film layers, and the bottom of each covering film layer is provided with a bonding layer, so that the flexible retro circuit board has the advantages of double-sided current transmission, effective reduction of the line width of the flexible retro circuit board, further reduction of the size of the flexible retro circuit board, increase of the sectional area of the circuit, reduction of the heat productivity and temperature reduction, free bending and winding and the like.
Description
Technical Field
The utility model relates to a circuit board technical field specifically says a flexible composite line way board.
Background
The Flexible Printed Circuit Board (Flexible Printed Circuit Board) is called as a 'Flexible Board' for short, is commonly called as FPC in the industry, is a Printed Circuit Board made of Flexible insulating base materials, has the advantages that a plurality of rigid Printed Circuit boards do not have, can be freely bent, wound and folded, can greatly reduce the volume of electronic products by utilizing the FPC, and is suitable for the development of the electronic products in the directions of high density, miniaturization and high reliability.
However, analysis shows that the existing flexible circuit board has the disadvantages of small allowable overcurrent, large line width of the circuit board, large size of the flexible circuit board and high working temperature.
SUMMERY OF THE UTILITY MODEL
Therefore, in order to solve the above-mentioned not enough, the utility model provides a flexible composite line board herein has two-sided transmission current, and the line width of effectual reduction flexible ancient ways board further reduces its size, and the sectional area of increase circuit reduces calorific capacity and reduces operating temperature, can freely bend, advantage such as convolute.
The utility model discloses a realize like this, construct a flexible composite circuit board, including substrate layer and copper foil layer A, the substrate layer top is equipped with copper foil layer A, and the substrate layer bottom is equipped with copper foil layer B, copper foil layer A, copper foil layer B is the both sides that the level set up at the substrate layer respectively, copper foil layer A, copper foil layer B both ends all are equipped with the terminal, substrate layer one side is equipped with ground line hole and power hole, ground line hole is seted up perpendicularly at substrate layer one side edge position, the power hole is and sets up perpendicularly in ground line hole one side, and ground line hole, the inside all embedding of power hole is equipped with the connection gasket, copper foil layer A, copper foil layer B surface all is the level and is equipped with the covering film layer, covering film layer bottom is equipped with the tie coat, the tie coat is the level setting and is in covering film layer.
Further, copper foil layer A is inside to be formed with conducting wire A, power supply line A and ground connection circuit A, conducting wire A passes through electric connection with power supply line A, copper foil layer B is inside to be formed with conducting wire B, power supply line B and ground connection circuit B, conducting wire B and power supply line B pass through electric connection, realize two-sided transmission current through the circuit that sets up inside copper foil layer A and copper foil layer B, can effectually reduce the width of each circuit, thereby reduce the board width of flexible line board and then reduce the circuit board size.
Furthermore, the top of the connecting pad is tightly attached to the power supply circuit A and the grounding circuit A, the bottom of the connecting pad is tightly attached to the power supply circuit B and the grounding circuit B, bidirectional current transmission is achieved through connection of the connecting pad with the power supply circuit B and the grounding circuit B, meanwhile, single-side circuit faults can be effectively avoided, and therefore the sectional area of the lead is increased, the heat productivity is reduced, and the working temperature of the flexible composite circuit board is effectively reduced.
Furthermore, the terminals are respectively connected with the power supply circuit A and the power supply circuit B, at least one ground wire hole is arranged, at least two power supply holes are arranged, and the ground wire holes can be connected with an external circuit through the terminals.
Furthermore, the material of the substrate layer 1 is made of one of polyimide, polyethylene terephthalate and polyethylene naphthalate, and the circuit board made of the flexible insulating material can be freely bent and wound, so that the flexible insulating material is suitable for high-density and small-sized electronic products.
The utility model has the advantages of two-sided transmission current, the line width of the flexible ancient ways board of effectual reduction further reduces its size, and the sectional area of increase circuit reduces calorific capacity and reduces operating temperature, can freely bend, convolute, and concrete advantage embodies:
the method has the advantages that: copper foil layer A is inside to be formed with conducting wire A, power supply line A and ground connection circuit A, conducting wire A passes through electric connection with power supply line A, copper foil layer B is inside to be formed with conducting wire B, power supply line B and ground connection circuit B, conducting wire B and power supply line B pass through electric connection, realize two-sided transmission current through the circuit that sets up inside copper foil layer A and copper foil layer B, can effectually reduce the width of each circuit, thereby reduce the board width of flexible line board and then reduce the circuit board size.
The method has the advantages that: the top of the connecting pad is tightly attached to the power supply line A and the grounding line A, the bottom of the connecting pad is tightly attached to the power supply line B and the grounding line B, bidirectional current transmission is achieved through connection of the connecting pad with the power supply line B and the grounding line B, single-side circuit faults can be effectively avoided, the sectional area of the lead is increased, heat productivity is reduced, and the working temperature of the flexible composite circuit board is effectively reduced.
The method has the advantages that: the material of substrate layer 1 adopts one of polyimide, polyethylene terephthalate, polyethylene naphthalate to make, and the circuit board of making through flexible insulating material can freely be crooked, convoluteed, is applicable to high density, miniaturized electronic product.
Drawings
Fig. 1 is a side sectional view of the substrate layer of the flexible composite circuit board of the present invention;
fig. 2 is a side sectional view of the flexible composite circuit board of the present invention;
fig. 3 is a schematic cross-sectional view of fig. 2 according to the present invention;
the figure illustrates the format: 1. a substrate layer; 2. a copper foil layer A; 21. a conductive circuit A; 22. a power supply line A; 23. a ground line A; 3. a copper foil layer B; 31. a conductive line B; 32. a power supply line B; 33. a ground line B; 4. a ground wire hole; 5. a power supply hole; 6. covering the film layer; 7. a connecting pad; 8. a bonding layer; 9. and a terminal.
Detailed Description
The present invention will be described in detail below with reference to the attached drawings, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention; furthermore, the terms "first," "second," "third," "upper, lower, left, right," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Meanwhile, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model provides a flexible composite circuit board through improvement, as shown in the attached drawing of the specification, the flexible composite circuit board can be implemented as follows; including substrate layer 1 and copper foil layer A2, 1 top of substrate layer is equipped with copper foil layer A2, and 1 bottom of substrate layer is equipped with copper foil layer B3, copper foil layer A2, copper foil layer B3 is the level setting respectively in the both sides of substrate layer 1, copper foil layer A2, copper foil layer B3 both ends all are equipped with terminal 9, 1 one side of substrate layer is equipped with ground wire hole 4 and power supply hole 5, ground wire hole 4 is and sets up perpendicularly at 1 side edge position of substrate layer, power supply hole 5 is and sets up perpendicularly in ground wire hole 4 one side, and ground wire hole 4, the inside all embedding of power supply hole 5 is equipped with connection pad 7, copper foil layer A2, copper foil layer B3 surface all is the level and is equipped with cover rete 6, 6 bottoms in cover rete are equipped with tie coat 8, tie coat 8 is the level setting in 6 bottoms in cover rete, tie.
As shown in fig. 1 and 2, a conductive circuit a21, a power supply circuit a22 and a ground circuit a23 are formed inside the copper foil layer a2, the conductive circuit a21 is electrically connected with the power supply circuit a22, a conductive circuit B31 is formed inside the copper foil layer B3, the power supply circuit B32 and the ground circuit B33 are formed inside the copper foil layer B3, the conductive circuit B31 and the power supply circuit B32 are electrically connected, double-sided current transmission is realized through circuits arranged inside the copper foil layer a2 and the copper foil layer B3, the width of each circuit can be effectively reduced, and therefore the board width of the flexible circuit board is reduced, and the size of the circuit board is reduced.
As shown in fig. 2, the top of the connecting pad 7 is closely attached to the power line a22 and the ground line a23, and the bottom of the connecting pad 7 is closely attached to the power line B32 and the ground line B33, so that double-sided current transmission is realized by the connection of the connecting pad 7 to the power line B32 and the ground line B33, and meanwhile, single-side circuit faults can be effectively avoided, thereby increasing the cross-sectional area of the circuit, reducing the heat generation amount, and effectively reducing the working temperature of the flexible composite circuit board.
As shown in fig. 3, the terminals 9 are connected to the power supply line a22 and the power supply line B32, respectively, at least one ground hole 4 is provided, and at least two power holes 5 are provided, and the external lines can be connected through the terminals 9.
As shown in fig. 1, the material of the substrate layer 1 is made of one of polyimide, polyethylene terephthalate, and polyethylene naphthalate, and the circuit board made of flexible insulating material can be freely bent and wound, and is suitable for high-density and small-sized electronic products.
The working principle of the flexible composite circuit board is as follows: the connecting pad 7 is connected with the circuits inside the copper foil layer A2 and the copper foil layer B3 to realize the double-sided simultaneous transmission of current, the sectional area of the circuit can be effectively increased, the heat productivity is effectively reduced, the line width is reduced, the size of the flexible composite circuit board is reduced, the grounding protection work is finished through the grounding wire holes 4, the circuit board made of flexible insulating materials (such as polyimide, polyethylene terephthalate and polyethylene naphthalate) can be freely bent and wound, the flexible composite circuit board is suitable for high-density and small-sized electronic products, and the bonding and fixing of the flexible composite circuit board are facilitated through the arranged bonding layer 8.
In summary, the following steps: flexible composite circuit board compares with current circuit board, has two-sided transmission current, and the linewidth of the flexible ancient ways board of effectual reduction further reduces its size, and the sectional area of increase circuit reduces, gives out heat and reduces operating temperature, can freely bend, advantage such as convolute.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (4)
1. The utility model provides a flexible composite circuit board, includes substrate layer (1) and copper foil layer A (2), its characterized in that: the top of the substrate layer (1) is provided with a copper foil layer A (2), the bottom of the substrate layer (1) is provided with a copper foil layer B (3), the copper foil layer A (2) and the copper foil layer B (3) are respectively horizontally arranged on two sides of the substrate layer (1), terminals (9) are arranged at two ends of the copper foil layer A (2) and the copper foil layer B (3), one side of the substrate layer (1) is provided with a ground wire hole (4) and a power supply hole (5), the ground wire hole (4) is vertically arranged at the edge position of one side of the substrate layer (1), the power supply hole (5) is vertically arranged at one side of the ground wire hole (4), a connecting pad (7) is embedded into the ground wire hole (4) and the power supply hole (5), the surfaces of the copper foil layer A (2) and the copper foil layer B (3) are both horizontally provided with a covering film layer (6), and the bottom of the covering, the bonding layer (8) is horizontally arranged at the bottom of the covering film layer (6).
2. The flexible composite wiring board of claim 1, wherein: copper foil layer A (2) inside is formed with conducting wire A (21), power supply line A (22) and ground connection circuit A (23), conducting wire A (21) and power supply line A (22) are through electric connection, copper foil layer B (3) inside is formed with conducting wire B (31), power supply line B (32) and ground connection circuit B (33), conducting wire B (31) and power supply line B (32) are through electric connection.
3. The flexible composite wiring board of claim 1, wherein: the top of the connecting pad (7) is tightly attached to a power supply line A (22) and a grounding line A (23), and the bottom of the connecting pad (7) is tightly attached to a power supply line B (32) and a grounding line B (33).
4. The flexible composite wiring board of claim 1, wherein: the terminal (9) is respectively connected with a power supply circuit A (22) and a power supply circuit B (32), at least one ground wire hole (4) is formed, and at least two power supply holes (5) are formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921967063.9U CN211557633U (en) | 2019-11-14 | 2019-11-14 | Flexible composite circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921967063.9U CN211557633U (en) | 2019-11-14 | 2019-11-14 | Flexible composite circuit board |
Publications (1)
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CN211557633U true CN211557633U (en) | 2020-09-22 |
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Family Applications (1)
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CN201921967063.9U Expired - Fee Related CN211557633U (en) | 2019-11-14 | 2019-11-14 | Flexible composite circuit board |
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CN (1) | CN211557633U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023095386A1 (en) * | 2021-11-29 | 2023-06-01 | 日立Astemo株式会社 | Electronic device |
-
2019
- 2019-11-14 CN CN201921967063.9U patent/CN211557633U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023095386A1 (en) * | 2021-11-29 | 2023-06-01 | 日立Astemo株式会社 | Electronic device |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200922 Termination date: 20211114 |
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CF01 | Termination of patent right due to non-payment of annual fee |