CN211556418U - Semiconductor laser packaging structure with adjustable light emitting point height - Google Patents
Semiconductor laser packaging structure with adjustable light emitting point height Download PDFInfo
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- CN211556418U CN211556418U CN202020285182.2U CN202020285182U CN211556418U CN 211556418 U CN211556418 U CN 211556418U CN 202020285182 U CN202020285182 U CN 202020285182U CN 211556418 U CN211556418 U CN 211556418U
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Abstract
The utility model discloses a semiconductor laser packaging structure with adjustable luminous point height, which comprises a packaging body, wherein the bottom surface of a base is uniformly provided with an adjusting groove, the adjusting groove is internally provided with an adjusting post, the bottom surface of the adjusting post is welded with a stopper, the bottom surface of the base is provided with a rotating groove near the adjusting groove, one end of the rotating groove is provided with a clamping groove, the inside of the rotating groove is slidably connected with a movable rod, the outside of the stopper is sleeved with a limiting cylinder, the top surface of the movable rod is welded on the bottom surface of the limiting cylinder, the inside of the limiting cylinder is bonded with a rubber cylinder, when the height of the luminous point needs to be adjusted, a worker rotates the limiting cylinder to enable the movable rod to rotate from the clamping groove to the rotating groove, the worker presses the stopper downwards, because the rubber plate has certain elasticity, the rubber plate is compressed at, the efficiency of regulation is improved to improve staff's work efficiency.
Description
Technical Field
The utility model relates to a semiconductor laser technical field specifically is a luminous point height-adjustable's semiconductor laser packaging structure.
Background
Semiconductor lasers, also known as laser diodes, are lasers using semiconductor materials as working substances, and the specific processes for generating laser light of different types are special due to the difference in substance structures. The common working substances include gallium arsenide, cadmium sulfide, indium phosphide, zinc sulfide and the like, the excitation mode includes three modes of electric injection, electron beam excitation and optical pumping, and the semiconductor laser needs to be packaged before being used.
The 'semiconductor laser packaging structure with the height-adjustable light emitting point' mentioned in the application number 201720816672.9 can realize that the height of the light emitting point of a horizontal array semiconductor laser can be adjusted, the consistency and the uniformity of the height of light spots are realized, and the guarantee is provided for further obtaining various high-quality light spots.
SUMMERY OF THE UTILITY MODEL
The utility model provides a luminous point height-adjustable's semiconductor laser packaging structure can effectively solve and provide in the above-mentioned background art but when adjusting through the screw rod, needs the staff to use specific instrument to go to rotate the screw rod, when needs adjust great distance simultaneously, needs slow rotation screw rod, reduces the speed of adjusting to staff's work efficiency's problem has been reduced.
In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor laser packaging structure with an adjustable light emitting point height comprises a packaging machine body, wherein a rubber plate is bonded on the bottom surface of the packaging machine body, and a base is installed on the bottom surface of the rubber plate through a screw;
an adjusting assembly is arranged in the base and comprises an adjusting groove, an adjusting column, a limiting block, a rotating groove, a clamping groove, a movable rod, a limiting barrel and a rubber barrel;
the utility model discloses a spacing section of thick bamboo, including base, adjustment tank, regulation post, stopper, base bottom surface, adjusting groove internally mounted has the regulation post, it has the stopper to adjust the welding of post bottom surface, the base bottom surface is close to adjustment tank department and has seted up the rotation groove, it has seted up the draw-in groove to rotate groove one end, it has the movable rod to rotate inslot sliding connection, spacing section of thick bamboo has been cup jointed in the stopper outside, the movable rod top surface welds in spacing section of thick bamboo bottom surface, the inside.
Preferably, the cross section of the limiting block is square, the rubber block is bonded to the bottom surface of the limiting block, and the cross section of the rubber block is the same as the cross section of the limiting block in shape.
Preferably, the diameter of the adjusting groove is equal to that of the adjusting column, and the top surface of the adjusting column is in contact with the bottom surface of the rubber plate.
Preferably, the shape of the cross section of the inner part of the limiting cylinder is the same as that of the cross section of the limiting block, and the length of the inner part of the limiting cylinder is greater than that of the limiting block.
Preferably, the inner diameter of the clamping groove is equal to the outer diameter of the movable rod, and the shape of the longitudinal section of the clamping groove is the same as that of the longitudinal section of the movable rod.
Preferably, the base bottom surface is evenly welded with a thread cylinder, a screw rod is installed inside the thread cylinder through threads, a support plate is installed on the bottom surface of the screw rod through a screw, and a lug is evenly welded on the bottom surface of the support plate.
Preferably, the silver colloid is installed to encapsulation organism top one side, the backstop is installed to silver colloid one side, the louvre has evenly been seted up to silver colloid one side, the mounting hole has been seted up to backstop department of corresponding louvre, mounting hole internally mounted has the exhaust fan, the input and the external power supply output electric connection of exhaust fan.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model has the advantages of being scientific and reasonable in structure, convenience safe in utilization:
1. be provided with adjusting part, when needing to adjust the height of luminous point, the staff rotated spacing section of thick bamboo this moment for the movable rod rotates to rotating the groove in from the draw-in groove, and the staff pushes down the stopper this moment, because the rubber slab has certain elasticity, the rubber slab compression of this moment drives the encapsulation organism and removes, adjusts semiconductor laser's height, does not need the staff to rotate the screw rod, improves the efficiency of adjusting, thereby improves staff's work efficiency.
2. When placing the base on work platform, the staff can drive the screw rod to rotate in a screw thread section of thick bamboo through rotating the backup pad this moment to adjust the height that the backup pad supported, make the base bottom surface keep the level, make things convenient for the staff to adjust the height of luminous point.
3. When semiconductor laser moves, the staff opens the exhaust fan this moment, because the elargol has better heat conductivity to make the produced heat of semiconductor laser move derive through the elargol, then discharge from the encapsulation organism through the exhaust fan, life-span that can effectual extension semiconductor laser improves the device's practicality simultaneously.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
In the drawings:
fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic view of the base mounting structure of the present invention;
FIG. 3 is a schematic view of the adjusting post mounting structure of the present invention;
FIG. 4 is a schematic view of the installation structure of the limiting cylinder of the present invention;
fig. 5 is a schematic view of the bump mounting structure of the present invention;
FIG. 6 is a schematic view of the installation structure of the exhaust fan of the present invention;
reference numbers in the figures: 1. packaging the machine body; 2. a rubber plate; 3. a base;
4. an adjustment assembly; 401. an adjustment groove; 402. an adjustment column; 403. a limiting block; 404. a rotating groove; 405. a card slot; 406. a movable rod; 407. a limiting cylinder; 408. a rubber cylinder;
5. a threaded barrel; 6. a screw; 7. a support plate; 8. a bump; 9. silver glue; 10. a rear stop block; 11. heat dissipation holes; 12. mounting holes; 13. an exhaust fan.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Example (b): as shown in fig. 1-6, the present invention provides a technical solution, a semiconductor laser package structure with adjustable light emitting point height, comprising a package body 1, a rubber plate 2 bonded to the bottom surface of the package body 1, and a base 3 mounted on the bottom surface of the rubber plate 2 through screws;
an adjusting component 4 is arranged in the base 3, and the adjusting component 4 comprises an adjusting groove 401, an adjusting column 402, a limiting block 403, a rotating groove 404, a clamping groove 405, a movable rod 406, a limiting cylinder 407 and a rubber cylinder 408;
the bottom surface of the base 3 is uniformly provided with an adjusting groove 401, an adjusting column 402 is arranged in the adjusting groove 401, the diameter of the adjusting groove 401 is equal to that of the adjusting column 402, the top surface of the adjusting column 402 is in contact with the bottom surface of the rubber plate 2, the adjusting column 402 is convenient to move in the adjusting groove 401, the adjusting column 402 is convenient to push the rubber plate 2, the bottom surface of the adjusting column 402 is welded with a limiting block 403, the cross section of the limiting block 403 is square, the bottom surface of the limiting block 403 is bonded with a rubber block, the cross section of the rubber block is the same as that of the limiting block 403, the limiting block 403 is convenient to fix and convenient for a worker to move the limiting block 403, the bottom surface of the base 3, which is close to the adjusting groove 401, is provided with a rotating groove 404, one end of the rotating groove 404 is provided with a clamping groove 405, a movable rod 406 is slidably connected in the rotating groove 404, the, the convenience is gone into draw-in groove 405 with movable rod 406 card to it is fixed with a spacing section of thick bamboo 407, spacing section of thick bamboo 407 has been cup jointed in the stopper 403 outside, the shape of the inside cross section of a spacing section of thick bamboo 407 is the same with the shape of the cross section of stopper 403, the inside length of spacing section of thick bamboo 407 is greater than the length of stopper 403, make things convenient for spacing section of thick bamboo 407 to rotate, thereby it is fixed with stopper 403, movable rod 406 top surface welds in spacing section of thick bamboo 407 bottom surface, the inside bonding of spacing section of thick bamboo.
3 bottom surface of base evenly welds and has a screw thread section of thick bamboo 5, and screw rod 6 is installed through the screw thread to 5 insides of a screw thread section of thick bamboo, and 6 underrun screws of screw rod have backup pad 7, and 7 bottom surfaces of backup pad have lug 8 evenly to weld.
The packaging machine comprises a packaging machine body 1, wherein silver colloid 9 is installed on one side of the top end of the packaging machine body 1, a rear stop block 10 is installed on one side of the silver colloid 9, heat dissipation holes 11 are evenly formed in one side of the silver colloid 9, mounting holes 12 are formed in positions, corresponding to the heat dissipation holes 11, of the rear stop block 10, an exhaust fan 13 is installed inside the mounting holes 12, the input end of the exhaust fan 13 is electrically connected with the output end of an external power supply, and the type of the exhaust.
The utility model discloses a theory of operation and use flow: when the height of luminous point needs to be adjusted, staff rotates spacing section of thick bamboo 407 this moment, make movable rod 406 rotate to rotating in the groove 404 from draw-in groove 405, staff pushes down stopper 403 this moment, because rubber slab 2 has certain elasticity, 2 compressions of rubber slab this moment, drive encapsulation organism 1 and remove, adjust the height of semiconductor laser, do not need staff to rotate the screw, improve the efficiency of regulation, thereby improve staff's work efficiency, when not needing height-adjusting, rotate movable rod 406 to draw-in groove 405, stopper 403 and rubber barrel 408 contact this moment, and extrude rubber barrel 408, thereby it is fixed with stopper 403, prevent 2 rebounds of rubber slab.
When placing base 3 on work platform, the staff can drive screw rod 6 and rotate in screw thread section of thick bamboo 5 through rotating backup pad 7 this moment to adjust the height that backup pad 7 supported, make 3 bottom surfaces of base keep the level, make things convenient for the staff to adjust the height of luminous point, through lug 8, make backup pad 7 fixed more stable.
When semiconductor laser moves, the staff opens exhaust fan 13 this moment, because the elargol 9 has better heat conductivity to make the produced heat of semiconductor laser move export through elargol 9, also through louvre 11 effluvium simultaneously, then discharge from encapsulation organism 1 through exhaust fan 13, life-span that can effectual extension semiconductor laser improves the device's practicality simultaneously.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a luminous point height-adjustable's semiconductor laser packaging structure, includes encapsulation organism (1), its characterized in that: the bottom surface of the packaging machine body (1) is bonded with a rubber plate (2), and the bottom surface of the rubber plate (2) is provided with a base (3) through a screw;
an adjusting component (4) is arranged in the base (3), and the adjusting component (4) comprises an adjusting groove (401), an adjusting column (402), a limiting block (403), a rotating groove (404), a clamping groove (405), a movable rod (406), a limiting cylinder (407) and a rubber cylinder (408);
adjustment tank (401) have evenly been seted up to base (3) bottom surface, adjustment tank (401) internally mounted has regulation post (402), it has stopper (403) to adjust post (402) bottom surface welding, base (3) bottom surface is close to adjustment tank (401) department and has seted up rotation groove (404), draw-in groove (405) have been seted up to rotation groove (404) one end, it has movable rod (406) to rotate groove (404) inside sliding connection, spacing section of thick bamboo (407) have been cup jointed in stopper (403) outside, movable rod (406) top surface welds in spacing section of thick bamboo (407) bottom surface, spacing section of thick bamboo (407) inside bonding has rubber tube (408).
2. A semiconductor laser package structure with adjustable light emitting point height as claimed in claim 1, wherein: the cross section of the limiting block (403) is square, a rubber block is bonded to the bottom surface of the limiting block (403), and the cross section of the rubber block is the same as the cross section of the limiting block (403).
3. A semiconductor laser package structure with adjustable light emitting point height as claimed in claim 1, wherein: the diameter of the adjusting groove (401) is equal to that of the adjusting column (402), and the top surface of the adjusting column (402) is in contact with the bottom surface of the rubber plate (2).
4. A semiconductor laser package structure with adjustable light emitting point height as claimed in claim 1, wherein: the shape of the cross section of the inside of the limiting cylinder (407) is the same as that of the cross section of the limiting block (403), and the length of the inside of the limiting cylinder (407) is larger than that of the limiting block (403).
5. A semiconductor laser package structure with adjustable light emitting point height as claimed in claim 1, wherein: the inner diameter of the clamping groove (405) is equal to the outer diameter of the movable rod (406), and the shape of the longitudinal section of the clamping groove (405) is the same as that of the longitudinal section of the movable rod (406).
6. A semiconductor laser package structure with adjustable light emitting point height as claimed in claim 1, wherein: the base (3) bottom surface is even welded with a screw thread section of thick bamboo (5), screw rod (6) are installed through the screw thread to screw thread section of thick bamboo (5) inside, backup pad (7) are installed through the screw to screw rod (6) bottom surface, even welding of backup pad (7) bottom surface has lug (8).
7. A semiconductor laser package structure with adjustable light emitting point height as claimed in claim 1, wherein: encapsulating organism (1) top one side and installing elargol (9), backstop (10) are installed to elargol (9) one side, louvre (11) have evenly been seted up to elargol (9) one side, backstop (10) correspond louvre (11) department and have seted up mounting hole (12), mounting hole (12) internally mounted has exhaust fan (13), the input and the external power supply output electric property of exhaust fan (13) are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020285182.2U CN211556418U (en) | 2020-03-10 | 2020-03-10 | Semiconductor laser packaging structure with adjustable light emitting point height |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020285182.2U CN211556418U (en) | 2020-03-10 | 2020-03-10 | Semiconductor laser packaging structure with adjustable light emitting point height |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211556418U true CN211556418U (en) | 2020-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020285182.2U Active CN211556418U (en) | 2020-03-10 | 2020-03-10 | Semiconductor laser packaging structure with adjustable light emitting point height |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211556418U (en) |
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2020
- 2020-03-10 CN CN202020285182.2U patent/CN211556418U/en active Active
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