CN208984754U - A kind of TO5 encapsulation semiconductor laser ageing device - Google Patents
A kind of TO5 encapsulation semiconductor laser ageing device Download PDFInfo
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- CN208984754U CN208984754U CN201821558289.9U CN201821558289U CN208984754U CN 208984754 U CN208984754 U CN 208984754U CN 201821558289 U CN201821558289 U CN 201821558289U CN 208984754 U CN208984754 U CN 208984754U
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Abstract
The utility model relates to a kind of TO5 to encapsulate semiconductor laser ageing device, belong to semiconductor burn-in screen technical field, including cooling fin, pedestal, electrode socket and pressure cap, the pedestal is fixed on the cooling fin, and the centre of the pedestal offers first through hole；The electrode socket includes circuit board and connection-peg, fixing groove is provided on the cooling fin, the circuit board is fixed in the fixing groove of cooling fin, the connection-peg is inserted into the first through hole, for connecting the pipe leg of TO5 encapsulated laser as laser energization, the pressure cap is fixedly connected with the base for compressing laser.The utility model secures TO5 encapsulation semiconductor laser well, while playing the role of energization and heat dissipation, solves the aging device loosening in ageing process, leads to the problem that ageing results are bad.
Description
Technical field
The utility model relates to a kind of TO5 to encapsulate semiconductor laser ageing device, belong to semiconductor burn-in screen skill
Art field.
Background technique
With the development of society and being constantly progressive for science and technology, laser constantly highlights it importantly in social every field
Position.Especially semiconductor laser has many advantages, such as that small in size, high-efficient, the service life is long, is widely used in industry, medical treatment, communication
With military field etc..The reliability of device is an a crucial factor, this is also the master that is related to them and whether can be commercialized
Want factor.The Reliability Check of semiconductor laser is generally tested using voltage ageing, is exactly to observe device at a certain current to exist
Aging period output.The ageing process of semiconductor laser determines the durability of product, reliability to a certain extent, and old
Aging device used in changing just plays the role of product key.
It at present all can noise spectra of semiconductor lasers progress voltage ageing in the industry.Since semiconductor laser is in energization aging
There are heating problem in journey, fever affects the ageing process of entire semiconductor laser to a certain extent, if heat dissipation is not
It sufficiently just will affect the performance of entire product.Thus the performance of aging equipment and workmanship determine entire old to a certain extent
Disguise the final working result set.
Chinese patent 201010550883.5 discloses test and the ageing adapter of a kind of semiconductor laser, i.e. attachment
D1, including adapter shoe, adapter electrode, semiconductor laser, spring pressure head, adapter upper cover, upper bolt of cover setting, half
Conductor laser is placed on the centre of adapter shoe, and semiconductor laser is fixed with adapter electrode and spring pressure head above
And compression, adapter upper cover is adapter shoe, adapter electrode, semiconductor laser, spring pressure head provide mechanical protection work
With, while providing for semiconductor laser test and aging by flattening bench, to ensure the uniform cooling of adapter shoe.The present invention
A kind of disclosed test and burn-in screen adapter for semiconductor laser ChiponSubmount (CoS).
At present in semicon industry, especially in field of semiconductor lasers, there is miscellaneous burn-in screen device, all
Have the advantages that it is respective, but equally all exist in varying degrees the shortcomings that, have for TO56 product, COS product and C-mount
The aging equipment of the products such as encapsulated laser, but it is related to the aging equipment of TO5 encapsulated laser currently without patent.TO5 is
Refer to a kind of general individual laser package form, appearance is similar with TO56, but size ratio TO56 is big, housing diameter 9mm.
As shown in Figure 1, TO5 encapsulated laser includes the chip of laser of pedestal 1 ', pipe cap 2 ' and setting on pedestal 1 ',
Pipe leg 3 ' is provided on pedestal 1 ', for connecting with external circuit.
Utility model content:
In view of the deficiencies of the prior art, the utility model provides a kind of TO5 encapsulation semiconductor laser ageing device,
In ageing process, TO5 encapsulation semiconductor laser is secured well, while playing the role of energization and heat dissipation, solved
Aging device loosens in ageing process, leads to the problem that ageing results are bad.
The utility model uses following technical scheme:
The utility model provides a kind of TO5 encapsulation semiconductor laser ageing device, including cooling fin, pedestal, electrode
Socket and pressure cap, the pedestal are fixed on the cooling fin, and convenient for the heat dissipation of ageing process, the centre of the pedestal is offered
First through hole；
The electrode socket includes circuit board and connection-peg, preferably 3 connection-pegs, can be between connection-peg and circuit board
Using welded connecting, fixing groove is provided on the cooling fin, the circuit board is fixed in the fixing groove of cooling fin, can be adopted
It is fixed with various ways such as welding, this is repeated no more, and the connection-peg is inserted into the first through hole, for connecting
The pipe leg of TO5 encapsulated laser is laser energization, and the pressure cap is fixedly connected with the base for compressing laser.
Preferably, the quadrangle of the pedestal is provided with the first counterbore, is provided on the cooling fin and sinks with described first
Pedestal is fixed on cooling fin by the corresponding fixation hole in hole site by screw connection between first counterbore and fixation hole,
Cooling fin herein can be active heatsink or passive heat radiation piece, not influence the implementation of the utility model.
Preferably, cylindrical protrusions are provided on the pedestal, the protrusion periphery is provided with external screw thread, and described first is logical
Hole is the second counterbore positioned at raised central portion, and the top circular groove diameter of second counterbore and the pedestal of TO5 encapsulated laser are straight
Diameter is adapted, and for blocking the pedestal of TO5 encapsulated laser, the connection-peg is inserted into the lower part of second counterbore, for connecting
The pin of TO5 encapsulated laser is connect as laser energization.
It is further preferred that the pressure cap is that one groove of setting is formed in the middle part of circular slab, the middle part of the groove is described
The second through-hole is provided on circular slab, the diameter of second through-hole is greater than the pipe cap diameter of TO5 encapsulated laser, and is less than
The base diameter of TO5 encapsulated laser, the TO5 encapsulated laser pipe cap is protruding across second through-hole, rigid in this way
It is good to fix the pedestal except TO5 encapsulated laser pipe cap, the external screw thread with the protrusion is provided on the groove inner wall
The internal screw thread matched, pressure cap are screwed on pedestal by being threadedly engaged.
It is further preferred that insulation paster is posted in the bottom of the pedestal.
When the utility model is used, the pedestal of TO5 encapsulated laser to be first fixed on to the top of the second counterbore of pedestal
In circular groove, while by the connection-peg of the pipe leg aligning electrodes socket of TO5 encapsulated laser, then pressure cap is covered to encapsulate in TO5 and be swashed
On light device, the second through-hole that the pipe cap of TO5 encapsulated laser passes through pressure cap at this time stretches out, and finally pressure cap is tightened on pedestal,
When aging, power on into ageing process, by the aging of certain time (being provided according to the characteristic of product itself), according to work
Skill screens product.
The utility model has the following beneficial effects:
The utility model improves the burn-in screen yield rate of TO5 encapsulation semiconductor laser, it is known that semiconductor swashs
Light device characteristic can be divided into rapid failure phase, stabilizer, decline phase, can be selected away by aging and be failed in the rapid failure phase
Laser, improve production efficiency under the premise of guaranteeing product quality, solve existing operating defect in production, have
Following advantages:
(1) small in size, simple structure, easy to operate, it reduces the production cost.
(2) the utility model is given TO5 encapsulation semiconductor laser power supply well, is played simultaneously in ageing process
The effect of fixed support and heat dissipation.
(3) aging is loaded and unloaded TO5 encapsulated laser with device and is more facilitated, and pressure cap and pedestal cooperate firmly to lock and swash
Light device solves the aging device loosening in ageing process, leads to the problem that ageing results are bad.
To sum up, the utility model secures TO5 encapsulation semiconductor laser well, plays simultaneously in ageing process
It is powered and the effect of heat dissipation, solves in ageing process that aging device loosens, lead to the problem that ageing results are bad.
Detailed description of the invention:
Fig. 1 is the structural schematic diagram of traditional TO5 encapsulated laser；
Fig. 2 is that the TO5 of the utility model encapsulates the general structure schematic diagram of semiconductor laser ageing device；
Fig. 3 is the side view of pedestal in Fig. 2 (the first counterbore is not shown)；
Fig. 4 is the matching relationship schematic diagram of the pedestal of an embodiment of the present invention, pressure cap and TO5 encapsulated laser
(the first counterbore in pedestal is not shown)；
Wherein: the pedestal of 1 '-TO5 encapsulated laser, 2 '-pipe caps, 3 '-pipe legs, 1- pressure cap, 1-1 circular slab, 1-2 are recessed
Slot, the second through-hole of 1-3,2- pedestal, 2-1 protrusion, the second counterbore of 2-2,3- electrode socket, 4- cooling fin, the first counterbore of 5-, 6-
Screw.
Specific embodiment:
In order to make the technical problems, technical solutions and advantages to be solved by the utility model clearer, below in conjunction with attached drawing
And specific embodiment is described in detail, but is not limited only to this, and what the utility model did not elaborated, press this field routine skill
Art.
Embodiment 1:
As shown in Fig. 2, a kind of TO5 encapsulates semiconductor laser ageing device, including cooling fin 4, pedestal 2, electrode are inserted
Seat 3 and pressure cap 1, pedestal 2 are fixed on cooling fin 4, and the centre of pedestal 2 offers first through hole；
Electrode socket 3 includes circuit board and connection-peg, is provided with fixing groove on cooling fin 4, circuit board is fixed on cooling fin 4
Fixing groove in, connection-peg be inserted into first through hole, for connect the pipe leg 3 ' of TO5 encapsulated laser be laser be powered, pressure cap 1
It is fixedly connected with pedestal 2 for compressing laser.
Embodiment 2:
A kind of TO5 encapsulation semiconductor laser ageing device, structure is as described in Example 1, the difference is that pedestal 2
Quadrangle be provided with the first counterbore 5, fixation hole corresponding with 5 position of the first counterbore, the first counterbore 5 are provided on cooling fin 4
It is connect between fixation hole by screw 6.
Embodiment 3:
A kind of TO5 encapsulation semiconductor laser ageing device, structure is as described in Example 1, the difference is that such as Fig. 3
It is shown, cylindrical protrusions 2-1 is provided on pedestal 2, the raised periphery 2-1 is provided with external screw thread, and first through hole is positioned at raised 2-1
The top circular groove diameter of second the counterbore 2-2, the second counterbore 2-2 at middle part and the 1 ' diameter of pedestal of TO5 encapsulated laser are adapted,
For blocking the pedestal 1 ' of TO5 encapsulated laser, connection-peg is inserted into the lower part of the second counterbore 2-2, swashs for connecting TO5 encapsulation
The pipe leg 3 ' of light device is laser energization.
Embodiment 4:
A kind of TO5 encapsulation semiconductor laser ageing device, structure is as described in Example 3, the difference is that such as Fig. 4
Shown, pressure cap 1 is that one groove 1-2 of setting is formed in the middle part of circular slab 1-1, and the middle part of groove 1-1 is provided on circular slab 1-1
The diameter of second through-hole 1-3, the second through-hole 1-3 is greater than the 2 ' diameter of pipe cap of TO5 encapsulated laser, and is less than TO5 and encapsulates laser
1 ' the diameter of pedestal of device, the TO5 encapsulated laser pipe cap 2 ' is protruding across the second through-hole 1-3, sets on groove 1-2 inner wall
It is equipped with the internal screw thread matched with the external screw thread of protrusion 2-1.
Embodiment 5:
A kind of TO5 encapsulation semiconductor laser ageing device, structure is as described in Example 4, the difference is that pedestal 2
Bottom post insulation paster.
The above is preferred embodiments of the present invention, it is noted that for the ordinary skill of the art
For personnel, under the premise of not departing from principle described in the utility model, it can also make several improvements and retouch, these improvement
It also should be regarded as the protection scope of the utility model with retouching.
Claims (5)
1. a kind of TO5 encapsulates semiconductor laser ageing device, which is characterized in that including cooling fin, pedestal, electrode socket and
Pressure cap, the pedestal are fixed on the cooling fin, and the centre of the pedestal offers first through hole；
The electrode socket includes circuit board and connection-peg, and fixing groove is provided on the cooling fin, and the circuit board is fixed on
In the fixing groove of cooling fin, the connection-peg is inserted into the first through hole, and the pipe leg for connecting TO5 encapsulated laser is laser
Device is powered, and the pressure cap is fixedly connected with the base for compressing laser.
2. TO5 according to claim 1 encapsulates semiconductor laser ageing device, which is characterized in that the pedestal
Quadrangle is provided with the first counterbore, is provided with fixation hole corresponding with first counterbore position on the cooling fin, and described
Pass through screw connection between one counterbore and fixation hole.
3. TO5 according to claim 1 encapsulates semiconductor laser ageing device, which is characterized in that on the pedestal
Cylindrical protrusions are provided with, the protrusion periphery is provided with external screw thread, and the first through hole is to sink positioned at the second of raised central portion
Hole, the top circular groove diameter of second counterbore and the base diameter of TO5 encapsulated laser are adapted, for blocking TO5 encapsulation
The pedestal of laser, the connection-peg are inserted into the lower part of second counterbore, and the pin for connecting TO5 encapsulated laser is sharp
Light device is powered.
4. TO5 according to claim 3 encapsulates semiconductor laser ageing device, which is characterized in that the pressure cap is
One groove of setting is formed in the middle part of circular slab, and the middle part of the groove is provided with the second through-hole on the circular slab, and described second
The diameter of through-hole is greater than the pipe cap diameter of TO5 encapsulated laser, and is less than the base diameter of TO5 encapsulated laser, the TO5 envelope
It is protruding across second through-hole to fill laser pipe cap, the external screw thread phase with the protrusion is provided on the groove inner wall
The internal screw thread of cooperation.
5. TO5 according to any one of claims 1-4 encapsulates semiconductor laser ageing device, which is characterized in that
Post insulation paster in the bottom of the pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821558289.9U CN208984754U (en) | 2018-09-25 | 2018-09-25 | A kind of TO5 encapsulation semiconductor laser ageing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821558289.9U CN208984754U (en) | 2018-09-25 | 2018-09-25 | A kind of TO5 encapsulation semiconductor laser ageing device |
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| Publication Number | Publication Date |
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| CN208984754U true CN208984754U (en) | 2019-06-14 |
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| CN201821558289.9U Active CN208984754U (en) | 2018-09-25 | 2018-09-25 | A kind of TO5 encapsulation semiconductor laser ageing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112557710A (en) * | 2020-12-28 | 2021-03-26 | 武汉光迅科技股份有限公司 | Test fixture and test device for optical device |
-
2018
- 2018-09-25 CN CN201821558289.9U patent/CN208984754U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112557710A (en) * | 2020-12-28 | 2021-03-26 | 武汉光迅科技股份有限公司 | Test fixture and test device for optical device |
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