CN211528605U

CN211528605U - VCSEL single testing base

Info

Publication number: CN211528605U
Application number: CN201921686609.3U
Authority: CN
Inventors: 周汉川
Original assignee: Hubei Guanganlun Chip Co ltd
Current assignee: Hubei Guanganlun Chip Co ltd
Priority date: 2019-10-10
Filing date: 2019-10-10
Publication date: 2020-09-18
Anticipated expiration: 2029-10-10

Abstract

The utility model provides a VCSEL single test base, including electrically conductive base and test strip, electrically conductive base and test strip can dismantle the connection, and electrically conductive base sets up the recess of acceping the test strip, and the test strip is connected with electrically conductive base electricity, all is equipped with the spacing platform of a fixed test strip position on two inside walls that the recess is relative, and the test strip is located spacing platform below, and the test strip is located the fixed slot of seting up fixed VCSEL chip on the part between two spacing platforms, the electrically conductive gluing agent that coating and VCSEL chip electricity are connected in the fixed slot. The utility model provides a VCSEL single test base can fix multiple specification VCSEL chip on a test piece, and the chip is placed in the fixed slot of test piece, and the installation chip is simple and convenient, and the chip is firm unmovable. Because the conductive base is large in size and heavy in weight, the contact area between the chip and the testing machine can be effectively increased, and the testing accuracy is improved.

Description

VCSEL single testing base

Technical Field

The utility model relates to a single VCSEL chip's test field especially relates to a single test base of VCSEL.

Background

At present, a VCSEL chip is tested while being in contact with a conductive stage of a tester and while being connected to a test probe. Because the size of the VCSEL wafer which is not separated is large, the VCSEL wafer can be attached to a conductive carrying platform of a testing machine tightly by means of the self weight and the size, but after the VCSEL wafer is separated into single chips, the single chips are light in weight and small in size, and when the VCSEL wafer is placed on the conductive carrying platform of the testing machine, the VCSEL wafer is frequently in poor contact, and the single chips are easy to shift and cannot fix the testing position well.

Disclosure of Invention

An object of the utility model is to overcome prior art's defect, provide a single test base of VCSEL to overcome single chip and electrically conductive microscope carrier contact failure and single chip and shift the problem of good fixed test position easily.

The utility model discloses a realize like this:

the utility model provides a VCSEL single test base, including electrically conductive base and test strip, electrically conductive base and test strip can dismantle the connection, and electrically conductive base sets up the recess of acceping the test strip, and the test strip is connected with electrically conductive base electricity, all is equipped with the spacing platform of a fixed test strip position on two inside walls that the recess is relative, and the test strip is located spacing platform below, and the test strip is located the fixed slot of seting up fixed VCSEL chip on the part between two spacing platforms, the electrically conductive gluing agent that coating and VCSEL chip electricity are connected in the fixed slot.

As preferred, the both sides that the test strip is relative all have upwards protruding, two protruding and two spacing platform one-to-one, spacing platform is seted up towards one side of test strip and is supplied the protruding draw-in groove that stretches into the chucking that corresponds.

Preferably, the test piece is provided with a plurality of fixing grooves matched with VCSEL chips with different sizes.

Preferably, the test piece is provided with a gold wire electrically connected with the VCSEL chip.

Preferably, bosses which are convenient for holding to take and place the conductive base are arranged on the two opposite outer side walls of the conductive base.

Preferably, the conductive adhesive is conductive silver adhesive.

Preferably, the test strip is a metal conductor.

The utility model discloses following beneficial effect has:

1. the utility model provides a VCSEL single test base can fix multiple specification VCSEL chip on a test piece, and the chip is placed in the fixed slot of test piece, and the installation chip is simple and convenient, and the chip is firm unmovable. Because the conductive base is large in size and heavy in weight, the contact area between the chip and the testing machine can be effectively increased, and the testing accuracy is improved.

2. The utility model provides a VCSEL single test base, test piece and electrically conductive base are that the components of a whole that can function independently are mobilizable, test on one side, and the another side can use other test pieces to place the chip, has promoted work efficiency.

3. The utility model provides a VCSEL single test base coats conductive silver colloid in the fixed slot, and the chip uses the gold thread welding with the test piece, fixes into the encapsulated form with test piece and VCSEL, is used for simulating the chip encapsulation.

4. The utility model provides a VCSEL single test base, the test piece after the encapsulation can be retrieved, avoids becoming disposable like the TO support, reduce cost.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a plan view of a VCSEL single test socket according to an embodiment of the present invention;

fig. 2 is a cross-sectional view of a conductive base according to an embodiment of the present invention;

FIG. 3 is a cross-sectional view of a test strip according to an embodiment of the present invention;

fig. 4 is a plan view of a test strip provided by an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1-4, the embodiment of the utility model provides a single test base of VCSEL, including conductive base 1 and test strip 2, in this embodiment, test strip 2 is metallic conductor, conductive base 1 and test strip 2 can be dismantled the connection, conductive base 1 sets up the recess 3 of acceping test strip 2, test strip 2 is connected with conductive base 1 electricity, all be equipped with the spacing platform 4 of a fixed test strip position on two inside walls that recess 3 is relative, test strip 2 is located spacing platform 4 below, set up the fixed slot 5 of fixed VCSEL chip on the part that test strip 2 is located between two spacing platforms 4, the coating is connected with the electrically conductive gluing agent of 6 electricity of VCSEL chip in the fixed slot 5. Preferably, the test piece 2 is provided with a plurality of fixing grooves 5 matched with VCSEL chips with different sizes. The utility model provides a VCSEL single test base can fix multiple specification VCSEL chip on a test piece, and the chip is placed in the fixed slot of test piece, and the installation chip is simple and convenient, and the chip is firm unmovable. Because the conductive base is large in size and heavy in weight, the contact area between the chip and the testing machine can be effectively increased, and the testing accuracy is improved.

The utility model discloses in, the electrically conductive gluing agent is electrically conductive silver adhesive, and electrically conductive silver adhesive has fixed the position of VCSEL chip and has made VCSEL chip and 1 electricity of electrically conductive base be connected simultaneously and reach the test purpose, and the test piece is mobilizable with electrically conductive base as a whole that can function independently, tests on one side, and the chip can be placed to other test pieces to the another side, has promoted work efficiency.

As preferred, the both sides that test strip 2 is relative all have upwards protruding 7, two protruding 7 and two spacing platform 4 one-to-one, spacing platform 4 is offered the protruding draw-in groove 8 that stretches into the chucking that supplies to correspond towards one side of test strip, and above-mentioned structure makes test strip 2 better with the fixed effect of electrically conductive base 1, and test strip 2 still is the detachable relation with electrically conductive base 1 simultaneously.

The utility model discloses in, be equipped with the gold thread 9 of being connected with VCSEL chip electricity on the test piece, VCSEL chip and the welding of gold thread 9 will test the piece and fix into the encapsulation form with VCSEL, are used for simulating the chip encapsulation. The test piece after the encapsulation can be retrieved, avoids like the TO support becomes disposable, reduce cost.

The VCSEL chip is electrically connected with the test piece through a gold wire 9, and other tests can be carried out.

The utility model discloses in, be equipped with boss 10 on two relative lateral walls of electrically conductive base 1, conveniently handheld getting is put electrically conductive base.

The utility model provides a VCSEL single test base adopted technical scheme is: a movable test piece is inserted into the metal conductive base, the test piece is made of metal conductive materials, and different fixing grooves are distributed on the test piece according to the size of the existing VCSEL. The size of the fixing groove can be set to be in multiple specifications, for example, three types of chips are provided, the size of the fixing groove is slightly larger than that of the chip by 10-20um, the depth of the fixing groove is 20-30um shallower than the thickness of the chip, the size of the chip in anticipation can be increased on the test piece, and the test piece is prevented from being replaced when the size of the chip is upgraded in the future.

In the embodiment shown in fig. 1, the conductive base 1 and the test strip 2 are connected through the card slot 8 shown in fig. 2, and the VCSEL chip 6 and the test strip 2 are connected by using a gold wire 9, or the VCSEL chip 6 may be placed in the fixing slot 5 without using the gold wire 9. During testing, a whole auxiliary tool is used for replacing a single chip.

The utility model discloses in, the test piece independently exists with electrically conductive base, the test piece can be according to the VCSEL chip size processing fixed slot of current VCSEL chip size or expectation, the fixed slot size is slightly bigger 10-20um than chip size, the degree of depth in groove is shallow 20-30um than the thickness of chip, can process many money fixed slots on a test piece, a slice test piece can carry out the test of many money chips, because of the degree of depth of fixed slot is shallow 20-30um than chip thickness, can go up electrically conductive silver glue in the fixed slot, the chip uses gold thread welding with the test piece, fix into the encapsulated form with VCSEL with the test piece, be used for simulating the chip encapsulation.

The utility model discloses in, the test strip size is ordinary TO support relatively big, behind the encapsulation test, can retrieve the test strip, gets rid of surperficial gold thread and conducting resin through physics and chemical mode, and the test strip can reuse.

The utility model provides a single test base of VCSEL, this single test base can not only let chip and test microscope carrier contact inseparable, the fixed chip that can be convenient moreover to can regard as the encapsulation support to use.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A VCSEL single testing base is characterized in that: including electrically conductive base and test piece, electrically conductive base and test piece can be dismantled the connection, the recess of acceping the test piece is seted up to electrically conductive base, the test piece is connected with electrically conductive base electricity, all be equipped with the spacing platform of a fixed test piece position on two inside walls that the recess is relative, the test piece is located spacing platform below, the fixed slot of seting up fixed VCSEL chip is located to the part between two spacing platforms to the test piece, the electrically conductive gluing agent of coating and VCSEL chip electricity is connected in the fixed slot.

2. The VCSEL single test fixture of claim 1, wherein: the both sides that the test strip is relative all have upwards protruding, two protruding and two spacing platform one-to-one, spacing platform is seted up towards one side of test strip and is supplied the protruding draw-in groove that stretches into the chucking that corresponds.

3. The VCSEL single test fixture of claim 1, wherein: a plurality of fixing grooves matched with VCSEL chips of different sizes are formed in the test sheet.

4. The VCSEL single test fixture of claim 1, wherein: and a gold wire electrically connected with the VCSEL chip is arranged on the test piece.

5. The VCSEL single test fixture of claim 1, wherein: bosses which are convenient for holding and taking the conductive base are arranged on the two opposite outer side walls of the conductive base.

6. The VCSEL single test fixture of claim 1, wherein: the conductive adhesive is conductive silver adhesive.

7. The VCSEL single test fixture of claim 1, wherein: the test piece is a metal conductor.