CN211453852U - Full-automatic high-speed vertical point measurement machine for LED chip - Google Patents
Full-automatic high-speed vertical point measurement machine for LED chip Download PDFInfo
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- CN211453852U CN211453852U CN201920530796.XU CN201920530796U CN211453852U CN 211453852 U CN211453852 U CN 211453852U CN 201920530796 U CN201920530796 U CN 201920530796U CN 211453852 U CN211453852 U CN 211453852U
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Abstract
The utility model relates to a machine is surveyed with full-automatic high-speed perpendicular point to LED chip, including wafer sucking disc and sucking disc action actuating mechanism, its characterized in that: the sucker action executing mechanism comprises a fixing plate, a fine adjustment module and a combined action module; the fine adjustment module is fixedly connected to the fixing plate; the combined action module is connected to the fine adjustment module; the wafer sucker is arranged on the wafer sucker action executing mechanism; the rollers on the horizontal moving plate and the vertical moving plate are tightly attached to the outer contour of the compound eccentric wheel through the action of a spring, and form a path along the outer contour of the compound eccentric wheel under the driving of a motor to form compound motion in the horizontal direction and the vertical direction; the fine adjustment module is adjusted through a manual adjusting wheel, so that the overall precision of the combined action module is higher; the actuating mechanism with composite action can greatly shorten the time for taking the crystal and point measurement and the arrangement time, reduce the equipment space, improve the utilization rate of a factory building and greatly improve the production efficiency.
Description
Technical Field
The utility model relates to a LED chip testing arrangement field especially relates to a machine is surveyed with full-automatic high-speed perpendicular point to LED chip.
Background
A full-automatic high-speed vertical point measurement machine is an automatic high-speed LED chip point measurement device. The point-testing platform can be used for accurately and quickly testing the upper point of the die seat to be tested on the wafer ring, and the point-testing platform is accurately arranged on the workbench after testing, so that accurate post-testing parameters are provided for subsequent sorting and process analysis. The output per hour can reach more than 7-8K. The device is suitable for testing various LED vertical structure chips (ultraviolet, purple light, red light, yellow light, blue light, green light, white light, far infrared and the like). It can also be used for large current (0-5000 mA) point measurement of high-power LED planar structure. The mechanical arm of the spot measuring machine can greatly shorten the time for taking the crystal and spot measuring and the arrangement time, reduce the equipment space, improve the utilization rate of a factory building and greatly improve the production efficiency.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a can promote to shorten by a wide margin and get the time of brilliant, point survey, and arrange the time to there is the reduction equipment space, improves the factory building utilization ratio, makes the full-automatic high-speed perpendicular point survey machine for the LED chip that production efficiency promoted greatly.
In order to solve the technical problem, the utility model adopts the technical scheme that: the utility model provides a machine is surveyed with full-automatic high-speed perpendicular point to LED chip, includes wafer sucking disc and sucking disc action actuating mechanism, and its innovation point lies in: the sucker action executing mechanism comprises a fixing plate, a fine adjustment module and a combined action module; the fine adjustment module is fixedly connected to the fixing plate; the combined action module is connected to the fine adjustment module; the wafer sucker is arranged on the wafer sucker action executing mechanism;
the combined action module drives a motor, a composite eccentric wheel, a horizontal moving plate and a vertical moving plate; the driving motor is horizontally connected to the fine adjustment module through a motor frame; the compound eccentric wheel is connected with the output end of the driving motor; the horizontal moving plate is perpendicular to the fine adjustment module and is connected with the fine adjustment module through a sliding rail plate with a sliding rail, and the vertical moving plate is connected with the horizontal moving plate through the sliding rail; and the driving motor drives the composite eccentric wheel so as to realize that the rollers on the horizontal moving plate and the vertical moving plate move along the outer contour path of the composite eccentric wheel to realize composite motion.
Further, the fine adjustment module comprises an upper connecting plate, a longitudinal fine adjustment plate and a transverse fine adjustment plate; the upper connecting plate is fixedly arranged on the bottom end face of the fixed plate; the longitudinal fine adjustment plate is connected with the upper connecting plate through a sliding rail and is longitudinally fine adjusted in the horizontal direction through a screw rod structure; the transverse fine adjustment plate is connected with the longitudinal fine adjustment plate through a sliding rail, and the transverse fine adjustment plate is transversely fine adjusted in the horizontal direction through a screw rod structure;
furthermore, the side edges of the longitudinal fine adjustment plate and the transverse fine adjustment plate are provided with manual adjustment wheels which are connected with the screw rod structure, and fine adjustment is realized through the manual adjustment wheels.
Furthermore, a through hole for accommodating the roller on the longitudinal moving plate and matching with the outer contour of the composite eccentric wheel is formed in the middle of the horizontal moving plate; the horizontal moving plate is provided with a first spring connected with the longitudinal moving plate; and the vertical moving plate is provided with a second spring connected with the horizontal moving plate, and the rollers on the vertical moving plate and the rollers on the horizontal moving plate are respectively tightly attached to the outer contour of the compound eccentric wheel through the first spring and the second spring.
The utility model has the advantages that:
1) the idler wheels on the horizontal moving plate and the vertical moving plate are tightly attached to the outer contour of the compound eccentric wheel through the action of the spring, and the compound motion in the horizontal direction and the vertical direction is formed along the outer contour forming path of the compound eccentric wheel under the driving of the motor; the fine adjustment module can realize the adjustment of the integral initial position of the combined action module through a manual adjustment wheel, so that the integral precision of the combined action module is higher; the actuating mechanism with composite action can greatly shorten the time for taking the crystal and point measurement and the arrangement time, reduce the equipment space, improve the utilization rate of a factory building and greatly improve the production efficiency.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 1 is the utility model discloses a wafer sucking disc action execution mechanism picture of full-automatic high-speed vertical spot measuring machine for LED chip.
Fig. 2 is another angle structure diagram of the wafer chuck action of the full-automatic high-speed vertical spot measuring machine for LED chips of the present invention.
Fig. 3 is the utility model discloses a partial structure schematic diagram of action actuating mechanism of full-automatic high-speed vertical spot measuring machine for LED chip.
Detailed Description
The following examples are presented to enable those skilled in the art to more fully understand the present invention and are not intended to limit the scope of the present invention.
The full-automatic high-speed vertical spot measurement machine for the LED chip as shown in FIGS. 1 to 3 comprises a wafer chuck and a chuck action executing mechanism, wherein the chuck action executing mechanism comprises a fixing plate 1, a fine adjustment module 2 and a combined action module 3; the fine adjustment module 2 is fixedly connected to the fixing plate 1; the combined action module 3 is connected to the fine adjustment module 2; the wafer sucker is arranged on the wafer sucker action executing mechanism;
the combined action module 3 drives a motor 31, a compound eccentric wheel 32, a horizontal moving plate 33 and a vertical moving plate 34; the driving motor 31 is horizontally connected to the fine adjustment module 2 through a motor frame; the compound eccentric wheel 32 is connected with the output end of the driving motor 31; the horizontal moving plate 33 is perpendicular to the fine adjustment module 2 and is connected through a sliding rail plate 38 with a sliding rail, and the vertical moving plate 34 is connected to the horizontal moving plate 33 through a sliding rail; the horizontal moving plate 33 and the vertical moving plate 34 are both provided with rollers 35 which are attached to the contour surfaces of the compound eccentric wheels, and the driving motor 31 drives the compound eccentric wheels 32 to realize that the rollers 35 on the horizontal moving plate 33 and the vertical moving plate 34 move along the contour paths of the compound eccentric wheels 32 to realize compound motion.
The fine adjustment module 2 comprises an upper connecting plate 21, a longitudinal fine adjustment plate 22 and a transverse fine adjustment plate 23; the upper connecting plate 21 is fixedly arranged on the bottom end face of the fixed plate; the longitudinal fine adjustment plate 22 is connected with the upper connecting plate 21 through a sliding rail, and the longitudinal fine adjustment plate 22 is longitudinally fine adjusted in the horizontal direction through a screw rod structure; the transverse fine adjustment plate 23 is connected with the longitudinal fine adjustment plate 22 through a sliding rail, and the transverse fine adjustment plate 23 conducts transverse fine adjustment in the horizontal direction through a screw rod structure.
The side edges of the longitudinal fine adjustment plate 22 and the transverse fine adjustment plate 23 are respectively provided with a manual adjusting wheel 24 which is connected with a screw rod structure, and fine adjustment is realized through the manual adjusting wheels 24.
A through hole for accommodating the roller on the longitudinal moving plate 34 and matching with the outer contour of the composite eccentric wheel 32 is formed in the middle of the horizontal moving plate 33; the horizontal moving plate 33 is provided with a first spring 36 connected with the longitudinal moving plate 34; the vertical moving plate 34 is provided with a second spring 37 connected with the horizontal moving plate 33, and the roller on the vertical moving plate 34 and the roller 35 on the horizontal moving plate 33 are respectively attached to the outer contour of the compound eccentric wheel 32 through the first spring 36 and the second spring 37.
The utility model discloses a theory of operation is: the combined action module is located at an initial position, the longitudinal adjusting plate and the transverse adjusting plate of the fine adjustment module are adjusted through the manual adjusting wheel, the combined action module is located at a proper action initial position, the compound eccentric wheel is driven through the driving motor, the horizontal moving plate of the combined action module and the roller on the vertical moving plate are tightly attached to the outer contour of the compound eccentric wheel in a matched manner through the spring under the driving of the compound eccentric wheel, and the compound eccentric wheel realizes the movement of the combined action module in the rotating process.
It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. The utility model provides a machine is surveyed with full-automatic high-speed perpendicular point to LED chip, includes wafer sucking disc and sucking disc action actuating mechanism, its characterized in that: the sucker action executing mechanism comprises a fixing plate, a fine adjustment module and a combined action module; the fine adjustment module is fixedly connected to the fixing plate; the combined action module is connected to the fine adjustment module; the wafer sucker is arranged on the wafer sucker action executing mechanism;
the combined action module drives a motor, a composite eccentric wheel, a horizontal moving plate and a vertical moving plate; the driving motor is horizontally connected to the fine adjustment module through a motor frame; the compound eccentric wheel is connected with the output end of the driving motor; the horizontal moving plate is perpendicular to the fine adjustment module and is connected through a sliding rail plate with a sliding rail, and the vertical moving plate is connected to the horizontal moving plate through the sliding rail; and the driving motor drives the composite eccentric wheel so as to realize that the rollers on the horizontal moving plate and the vertical moving plate move along the outer contour path of the composite eccentric wheel to realize composite motion.
2. The full-automatic high-speed vertical spot measuring machine for the LED chip according to claim 1, characterized in that: the fine adjustment module comprises an upper connecting plate, a longitudinal fine adjustment plate and a transverse fine adjustment plate; the upper connecting plate is fixedly arranged on the bottom end face of the fixed plate; the longitudinal fine adjustment plate is connected with the upper connecting plate through a sliding rail and is longitudinally fine adjusted in the horizontal direction through a screw rod structure; the transverse fine adjustment plate is connected with the longitudinal fine adjustment plate through a sliding rail, and the transverse fine adjustment plate is transversely fine adjusted in the horizontal direction through a screw rod structure.
3. The full-automatic high-speed vertical spot measuring machine for the LED chip according to claim 2, characterized in that: the side edges of the longitudinal fine adjustment plate and the transverse fine adjustment plate are provided with manual adjustment wheels which are connected with the screw rod structure, and fine adjustment is achieved through the manual adjustment wheels.
4. The full-automatic high-speed vertical spot measuring machine for the LED chip according to claim 1, characterized in that: a through hole for accommodating the roller on the longitudinal moving plate and matching with the outer contour of the composite eccentric wheel is formed in the middle of the horizontal moving plate; the horizontal moving plate is provided with a first spring connected with the longitudinal moving plate; and the vertical moving plate is provided with a second spring connected with the horizontal moving plate, and the rollers on the vertical moving plate and the rollers on the horizontal moving plate are respectively tightly attached to the outer contour of the compound eccentric wheel through the first spring and the second spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920530796.XU CN211453852U (en) | 2019-04-18 | 2019-04-18 | Full-automatic high-speed vertical point measurement machine for LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920530796.XU CN211453852U (en) | 2019-04-18 | 2019-04-18 | Full-automatic high-speed vertical point measurement machine for LED chip |
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| CN211453852U true CN211453852U (en) | 2020-09-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920530796.XU Active CN211453852U (en) | 2019-04-18 | 2019-04-18 | Full-automatic high-speed vertical point measurement machine for LED chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110108998A (en) * | 2019-04-18 | 2019-08-09 | 海迪科（南通）光电科技有限公司 | A kind of vertical point measurement machine of LED chip fully automatic high-speed |
-
2019
- 2019-04-18 CN CN201920530796.XU patent/CN211453852U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110108998A (en) * | 2019-04-18 | 2019-08-09 | 海迪科（南通）光电科技有限公司 | A kind of vertical point measurement machine of LED chip fully automatic high-speed |
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