CN203491228U - Wafer assembling system - Google Patents
Wafer assembling system Download PDFInfo
- Publication number
- CN203491228U CN203491228U CN201320629015.5U CN201320629015U CN203491228U CN 203491228 U CN203491228 U CN 203491228U CN 201320629015 U CN201320629015 U CN 201320629015U CN 203491228 U CN203491228 U CN 203491228U
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- wafer
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- translation
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Abstract
The utility model relates to a wafer assembling system. The wafer assembling system comprises a lead wire longitudinal translation assembly, a lead wire horizontal translation assembly, a workbench motion assembly, a wafer disc positioning assembly, a wafer disc X/Y axis translation assembly and a wafer installing and taking manipulator (13). The lead wire longitudinal/horizontal translation assembly is used for driving a lead wire to translate longitudinally or horizontally, and self-positioning welding assembly of a wafer is achieved; in a self-positioning absorption process of the wafer, the wafer disc positioning assembly provides support to a wafer taking-out disc (17); the wafer disc X/Y axis translation assembly drives the wafer taking-out disc (17) to move towards the X axial direction or the Y axial direction, and self-positioning absorption of the wafer is achieved; and the wafer installing and taking manipulator (13) is used for absorbing a wafer to be welded, and the wafer is welded to a lead wire. According to the utility model, self-positioning of the assembling position of the wafer is achieved through the lead wire longitudinal/horizontal translation assembly, the self-positioning absorption of the wafer is achieved through the wafer disc X/Y axis translation assembly, the whole assembling process is completely automatic, the assembling speed is fast, and the positioning precision is high.
Description
Technical field
The utility model relates to a kind of wafer assembly system.
Background technology
Diode is one of the most frequently used electronic devices and components; the characteristic of its maximum is exactly unilateal conduction; namely electric current can only flow through from a direction of diode; in many circuit, play an important role; the application of diode is very extensive, conventionally it is used in the circuit such as rectification, isolation, voltage stabilizing, polarity protection and coding-control.
Diode wafer is the main raw material(s) of diode, and diode wafer, according to the difference of constituent, can be divided into the Second Academy, ternary, quaternary wafer and nitride wafers; Press the difference of wafer emission wavelength, be divided into again infrared ray, red, orange, yellow, green, blue, purple all band, by size, divide, be divided into 6mil, 8mil etc.
In the production process of diode, diode wafer welding is a necessary operation.Yet current diode production producer is when carrying out diode wafer welding, mainly, by manually completing, working strength is large, and product fraction defective is higher, efficiency of assembling is low.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, a kind of energy realization assembling automatically, the wafer assembly system that assembly precision is high are provided, it has realized the self-align of wafer rigging position by lead-in wire transverse translation assembly and lead-in wire longitudinal translation assembly, by wafer disk X-axis translation assembly and wafer disk Y-axis translation assembly, realized the self-align absorption of wafer, the motion conditions of each assembly is controlled automatically by automatic control system, make whole assembling process full-automatic, assembling speed is fast, positioning precision is high.
The purpose of this utility model is achieved through the following technical solutions: wafer assembly system, it comprises lead-in wire longitudinal translation assembly, lead-in wire transverse translation assembly, working table movement assembly, wafer disk positioning component, wafer disk X-axis translation assembly, wafer disk Y-axis translation assembly and wafer dress are got manipulator, working table movement assembly comprises workbench mounting base, work top and workbench fixed mount, work top is fixedly mounted on workbench mounting base by many workbench fixed mounts, on workbench mounting base, be provided with lead-in wire transverse translation assembly, lead-in wire transverse translation assembly is arranged between workbench fixed mount a and workbench fixed mount b, lead-in wire transverse translation assembly comprises lead-in wire transverse translation pedestal, lead-in wire transverse translation slide block, lead-in wire transverse translation screw mandrel and lead-in wire transverse translation drive motors, lead-in wire transverse translation drive motors is arranged on workbench fixed mount b outside, lead-in wire transverse translation pedestal is fixed on workbench mounting base, lead-in wire transverse translation slide block is installed on lead-in wire transverse translation pedestal, lead-in wire transverse translation slide block top is provided with the thimble of guiding lead-in wire transverse translation, lead-in wire transverse translation screw mandrel one end is by shaft coupling connecting lead wire transverse translation drive motors, the other end is fixed on workbench fixed mount a through lead-in wire transverse translation slide block.
Lead-in wire longitudinal translation assembly is installed below workbench mounting base, lead-in wire longitudinal translation assembly comprises lead-in wire longitudinal translation pedestal, lead-in wire longitudinal translation drive motors and lead-in wire longitudinal translation slide rail, the upper surface of lead-in wire longitudinal translation pedestal is provided with lead-in wire longitudinal translation slide rail, between workbench mounting base and lead-in wire longitudinal translation pedestal, by lead-in wire longitudinal translation slide rail, be flexibly connected, lead-in wire longitudinal translation pedestal one end is fixed with lead-in wire longitudinal translation drive motors.
In a side of working table movement assembly, be respectively equipped with wafer dress and get manipulator, wafer disk positioning component, wafer disk X-axis translation assembly and wafer disk Y-axis translation assembly, wafer disk Y-axis translation assembly comprises Y-axis mounting base, Y-axis slide rail, the Y-axis slide block matching with Y-axis slide rail, Y-axis drive motors, Y-axis screw mandrel, the Y-axis feed screw nut who matches with Y-axis screw mandrel, two Y-axis slide rails are separately positioned on Y-axis mounting base, Y-axis feed screw nut is fixed on Y-axis slide block, Y-axis drive motors is arranged on one end of Y-axis mounting base, Y-axis screw mandrel one end is connected with Y-axis drive motors, the other end is fixed on the other end of Y-axis mounting base through Y-axis feed screw nut, wafer disk X-axis translation assembly comprises X-axis drive motors, X-axis screw mandrel, the X-axis feed screw nut who matches with X-axis screw mandrel, X-axis mounting base, X-axis slide rail, the X-axis slide block matching with X-axis slide rail is connected supporting plate with wafer disk, X-axis mounting base is arranged on the upper end of Y-axis mounting base, and be flexibly connected with Y-axis mounting base by Y-axis slide block, two X-axis slide rails are separately positioned on X-axis mounting base, X-axis feed screw nut is fixed on X-axis slide block, X-axis drive motors is arranged on one end of X-axis mounting base, X-axis screw mandrel one end is connected with X-axis drive motors, the other end is fixed on the other end of X-axis mounting base through X-axis feed screw nut, on X-axis slide block top, be installed with wafer disk and connect supporting plate, wafer taking-up dish is arranged on wafer disk and connects on supporting plate end face.
Wafer disk positioning component comprises wafer disk hold-down support, wafer fore-set and wafer fore-set drive motors, wafer fore-set drive motors is arranged in wafer disk hold-down support, on wafer disk hold-down support, be fixed with wafer fore-set, wafer taking-up dish covers on wafer disk positioning component upper end.
Further, in the both sides of lead-in wire longitudinal translation pedestal, be provided with chute, workbench mounting base is flexibly connected with lead-in wire longitudinal translation pedestal by chute.
Further, in wafer fore-set upper end, be provided with wafer thimble, wafer thimble is provided with a plurality of negative pressure holes around.
Concrete, described wafer taking-up dish central authorities are cyst membrane, chip sucking to be assembled is attached on cyst membrane.
The beneficial effects of the utility model are:
(1) be provided with lead-in wire transverse translation assembly and lead-in wire longitudinal translation assembly, in the process of wafer is installed, transverse movement and lengthwise movement by lead-in wire, realized the self-align of wafer rigging position, wafer can be assembled automatically, without artificial participation;
(2) be provided with wafer disk X-axis translation assembly and wafer disk Y-axis translation assembly, in drawing the process of wafer, by X-motion and the Y-motion of wafer disk, and then make the wafer on wafer disk can move to automatically position to be drawn, realized the self-align absorption of wafer;
(3) be provided with wafer disk positioning component, in the process of drawing at wafer, by wafer fore-set, provide a supporting surface for wafer to be drawn, avoid wafer dress to get manipulator and when drawing wafer, because wafer disk is unsettled, cause the generation of the phenomenons such as chip sucking fetch bit offset moves, cyst membrane breakage;
(4) in wafer fore-set upper end, be provided with wafer thimble, wafer thimble is provided with a plurality of negative pressure holes around, and when thimble ejects wafer, negative pressure hole absorption cyst membrane, is convenient to wafer dress and gets manipulator taking-up wafer;
(5) lead-in wire laterally and the motion of translation longitudinally, wafer disk X axis and Y-axis can adopt automatic control mode, can realize hi-Fix.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
In figure, 1-workbench mounting base, 2-work top, 3-workbench fixed mount a, 4-workbench fixed mount b, 5-lead-in wire transverse translation pedestal, 6-lead-in wire transverse translation slide block, 7-lead-in wire transverse translation screw mandrel, 8-shaft coupling, 9-lead-in wire transverse translation drive motors, 10-lead-in wire longitudinal translation pedestal, 11-lead-in wire longitudinal translation drive motors, 12-lead-in wire longitudinal translation slide rail, 13-wafer dress is got manipulator, 14-wafer disk hold-down support, 15-wafer fore-set drive motors, 16-wafer fore-set, 17-wafer taking-up dish, 18-X axis drive motor, 19-X axial filament bar, 20-X axial filament stem nut, 21-X axle mounting base, 22-wafer disk connects supporting plate, 23-X axle slide rail, 24-X axle slide block, 25-Y axle mounting base, 26-Y axle slide block, 27-Y axial filament stem nut, 28-Y axis drive motor, 29-Y axial filament bar, 30-Y axle slide rail.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail, but protection range of the present utility model is not limited to the following stated.
As shown in Figure 1, wafer assembly system, it comprises that lead-in wire longitudinal translation assembly, go between transverse translation assembly, working table movement assembly, wafer disk positioning component, wafer disk X-axis translation assembly, wafer disk Y-axis translation assembly and wafer fill and get manipulator 13, the lengthwise movement of lead-in wire longitudinal translation Component driver working table movement assembly, and then make the lead-in wire longitudinal translation on work top 2, lead-in wire transverse translation assembly is for realizing the transverse translation of lead-in wire, and then realizes the self-align of wafer and be welded.In the process of the self-align absorption of wafer, wafer disk positioning component is that wafer taking-up dish 17 provides support.Wafer disk X-axis translation assembly drives wafer taking-up dish 17 towards X-motion, and wafer disk Y-axis translation assembly drives wafer taking-up dish 17 towards Y-motion, realizes the self-align absorption of wafer.Wafer dress is got manipulator 13 for drawing wafer to be welded, and completes wafer to the action that is welded of lead-in wire, and wafer dress is got manipulator 13 by air cylinder driven.
Working table movement assembly comprises workbench mounting base 1, work top 2 and workbench fixed mount, and work top 2 is fixedly mounted on workbench mounting base 1 by many workbench fixed mounts, is provided with lead-in wire transverse translation assembly on workbench mounting base 1.Lead-in wire transverse translation assembly is arranged between workbench fixed mount a3 and workbench fixed mount b4, lead-in wire transverse translation assembly comprises lead-in wire transverse translation pedestal 5, lead-in wire transverse translation slide block 6, lead-in wire transverse translation screw mandrel 7 and lead-in wire transverse translation drive motors 9, lead-in wire transverse translation drive motors 9 is arranged on workbench fixed mount b4 outside, lead-in wire transverse translation pedestal 5 is fixed on workbench mounting base 1, lead-in wire transverse translation slide block 6 is installed on lead-in wire transverse translation pedestal 5, lead-in wire transverse translation pedestal 5 is flexibly connected with lead-in wire transverse translation slide block 6, lead-in wire transverse translation slide block 6 is under the driving of lead-in wire transverse translation drive motors 9, on lead-in wire transverse translation pedestal 5, laterally slide.Lead-in wire transverse translation slide block 6 tops are provided with the thimble of guiding lead-in wire transverse translation, and lead-in wire transverse translation screw mandrel 7 one end are by shaft coupling 8 connecting lead wire transverse translation drive motors 9, and the other end is fixed on workbench fixed mount a3 through lead-in wire transverse translation slide block 6.
Lead-in wire longitudinal translation assembly is installed below workbench mounting base 1, lead-in wire longitudinal translation assembly comprises lead-in wire longitudinal translation pedestal 10, lead-in wire longitudinal translation drive motors 11 and lead-in wire longitudinal translation slide rail 12, the upper surface of lead-in wire longitudinal translation pedestal 10 is provided with lead-in wire longitudinal translation slide rail 12, between workbench mounting base 1 and lead-in wire longitudinal translation pedestal 10, by lead-in wire longitudinal translation slide rail 12, is flexibly connected, longitudinal translation pedestal 10 one end that go between are fixed with the longitudinal translation drive motors 11 that goes between.Further, also can chute be set in the both sides of lead-in wire longitudinal translation pedestal 10, workbench mounting base 1 is flexibly connected with lead-in wire longitudinal translation pedestal 10 by chute.
In a side of working table movement assembly, be respectively equipped with wafer dress and get manipulator 13, wafer disk positioning component, wafer disk X-axis translation assembly and wafer disk Y-axis translation assembly, wafer disk Y-axis translation assembly comprises Y-axis mounting base 25, Y-axis slide rail 30, the Y-axis slide block 26 matching with Y-axis slide rail 30, Y-axis drive motors 28, Y-axis screw mandrel 29, the Y-axis feed screw nut 27 who matches with Y-axis screw mandrel 29, two Y-axis slide rails 30 are separately positioned on Y-axis mounting base 25, Y-axis feed screw nut 27 is fixed on Y-axis slide block 26, Y-axis drive motors 28 is arranged on one end of Y-axis mounting base 25, Y-axis screw mandrel 29 one end are connected with Y-axis drive motors 28, the other end is fixed on the other end of Y-axis mounting base 25 through Y-axis feed screw nut 27.
Wafer disk X-axis translation assembly comprises X-axis drive motors 18, X-axis screw mandrel 19, the X-axis feed screw nut 20 who matches with X-axis screw mandrel 19, X-axis mounting base 21, X-axis slide rail 23, the X-axis slide block 24 matching with X-axis slide rail 23 is connected supporting plate 22 with wafer disk, X-axis mounting base 21 is arranged on the upper end of Y-axis mounting base 25, and be flexibly connected with Y-axis mounting base 25 by Y-axis slide block 26, two X-axis slide rails 23 are separately positioned on X-axis mounting base 21, X-axis feed screw nut 20 is fixed on X-axis slide block 24, X-axis drive motors 18 is arranged on one end of X-axis mounting base 21, X-axis screw mandrel 19 one end are connected with X-axis drive motors 18, the other end is fixed on the other end of X-axis mounting base 21 through X-axis feed screw nut 20, on X-axis slide block 24 tops, be installed with wafer disk and connect supporting plate 22, wafer taking-up dish 17 is arranged on wafer disk and connects on supporting plate 22 end faces.
Wafer disk positioning component comprises wafer disk hold-down support 14, wafer fore-set 16 and wafer fore-set drive motors 15, wafer fore-set drive motors 15 is arranged in wafer disk hold-down support 14, on wafer disk hold-down support 14, be fixed with wafer fore-set 16, wafer taking-up dish 17 covers on wafer disk positioning component upper end.Further, in wafer fore-set 16 upper ends, be provided with wafer thimble, wafer thimble is provided with a plurality of negative pressure holes around.Concrete, described wafer taking-up dish 17 central authorities are cyst membrane, chip sucking to be assembled is attached on cyst membrane.Directly over wafer taking-up dish 17, also wafer detection device can be set, for detecting in real time the position that wafer on 17 cyst membranes is coiled in wafer taking-up, and detection information be fed back to controller, the accuracy moving to improve wafer taking-up dish 17.
The course of work of the present utility model is as follows: automatic control system consists of servomotor, servo-drive, controller, position grating scale, and positioning precision is high.Between automatic control system and host computer, can communicate with one another, automatic control system can be controlled in real time by upper computer software.Wafer disk X-axis translation assembly and wafer disk Y-axis translation assembly, by the situation of controller controlled motion, make wafer taking-up dish 17 move to tram, are convenient to wafer dress and get accurate absorption of manipulator 13 and be positioned at the wafer on wafer taking-up dish 17.Lead-in wire on work top 2 moves to wafer while being welded the position at work station, wafer dress is got manipulator 13 and is drawn wafer and wafer is welded to lead-in wire from wafer taking-up dish 17, the lengthwise movement of the whole working table movement assembly of lead-in wire longitudinal translation Component driver, drive lead-in wire longitudinal translation, complete being welded one by one of wafer of lead-in wire lengthwise position, until lengthwise position wafer has all been welded, lead-in wire transverse translation slide block 6 in lead-in wire transverse translation assembly is under the drive of lead-in wire transverse translation screw mandrel 7, on lead-in wire transverse translation pedestal 5, slide, by the thimble guiding lead-in wire transverse translation of lead-in wire transverse translation slide block 6 upper ends, the i.e. direction translation at past next work station, running so repeatedly.
Claims (4)
1. wafer assembly system, it is characterized in that: it comprises lead-in wire longitudinal translation assembly, lead-in wire transverse translation assembly, working table movement assembly, wafer disk positioning component, wafer disk X-axis translation assembly, wafer disk Y-axis translation assembly and wafer dress are got manipulator (13), working table movement assembly comprises workbench mounting base (1), work top (2) and workbench fixed mount, work top (2) is fixedly mounted on workbench mounting base (1) by many workbench fixed mounts, on workbench mounting base (1), be provided with lead-in wire transverse translation assembly, lead-in wire transverse translation assembly is arranged on workbench fixed mount a(3) and workbench fixed mount b(4) between, lead-in wire transverse translation assembly comprises lead-in wire transverse translation pedestal (5), lead-in wire transverse translation slide block (6), lead-in wire transverse translation screw mandrel (7) and lead-in wire transverse translation drive motors (9), lead-in wire transverse translation drive motors (9) is arranged on workbench fixed mount b(4) outside, lead-in wire transverse translation pedestal (5) is fixed on workbench mounting base (1), lead-in wire transverse translation slide block (6) is installed on lead-in wire transverse translation pedestal (5), lead-in wire transverse translation slide block (6) top is provided with the thimble of guiding lead-in wire transverse translation, lead-in wire transverse translation screw mandrel (7) one end is by shaft coupling (8) connecting lead wire transverse translation drive motors (9), the other end is fixed on workbench fixed mount a(3 through lead-in wire transverse translation slide block (6)) on,
Lead-in wire longitudinal translation assembly is installed in workbench mounting base (1) below, lead-in wire longitudinal translation assembly comprises lead-in wire longitudinal translation pedestal (10), lead-in wire longitudinal translation drive motors (11) and lead-in wire longitudinal translation slide rail (12), the upper surface of lead-in wire longitudinal translation pedestal (10) is provided with lead-in wire longitudinal translation slide rail (12), between workbench mounting base (1) and lead-in wire longitudinal translation pedestal (10), by lead-in wire longitudinal translation slide rail (12), is flexibly connected, longitudinal translation pedestal (10) one end that goes between is fixed with the longitudinal translation drive motors (11) that goes between;
In a side of working table movement assembly, be respectively equipped with wafer dress and get manipulator (13), wafer disk positioning component, wafer disk X-axis translation assembly and wafer disk Y-axis translation assembly, wafer disk Y-axis translation assembly comprises Y-axis mounting base (25), Y-axis slide rail (30), the Y-axis slide block (26) matching with Y-axis slide rail (30), Y-axis drive motors (28), Y-axis screw mandrel (29), the Y-axis feed screw nut (27) who matches with Y-axis screw mandrel (29), two Y-axis slide rails (30) are separately positioned on Y-axis mounting base (25), Y-axis feed screw nut (27) is fixed on Y-axis slide block (26), Y-axis drive motors (28) is arranged on one end of Y-axis mounting base (25), Y-axis screw mandrel (29) one end is connected with Y-axis drive motors (28), the other end is fixed on the other end of Y-axis mounting base (25) through Y-axis feed screw nut (27), wafer disk X-axis translation assembly comprises X-axis drive motors (18), X-axis screw mandrel (19), the X-axis feed screw nut (20) who matches with X-axis screw mandrel (19), X-axis mounting base (21), X-axis slide rail (23), the X-axis slide block (24) matching with X-axis slide rail (23) is connected supporting plate (22) with wafer disk, X-axis mounting base (21) is arranged on the upper end of Y-axis mounting base (25), and be flexibly connected with Y-axis mounting base (25) by Y-axis slide block (26), two X-axis slide rails (23) are separately positioned on X-axis mounting base (21), X-axis feed screw nut (20) is fixed on X-axis slide block (24), X-axis drive motors (18) is arranged on one end of X-axis mounting base (21), X-axis screw mandrel (19) one end is connected with X-axis drive motors (18), the other end is fixed on the other end of X-axis mounting base (21) through X-axis feed screw nut (20), on X-axis slide block (24) top, be installed with wafer disk and connect supporting plate (22), wafer taking-up dish (17) is arranged on wafer disk and connects on supporting plate (22) end face,
Wafer disk positioning component comprises wafer disk hold-down support (14), wafer fore-set (16) and wafer fore-set drive motors (15), wafer fore-set drive motors (15) is arranged in wafer disk hold-down support (14), on wafer disk hold-down support (14), be fixed with wafer fore-set (16), wafer taking-up dish (17) covers on wafer disk positioning component upper end.
2. wafer assembly system according to claim 1, is characterized in that: the both sides of described lead-in wire longitudinal translation pedestal (10) are provided with chute, and workbench mounting base (1) is flexibly connected with lead-in wire longitudinal translation pedestal (10) by chute.
3. wafer assembly system according to claim 1, is characterized in that: described wafer fore-set (16) upper end is provided with wafer thimble, and wafer thimble is provided with a plurality of negative pressure holes around.
4. wafer assembly system according to claim 1, is characterized in that: described wafer taking-up dish (17) central authorities are cyst membrane, and chip sucking to be assembled is attached on cyst membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320629015.5U CN203491228U (en) | 2013-10-12 | 2013-10-12 | Wafer assembling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320629015.5U CN203491228U (en) | 2013-10-12 | 2013-10-12 | Wafer assembling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203491228U true CN203491228U (en) | 2014-03-19 |
Family
ID=50262038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320629015.5U Withdrawn - After Issue CN203491228U (en) | 2013-10-12 | 2013-10-12 | Wafer assembling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203491228U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531505A (en) * | 2013-10-12 | 2014-01-22 | 四川蓝彩电子科技有限公司 | Wafer assembly system |
| CN113192867A (en) * | 2016-03-11 | 2021-07-30 | 捷进科技有限公司 | Chip mounting device and method for manufacturing semiconductor device |
-
2013
- 2013-10-12 CN CN201320629015.5U patent/CN203491228U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531505A (en) * | 2013-10-12 | 2014-01-22 | 四川蓝彩电子科技有限公司 | Wafer assembly system |
| CN103531505B (en) * | 2013-10-12 | 2015-12-30 | 四川蓝彩电子科技有限公司 | Wafer assembly system |
| CN113192867A (en) * | 2016-03-11 | 2021-07-30 | 捷进科技有限公司 | Chip mounting device and method for manufacturing semiconductor device |
| CN113192867B (en) * | 2016-03-11 | 2024-01-23 | 捷进科技有限公司 | Chip mounting apparatus and method for manufacturing semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Wafer assembly system Effective date of registration: 20141106 Granted publication date: 20140319 Pledgee: Suining City Commercial Bank Limited by Share Ltd Jinlong branch Pledgor: The Sichuan color electronics technology of indigo plant company limited Registration number: 2014510000031 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20151123 Granted publication date: 20140319 Pledgee: Suining City Commercial Bank Limited by Share Ltd Jinlong branch Pledgor: The Sichuan color electronics technology of indigo plant company limited Registration number: 2014510000031 |
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| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140319 Effective date of abandoning: 20151230 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20140319 Effective date of abandoning: 20151230 |
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| C25 | Abandonment of patent right or utility model to avoid double patenting |