CN114227959A - Grinding wheel scribing machine with auxiliary cutting and positioning function for wafer processing - Google Patents
Grinding wheel scribing machine with auxiliary cutting and positioning function for wafer processing Download PDFInfo
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- CN114227959A CN114227959A CN202111525868.XA CN202111525868A CN114227959A CN 114227959 A CN114227959 A CN 114227959A CN 202111525868 A CN202111525868 A CN 202111525868A CN 114227959 A CN114227959 A CN 114227959A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 39
- 238000000227 grinding Methods 0.000 title description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 43
- 238000003860 storage Methods 0.000 claims description 13
- 230000008602 contraction Effects 0.000 claims description 6
- 229910001651 emery Inorganic materials 0.000 claims description 6
- 230000000087 stabilizing effect Effects 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 239000007858 starting material Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 33
- 230000000694 effects Effects 0.000 description 5
- 238000011010 flushing procedure Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009347 mechanical transmission Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to the technical field of abrasive wheel scribers, and discloses an abrasive wheel scriber with auxiliary cutting and positioning function for wafer processing, which comprises a base, wherein a supporting column is fixedly connected to the top of the base, a top plate is fixedly connected to the top of the supporting column, a cutting structure is arranged at the bottom of the top plate, an auxiliary structure is arranged at the top of the base, a sliding structure is arranged inside the auxiliary structure, and the cutting structure comprises an electric telescopic cylinder. This abrasive wheel scribing machine is used in wafer processing with supplementary cutting location, through placing the wafer at the top of placing the board, then start electric hydraulic cylinder, electric hydraulic cylinder drives the hydraulic stem, make the hydraulic stem drive spur rack and slurcam fix and spacing to the wafer, simultaneously through starter motor, the motor drives the axis of rotation, make the axis of rotation drive belt body and first gyro wheel rotate, first gyro wheel just can drive like this and place the board and remove to the left side, be convenient for remove the location cutting to the wafer.
Description
Technical Field
The invention relates to the technical field of abrasive wheel scribers, in particular to an abrasive wheel scriber with auxiliary cutting and positioning function for wafer processing.
Background
The wafer scriber comprises a grinding wheel wafer scriber and a laser wafer scriber, and is also the grinding wheel wafer scriber which integrates the precise numerical control equipment of the technologies of a water-gas-electricity and air static pressure high-speed main shaft, precise mechanical transmission, a sensor, automation control and the like at present, is mainly used for the scribing processing of materials such as silicon integrated circuits, light-emitting diodes and the like and the specific application such as the scribing of prepared wafers, but the existing wafers have some problems to be improved in the process of cutting the materials by the grinding wheel wafer scriber, and firstly, the wafers are not well positioned due to the morphological problems in the cutting process; secondly, when a wafer is cut, the wafer is easy to move and unstable, and the cutting position is easy to be wrong, so that the grinding wheel scribing machine with the auxiliary cutting positioning function for wafer processing is provided for solving the problems.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the grinding wheel dicing saw with the auxiliary cutting positioning function for wafer processing, which has the advantages of auxiliary cutting positioning function, stable movement and the like, and solves the problems in the background technology.
The technical scheme adopted by the invention for solving the technical problems is as follows: a grinding wheel dicing saw with auxiliary cutting and positioning functions for wafer processing comprises a base, wherein a supporting column is fixedly connected to the top of the base, a top plate is fixedly connected to the top of the supporting column, a cutting structure is arranged at the bottom of the top plate, an auxiliary structure is arranged at the top of the base, and a sliding structure is arranged inside the auxiliary structure;
the cutting structure comprises an electric telescopic cylinder, the bottom of the electric telescopic cylinder is fixedly connected to the top of the top plate, the inside of the electric telescopic cylinder is movably connected with a telescopic rod, the bottom of the telescopic rod is fixedly connected with a connecting plate, the bottom of the connecting plate is fixedly connected with a U-shaped frame, the inside of the U-shaped frame is rotatably connected with a scribing grinding wheel, an output end of the scribing grinding wheel is fixedly connected with a driving machine, and the top of the connecting plate is provided with a washing structure.
Furthermore, the flushing structure comprises a water tank, the bottom of the water tank is fixedly connected to the top of the top plate, a contraction pipe is fixedly communicated with the top of the water tank, a water pump is fixedly communicated with the bottom end of the contraction pipe, a water inlet pipe is fixedly communicated with the inside of the right side of the water pump, a water storage pipe is fixedly communicated with the bottom end of the water inlet pipe, and a water spraying head is movably mounted at the bottom of the water storage pipe.
Further, the auxiliary structure includes the workstation, the bottom fixed connection of workstation is at the top of base, the spacing groove has been seted up at the top of workstation, the inside of workstation is close to the bottom of spacing groove and has seted up the rectangular channel, the inside of workstation is rotated and is connected with the axis of rotation, the front end outer wall fixedly connected with belt pulley of axis of rotation, the outer wall of belt pulley rotates and is connected with the belt body, the first gyro wheel of outer wall fixedly connected with of axis of rotation, the rear end outer wall fixed connection of axis of rotation is in the inside of motor, the inside of workstation is provided with stable structure, the spout has been seted up to one side that the inside of workstation is close to the spacing groove.
Further, stable structure includes the cavity, the inside at the workstation is seted up to the cavity, the spread groove has been seted up at the top of cavity, the inner wall fixedly connected with fixed block of cavity, the inside swing joint in right side of fixed block has first loose axle, the outer wall swing joint of first loose axle has the adjustable shelf, the inside swing joint in bottom of adjustable shelf has the second loose axle, the outer wall swing joint of second loose axle has the pulley, the first spring of bottom outer wall fixedly connected with of adjustable shelf, one side sliding connection of pulley has the trapezoidal piece, the rear side outer wall fixedly connected with sliding block of trapezoidal piece, the outer wall sliding connection of sliding block is in the inside of sliding tray, the top right side fixedly connected with second spring of adjustable shelf, the inside movable mounting in bottom of trapezoidal piece has the second gyro wheel.
Further, the sliding structure is including placing the board, place board swing joint in the inside of spacing groove, the top fixedly connected with limiting plate of placing the board, the through-hole has been seted up to the inside of limiting plate, the inside of through-hole is provided with limit structure.
Further, limit structure includes the spur rack, spur rack swing joint is in the inside of through-hole, the rear end fixedly connected with hydraulic stem of spur rack, the rear end outer wall swing joint of hydraulic stem is in electric hydraulic cylinder's inside, electric hydraulic cylinder's bottom fixed connection is at the top of placing the board, the front end fixedly connected with slurcam of spur rack, the front side fixedly connected with rubber pad of slurcam, the right side outer wall of spur rack and the outer wall of gear mesh mutually, the inside swing joint of gear is at the outer wall of fixed axle, the bottom fixed connection of fixed axle is in the inside of through-hole.
Furthermore, the rear side of the driving machine is fixedly installed on the outer wall of the front side of the U-shaped frame, the bottom of the water storage pipe penetrates through the inside of the connecting plate, and the bottom of the water pump is fixedly connected to the top of the water storage pipe.
Further, the inside swing joint of rectangular channel has first gyro wheel, the sliding tray has been seted up to the inside one side that is close to the cavity of workstation, the quantity of adjustable shelf has two, and the size of every adjustable shelf is the same.
Furthermore, the inside sliding connection of spout has places the board, the front side top swing joint who places the board has the second gyro wheel, the bottom swing joint who places the board has first gyro wheel, the quantity of first gyro wheel has a plurality of, and the size of every first gyro wheel is the same.
Furthermore, the front side of motor fixed connection is at the rear side outer wall of workstation, limit structure's quantity has six, and every limit structure's size is the same.
The invention has the beneficial effects that:
1. this abrasive wheel scribing machine is used in wafer processing with supplementary cutting location, through placing the wafer at the top of placing the board, then start electric hydraulic cylinder, electric hydraulic cylinder drives the hydraulic stem, make the hydraulic stem drive spur rack and slurcam fix and spacing to the wafer, simultaneously through starter motor, the motor drives the axis of rotation, make the axis of rotation drive belt body and first gyro wheel rotate, first gyro wheel just can drive like this and place the board and remove to the left side, be convenient for remove the location cutting to the wafer.
2. This wafer processing is with emery wheel scribing machine with supplementary cutting location through the setting of trapezoidal piece, adjustable shelf, pulley, second gyro wheel, sliding block, first spring and second spring, places in the inside of spout when placing the front and back both ends of board, through the pulley of trapezoidal piece both sides and the extrusion of first spring to the trapezoidal piece, makes to place the board and played the effect that the removal is stable.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
FIG. 1 is a perspective view of the structure of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic view of an auxiliary structure of the present invention;
FIG. 4 is a schematic view of a stabilization construct of the present invention;
fig. 5 is a schematic view of the limiting structure of the present invention.
Description of reference numerals: 1. a base; 2. a support pillar; 3. a top plate; 4. cutting the structure; 41. an electric telescopic cylinder; 42. a telescopic rod; 43. a connecting plate; 44. a U-shaped frame; 45. scribing a grinding wheel; 46. a driver; 47. flushing the structure; 471. a water tank; 472. a shrink tube; 473. a water pump; 474. a water inlet pipe; 475. a water storage pipe; 476. a sprinkler head; 5. an auxiliary structure; 51. a work table; 52. a limiting groove; 53. a rectangular groove; 54. a rotating shaft; 55. a belt pulley; 56. a belt body; 57. a first roller; 58. a motor; 59. stabilizing the structure; 591. a cavity; 592. connecting grooves; 593. a fixed block; 594. a first movable shaft; 595. a movable frame; 596. a second movable shaft; 597. a pulley; 598. a first spring; 599. a trapezoidal block; 5910. a slider; 5911. a sliding groove; 5912. a second spring; 5913. a second roller; 510. a chute; 6. a sliding structure; 61. placing the plate; 62. a limiting plate; 63. a through hole; 64. a limiting structure; 641. straight rack; 642. a hydraulic lever; 643. an electric hydraulic cylinder; 644. a push plate; 645. a rubber pad; 646. a gear; 647. and fixing the shaft.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-5, a grinding wheel dicing saw with auxiliary cutting positioning for wafer processing includes a base 1, a supporting pillar 2 fixedly connected to the top of the base 1, a top plate 3 fixedly connected to the top of the supporting pillar 2, a cutting structure 4 arranged at the bottom of the top plate 3, an auxiliary structure 5 arranged at the top of the base 1, and a sliding structure 6 arranged inside the auxiliary structure 5;
cutting structure 4 includes electronic telescoping cylinder 41, and the bottom fixed connection of electronic telescoping cylinder 41 is at the top of roof 3, and the inside swing joint of electronic telescoping cylinder 41 has telescopic link 42, and telescopic link 42's bottom fixedly connected with connecting plate 43, the bottom fixedly connected with U-shaped frame 44 of connecting plate 43, and the internal rotation of U-shaped frame 44 is connected with scribing emery wheel 45, and scribing emery wheel 45's output fixedly connected with driving machine 46, the top of connecting plate 43 is provided with washes structure 47.
The flushing structure 47 comprises a water tank 471, the bottom of the water tank 471 is fixedly connected to the top of the top plate 3, the top of the water tank 471 is fixedly communicated with a contraction pipe 472, the bottom end of the contraction pipe 472 is fixedly communicated with a water pump 473, the inside of the right side of the water pump 473 is fixedly communicated with a water inlet pipe 474, the bottom end of the water inlet pipe 474 is fixedly communicated with a water storage pipe 475, and the bottom of the water storage pipe 475 is movably provided with a water spray head 476; through the arrangement of the flushing structure 47, the effect of cleaning the workbench 51 and the wafer conveniently is realized, and the surface cleanliness of the workbench 51 is ensured.
The auxiliary structure 5 comprises a workbench 51, the bottom of the workbench 51 is fixedly connected to the top of the base 1, a limiting groove 52 is formed in the top of the workbench 51, a rectangular groove 53 is formed in the inner portion of the workbench 51, which is close to the bottom of the limiting groove 52, a rotating shaft 54 is rotatably connected to the inner portion of the workbench 51, a belt pulley 55 is fixedly connected to the outer wall of the front end of the rotating shaft 54, a belt body 56 is rotatably connected to the outer wall of the belt pulley 55, a first roller 57 is fixedly connected to the outer wall of the rotating shaft 54, the outer wall of the rear end of the rotating shaft 54 is fixedly connected to the inner portion of a motor 58, a stable structure 59 is arranged in the workbench 51, and a sliding groove 510 is formed in one side, which is close to the limiting groove 52, of the inner portion of the workbench 51; through the setting of auxiliary structure 5, realized being convenient for to remove spacing effect to the wafer, prevented that the wafer is unstable when carrying out the cutting, lead to cutting position mistake.
The stabilizing structure 59 comprises a cavity 591, the cavity 591 is arranged inside the workbench 51, a connecting groove 592 is formed in the top of the cavity 591, a fixed block 593 is fixedly connected to the inner wall of the cavity 591, a first movable shaft 594 is movably connected to the inside of the right side of the fixed block 593, a movable frame 595 is movably connected to the outer wall of the first movable shaft 594, a second movable shaft 596 is movably connected to the inside of the bottom end of the movable frame 595, a pulley 597 is movably connected to the outer wall of the right side of the second movable shaft 596, a first spring 598 is fixedly connected to the outer wall of the bottom end of the movable frame 595, a trapezoidal block 599 is slidably connected to one side of the pulley 597, a sliding block 5910 is fixedly connected to the outer wall of the rear side of the trapezoidal block 599, the outer wall of the sliding block 5910 is slidably connected to the inside of the sliding groove 5911, a second spring 5912 is fixedly connected to the right side of the top end of the movable frame 595, and a second roller 5913 is movably mounted inside the bottom end of the trapezoidal block 599; when the wafer is cut, since the wafer is in a moving state at the time, the placing plate 61 has an effect of moving stably by pressing the trapezoidal block 599 through the pulleys 597 and the first spring 598 on both sides of the trapezoidal block 599.
The sliding structure 6 comprises a placing plate 61, the placing plate 61 is movably connected inside the limiting groove 52, a limiting plate 62 is fixedly connected to the top of the placing plate 61, a through hole 63 is formed inside the limiting plate 62, and a limiting structure 64 is arranged inside the through hole 63.
The limiting structure 64 comprises a straight rack 641, the straight rack 641 is movably connected inside the through hole 63, a hydraulic rod 642 is fixedly connected to the rear end of the straight rack 641, the outer wall of the rear end of the hydraulic rod 642 is movably connected inside an electric hydraulic cylinder 643, the bottom of the electric hydraulic cylinder 643 is fixedly connected to the top of the placing plate 61, a pushing plate 644 is fixedly connected to the front end of the straight rack 641, a rubber pad 645 is fixedly connected to the front side of the pushing plate 644, the outer wall of the right side of the straight rack 641 is meshed with the outer wall of a gear 646, the inside of the gear 646 is movably connected to the outer wall of a fixed shaft 647, and the bottom of the fixed shaft 647 is fixedly connected inside the through hole 63; through placing the wafer on the top of placing board 61, then start electric hydraulic cylinder 643, electric hydraulic cylinder 643 drives hydraulic rod 642, makes hydraulic rod 642 drive spur rack 641 and pushing plate 644 and fix and spacing to the wafer, simultaneously through starter motor 58, motor 58 drives axis of rotation 54, makes axis of rotation 54 drive belt body 56 and first gyro wheel 57 rotate, and first gyro wheel 57 just so can drive and place board 61 and move to the left side, is convenient for move the location cutting to the wafer.
The rear side of the driving machine 46 is fixedly installed on the outer wall of the front side of the U-shaped frame 44, the bottom of the water storage pipe 475 penetrates through the inside of the connecting plate 43, and the bottom of the water pump 473 is fixedly connected to the top of the water storage pipe 475.
The first roller 57 is movably connected inside the rectangular groove 53, the sliding groove 5911 is formed in one side, close to the cavity 591, of the inside of the workbench 51, the number of the movable frames 595 is two, and the size of each movable frame 595 is the same.
The inside sliding connection of spout 510 has place board 61, places the front side top swing joint of board 61 and has second gyro wheel 5913, places the bottom swing joint of board 61 and has first gyro wheel 57, and the quantity of first gyro wheel 57 has a plurality of, and every first gyro wheel 57's size is the same.
The front side of the motor 58 is fixedly connected to the outer wall of the rear side of the workbench 51, the number of the limiting structures 64 is six, and the size of each limiting structure 64 is the same.
When the wafer positioning device is used, a wafer is placed on the top of the placing plate 61, then the electric hydraulic cylinder 643 is started, the electric hydraulic cylinder 643 drives the hydraulic rod 642, the hydraulic rod 642 drives the spur rack 641 and the pushing plate 644 to fix and limit the wafer, meanwhile, the motor 58 drives the rotating shaft 54 by starting the motor 58, the rotating shaft 54 drives the belt body 56 and the first roller 57 to rotate, and therefore the first roller 57 can drive the placing plate 61 to move towards the left side, and the wafer is convenient to move, position and cut; through the arrangement of the trapezoidal block 599, the movable frame 595, the pulley 597, the second roller 5913, the sliding block 5910, the first spring 598 and the second spring 5912, when the front end and the rear end of the placing plate 61 are placed in the sliding groove 510, the placing plate 61 has the effect of moving stably through the extrusion of the pulley 597 and the first spring 598 on the two sides of the trapezoidal block 599 on the trapezoidal block 599.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a wafer processing is with emery wheel wafer scriber with supplementary cutting location, includes base (1), its characterized in that: the top of the base (1) is fixedly connected with a supporting column (2), the top of the supporting column (2) is fixedly connected with a top plate (3), the bottom of the top plate (3) is provided with a cutting structure (4), the top of the base (1) is provided with an auxiliary structure (5), and a sliding structure (6) is arranged inside the auxiliary structure (5);
cutting structure (4) include electronic telescoping cylinder (41), the bottom fixed connection of electronic telescoping cylinder (41) is at the top of roof (3), the inside swing joint of electronic telescoping cylinder (41) has telescopic link (42), the bottom fixedly connected with connecting plate (43) of telescopic link (42), the bottom fixedly connected with U-shaped frame (44) of connecting plate (43), the internal rotation of U-shaped frame (44) is connected with scribing emery wheel (45), the output fixedly connected with driving machine (46) of scribing emery wheel (45), the top of connecting plate (43) is provided with washes structure (47).
2. The wafer processing abrasive wheel scribing machine with auxiliary cutting positioning function as claimed in claim 1, wherein: the washing structure (47) comprises a water tank (471), the bottom of the water tank (471) is fixedly connected to the top of the top plate (3), the top of the water tank (471) is fixedly communicated with a contraction pipe (472), the bottom end of the contraction pipe (472) is fixedly communicated with a water pump (473), the right side of the water pump (473) is fixedly communicated with a water inlet pipe (474), the bottom end of the water inlet pipe (474) is fixedly communicated with a water storage pipe (475), and the bottom of the water storage pipe (475) is movably provided with a water spray head (476).
3. The wafer processing abrasive wheel scribing machine with auxiliary cutting positioning function as claimed in claim 2, wherein: the auxiliary structure (5) comprises a workbench (51), the bottom of the workbench (51) is fixedly connected with the top of the base (1), the top of the workbench (51) is provided with a limit groove (52), the inner part of the workbench (51) close to the bottom of the limit groove (52) is provided with a rectangular groove (53), a rotating shaft (54) is rotatably connected inside the workbench (51), the outer wall of the front end of the rotating shaft (54) is fixedly connected with a belt pulley (55), the outer wall of the belt pulley (55) is rotationally connected with a belt body (56), the outer wall of the rotating shaft (54) is fixedly connected with a first roller (57), the outer wall of the rear end of the rotating shaft (54) is fixedly connected inside the motor (58), the inside of workstation (51) is provided with stable structure (59), spout (510) have been seted up to the inside one side that is close to spacing groove (52) of workstation (51).
4. The wafer processing abrasive wheel scribing machine with auxiliary cutting positioning function as claimed in claim 3, wherein: the stabilizing structure (59) comprises a cavity (591), the cavity (591) is arranged in the workbench (51), a connecting groove (592) is formed in the top of the cavity (591), a fixing block (593) is fixedly connected to the inner wall of the cavity (591), a first movable shaft (594) is movably connected to the inner side of the right side of the fixing block (593), a movable frame (595) is movably connected to the outer wall of the first movable shaft (594), a second movable shaft (596) is movably connected to the inner side of the bottom end of the movable frame (595), a pulley (597) is movably connected to the outer wall of the second movable shaft (596), a first spring (598) is fixedly connected to the outer wall of the bottom end of the movable frame (595), a trapezoidal block (599) is slidably connected to one side of the pulley (597), a sliding block (5910) is fixedly connected to the outer wall of the rear side of the trapezoidal block (599), and a sliding block (5910) is slidably connected to the outer wall of the sliding block (5910) in the sliding groove (5911), the top right side of adjustable shelf (595) is fixedly connected with second spring (5912), inside movable mounting in the bottom of trapezoidal piece (599) has second gyro wheel (5913).
5. The wafer processing abrasive wheel scribing machine with auxiliary cutting positioning function as claimed in claim 4, wherein: sliding structure (6) are including placing board (61), place board (61) swing joint in the inside of spacing groove (52), the top fixedly connected with limiting plate (62) of placing board (61), through-hole (63) have been seted up to the inside of limiting plate (62), the inside of through-hole (63) is provided with limit structure (64).
6. The wafer processing abrasive wheel scribing machine with auxiliary cutting positioning function as claimed in claim 5, wherein: limiting structure (64) include spur rack (641), spur rack (641) swing joint is in the inside of through-hole (63), the rear end fixedly connected with hydraulic stem (642) of spur rack (641), the rear end outer wall swing joint of hydraulic stem (642) is in the inside of electric hydraulic cylinder (643), the bottom fixed connection of electric hydraulic cylinder (643) is at the top of placing board (61), the front end fixedly connected with slurcam (644) of spur rack (641), the front side fixedly connected with rubber pad (645) of slurcam (644), the right side outer wall of spur rack (641) and the outer wall of gear (646) mesh mutually, the inside swing joint of gear (646) is at the outer wall of fixed axle (647), the bottom fixed connection of fixed axle (647) is in the inside of through-hole (63).
7. The wafer processing abrasive wheel scribing machine with auxiliary cutting positioning function as claimed in claim 6, wherein: the rear side of the driving machine (46) is fixedly arranged on the outer wall of the front side of the U-shaped frame (44), the bottom of the water storage pipe (475) penetrates through the inside of the connecting plate (43), and the bottom of the water pump (473) is fixedly connected to the top of the water storage pipe (475).
8. The wafer processing abrasive wheel scribing machine with auxiliary cutting positioning function as claimed in claim 7, wherein: the inside swing joint of rectangular channel (53) has first gyro wheel (57), sliding tray (5911) have been seted up to the inside one side that is close to cavity (591) of workstation (51), the quantity of adjustable shelf (595) has two, and the size of every adjustable shelf (595) is the same.
9. The wafer processing abrasive wheel scribing machine with auxiliary cutting positioning function as claimed in claim 8, wherein: the inner portion of the sliding groove (510) is connected with a placing plate (61) in a sliding mode, the top of the front side of the placing plate (61) is movably connected with a second roller (5913), the bottom of the placing plate (61) is movably connected with a first roller (57), the number of the first rollers (57) is several, and the size of each first roller (57) is the same.
10. The wafer processing abrasive wheel scribing machine with auxiliary cutting positioning function as claimed in claim 9, wherein: the front side of the motor (58) is fixedly connected to the outer wall of the rear side of the workbench (51), the number of the limiting structures (64) is six, and the size of each limiting structure (64) is the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111525868.XA CN114227959A (en) | 2021-12-14 | 2021-12-14 | Grinding wheel scribing machine with auxiliary cutting and positioning function for wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111525868.XA CN114227959A (en) | 2021-12-14 | 2021-12-14 | Grinding wheel scribing machine with auxiliary cutting and positioning function for wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114227959A true CN114227959A (en) | 2022-03-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111525868.XA Pending CN114227959A (en) | 2021-12-14 | 2021-12-14 | Grinding wheel scribing machine with auxiliary cutting and positioning function for wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114227959A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209478632U (en) * | 2018-11-13 | 2019-10-11 | 泰州芯格电子科技有限公司 | Scribing machine is used in a kind of cutting of wafer wet type |
| CN111451917A (en) * | 2020-04-12 | 2020-07-28 | 嘉兴巨腾信息科技有限公司 | Wafer scribing machine for semiconductor processing |
| CN211440666U (en) * | 2019-11-26 | 2020-09-08 | 东莞平晶微电子科技有限公司 | Automatic cutting machine for semiconductor packaging wafer |
| WO2021223129A1 (en) * | 2020-05-07 | 2021-11-11 | 江苏江海机床集团有限公司 | High shearing, bending, and rolling cnc machine tool having precise positioning |
| CN214724442U (en) * | 2021-04-01 | 2021-11-16 | 东莞市译码半导体有限公司 | Semiconductor cutting device with fixing function |
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2021
- 2021-12-14 CN CN202111525868.XA patent/CN114227959A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209478632U (en) * | 2018-11-13 | 2019-10-11 | 泰州芯格电子科技有限公司 | Scribing machine is used in a kind of cutting of wafer wet type |
| CN211440666U (en) * | 2019-11-26 | 2020-09-08 | 东莞平晶微电子科技有限公司 | Automatic cutting machine for semiconductor packaging wafer |
| CN111451917A (en) * | 2020-04-12 | 2020-07-28 | 嘉兴巨腾信息科技有限公司 | Wafer scribing machine for semiconductor processing |
| WO2021223129A1 (en) * | 2020-05-07 | 2021-11-11 | 江苏江海机床集团有限公司 | High shearing, bending, and rolling cnc machine tool having precise positioning |
| CN214724442U (en) * | 2021-04-01 | 2021-11-16 | 东莞市译码半导体有限公司 | Semiconductor cutting device with fixing function |
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