CN211221059U

CN211221059U - Impulse channel equipment for integrated circuit

Info

Publication number: CN211221059U
Application number: CN201921692535.4U
Authority: CN
Inventors: 曹立龙; 刘文超; 黄银青; 方唐利; 朱晟; 陈海涛; 钱明
Original assignee: Anhui Naike Equipment Technology Co ltd
Current assignee: Anhui Naike Equipment Technology Co ltd
Priority date: 2019-10-10
Filing date: 2019-10-10
Publication date: 2020-08-11
Anticipated expiration: 2029-10-10

Abstract

The utility model discloses a towards runner equipment for integrated circuit, including the support body to and be located buffer memory district, towards runner district and collecting region in the frame. The flushing runner device is compact in structure and improves working efficiency.

Description

Impulse channel equipment for integrated circuit

Technical Field

The present invention relates to an apparatus for manufacturing an integrated circuit, and more particularly, to a runner apparatus for an integrated circuit.

Background

Currently, the process work after the integrated circuit package is realized is completed by different devices which are scattered. For example, the runner process is performed on the integrated circuit by a runner mold. After the flow channel punching process, the finished product after the flow channel punching is manually placed in a finished product collecting device, or the finished product is taken out of the flow channel punching mold by a manipulator and then placed in the finished product collecting device. Because each device sets up alone, occupy more places on the one hand, secondly need more operating personnel to lead to product quality unstable, uncontrollable, production efficiency is low, with high costs.

Disclosure of Invention

The utility model provides a towards runner equipment for integrated circuit, compact structure improves work efficiency.

In order to solve the technical problem, the embodiment of the utility model provides an adopt following technical scheme:

a flow channel flushing device for an integrated circuit comprises a frame body, and a buffer area, a flow channel flushing area and a collecting area which are arranged on the frame body.

Preferably, during normal operation, the integrated circuit flows according to the sequence of the buffer area, the flushing channel area and the collecting area.

As a preferred example, the channel flushing area and the collecting area are arranged in parallel, and the buffer area is located on the same side of the channel flushing area and the collecting area.

As a preferred example, the flow channel flushing device for the integrated circuit further includes a gripping device movably connected to the frame body, and the gripping device is configured to grip the plastic-encapsulated integrated circuit chip from the buffer area to the flow channel flushing area.

Preferably, the grabbing device is further used for grabbing the integrated circuit chip after the flow channel from the flow channel area to the collecting area.

As a preferred example, the flow channel punching area comprises a first guide rail and a flow channel punching die comprising an upper die and a lower die, wherein the first guide rail and the upper die are respectively connected with the frame body; the lower die is positioned on the first guide rail and can move along the first guide rail; the lower die may be opposite to the upper die.

Preferably, the runner area further comprises a lower die cleaning device, the lower die cleaning device is connected with the upper die or the frame body, and the lower die cleaning device is used for cleaning the lower die.

Preferably, the lower die cleaning device comprises a negative pressure device and a first pipeline, and the upper end of the first pipeline is connected with an air inlet of the negative pressure device.

Preferably, the lower die cleaning device further comprises a second pipeline, one end of the second pipeline is connected with an air outlet of the negative pressure device, and the other end of the second pipeline is located in the waste collecting device.

As a preferred example, the lower end of the first pipeline is strip-shaped and is distributed along the longitudinal direction of the lower die; or the first pipelines are multiple, and the multiple hoses are distributed along the longitudinal direction of the lower die.

As a preferred example, the flow channel device for an integrated circuit further includes a first detection device, the first detection device is connected to the grasping device, and the first detection device is configured to detect whether a center flow channel of the integrated circuit chip after plastic encapsulation grasped from the buffer area is complete.

As a preferred example, the first detection device comprises a suction cup and a suction cup support, the suction cup is connected with the suction cup support, the suction cup support is connected with the gripping device, and the gripping device provides an air source for the suction cup.

As a preferred example, the collecting region comprises a waste product collecting sub-region, a detection sub-region and a finished product collecting sub-region which are arranged in sequence.

As a preferred example, the collecting area comprises a bracket, a second guide rail, a finished product collecting device, a waste product collecting device and a second detecting device; the second guide rail is connected with the frame body; the bracket is positioned on the second guide rail and can move along the second guide rail; the second detection device is used for detecting whether the integrated circuit chip after the runner is qualified or not; the finished product collecting device is used for collecting the integrated circuit chips qualified by the detection of the second detecting device; the waste collecting device is used for collecting the integrated circuit chips which are detected to be unqualified by the second detecting device.

Preferably, the second detection device comprises visual sensors distributed above and below the second guide rail for detecting the integrated circuit chip located in the detection subarea.

As a preferred example, the finished product collecting device and the waste product collecting device are both located below the second guide rail, the finished product collecting device is located in the finished product collecting sub-area, and the waste product collecting device is located in the waste product collecting sub-area.

Compared with the prior art, the utility model discloses equipment structure is compact, and area is little, and work efficiency is high. The utility model discloses equipment, including the support body to and be located buffer memory district, towards runner district and collecting region on the support body. The device integrates the caching, flushing and collecting procedures. Compared with the existing distributed device, the device of the embodiment has compact structure and small occupied area. Meanwhile, the buffer memory, the channel flushing and the collection are connected compactly, and the working efficiency is improved.

Drawings

Fig. 1 is a top view of an embodiment of the present invention;

fig. 2 is a front view of an embodiment of the invention;

fig. 3 is a perspective view of an embodiment of the present invention;

fig. 4 is a schematic structural diagram of the first detection device in the embodiment of the present invention.

The figure shows that: the device comprises a frame body 1, a buffer area 2, a runner area 3, a first guide rail 301, a runner mold 302, an upper mold 3021, a lower mold 3022, a lower mold cleaning device 303, a collecting area 4, a bracket 401, a second guide rail 402, a finished product collecting device 403, a waste collecting device 404, a second detecting device 405, a grabbing device 5, a first detecting device 6, a suction cup 601 and a suction cup support 602.

Detailed Description

The technical solution of the present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1 to fig. 3, the flow channel flushing device for an integrated circuit according to an embodiment of the present invention includes a frame body 1, and a buffer area 2, a flow channel flushing area 3, and a collecting area 4 located on the frame body 1.

In this embodiment, a plurality of functions are integrated on the same device. The integrated circuit chip after plastic package is placed in the buffer area 2 of the embodiment, then enters the channel flushing area 3 for channel flushing processing, and finally enters the collecting area 4. In the collection area 4, the qualified integrated circuit chips are collected. The equipment of the embodiment realizes the automatic operation of the integrated circuit chip after plastic package, reduces manual operation and improves the working efficiency. Compared with the existing distributed device, the device of the embodiment has compact structure and small occupied area.

When the integrated circuit chip normally works, the integrated circuit chip flows according to the sequence of the buffer area 2, the runner area 3 and the collecting area 4. When the integrated circuit chip is detected to be broken, the flow is stopped.

In order to realize the overall automatic operation, the flushing channel equipment of the embodiment further comprises a gripping device 5 movably connected with the frame body 1. The grabbing device 5 is used for grabbing the integrated circuit chip after being molded from the buffer area 2 to the runner area 3. Cache 2 may house a plurality of integrated circuit chips. The grabbing device 5 grabs the integrated circuit chip after plastic package and places the integrated circuit chip on the lower die of the runner punching area 3. Preferably, after the ic chip is processed by the runner, the ic chip after the runner is grabbed from the runner area 3 to the collecting area 4 by the grabbing device 5. Preferably, the gripping device 5 is a robot, which can move up and down. Taking a manipulator as an example, when the integrated circuit chip needs to be grabbed, the manipulator moves downwards to grab the integrated circuit chip; after the pick, the robot moves upward to place the integrated circuit chip in the proper position.

Preferably, the gripping device 5 is mounted on the frame body 1 by means of a guide rail. According to the motion track requirement, the gripping device 5 can move back and forth and left and right along the guide rail. As shown in fig. 1, the guide rails include a transverse guide rail and two longitudinal guide rails, and the grasping device 5 is connected to the transverse guide rail and can move left and right along the transverse guide rail. The transverse guide rail is erected on the two longitudinal guide rails and can move back and forth along the longitudinal guide rails.

In the above embodiment, the flow channel flushing region 3 and the collecting region 4 are arranged in parallel, and the buffer region 2 is located on the same side of the flow channel flushing region 3 and the collecting region 4. The structure is more compact due to the arrangement. Meanwhile, the integrated circuit chip can be grabbed from the buffer area 2 to the flushing channel area 3 and from the flushing channel area 3 to the collecting area 4 by using the same grabbing device 5. In the preferred embodiment, the buffer area 2, the runner area 3 and the collecting area 4 are arranged in a manner that the action track of the grabbing device 5 can be reduced, and the working efficiency is improved.

Preferably, the buffer area 2 may be provided with a plurality of trays for accommodating the integrated circuit chips after being molded. The integrated circuit chips on the carrier of the buffer area 2 are grabbed to the runner area 3 by the grabbing device 5.

Preferably, the runner section 3 includes a first guide rail 301, a runner mold 302 including an upper mold 3021 and a lower mold 3022. The first rail 301 and the upper die 3021 are respectively connected to the frame body 1, and the lower die 3022 is located on the first rail 301 and is movable along the first rail 301. The lower die 3022 may be opposite to the upper die 3021.

In the preferred embodiment, the packaged integrated circuit chip is placed on the lower die 3022; then, the lower die 3022 is moved so that the lower die 3022 and the upper die 3021 are opposed to each other; subsequently, the upper die 3021 is activated, the upper die 3021 moves downward, the upper die 3021 and the lower die 3022 begin to close, unnecessary scrap on the product is punched out, and the integrated circuit chip is punched out. After the runner punching is finished, the upper die 3021 is started to move upwards; subsequently, the lower die 3022 is moved in the first guide rail 301 out of the position opposite to the upper die 3021; the ic chip on the lower die 3022 is taken out by the gripper 5 and enters the next collection process.

After the flow path flushing process is completed, the lower die 3022 moves along the first guide rail 301, and moves out of the position facing the upper die 3021, and the process proceeds to the collecting process. The flow channel flushing process and the collecting process are connected compactly, and the working efficiency is improved.

In order to further improve the working efficiency, the apparatus of the present embodiment further includes a power device, which is connected to the lower mold 3022 and drives the lower mold 3022 to move along the first guide rail 301. The lower die 3022 is driven by a power device to move along the first guide rail 301, so that the lower die 3022 is moved, and the working efficiency can be improved.

In operation, when the grasping device 5 grasps the integrated circuit chip after the runner, the lower die 3022 moves in the direction of the upper die 3021 along the first guide rail 301. At this time, there may still be residual scrap on the lower mold 3022. If the scrap material is not cleaned, it may affect the placement of new ic chips in subsequent steps and thus the runner process. Therefore, before the lower mold 3022 carries a new molded integrated circuit, the scrap on the surface of the lower mold 3022 needs to be cleaned.

Preferably, the runner section 3 further includes a lower mold cleaning device 303, the lower mold cleaning device 303 is connected to the upper mold 3021 or the frame body 1, and the lower mold cleaning device 303 is used for cleaning the lower mold 3022. The lower mold cleaning device 303 may be moved up and down by a cylinder.

Preferably, the lower mold cleaning device 303 comprises a negative pressure device and a first pipeline, and the upper end of the first pipeline is connected with an air inlet of the negative pressure device. In operation, the first pipeline sucks waste on the surface of the lower die 3022 into the first pipeline through negative pressure generated by the negative pressure device, so as to clean the surface of the lower die 3022.

Preferably, the lower mold cleaning device 303 further includes a second duct. One end of the second pipeline is connected with an air outlet of the negative pressure device, and the other end of the second pipeline is positioned in the waste collecting device. Thus, the scraps on the surface of the lower mold 3022 are fed to the scrap collecting apparatus through the first and second pipes. Preferably, the waste collection means is located in the collection zone 4.

In order to improve the cleaning effect, preferably, the lower end of the first pipeline is strip-shaped and is arranged along the longitudinal direction of the lower die 3022; or, the first pipelines are multiple, and multiple hoses are arranged along the longitudinal direction of the lower die 3022. Since the lower die 3022 moves horizontally along the first guide rail 301, the first duct is arranged in the preferred embodiment so that the waste can be cleaned as much as possible during the horizontal movement of the lower die 3022.

In this embodiment, after all the products on the lower mold 3022 are moved to the next station by the robot, the lower mold 3022 is moved to the side of the upper mold 3021 again, the cleaning device 303 cleans and sucks up the impurities possibly remaining on the lower mold 3022 during the movement, and finally the lower mold 3022 is moved to the initial position to wait for receiving a new loading frame.

In order to ensure that the central flow channel of the integrated circuit chip after plastic packaging entering the runner punching area 3 from the buffer area 2 is not damaged, preferably, the device further comprises a first detection device 6, wherein the first detection device 6 is connected with the grabbing device 5, and the first detection device 6 is used for detecting whether the central flow channel of the integrated circuit chip after plastic packaging grabbed from the buffer area 2 is complete.

If the integrated circuit chip is not complete, the flow channel process cannot be entered. A first detection device 6 is arranged on the gripping device 5. If the first detection means 6 detect that the integrated circuit chip is not complete, an alarm is given. After the alarm is given out, the man-made dry alarm can be eliminated, and then the next link process is carried out.

Preferably, as shown in fig. 4, the first detecting device 6 includes a suction cup 601 and a suction cup holder 602, the suction cup 601 is connected to the suction cup holder 602, the suction cup holder 602 is connected to the gripping device 5, and the gripping device 5 provides an air source for the suction cup 601. The suction cups 601 correspond to the center runners of the integrated circuit chip one to one. If the center flow channel is damaged, the suction cup 601 cannot establish a set negative pressure value when adsorbing the center flow channel, thereby giving an alarm.

Preferably, the collecting region 4 comprises a waste product collecting sub-region, a detection sub-region and a finished product collecting sub-region which are arranged in sequence. The IC chip after the channel punching may be a qualified product or an unqualified product. In the preferred embodiment, the collecting region 4 comprises a waste collecting sub-region, a detecting sub-region and a finished product collecting sub-region which are arranged in sequence. The detection sub-area is used for detecting whether the integrated circuit chip after the runner is qualified or not. The waste collection subarea is used for collecting unqualified integrated circuit chips. The finished product collecting subarea is used for collecting qualified integrated circuit chips. Thus, the collection region 4 integrates both the detection and collection functions.

Preferably, the collecting zone 4 comprises a carriage 401, a second guide 402, a finished product collecting device 403, a reject collecting device 404 and a second detecting device 405. The second guide rail 402 is connected with the frame body 1, and the bracket 401 is positioned on the second guide rail 402 and can move along the second guide rail 402; the second detecting device 405 is used for detecting whether the integrated circuit chip after the runner is qualified; the finished product collecting device 403 is used for collecting the qualified integrated circuit chips detected by the second detecting device 405; the waste collecting device 404 is used for collecting the integrated circuit chips which are detected to be unqualified by the second detecting device 405.

The tray 401 is used to hold the ic chip after the flow channel captured from the flow channel region 3. At this time, the carriage 401 may be located at a waste collection sub-area. This may reduce the length of the second rail 402, making the structure more compact. The carrier 401 carries the integrated circuit chip after the runner, moves on the second guide rail 402, and moves from the waste collection sub-area to the inspection sub-area. In the detection sub-area, the second detection device 405 detects whether the ic chip located behind the runner on the carrier 401 is a qualified product. If the inspection result is a qualified product, the ic chip is moved along the second guide rail 402 to the finished product collecting sub-area, unloaded, and moved to the finished product collecting device 403, and then returned to the initial position (i.e., the waste product collecting sub-area) to wait for the ic chip after the next runner. If the test result is a defective product, the ic chip is returned to the reject collection sub-area (i.e., the initial position) along the second guide rail 402, unloaded into the reject collection device 404, and then placed in place to wait for the ic chip after the next runner.

Preferably, the second detection device 405 comprises visual sensors distributed above and below the second guide rail 402 for detecting the integrated circuit chips located in the detection sub-area. The second inspection device 405 may be four vision sensors for inspecting the front and back surfaces of the ic chip after the runner is flushed.

Preferably, the finished product collecting device 403 and the waste product collecting device 404 are both located below the second guide rail 402, the finished product collecting device 403 is located in a finished product collecting sub-area, and the waste product collecting device 404 is located in a waste product collecting sub-area. The finished product collecting device 403 is used for collecting the qualified integrated circuit chips detected by the second detecting device 405. The waste collecting device 404 is used for collecting the integrated circuit chips which are detected to be unqualified by the second detecting device 405. The scrap collector 404 may also be used to collect residue on the surface of the lower die 3022 in the sprue area 3.

The device of the embodiment integrates the functions of caching, channel flushing, collecting and the like of the integrated circuit chip to be processed on one device, and converts manual operation into mechanical automatic operation. The equipment saves space, reduces operators, can also stabilize and control the product quality, and obviously improves the working efficiency.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration only, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the claims and their equivalents.

Claims

1. The flow channel flushing device for the integrated circuit is characterized by comprising a frame body (1), and a buffer area (2), a flow channel flushing area (3) and a collecting area (4) which are positioned on the frame body (1).

2. The washrunner apparatus for integrated circuits according to claim 1, wherein, in normal operation, the integrated circuits flow in the order of the buffer region (2), the washrunner region (3), and the collection region (4).

3. The washout channel arrangement for integrated circuits according to claim 1, characterized in that the washout channel region (3) and the collecting region (4) are arranged in parallel, the buffer region (2) being located on the same side of the washout channel region (3) and the collecting region (4).

4. The runner apparatus for ic's according to claim 1, further comprising a gripper (5) movably connected to the frame (1), the gripper (5) being adapted to grip the encapsulated ic chip from the buffer area (2) to the runner area (3).

5. A runner device for ICs, as claimed in claim 4, characterized in that said gripping means (5) are also adapted to grip the IC chip after the runner from the runner region (3) to the collecting region (4).

6. The runner apparatus for integrated circuits according to claim 1, wherein the runner section (3) comprises a first guide rail (301), a runner mold (302) including an upper mold (3021) and a lower mold (3022), the first guide rail (301) and the upper mold (3021) being respectively connected to the frame body (1); the lower die (3022) is positioned on the first guide rail (301) and can move along the first guide rail (301); the lower die (3022) may be opposed to the upper die (3021).

7. The runner apparatus for integrated circuits according to claim 6, wherein said runner section (3) further comprises a lower die cleaning device (303), the lower die cleaning device (303) being connected to the upper die (3021) or the frame body (1), the lower die cleaning device (303) being adapted to clean the lower die (3022).

8. The washrunner apparatus for integrated circuits as claimed in claim 7, wherein the lower mold cleaning device (303) comprises a negative pressure device and a first duct, an upper end of the first duct being connected to an air inlet of the negative pressure device.

9. The washrunner apparatus for integrated circuits as claimed in claim 8, wherein the lower mold cleaning device (303) further comprises a second duct, one end of the second duct being connected to the air outlet of the negative pressure device, the other end of the second duct being located in the scrap collecting device.

10. The runner apparatus for integrated circuits according to claim 8, wherein the lower end of the first pipe is strip-shaped and arranged in the longitudinal direction of the lower die (3022); or a plurality of first pipelines are arranged, and a plurality of hoses are arranged along the longitudinal direction of the lower die (3022).

11. The runner apparatus for integrated circuits according to claim 4, further comprising a first detecting device (6), wherein the first detecting device (6) is connected to the grasping device (5), and the first detecting device (6) is configured to detect whether the center runner of the plastic-encapsulated integrated circuit chip grasped from the buffer area (2) is complete.

12. The washrunner apparatus for integrated circuits according to claim 11, wherein the first detecting means (6) comprises a suction cup (601), a suction cup holder (602), the suction cup (601) being connected to the suction cup holder (602), the suction cup holder (602) being connected to the gripping means (5), the gripping means (5) providing a gas source for the suction cup (601).

13. The washrunner apparatus for integrated circuits according to claim 1, wherein the collecting region (4) comprises a waste collector sub-region, a detector sub-region, and a product collector sub-region arranged in this order.

14. The washrunner apparatus for integrated circuits according to claim 13, characterized in that the collecting zone (4) comprises a carriage (401), a second guide rail (402), a finished product collecting device (403), a reject collecting device (404) and a second detecting device (405);

the second guide rail (402) is connected with the frame body (1); the bracket (401) is positioned on the second guide rail (402) and can move along the second guide rail (402); the second detection device (405) is used for detecting whether the integrated circuit chip after the runner is qualified or not; the finished product collecting device (403) is used for collecting the qualified integrated circuit chips detected by the second detecting device (405); the waste collecting device (404) is used for collecting the integrated circuit chips which are detected to be unqualified by the second detecting device (405).

15. The washrunner apparatus for integrated circuits as claimed in claim 14, characterized in that the second detection device (405) comprises visual sensors which are distributed above and below the second guide rail (402) for detecting integrated circuit chips located in the detection sub-area.

16. The runner apparatus for integrated circuits according to claim 14, wherein the finished product collecting device (403) and the reject collecting device (404) are both located below the second guide rail (402), the finished product collecting device (403) being located in a finished product collecting sub-area, the reject collecting device (404) being located in a reject collecting sub-area.