CN211152546U - Liquid-cooled broadband power amplifier - Google Patents

Abstract

The utility model relates to a power amplifier technical field specifically is a liquid cooling type broadband power amplifier, include the broadband power amplifier body and install the processing chip in broadband power amplifier body bottom, the broadband power amplifier body is installed on the casing, the installing port of rectangle is seted up to one side of casing, the installing port that the broadband power amplifier runs through the casing stretches out the casing with the grafting panel, and the grafting panel is provided with seal ring with the junction of installing port, and through being kept apart each other with the air of casing inside and outside, can avoid the influence of outside environment to the inside electron device of broadband power amplifier body, make the utility model discloses can be applicable to and use under the great environment of humidity.

Description

Liquid-cooled broadband power amplifier

Technical Field

The utility model relates to a power amplifier technical field specifically is a liquid cooling type broadband power amplifier.

Background

The broadband power amplifier mainly comprises a power divider, a power amplification module, a power synthesizer, a coupler and various control circuits. The broadband power amplifier has the important characteristics that the power amplification module has high power consumption, the area of a key processing chip is small, the heat productivity is large, and the heat dissipation is difficult. At present, in order to ensure the heat dissipation of a processing chip, a heat dissipation hole is generally formed in a casing of a broadband power amplifier, and some broadband power amplifiers loaded with high-frequency processing chips can be air-cooled for heat dissipation, but the heat dissipation hole formed in the casing can enable moisture in the external environment to enter the broadband power amplifier, corrode electronic elements in the broadband power amplifier, and reduce the service life, so that a liquid-cooled broadband power amplifier capable of being normally used in an environment with high humidity is provided.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problem, the present invention provides a liquid-cooled wideband power amplifier.

The utility model provides a its technical problem adopt following technical scheme to realize: the utility model provides a liquid cooling type broadband power amplifier, includes the broadband power amplifier body and installs the processing chip in broadband power amplifier body bottom, the broadband power amplifier body is installed on the casing, the installing port of rectangle is seted up to one side of casing, the installing port that the broadband power amplifier body runs through the casing stretches out the casing with the grafting panel, and the grafting panel is provided with seal ring with the junction of installing port, the air of casing inside and outside is by mutual isolation, be provided with the liquid cooling device on the processing chip.

Preferably, the liquid cooling device comprises a lower heat conducting plate, an upper heat conducting plate, a breathable hydrophobic membrane, a heat insulating plate, a water tank and a cooling pipe, wherein the lower heat conducting plate is fixedly arranged on the shell through screws, the lower heat conducting plate is in contact with the surface of the processing chip, a plurality of lower grooves are formed in the upper end surface of the lower heat conducting plate, the upper heat conducting plate is reversely buckled on the upper side of the lower heat conducting plate, the upper heat conducting plate and the lower heat conducting plate are fixed through bolts, upper grooves corresponding to the lower grooves are formed in the lower end surface of the upper heat conducting plate, the breathable hydrophobic membrane is arranged between the upper heat conducting plate and the lower heat conducting plate and used for isolating the lower grooves from the upper grooves, the heat insulating plate is fixedly connected to the upper end surface of the upper heat conducting plate, the water tank is fixedly arranged on the upper end surface of the water conducting plate, cooling liquid is, the inlet tube intercommunication has the circulating pump, the circulating pump is followed the water tank and is sent water to the inlet tube, the tip intercommunication of outlet pipe is on the cooling pipe, the cooling pipe is annular platykurtic structure, the fixed cover of cooling pipe is in the outside of casing, still is connected with the back flow on the cooling pipe, back flow and water tank intercommunication, it has the blast pipe to go up the slot intercommunication, the tip of blast pipe runs through the outside that the casing reachd the casing.

Preferably, the outer wall of the cooling pipe is provided with a plurality of bulges.

Preferably, the cooling pipe is made of copper.

Compared with the prior art, the beneficial effects of the utility model are that: according to the liquid-cooled broadband power amplifier, the air inside and outside the shell is isolated from each other, so that the influence of the external environment on electronic devices inside the broadband power amplifier body can be avoided, and the liquid-cooled broadband power amplifier can be suitable for being used in an environment with high humidity; the circulating pump is full of the coolant liquid in the water tank and is gone down the slot, when the coolant liquid passes through the slot down, can take away down the heat on the heat-conducting plate, and then cool down to handling the chip, can get into the slot through ventilative hydrophobic membrane after the bubble come-up, outside the blast pipe discharge casing again, thereby avoid the bubble to refrigerated negative effects in the slot down, and then realize efficient cooling, can adopt the processing chip of higher frequency, with the throughput who improves the chip.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a cross-sectional view of a liquid cooling apparatus;

fig. 3 is a plan view of the liquid cooling apparatus.

In the figure: the broadband power amplifier comprises a broadband power amplifier body 100, a processing chip 200, a machine shell 300, a sealing gasket 400, a liquid cooling device 500, a lower heat conducting plate 510, a lower groove 511, an upper heat conducting plate 520, an upper groove 521, a breathable hydrophobic membrane 530, a heat insulating plate 540, a water tank 550, a cooling pipe 560, a protrusion 561 and a circulating pump 570.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a liquid-cooled broadband power amplifier comprises a broadband power amplifier body 100 and a processing chip 200 installed at the bottom of the broadband power amplifier body 100, wherein the broadband power amplifier body 100 is installed on a casing 300, one side of the casing 300 is provided with a rectangular installation port, the broadband power amplifier body 100 penetrates through the installation port of the casing 300 to extend a plug panel out of the casing 300, a sealing washer 400 is arranged at the joint of the plug panel and the installation port, the air inside and outside the casing 300 is isolated from each other, a liquid cooling device 500 is arranged on the processing chip 200, the air inside and outside the casing 300 is isolated from each other, the influence of the external environment on electronic devices inside the broadband power amplifier body 100 can be avoided, the liquid-cooled broadband power amplifier can be used in an environment with high humidity, and the liquid-cooled heat dissipation is carried out on the processing chip 200 through the liquid cooling device 500, can be effectual to the processing chip 200 cooling, can adopt the processing chip 200 of higher frequency to improve the throughput of chip.

As an embodiment of the present invention, the liquid cooling device 500 includes a lower heat conduction plate 510, an upper heat conduction plate 520, a permeable hydrophobic membrane 530, a heat insulation plate 540, a water tank 550 and a cooling pipe 560, the lower heat conduction plate 510 is fixedly mounted on the casing 300 by screws, the lower heat conduction plate 510 is in contact with the surface of the processing chip 200, for the sufficient contact of the lower heat conduction plate 510 and the processing chip 200, a heat conduction silicone grease layer is coated between the lower heat conduction plate 510 and the processing chip 200, a plurality of lower grooves 511 are formed on the upper end surface of the lower heat conduction plate 510, an upper heat conduction plate 520 is inversely buckled on the upper side of the lower heat conduction plate 510, the upper heat conduction plate 520 is fixed to the lower heat conduction plate 510 by bolts, an upper groove 521 corresponding to the lower groove 511 is formed on the lower end surface of the upper heat conduction plate 520, the permeable hydrophobic membrane 530 is disposed between the upper heat conduction plate 520 and the lower heat conduction plate 510, the permeable, the upper end face of the upper heat conducting plate 520 is fixedly connected with a heat insulating plate 540, the upper end face of the heat insulating plate 540 is fixedly provided with a water tank 550, the water tank 550 is filled with cooling liquid, one end of the lower groove 511 is communicated with a water inlet pipe, the other end of the lower groove 511 is communicated with a water outlet pipe, the water inlet pipe is communicated with a circulating pump 570, the circulating pump 570 sends water to the water inlet pipe from the water tank 550, the end part of the water outlet pipe is communicated with a cooling pipe 560, the cooling pipe 560 is of an annular flat structure, the cooling pipe 560 is fixedly sleeved outside the casing 300, the cooling pipe 560 is also connected with a return pipe, the return pipe is communicated with the water tank 550, the upper groove 521 is communicated with an exhaust pipe, and the end; circulation pump 570 is full of slot 511 down with the coolant liquid in the water tank 550, when the coolant liquid passes through slot 511 down, can take away the heat on the heat-conducting plate 510 down, and then cool down to handling chip 200, the coolant liquid carries the heat and then can get into cooling pipe 560 and dispel the heat and cool down, flow back again at last in the water tank 550, realize the circulation of rivers, coolant liquid after the heating can evaporate partly, produce a little bubble, the bubble can reduce refrigerated effect in slot 511 down, the bubble can get into slot 521 through ventilative hydrophobic membrane 530 after the come-up, again outside exhaust pipe casing 300, thereby avoid the bubble to the refrigerated negative effect in slot 511 down, and then realize efficient cooling.

As an embodiment of the present invention, the outer wall of the cooling tube 560 is provided with a plurality of protrusions 561, which can increase the contact area between the cooling tube 560 and the air by setting the protrusions 561, thereby improving the cooling effect.

As an embodiment of the present invention, the cooling tube 560 is made of copper.

While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims (4)

1. A liquid-cooled broadband power amplifier comprises a broadband power amplifier body (100) and a processing chip (200) installed at the bottom of the broadband power amplifier body (100), and is characterized in that: the broadband power amplifier comprises a broadband power amplifier body (100), a rectangular mounting port is formed in one side of a machine shell (300), the broadband power amplifier body (100) penetrates through the mounting port of the machine shell (300) to enable a plug panel to stretch out of the machine shell (300), a sealing gasket (400) is arranged at the joint of the plug panel and the mounting port, air inside and outside the machine shell (300) is isolated from each other, and a liquid cooling device (500) is arranged on a processing chip (200).

2. The liquid-cooled wideband power amplifier of claim 1, where: the liquid cooling device (500) comprises a lower heat conducting plate (510), an upper heat conducting plate (520), a ventilating hydrophobic membrane (530), a heat insulating plate (540), a water tank (550) and a cooling pipe (560), wherein the lower heat conducting plate (510) is fixedly arranged on the casing (300) through screws, the lower heat conducting plate (510) is in surface contact with the processing chip (200), a plurality of lower grooves (511) are formed in the upper end face of the lower heat conducting plate (510), the upper heat conducting plate (520) is inversely buckled on the upper side of the lower heat conducting plate (510), the upper heat conducting plate (520) and the lower heat conducting plate (510) are fixed through bolts, an upper groove (521) corresponding to the lower groove (511) is formed in the lower end face of the upper heat conducting plate (520), the ventilating hydrophobic membrane (530) is arranged between the upper heat conducting plate (520) and the lower heat conducting plate (510), and the ventilating hydrophobic membrane (530) is used for isolating the lower groove (, go up terminal surface fixedly connected with heat insulating board (540) of heat-conducting plate (520), the up end fixed mounting of heat insulating board (540) has water tank (550), is filled with the coolant liquid in water tank (550), the one end intercommunication of slot (511) has the inlet tube down, and the other end intercommunication has the outlet pipe, the inlet tube intercommunication has circulating pump (570), circulating pump (570) are followed water tank (550) and are sent water to the inlet tube, the tip intercommunication of outlet pipe is on cooling tube (560), cooling tube (560) are annular platykurtic structure, cooling tube (560) are fixed to be cup jointed in the outside of casing (300), still are connected with the back flow on cooling tube (560), back flow and water tank (550) intercommunication, it has the blast pipe to go up slot (521) intercommunication, the tip of blast pipe runs through the outside that casing (300) reachd casing (300).

3. The liquid-cooled wideband power amplifier of claim 2, where: the outer wall of the cooling pipe (560) is provided with a plurality of bulges (561).

4. The liquid-cooled wideband power amplifier of claim 3, where: the cooling pipe (560) is made of copper.

Images